CN201399436Y - Semiconductor device testing and sorting machine - Google Patents
Semiconductor device testing and sorting machine Download PDFInfo
- Publication number
- CN201399436Y CN201399436Y CN2009200362083U CN200920036208U CN201399436Y CN 201399436 Y CN201399436 Y CN 201399436Y CN 2009200362083 U CN2009200362083 U CN 2009200362083U CN 200920036208 U CN200920036208 U CN 200920036208U CN 201399436 Y CN201399436 Y CN 201399436Y
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- rotary
- suction nozzle
- rotary positioning
- semiconductor devices
- positioning apparatus
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 48
- 238000012360 testing method Methods 0.000 title claims abstract description 10
- 238000001514 detection method Methods 0.000 claims abstract description 25
- 230000007246 mechanism Effects 0.000 claims abstract description 15
- 208000002925 dental caries Diseases 0.000 claims description 5
- 238000009954 braiding Methods 0.000 abstract 2
- 230000002950 deficient Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
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Abstract
The utility model discloses a semiconductor device testing and sorting machine in the technical field of semiconductor device detection, including the rotary worktable installed on the upper end of the vertical shaft, the suction nozzle with a plurality of liftable is evenly distributed on the outer circumference of the rotary worktable, the separating table corresponding to the position of the suction nozzle is arranged in turn around the rotary worktable along the clockwise or anticlockwise direction, the first rotary positioning device, the detecting head, the image camera, the auxiliary turntable, the second rotary positioning device, the blanking mechanism and the braiding mechanism, the separating table is connected with the feeding mechanism, the first rotary positioning device and the second rotary positioning device respectively comprise a die cavity matched with the detected device, and the die cavity is positioned below the suction nozzle of the corresponding station; the periphery of the auxiliary turntable is uniformly provided with a plurality of concave cavities capable of containing detected devices, and the side surface of the auxiliary turntable is provided with a marking laser head corresponding to the concave cavities. The device controls a plurality of detection devices to work cooperatively by a computer, and the device can realize detection, marking, sorting and braiding; the structure is compact and the efficiency is high.
Description
Technical field
The utility model relates to a kind of device of semiconducter device testing sorting.
Background technology
After the semiconductor devices manufacturing is finished, need detect it, mark, sorting, tape package, in the prior art, above-mentioned each course of work is independently to carry out, it is slow that it detects separation velocity, equipment is many and mix, production efficiency is low.
The utility model content
The purpose of this utility model provides a kind of semiconductor device test separator, makes detection, mark, sorting, the braid of semiconductor devices can realize this apparatus structure compactness, detection efficiency height on a machine.
The purpose of this utility model is achieved in that semiconductor device test separator, comprise horizontally disposed rotary table, rotary table is installed in the vertical shaft upper end, be evenly equipped with some liftable suction nozzles on the rotary table excircle, be furnished with successively clockwise or counterclockwise and the corresponding separating table in suction nozzle position around the rotary table, first rotary positioning apparatus, detection head, the image pickup head, secondary rotating disk, second rotary positioning apparatus, cutting agency and braid mechanism, described separating table is connected with feed mechanism, described first rotary positioning apparatus, second rotary positioning apparatus respectively comprise one with the suitable die cavity of detected device, die cavity is positioned at the suction nozzle below of corresponding station just; Secondary rotating disk periphery is evenly equipped with some cavitys that hold detected device, and secondary rotating disk side is provided with the mark laser head corresponding with cavity.
During this device work, semiconductor devices is from the feed mechanism material loading, enter separating table then, the semiconductor devices suction be about under the suction nozzle in the suction nozzle bottom, suction nozzle lifts then, rotary table turns to first rotary positioning apparatus top, suction nozzle is descending, semiconductor devices is pressed down enter in the die cavity, under the guide effect of die cavity, semiconductor devices rotates, make its position accurately be positioned at the position of setting, so that in detection subsequently, its pin can mate with detection head, after suction nozzle rises once more, rotary table rotates a station once more, the pin of detection head and semiconductor devices just over against, suction nozzle is descending, detection head touches pin, every performance indications to semiconductor devices detect, detection head can have a plurality of, lay respectively on the different station, after a kind of parameter detecting finishes, transfer to the detection that next station carries out other parameters again, by detecting, can determine semiconductor devices whether qualified or its belong to any class quality, and give computer and preserve, after detection head detects, semiconductor devices is transferred to next station, the image pickup head can carry out outward appearance to it and detect, semiconductor devices is transferred to next station then, it is secondary rotating disk top, the suction nozzle release semiconductor devices of dying, make it enter into cavity, secondary dial rotation, make cavity over against the mark laser head, the mark laser head is stamped corresponding sign at semiconductor devices, detect underproof product for station before, suction nozzle also can not discharge semiconductor devices, enters next station and be with semiconductor devices to cross secondary rotating disk, and the semiconductor devices after the mark turns to corresponding station once more, can be held by suction nozzle once more, then it is transferred to the top of second rotary positioning apparatus, the reason same with first whirligig is after semiconductor devices is pressed down the location once more, transfer to the cutting agency blanking, cutting agency can be for a plurality of, and each occupies a station, and it is corresponding to the workpiece of different qualities, according to the result who detects, the semiconductor devices of the different detected parameters of computer-controllable system is in which cutting agency blanking; For specific semiconductor devices, cutting agency also can have only one, and it is exclusively used in defective blanking, and final qualified workpiece or the semiconductor devices that meets certain quality are sent to braid mechanism and carry out tape package.This device is realized detection, mark, sorting, braid by a plurality of checkout gear collaborative works of computer control on a machine; This apparatus structure compactness, the multistation continuous operation can obviously improve the detection efficiency of separation.
Description of drawings
Fig. 1 is the utility model perspective view.
Fig. 2 is the vertical view after removal rotary table and the nozzle portion in Fig. 1 semiconductor device test separator.
Wherein, 1 separating table, 2 feed mechanisms, 3 first rotary positioning apparatus, 4 detection heads, 5 secondary rotating disks, 6 image pickup heads, 7 mark laser heads, 8 cutting agencies, 9 rotary tables, 10 braid mechanisms, 11 suction nozzles, 12 cavitys, 13 second rotary positioning apparatus, 14 vertical shafts, 15 die cavitys.
The specific embodiment
As Fig. 1 and 2, be semiconductor device test separator, comprise horizontally disposed rotary table 9, rotary table 9 is installed in vertical shaft 14 upper ends, be evenly equipped with some liftable suction nozzles 11 on rotary table 9 excircles, be furnished with successively along clockwise direction and the corresponding separating table 1 in suction nozzle 11 positions around the rotary table 9, first rotary positioning apparatus 3, detection head 4, image pickup head 6, secondary rotating disk 5, second rotary positioning apparatus 13, cutting agency 8 and braid mechanism 10, described separating table 1 is connected with feed mechanism 2, described first rotary positioning apparatus 3, second rotary positioning apparatus 13 respectively comprise one with the suitable die cavity 15 of detected device, die cavity 15 is positioned at suction nozzle 11 belows of corresponding station just; Secondary rotating disk 5 peripheries are evenly equipped with some cavitys 12 that hold detected device, and secondary rotating disk 5 sides are provided with the mark laser head 7 corresponding with cavity 12.
During this device work, semiconductor devices is from feed mechanism 2 material loadings, enter separating table 1 then, suction nozzle is about to the semiconductor devices suction for 11 times in suction nozzle 11 bottoms, suction nozzle 11 lifts then, rotary table turns to first rotary positioning apparatus, 3 tops, suction nozzle 11 is descending, semiconductor devices is pressed down enter in the die cavity 15, under the guide effect of die cavity 15, semiconductor devices rotates, make its position accurately be positioned at the position of setting, so that in detection subsequently, its pin can mate with detection head 4, after suction nozzle 11 rises once more, rotary table rotates a station once more, the pin of detection head 4 and semiconductor devices just over against, suction nozzle 11 is descending, detection head 4 touches pin, every performance indications to semiconductor devices detect, detection head 4 can have a plurality of, lay respectively on the different station, after a kind of parameter detecting finishes, transfer to the detection that next station carries out other parameters again, by detecting, can determine semiconductor devices whether qualified or its belong to any class quality, and give computer and preserve, after detection head 4 detects, semiconductor devices is transferred to next station, image pickup head 6 can carry out outward appearance to it and detect, semiconductor devices is transferred to next station again then, be secondary rotating disk 5 tops, the suction nozzle 11 release semiconductor devices of dying, make semiconductor devices enter into cavity 12, secondary rotating disk 5 rotates, make cavity 12 over against mark laser head 7, mark laser head 7 is stamped corresponding sign to semiconductor devices, detect underproof product for station before, suction nozzle 11 also can not discharge semiconductor devices, enter next station and be with semiconductor devices to cross secondary rotating disk 5, semiconductor devices after the mark turns to corresponding station once more, can be held by suction nozzle 11 once more, then it be transferred to the top of second rotary positioning apparatus 13, the reason same with first rotary positioning apparatus, after semiconductor devices is pressed down the location once more, suction nozzle picks up it, transfers to cutting agency 8 blankings, and cutting agency 8 can be for a plurality of, each occupies a station, it is corresponding to the workpiece of different qualities, and according to the result who detects, the semiconductor devices of the different detected parameters of computer-controllable system is in which cutting agency blanking; For specific semiconductor devices, cutting agency also can have only one, and it is exclusively used in defective blanking, and final qualified workpiece is sent to braid mechanism 10 and carries out tape package.In the present embodiment, cutting agency is two.
Claims (2)
1, semiconductor device test separator, it is characterized in that comprising horizontally disposed rotary table, rotary table is installed in the vertical shaft upper end, be evenly equipped with some liftable suction nozzles on the rotary table excircle, be furnished with successively clockwise or counterclockwise and the corresponding separating table in suction nozzle position around the rotary table, first rotary positioning apparatus, detection head, the image pickup head, secondary rotating disk, second rotary positioning apparatus, cutting agency and braid mechanism, described separating table is connected with feed mechanism, described first rotary positioning apparatus, second rotary positioning apparatus respectively comprise one with the suitable die cavity of detected device, die cavity is positioned at the suction nozzle below of corresponding station just; Secondary rotating disk periphery is evenly equipped with some cavitys that hold detected device, and secondary rotating disk side is provided with the mark laser head corresponding with cavity.
2, semiconductor device test separator according to claim 1 is characterized in that: described cutting agency is provided with two at least.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200362083U CN201399436Y (en) | 2009-03-06 | 2009-03-06 | Semiconductor device testing and sorting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200362083U CN201399436Y (en) | 2009-03-06 | 2009-03-06 | Semiconductor device testing and sorting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201399436Y true CN201399436Y (en) | 2010-02-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009200362083U Expired - Fee Related CN201399436Y (en) | 2009-03-06 | 2009-03-06 | Semiconductor device testing and sorting machine |
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| CN (1) | CN201399436Y (en) |
Cited By (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101493495A (en) * | 2009-03-06 | 2009-07-29 | 江都市东元机电设备有限公司 | Semiconductor device testing and sorting machine |
| CN101933658A (en) * | 2010-08-27 | 2011-01-05 | 中国烟草总公司郑州烟草研究院 | Sample automatic-blanking and code printing device for cigarette inspection |
| CN101933657A (en) * | 2010-08-27 | 2011-01-05 | 中国烟草总公司郑州烟草研究院 | Automatic and random sample split-charging device for cigarette inspection |
| CN102602568A (en) * | 2012-02-22 | 2012-07-25 | 格兰达技术（深圳）有限公司 | Rotary detection marking and taping machine for IC (integrated circuit) block materials and working method of rotary detection marking and taping machine |
| CN102735967A (en) * | 2012-06-13 | 2012-10-17 | 苏州慧捷自动化科技有限公司 | Comprehensive tester for electrical performance of electronic element |
| CN103366912A (en) * | 2013-07-15 | 2013-10-23 | 深圳市众之城电子科技有限公司 | Resistance forming, testing and marking all-in-one machine |
| CN103786911A (en) * | 2012-10-30 | 2014-05-14 | 厦门市弘瀚电子科技有限公司 | Wafer braiding device and method |
| CN103817083A (en) * | 2014-02-24 | 2014-05-28 | 三星高新电机（天津）有限公司 | Tiny product high-speed screening device |
| CN103818596A (en) * | 2014-02-19 | 2014-05-28 | 浙江田中精机股份有限公司 | Electronic coil tester |
| CN104307763A (en) * | 2014-09-28 | 2015-01-28 | 德利赉精密五金制品(深圳)有限公司 | Automatic laser detection device and detection method using automatic laser detection device |
| CN104528015A (en) * | 2014-12-30 | 2015-04-22 | 深圳市良机自动化设备有限公司 | Automatic material replacement method of semiconductor device packing machine |
| CN104841649A (en) * | 2014-02-17 | 2015-08-19 | 泰克元有限公司 | Sorting machine for testing semiconductor elements, and operation method thereof |
| CN104879495A (en) * | 2015-05-29 | 2015-09-02 | 桂林斯壮微电子有限责任公司 | Vacuum sealing device for testing sorting printing braider |
| CN106081225A (en) * | 2016-07-25 | 2016-11-09 | 杭州电子科技大学 | Reel core type headband packer |
| CN106391512A (en) * | 2016-08-29 | 2017-02-15 | 福州派利德电子科技有限公司 | Testing and sorting device for SOT outline integrated circuit chip |
| CN106938255A (en) * | 2017-04-28 | 2017-07-11 | 扬州爱迪秀自动化科技有限公司 | Chip testing classifier device people |
| CN107128523A (en) * | 2017-05-26 | 2017-09-05 | 肇庆市端州区澳蒋科技有限公司 | Shield plane degree automatic detection and carrier band packaging integrated machine |
| CN107215499A (en) * | 2016-03-21 | 2017-09-29 | 无锡昌鼎电子有限公司 | A kind of integrated machine equipment for automated production electronic component |
| CN107499563A (en) * | 2017-08-29 | 2017-12-22 | 深圳市三联光智能设备股份有限公司 | Multistation crystal oscillator testing classification mark braid equipment integrating |
| CN109174677A (en) * | 2018-07-09 | 2019-01-11 | 中国科学院上海光学精密机械研究所 | Pellet sphericity battery checker structure and detection method for separating |
| CN111071530A (en) * | 2019-12-31 | 2020-04-28 | 深圳市标谱半导体科技有限公司 | Turret braider |
| CN113589146A (en) * | 2021-07-29 | 2021-11-02 | 武汉云岭光电有限公司 | Method and system for testing edge-emitting semiconductor laser chip |
| CN113926722A (en) * | 2018-12-11 | 2022-01-14 | 泰克元有限公司 | Sorter for electronic component test and moving device thereof |
| CN115672768A (en) * | 2022-11-10 | 2023-02-03 | 长园半导体设备(珠海)有限公司 | Chip detection device |
-
2009
- 2009-03-06 CN CN2009200362083U patent/CN201399436Y/en not_active Expired - Fee Related
Cited By (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101493495A (en) * | 2009-03-06 | 2009-07-29 | 江都市东元机电设备有限公司 | Semiconductor device testing and sorting machine |
| CN101933658A (en) * | 2010-08-27 | 2011-01-05 | 中国烟草总公司郑州烟草研究院 | Sample automatic-blanking and code printing device for cigarette inspection |
| CN101933657A (en) * | 2010-08-27 | 2011-01-05 | 中国烟草总公司郑州烟草研究院 | Automatic and random sample split-charging device for cigarette inspection |
| CN101933657B (en) * | 2010-08-27 | 2012-07-25 | 中国烟草总公司郑州烟草研究院 | Automatic and random sample split-charging device for cigarette inspection |
| CN101933658B (en) * | 2010-08-27 | 2012-08-15 | 中国烟草总公司郑州烟草研究院 | Sample automatic-blanking and code printing device for cigarette inspection |
| CN102602568A (en) * | 2012-02-22 | 2012-07-25 | 格兰达技术（深圳）有限公司 | Rotary detection marking and taping machine for IC (integrated circuit) block materials and working method of rotary detection marking and taping machine |
| CN102735967A (en) * | 2012-06-13 | 2012-10-17 | 苏州慧捷自动化科技有限公司 | Comprehensive tester for electrical performance of electronic element |
| CN103786911B (en) * | 2012-10-30 | 2016-09-28 | 厦门市弘瀚电子科技有限公司 | Wafer belt-braiding device and wafer braid method |
| CN103786911A (en) * | 2012-10-30 | 2014-05-14 | 厦门市弘瀚电子科技有限公司 | Wafer braiding device and method |
| CN103366912A (en) * | 2013-07-15 | 2013-10-23 | 深圳市众之城电子科技有限公司 | Resistance forming, testing and marking all-in-one machine |
| CN103366912B (en) * | 2013-07-15 | 2016-06-22 | 深圳市众之城电子科技有限公司 | A kind of resistance molding, test, mark all-in-one and operation method thereof |
| CN104841649A (en) * | 2014-02-17 | 2015-08-19 | 泰克元有限公司 | Sorting machine for testing semiconductor elements, and operation method thereof |
| CN103818596B (en) * | 2014-02-19 | 2017-08-22 | 浙江田中精机股份有限公司 | A kind of electronic coil test machine |
| CN103818596A (en) * | 2014-02-19 | 2014-05-28 | 浙江田中精机股份有限公司 | Electronic coil tester |
| CN103817083A (en) * | 2014-02-24 | 2014-05-28 | 三星高新电机（天津）有限公司 | Tiny product high-speed screening device |
| CN104307763A (en) * | 2014-09-28 | 2015-01-28 | 德利赉精密五金制品(深圳)有限公司 | Automatic laser detection device and detection method using automatic laser detection device |
| CN104528015A (en) * | 2014-12-30 | 2015-04-22 | 深圳市良机自动化设备有限公司 | Automatic material replacement method of semiconductor device packing machine |
| CN104879495B (en) * | 2015-05-29 | 2017-03-08 | 桂林斯壮微电子有限责任公司 | A kind of testing, sorting prints the vacuum sealing device of braider |
| CN104879495A (en) * | 2015-05-29 | 2015-09-02 | 桂林斯壮微电子有限责任公司 | Vacuum sealing device for testing sorting printing braider |
| CN107215499A (en) * | 2016-03-21 | 2017-09-29 | 无锡昌鼎电子有限公司 | A kind of integrated machine equipment for automated production electronic component |
| CN107215499B (en) * | 2016-03-21 | 2019-07-16 | 无锡昌鼎电子有限公司 | A kind of integrated machine equipment for automated production electronic component |
| CN106081225B (en) * | 2016-07-25 | 2018-05-15 | 杭州电子科技大学 | Reel core type headband packing machine |
| CN106081225A (en) * | 2016-07-25 | 2016-11-09 | 杭州电子科技大学 | Reel core type headband packer |
| CN106391512A (en) * | 2016-08-29 | 2017-02-15 | 福州派利德电子科技有限公司 | Testing and sorting device for SOT outline integrated circuit chip |
| CN106391512B (en) * | 2016-08-29 | 2020-09-04 | 福州派利德电子科技有限公司 | SOT appearance integrated circuit chip test sorting unit |
| CN106938255A (en) * | 2017-04-28 | 2017-07-11 | 扬州爱迪秀自动化科技有限公司 | Chip testing classifier device people |
| CN107128523A (en) * | 2017-05-26 | 2017-09-05 | 肇庆市端州区澳蒋科技有限公司 | Shield plane degree automatic detection and carrier band packaging integrated machine |
| CN107499563A (en) * | 2017-08-29 | 2017-12-22 | 深圳市三联光智能设备股份有限公司 | Multistation crystal oscillator testing classification mark braid equipment integrating |
| CN109174677A (en) * | 2018-07-09 | 2019-01-11 | 中国科学院上海光学精密机械研究所 | Pellet sphericity battery checker structure and detection method for separating |
| CN113926722A (en) * | 2018-12-11 | 2022-01-14 | 泰克元有限公司 | Sorter for electronic component test and moving device thereof |
| CN111071530A (en) * | 2019-12-31 | 2020-04-28 | 深圳市标谱半导体科技有限公司 | Turret braider |
| CN111071530B (en) * | 2019-12-31 | 2023-12-15 | 深圳市标谱半导体科技有限公司 | Turret braiding machine |
| CN113589146A (en) * | 2021-07-29 | 2021-11-02 | 武汉云岭光电有限公司 | Method and system for testing edge-emitting semiconductor laser chip |
| CN115672768A (en) * | 2022-11-10 | 2023-02-03 | 长园半导体设备(珠海)有限公司 | Chip detection device |
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Addressee: JiangDu Dong Yuan Microelectronices Co., Ltd. Document name: Notification of Termination of Patent Right |
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| DD01 | Delivery of document by public notice |
Addressee: JiangDu Dong Yuan Microelectronices Co., Ltd. Document name: Notification of Decision on Request for Restoration of Right |
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| ASS | Succession or assignment of patent right |
Owner name: WIXI HUAPU MICROELECTRONIC CO., LTD. Free format text: FORMER OWNER: JIANGDU CITY DONGYUAN MECHANICAL + ELECTRICAL EQUIPMENT CO., LTD. Effective date: 20150612 |
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Effective date of registration: 20150612 Address after: 214035 Jiangsu city of Wuxi Province River Road No. 5 Patentee after: WUXI HOPE MICROELECTRONICS CO., LTD. Address before: 225200 Jiangsu Province Jiangdu Sainty Road No. 209 Patentee before: JiangDu Dong Yuan Microelectronices Co., Ltd. |
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Granted publication date: 20100210 Termination date: 20170306 |
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| CF01 | Termination of patent right due to non-payment of annual fee |