CN108375428A - A kind of pressure sensor for fixing absolute pressure chip using no plastic structure - Google Patents
A kind of pressure sensor for fixing absolute pressure chip using no plastic structure Download PDFInfo
- Publication number
- CN108375428A CN108375428A CN201810008488.0A CN201810008488A CN108375428A CN 108375428 A CN108375428 A CN 108375428A CN 201810008488 A CN201810008488 A CN 201810008488A CN 108375428 A CN108375428 A CN 108375428A
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- China
- Prior art keywords
- pedestal
- chip
- pressure
- diaphragm
- pin
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The present invention relates to a kind of pressure sensors for fixing absolute pressure chip using no plastic structure, including pedestal, diaphragm, ceramic gasket, pressure chip, pressure ring, pin, conducting wire；Base upper surface is equipped with diaphragm；Diaphragm upper cap is equipped with pressure ring；A cavity is formed between diaphragm and pedestal；The top of pedestal is equipped with base top boss；Ceramic gasket is installed in base top boss；Ceramic gasket is internally provided with the cavity in about one；The cavity wall of ceramic gasket is equipped with contact fixed point, by contacting fixed point fixation pressure chip；Using this spline structure without viscose glue just can fixed chip and reduce production cost while improving core performance.
Description
Technical field
The present invention relates to electronic information field more particularly to a kind of pressure sensings for fixing absolute pressure chip using no plastic structure
Device.
Background technology
The chip in diffusion silicon pressure sensor is mainly fixed by way of viscose glue at present, and chip sensitive surface direction has
Stress, affects performance, and especially small-range core is more prominent.For the core for using absolute pressure chip, company is present
A kind of elasticity by ceramic blanket is just being developed come the pressure sensor of fixed chip, is being blocked using the ceramic blanket with certain elasticity
Chip surrounding, chip sensitive surface direction do not stress, and reduce influence of the external environment to chip to the greatest extent.Simultaneously because not
With drying glue, reduce production process.
Invention content
The technical problem to be solved by the present invention is to design a kind of pressure sensor for fixing absolute pressure chip using no plastic structure,
Solve above-mentioned existing technical problem.
In order to solve the above technical problems, the present invention provides a kind of pressure sensings for fixing absolute pressure chip using no plastic structure
Device, including pedestal, diaphragm, ceramic gasket, pressure chip, pressure ring, pin, conducting wire；Base upper surface is equipped with diaphragm；On diaphragm
Portion is covered with pressure ring；A cavity is formed between diaphragm and pedestal；The top of pedestal is equipped with base top boss；Base top is convex
Ceramic gasket is installed in platform；Ceramic gasket is internally provided with the cavity in about one；The cavity wall of ceramic gasket is equipped with contact
Fixed point, by contacting fixed point fixation pressure chip；Pressure chip is located in ceramic gasket boss；Base top boss and bottom
The lower part connection of seat, the opening of connection are equipped with steel ball；Space shape between base top boss and the lower part and steel ball of pedestal
At oil-filled slot；Oil-filled slot is equipped with opening in the lower part of pedestal；Pin one end is located in pedestal, and the pin other end is from base bottom
It is pierced by；Pressure chip is connect by conducting wire with pin.
Further, it is filled equipped with silicone oil in the confined space of the cavity between diaphragm and pedestal and oil-filled slot.
Further, pin is located at the coupling part of chassis interior one end, and coupling part pin surface wraps up glass insulation
Son.
Further, the material for contacting fixed point is stainless steel shrapnel or rubber plastic；Contact the position of fixed point connection
Positioned at each side midpoint of pressure chip.
Further, pin is connect by way of sintering with pedestal.
Further, conducting wire is gold thread.
Further, pressure ring, pedestal, diaphragm are welded by way of argon arc welding.
Further, base bottom also is provided with base bottom boss；It is installed on compensating plate in base bottom boss；Pedestal bottom
The pin that portion is drawn is pierced by from compensating plate.
Further, the outside of pedestal opens up fluted；O-ring is equipped in groove.
Beneficial effects of the present invention：After such structure：Without viscose glue just can fixed chip, improve core performance
Meanwhile and reducing production cost.
Description of the drawings
The specific implementation mode of the present invention is furtherd elucidate below in conjunction with the accompanying drawings.
Fig. 1 is the detonation configuration that the pressure sensor of absolute pressure chip is fixed in the use of the present invention without plastic structure；
Fig. 2 is the sectional view that the pressure sensor of absolute pressure chip is fixed in the use of the present invention without plastic structure；
Fig. 3 is the ceramic gasket and pressure chip connection structure diagram of the present invention；
Drawing reference numeral explanation：
1, pedestal；2, diaphragm；3, ceramic gasket；4, pressure chip；5, pressure ring；6, pin；7, steel ball；8, compensating plate；9, O-shaped
Circle；10, fixed point is contacted；11, conducting wire；12, silicone oil；13, glass insulator.
Specific implementation mode
In conjunction with attached drawing 1 to 3, the present invention provides a kind of pressure sensor for fixing absolute pressure chip using no plastic structure, packets
Include pedestal 1, diaphragm 2, ceramic gasket 3, pressure chip 4, pressure ring 5, pin 6, conducting wire 11；1 upper surface of pedestal is equipped with diaphragm 2；
2 upper cap of diaphragm is equipped with pressure ring 5；A cavity is formed between diaphragm 2 and pedestal 1；It is convex that the top of pedestal 1 is equipped with 1 top of pedestal
Platform；Ceramic gasket 3 is installed in 1 top boss of pedestal；Ceramic gasket 3 is internally provided with the cavity in about one；Ceramic gasket 3
Cavity wall is equipped with contact fixed point 10, by contacting 10 fixation pressure chip 4 of fixed point；Pressure chip 4 is located at ceramic gasket 3
In boss；1 top boss of pedestal is connected to the lower part of pedestal 1, and the opening of connection is equipped with steel ball 7；1 top boss of pedestal and bottom
Space between the lower part and steel ball 7 of seat 1 forms oil-filled slot；Oil-filled slot is equipped with opening in the lower part of pedestal 1；6 one end of pin position
Go out in pedestal 1,6 other end of pin is pierced by from 1 bottom of pedestal；Pressure chip 4 is connect by conducting wire 11 with pin 6.
The present embodiment is preferred, cavity between diaphragm 2 and pedestal 1 and is filled equipped with silicone oil 12 in the confined space of oil-filled slot.
The present embodiment is preferred, and the material of contact fixed point 10 is stainless steel shrapnel or rubber plastic；Fixed point 10 is contacted to connect
The position connect is located at 4 each side midpoint of pressure chip.
The present embodiment is preferred, and six roots of sensation pin 6 is located at the coupling part of 1 inside one end of pedestal, 6 surface of coupling part pin packet
Wrap up in glass insulator 13.
The present embodiment is preferred, and pin 6 is connect by way of sintering with pedestal 1.
The present embodiment is preferred, and conducting wire 11 is gold thread.The electric conductivity of gold thread is more preferable.
The present embodiment is preferred, and pressure ring 5, pedestal 1, diaphragm 2 are welded by way of argon arc welding.
The present embodiment is preferred, and 1 bottom of pedestal also is provided with 1 bottom boss of pedestal；It is installed on compensating plate in 1 bottom boss of pedestal
8；The pin 6 that 1 bottom of pedestal is drawn is pierced by from compensating plate 8.
The present embodiment is preferred, and the outside of pedestal 1 opens up fluted；O-ring 9 is equipped in groove.O-ring 9 can play close
The effect of sealing chip.
Structural principle：The frictional force fixed chip that the extruding of chip sides four direction is generated by ceramic blanket, due to
Chip very light weight itself, the core vibrations of some strength can't cause the movement of chip.
Production method：
The first step：Ceramic blanket is directed at pin positions by us, is pressed into pedestal 1 by tool, is allowed to fixation and is not shaken.
Second step：Pressure chip 4 is put into ceramic blanket with carbon tweezers, presses lightly on pressure chip 4, is allowed to be stuck in pottery
Porcelain pads in the square groove of center.Contact fixed point 10 is Hookean region, and material can be stainless steel shrapnel or rubber plastic etc..Pressure core
Piece 4 is reached balance by the pressure of ceramic blanket P1, P2, P3, P4 four direction, to fixed chip.
Third walks：It is bound by spun gold, realizes the electrical connection of pressure chip 4 and six roots of sensation pin 6.Then, pass through argon arc
Welding, pressure ring 5, pedestal 1, diaphragm 2 are welded together.The opening connected again by the oil-filled slot of pedestal 1 and steel ball 7, by silicon
Oil 12 pours into the cavity of core, and the opening that steel ball 7 connects oil-filled slot and steel ball 7 is used in combination to seal.
4th step：Resistance is pasted on compensating plate 8 using resistor network compensation principle, improves the temperature performance of core.Finally
Upper "O"-ring is covered in the groove outside pedestal 1, and core is tested.Test passes complete the chip manufacturing.
Many details are elaborated in the above description in order to fully understand the present invention.But above description is only
Presently preferred embodiments of the present invention, the invention can be embodied in many other ways as described herein, therefore this
Invention is not limited by specific implementation disclosed above.Any those skilled in the art are not departing from the technology of the present invention simultaneously
In the case of aspects, all technical solution of the present invention is made using the methods and technical content of the disclosure above many possible
Changes and modifications, or it is revised as the equivalent embodiment of equivalent variations.Every content without departing from technical solution of the present invention, according to this
The technical spirit any simple modifications, equivalents, and modifications made to the above embodiment of invention, still fall within skill of the present invention
In the range of the protection of art scheme.
Claims (9)
1. a kind of pressure sensor for fixing absolute pressure chip using no plastic structure, it is characterised in that：Including pedestal（1）, diaphragm
（2）, ceramic gasket（3）, pressure chip（4）, pressure ring（5）, pin（6）, conducting wire（11）；The pedestal（1）Upper surface is equipped with
Diaphragm（2）；The diaphragm（2）Upper cap is equipped with pressure ring（5）；The diaphragm（2）With pedestal（1）Between formed a cavity；Institute
State pedestal（1）Top be equipped with pedestal（1）Top boss；Pedestal（1）Ceramic gasket is installed in the boss of top（3）；The ceramics
Gasket（3）The cavity being internally provided in about one；The ceramic gasket（3）Cavity wall be equipped with contact fixed point（10）,
By contacting fixed point（10）Fixation pressure chip（4）；The pressure chip（4）Positioned at ceramic gasket（3）In boss；The bottom
Seat（1）Top boss and pedestal（1）Lower part connection, the opening of connection is equipped with steel ball（7）；The pedestal（1）Top boss
With pedestal（1）Lower part and steel ball（7）Between space form oil-filled slot；The oil-filled slot is in pedestal（1）Lower part be equipped with open
Mouthful；The pin（6）One end is located at pedestal（1）Inside go out, pin（6）The other end is from pedestal（1）Bottom is pierced by；The pressure chip
（4）Pass through conducting wire（11）With pin（6）Connection.
2. the pressure sensor according to claim 1 for fixing absolute pressure chip using no plastic structure, it is characterised in that：It is described
Diaphragm（2）With pedestal（1）Between cavity and oil-filled slot confined space in fill equipped with silicone oil（12）.
3. the pressure sensor according to claim 1 for fixing absolute pressure chip using no plastic structure, it is characterised in that：It is described
Pin（6）Positioned at pedestal（1）The coupling part of internal one end, the pin of coupling part（6）Wrap up glass insulator in surface（13）.
4. the pressure sensor according to claim 1 for fixing absolute pressure chip using no plastic structure, it is characterised in that：It is described
Contact fixed point（10）Material be stainless steel shrapnel or rubber plastic；The contact fixed point（10）The position of connection is located at pressure
Power chip（4）Each side midpoint.
5. the pressure sensor according to claim 1 for fixing absolute pressure chip using no plastic structure, it is characterised in that：It is described
Pin（6）By way of sintering and pedestal（1）Connection.
6. the pressure sensor according to claim 1 for fixing absolute pressure chip using no plastic structure, it is characterised in that：It is described
Conducting wire（11）For gold thread.
7. the pressure sensor according to claim 1 for fixing absolute pressure chip using no plastic structure, it is characterised in that：It is described
Pressure ring（5）, pedestal（1）, diaphragm（2）It is welded by way of argon arc welding.
8. the pressure sensor according to claim 1 for fixing absolute pressure chip using no plastic structure, it is characterised in that：It is described
Pedestal（1）Bottom also is provided with pedestal（1）Bottom boss；The pedestal（1）Compensating plate is installed in bottom boss（8）；The bottom
Seat（1）The pin that bottom is drawn（6）From compensating plate（8）In be pierced by.
9. the pressure sensor according to claim 1 for fixing absolute pressure chip using no plastic structure, it is characterised in that：It is described
Pedestal（1）Outside open up it is fluted；O-ring is equipped in the groove（9）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810008488.0A CN108375428B (en) | 2018-01-04 | 2018-01-04 | Pressure sensor adopting adhesive-free structure to fix absolute pressure chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810008488.0A CN108375428B (en) | 2018-01-04 | 2018-01-04 | Pressure sensor adopting adhesive-free structure to fix absolute pressure chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108375428A true CN108375428A (en) | 2018-08-07 |
| CN108375428B CN108375428B (en) | 2020-08-28 |
Family
ID=63016526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810008488.0A Active CN108375428B (en) | 2018-01-04 | 2018-01-04 | Pressure sensor adopting adhesive-free structure to fix absolute pressure chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108375428B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110044521A (en) * | 2019-05-29 | 2019-07-23 | 南京元感微电子有限公司 | The force snesor of pressure between measurement solid |
| CN110854079A (en) * | 2019-11-28 | 2020-02-28 | 宁波安创电子科技有限公司 | Packaging structure and packaging method for sensor chip with front surface exposed downwards |
| CN111633589A (en) * | 2020-06-16 | 2020-09-08 | 南京沃天科技有限公司 | Sensor chip centre gripping fixed knot constructs |
| CN113091985A (en) * | 2021-04-21 | 2021-07-09 | 南京特敏传感技术有限公司 | Wide-range miniaturized pressure transmitter |
| CN113483942A (en) * | 2021-07-01 | 2021-10-08 | 南京特敏传感技术有限公司 | Multipurpose integral type pressure sensing core |
| CN116429317A (en) * | 2023-06-09 | 2023-07-14 | 季华实验室 | Capacitive film vacuum gauge sensor, manufacturing method thereof and capacitive film vacuum gauge |
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| CN2540627Y (en) * | 2002-05-10 | 2003-03-19 | 李维平 | Integral mounted structure of silicon piezo-resistive pressure sensor |
| JP2004045424A (en) * | 2003-09-22 | 2004-02-12 | Tadahiro Omi | Mounting structure of pressure detector |
| CN201673008U (en) * | 2010-04-29 | 2010-12-15 | 麦克传感器有限公司 | Novel high-stability pressure sensor |
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Patent Citations (6)
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|---|---|---|---|---|
| CN2540627Y (en) * | 2002-05-10 | 2003-03-19 | 李维平 | Integral mounted structure of silicon piezo-resistive pressure sensor |
| JP2004045424A (en) * | 2003-09-22 | 2004-02-12 | Tadahiro Omi | Mounting structure of pressure detector |
| CN201673008U (en) * | 2010-04-29 | 2010-12-15 | 麦克传感器有限公司 | Novel high-stability pressure sensor |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110044521A (en) * | 2019-05-29 | 2019-07-23 | 南京元感微电子有限公司 | The force snesor of pressure between measurement solid |
| CN110854079A (en) * | 2019-11-28 | 2020-02-28 | 宁波安创电子科技有限公司 | Packaging structure and packaging method for sensor chip with front surface exposed downwards |
| CN110854079B (en) * | 2019-11-28 | 2022-04-26 | 宁波安创电子科技有限公司 | Packaging structure and packaging method for sensor chip with front surface exposed downwards |
| CN111633589A (en) * | 2020-06-16 | 2020-09-08 | 南京沃天科技有限公司 | Sensor chip centre gripping fixed knot constructs |
| CN113091985A (en) * | 2021-04-21 | 2021-07-09 | 南京特敏传感技术有限公司 | Wide-range miniaturized pressure transmitter |
| CN113091985B (en) * | 2021-04-21 | 2022-10-28 | 南京特敏传感技术有限公司 | Wide-range miniaturized pressure transmitter |
| CN113483942A (en) * | 2021-07-01 | 2021-10-08 | 南京特敏传感技术有限公司 | Multipurpose integral type pressure sensing core |
| CN116429317A (en) * | 2023-06-09 | 2023-07-14 | 季华实验室 | Capacitive film vacuum gauge sensor, manufacturing method thereof and capacitive film vacuum gauge |
| CN116429317B (en) * | 2023-06-09 | 2023-08-15 | 季华实验室 | Capacitive film vacuum gauge sensor, manufacturing method thereof and capacitive film vacuum gauge |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108375428B (en) | 2020-08-28 |
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Address after: 13 / F, building B2, Jiulonghu international enterprise headquarters park, Jiangning Development Zone, Nanjing, Jiangsu 210000 Patentee after: Nanjing wotian Technology Co.,Ltd. Address before: 13 / F, building B2, Jiulonghu international enterprise headquarters park, Jiangning Development Zone, Nanjing, Jiangsu 210000 Patentee before: NANJING WOTIAN TECHNOLOGY Co.,Ltd. |