CN104841649A - Sorting machine for testing semiconductor elements, and operation method thereof - Google Patents
Sorting machine for testing semiconductor elements, and operation method thereof Download PDFInfo
- Publication number
- CN104841649A CN104841649A CN201510075988.2A CN201510075988A CN104841649A CN 104841649 A CN104841649 A CN 104841649A CN 201510075988 A CN201510075988 A CN 201510075988A CN 104841649 A CN104841649 A CN 104841649A
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- semiconductor element
- test pallet
- test
- operation panel
- pallet
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The present invention discloses a sorting machine for testing produced semiconductor elements, wherein the semiconductor elements are electrically connected to a tester side. By means of the sorting machine, at least one portion of all operations on a manipulator is renewed. In this way, an impact is applied on a test tray, and abnormally placed semiconductor elements are guided to be correctly and properly seated. The manipulator is used for manipulating a latch member of an insert on the test tray. Therefore, the manual operation of administrators is greatly reduced, and the operation efficiency of the sorting machine is improved.
Description
Technical field
The separator used when the present invention relates to the semiconductor element tested and produce, particularly relates to the technology of the improper arrangement processing the improper semiconductor element be placed on test pallet.
Background technology
Test handler as following equipment by disclosed in numerous open source literatures.Namely, by the semiconductor element manufactured by predetermined manufacturing process from after client's pallet (CUSTOMER TRAY) moves to test pallet (TEST TRAY), provide support the tested test-run a machine of semiconductor element (TESTER) test (TEST) enabling to be carried on test pallet, and according to test result, semiconductor element undertaken classifying by grade and move to client's pallet from test pallet.
With reference to No. 10-2013-0105104, KR published patent (denomination of invention: side dock Test handler, hereinafter referred to as " prior art ") etc. known, test pallet is equipped with the insert (INSERT) (with reference to prior art Fig. 3) being formed with the accommodation space that semiconductor element can be made to settle with the form inserted.And the semiconductor element being placed in the accommodation space of insert is fixed to prevent the state departed from by means of latch piece.
The latch piece of insert, as shown in Fig. 5, Fig. 7 a and b of the prior art, operated by operator (being named as in prior art " opening device "), thus can remove the stationary state of semiconductor element.
Usually, after semiconductor element is grasped by pick and place device, the stationary state being positioned in latch piece the accommodation space of insert removed by operator.Now, there are some because of semiconductor element to be grasped abnormally by pick and place device or falling impacts etc. and the situation of normally not settling caused.In the case, as prior art by the back side of camera shooting insert or above and find the exception of insert time, carry out interfering and stop the operation of separator.Then, manager restarts separator after the semiconductor element settled abnormally being adjusted to normal arrangement.
But according to above-mentioned existing method, after interfering, manager needs the bad arrangement in person processing semiconductor element, therefore very loaded down with trivial details.Further, correspondingly, the operation ratio of separator will decline.
Summary of the invention
The object of the present invention is to provide a kind of technology that automatically can correct the improper arrangement of insert.
In order to achieve the above object, survey element test separator according to semiconductor of the present invention, comprising: test pallet, possess multiple insert, described insert has the latch piece of fixing settled semiconductor element; Element shifter, mobile semiconductor element between described test pallet and other load units; Operator, runs in order to the operation of described element shifter, thus by operation described latch piece, semiconductor element is moved; Tray support body, supports described test pallet, can operate described latch piece by described operator; Information acquirer, obtains the improper arrangement whether information about the semiconductor element be placed on described test pallet; Controller, the improper arrangement being placed in the semiconductor element on described test pallet is judged according to the information obtained by described information acquirer, when the arrangement confirming the semiconductor element be placed on described test pallet is improper, described operator is operated at least one times again; Connector, is electrically connected to tester side by the semiconductor element moving to described test pallet by described element shifter.
Operation again by means of the described operator of described controller is the part operation in all operations of the described operator of latch piece for operating described test pallet.
Described operator comprises: operation panel, operates the latch piece of described test pallet by being elevated; Lifter, makes described operation panel be elevated, and wherein, the operation again by means of the described operator of described controller is the operation being elevated described operation panel by running described lifter.
Described operator comprises: operation panel, operates the latch piece of described test pallet by being elevated; First lifter, makes described operation panel be elevated; Plate is set, described first lifter is set; Second lifter, makes the described plate that arranges be elevated, and wherein, the operation again by means of the described operator of described controller makes at least one lifter in described first lifter or described second lifter by operation and is elevated the operation of described operation panel.
Described tray support body comprises: the first holding components, supports the described test pallet of propradation; Second holding components, supports the described test pallet of decline state; Driver, maintains or removes the holding state of described first holding components.
Described operator comprises: multiple operation panel, corresponds respectively to multiple regions of described test pallet, operates the latch piece in described multiple region by being elevated; Lifter, is elevated described multiple operation panel respectively, and wherein, the operation again by means of the described operator of described controller is optionally elevated the operation panel corresponding with the position of the semiconductor element under improper arrangement state.
And, in order to achieve the above object, according to the method for operating of semiconductor element test separator of the present invention, comprising: the first component moving step, the semiconductor element being positioned at the first load units is moved to test pallet; Settle and confirm step, when semiconductor element is loaded onto on test pallet by described first component moving step, confirm that whether the arrangement of the semiconductor element loaded is improper; Settle and guide step, time improper by the described arrangement settling confirmation step to confirm semiconductor element, apply to impact to test pallet and guide semiconductor element correctly to settle; Connection Step, is electrically connected to tester side by the semiconductor element be placed on test pallet; Second component moving step, when completing the test of semiconductor element after described Connection Step, semiconductor element on test pallet is moved to the second load units, described first load units and described second load units can be identical load units or mutually different load units, and described arrangement confirms step and settle to guide step to perform at least one times.
Described arrangement guides step to be undertaken by the descending operation of operation panel, and the latch piece of described operation panel to the semiconductor element acted on fixing test pallet operates.
The lifting of test pallet and described operation panel links and is together elevated, and when test pallet is elevated, latch piece is in and makes semiconductor element be fixed on status releasing on test pallet.
According to the present invention, there is following effect.
First, due to the improper arrangement by means of operator automatic calibration semiconductor element, therefore can reduce gerentocratic loaded down with trivial details operation, and can manpower be reduced.
Secondly, minimum owing to the operation of separator being made to stop by automatic calibration, therefore improve the operation ratio of separator and increase process capacity.
Accompanying drawing explanation
Fig. 1 is the schematic plan view according to semiconductor element test separator of the present invention.
Fig. 2 is the stereogram of the test pallet to the separator being applied to Fig. 1.
Fig. 3 is the summary section of the insert to the test pallet being applied to Fig. 2.
Fig. 4 is the reference diagram of the circulating path of test pallet for illustration of Fig. 2.
Fig. 5 is the approximate three-dimensional map of the operator to the separator being applied to Fig. 1.
Fig. 6 to Fig. 9 is the reference diagram of the function of operator for illustration of Fig. 5.
Figure 10 is the general positive map of the tray support body to the separator being applied to Fig. 1.
Figure 11 and Figure 12 is the reference diagram of the function of tray support body for illustration of Figure 10.
Figure 13 is the flow chart of the method for operating of separator to Fig. 1.
Figure 14 to Figure 16 is the routine reference diagram of the operation again for illustration of the operator as feature of the present invention.
Symbol description
100: semiconductor element test separator 110: the first element shifter
120: loading plate 130: the second element shifter
140: test pallet 141: insert
L: latch piece 150: operator
151a, 151b: operation panel 152: the first lifter
153: plate 154: the second lifter is set
160: tray support body 162: the first holding components
163: the second holding components 164: driver
170: information acquirer CA: controller
180: connector 190: unload support plate
Detailed description of the invention
Hereinafter, with reference to the accompanying drawings of as above according to a preferred embodiment of the invention, omit as far as possible or reduce the explanation of repetition in order to illustrate brevity.
Fig. 1 is the schematic plan view about semiconductor element test separator according to the present invention (hreinafter referred to as " separator ") 100.
As shown in Figure 1, separator 100 according to the present invention comprises: a pair first element shifters 110, a pair loading plate 120, a pair second element shifters 130, test pallet 140, operator 150, tray support body 160, information acquirer 170, controller CA, connector 180 and three unload support plate 190 etc.
First element shifter 110 is for being present in the client's pallet CT loading key element as first
1on semiconductor element move to and load the loading plate 120 of key element as second, or move to vacant client's pallet CT using being present in the semiconductor element unloaded on support plate 190 loading key element as the 4th
2.For this reason, the first element shifter 110 can move in left-right direction, and can move by a small margin along the longitudinal direction.
Loading plate 120 can move along the longitudinal direction, to bear moving backward of non-measuring semiconductor element.That is, if loading plate 120 has loaded semiconductor element by the first element shifter 110 under the state of forwards movement, rearward moved, thus be positioned at the left lateral sides of the test pallet 140 loading key element as the 3rd.
The semiconductor element be positioned on test pallet 140 for the semiconductor element be positioned on loading plate 120 is shifted to test pallet 140, or is shifted to and is unloaded support plate 190 by a pair second element shifters 130.For this reason, the second element shifter 130 can move in left-right direction.
The first above-mentioned element shifter 110 and the second element shifter 130 as by vacuum suction pickup semiconductor element or the pick and place device removing pickup, be a kind of by numerous patent documents known device, therefore description is omitted.
As shown in Figure 2, test pallet 140 has multiple inserts 141 that can load semiconductor element.In addition, as shown in Figure 3, each insert 141 has a pair latch piece L, and this pair latch piece L is used for fixedly being loaded into the semiconductor element in loading chute S or releasing stationary state.
Further, test pallet 140 loopy moving in job position WP and test position TP, and as shown in Figure 4, declines at job position WP and test position TP place or rises, and move along circulating path C.Wherein, job position WP refers to that semiconductor element is loaded (loading) in test pallet 140 or the position obtaining unloading (unloading) from test pallet 140 by means of the second element shifter 130, and test position TP refers to that the semiconductor element being loaded into test pallet 140 is electrically connected on the position of test machine (not shown) side by means of connector 180.
Operator 150 operation is provided to the latch piece L of the insert 141 of test pallet 140, with the loading chute S enabling semiconductor element be loaded on insert 141, or semiconductor element is departed from from loading chute S.Such operator 150 is positioned at the below of the test pallet 140 being in job position WP, and comprises as illustrated in fig. 5: a pair operation panel 151a, 151b; A pair first lifters 152; Plate 153 is set; Second lifter 154; And support component 155.
Operation panel 151a, 151b have the multiple operative pin P for operated latch latch fitting L, and are set to be elevated.
First lifter 152 makes operation panel 151a, 151b be elevated, and can be made up of cylinder or motor.
Plate 153 is set and is provided with the first lifter 152.
Second lifter 154 makes to arrange plate 153 and is elevated, and can be made up of cylinder or motor.
Support component 155 is for supporting the lower end of test pallet 140 when arranging plate 153 and rising.So when only having operation panel 151a, 151b decline (with reference to Fig. 7) after arranging plate 153 and operation panel 151a, 151b rising (with reference to Fig. 6), test pallet 140 can not decline.Certainly, in the state of Fig. 7, change the state that latch piece L fixes semiconductor element into.
Below the operation of operator 150 as above is investigated.
When departing from when wanting under the state at Fig. 8 to make semiconductor element move from test pallet 140 or semiconductor element moved and is loaded into test pallet 140, first lifter 152 and the second lifter 153 start, thus make to arrange plate 153 and operation panel 151a, 151b as shown in Figure 6 state rise like that.So, originally the latch piece L being in the state of fixing semiconductor element D as shown in (a) of Fig. 9 makes lever l rotate operated by operative pin P, thus the shown semiconductor element D that becomes of (b) as Fig. 9 can realize movement for loading or the state of movement for departing from.In addition, the loading of semiconductor element D to test pallet 140 is realized.
If load complete, then operation panel 151a, 151b declines.Now, as shown in Figure 7, the border supported member 155 of test pallet 140 supported, therefore operation panel 151a, 151b is only had to decline, make the mode of operation by means of operation panel 151a, 151b be removed thus, thus latch piece L can be made to revert to the state of being fixed by the semiconductor element being loaded into loading chute S.
Tray support body 160 supports test pallet 140, can realize to make the operation of the latch piece L of the insert 141 being provided to test pallet 140 by means of operator 150.As shown in Figure 10, such tray support body 160 comprises retaining member 161, a pair first holding components 162, a pair second holding components 163, a pair driver 164 and arranges framework 165.
Retaining member 161 is for preventing test pallet 140 from departing from upward when operation panel 151a, 151b rise and operate latch piece L.
As shown in Figure 10, the first holding components 162 supports the test pallet 140 being in propradation.The first holding components 162 like this has both the guide rail function guiding test pallet 140 when test pallet 140 to be transferred from test position TP to job position WP and come, and is configured to rotate to be incorporated into the side that arranges framework 165 for benchmark.
Second holding components 163 is provided to the downside of the first holding components 162, and supports the test pallet 140 being in decline state as illustrated in fig. 11.And the second holding components 163 also has both the guide rail function guiding test pallet 140 when test pallet 140 moves to test position TP from job position WP and goes.
Driver 164 makes the first holding components 162 rotate.So as shown in (a), (b) of Figure 12, the first holding components 162 rotates according to the duty of driver 164, thus the support supporting test pallet 140 or remove test pallet 140.Namely, shown in (a) of Figure 12 under state test pallet 140 support by the first holding components 162, thus prevent the decline of test pallet 140, if but solution removes the support of the test pallet 140 based on the first holding components 162 as the state of (b) of Figure 12, then test pallet 140 can decline.Should illustrate, when the decline of the test pallet 140 carrying out carrying out on circulating path C, test pallet 140 will link in the decline arranging plate 153 and decline with the state that supported member 155 supports.
Framework 165 is set and is provided with above-mentioned retaining member 161, first holding components 162, second holding components 163 and driver 164 etc.
Information acquirer 170 is made up of video camera, and for take load complete test pallet 140 obtain image information above.
The information obtained by information acquirer 170 and standard picture information compare by controller CA, thus judge whether the semiconductor element being placed in test pallet 140 is normally settled, and when confirming the improper arrangement of the semiconductor element being placed in test pallet 140, operator 150 is operated at least again once.Now, the part operation again operated in the integrated operation that both can be operator 150 carried out also can be integrated operation or deformation operation.Separately will establish catalogue to such operation again and illustrate.
The semiconductor element be positioned on test pallet 140 coming test position TP from job position WP pressurizes downwards and is electrically connected on test pusher side by connector 180.
Unload support plate 190 and can move to bear moving forward of the semiconductor element that is completed along the longitudinal direction.That is, if the semiconductor element that will be completed by the second element shifter 130 under unloading support plate 190 is positioned at side on the right side of test pallet 140 state rearward moving loads, then vacant client's pallet CT forwards
2side is moved.
Flow chart and briefly explaining with reference to Figure 13 has the operation of the separator 100 of structure as above.
1, semiconductor element is from client's pallet CT
1<S1> is moved to loading plate 120
First element shifter 110 by the semiconductor element do not tested from client's pallet CT
1move to the loading plate 120 being in the state of forwards advancing.
2, loading plate 120 rearward moves <S2>
If semiconductor element is loaded in loading plate 120, then loading plate 120 rearward moves and is positioned at the left lateral sides of test pallet 140.
3, semiconductor element moves <S3> from loading plate 120 to test pallet 140
Make the semiconductor element being positioned at loading plate 120 move into place test pallet 140 in job position WP by means of the second element shifter 130.At this, in order to make the loading of semiconductor element complete rightly, plate 153 is set and operation panel 151a, 151b will rise.
Should illustrate, above-mentioned <S1> to <S3> can bundle and be illustrated as client's pallet CT
2semiconductor element move to the process of test pallet 140.
4, image information <S4> is obtained
If semiconductor element is complete to the loading of test pallet 140, then obtained the upper surface image information of test pallet 140 by information acquirer 170.
5, be confirmed whether as improper arrangement <S5>
By the image information obtained, controller CA confirms that whether the arrangement of semiconductor element is abnormal.
6, good arrangement <S6> is guided
If be judged as the improper arrangement that there occurs semiconductor element, then controller CA restarts operator 150 and applies to impact to test pallet 140, thus guides the good arrangement of semiconductor element.
Certainly, above-mentioned step <S4> to step <S6> can repeat for several times.
7, test pallet 140 moves <S7> from job position WP to test position TP
If confirmed semiconductor element to be loaded into test pallet 140 well by image information, then operation panel 151a, 151b and plate 153 is set declines, accordingly, the state that test pallet 140 also supports with supported member 155 drop to the position that supports by the second holding components 163, then move to test position TP.At this, in order to make test pallet 140 decline, remove the holding state of test pallet 140 by making the first holding components 162 rotate.
8, semiconductor element is electrically connected on test machine <S8>
The semiconductor element pressurization that the test pallet 140 moving to test position TP loads by connector 180, thus make semiconductor element be electrically connected on test pusher side.
9, test pallet 140 moves <S9> from test position TP to job position WP
If being completed of semiconductor element, then the connection status by means of connector 180 is removed, and then test pallet 140 moves to job position WP after rising.
10, semiconductor element moves <S10> from test pallet 140 to unloading support plate 190
The semiconductor element be completed moves to from test pallet 140 and unloads support plate 190 by the second element shifter 130 under the state arranging plate 153 and operation panel 151a, 151b rising.
Should illustrate, if made semiconductor element all move to from test pallet 140 unload support plate 190 by step <S10>, then the second element shifter 130 then performs step <S3>.
11, unload support plate 190 and forwards move <S11>
If unload the tested complete semiconductor element of support plate 190 loaded, then unload support plate 190 and forwards move.
12, semiconductor element is from unloading support plate 190 to vacant client's pallet CT
2mobile <S12>
In addition, the first element shifter 110 works and moves to vacant client's pallet CT by being positioned at the semiconductor element unloading support plate 190
2.
Should illustrate, above-mentioned step <S10> to <S12> can be tied to be illustrated as and the semiconductor element of test pallet 140 is moved to vacant client's pallet CT
2process.
Then, when confirming in the image information by obtaining by means of information acquirer 170 the improper arrangement that there occurs semiconductor element, with operator 150 again operate be associated and each accompanying drawing of reference below Figure 14 by its operational example classification declaration again.
< first operational example > again
As shown in Figure 6, under the state that plate 153 and operation panel 151a, 151b rising are set, when confirming the improper arrangement being loaded into the semiconductor element on test pallet 140, controller CA operates the first lifter 152 and makes more than operation panel 151a, 151b lifting (rising after declining, below also with the use of identical word meaning) once.By this lifting of operation panel 151a, 151b, apply to impact (impact that the integration again operating impact and operation panel 151a, 151b and the test pallet caused of latch piece causes) to test pallet 140, thus semiconductor element can be guided to carry out correct arrangement.
< second operational example > again
Under the state of Fig. 6, when confirming to be loaded into the improper arrangement of semiconductor element on test pallet 140, the position of improper arrangement that controller CA confirms to occur semiconductor element be the first operation panel 151a in a pair operation panel 151a, 151b the region of being responsible for, or the second operation panel 151b the region of being responsible for, then optionally only make the operation panel 151a/51b in the region of being responsible for the improper arrangement of generation be elevated.
< the 3rd operational example > again
Under the state of Fig. 6, the second lifter 154 is driven together with the first lifter 152, thus make to arrange plate 153 and operation panel 151a, 151b are all elevated.Now, as shown in figure 14, because test pallet 140 is slightly elevated between the lower end of retaining member 161 and the upper end of the first holding components 162, therefore the impact caused thus can additionally be produced.
Obviously, if be necessary, can also be embodied as and only drive the second lifter 154 and do not drive the first lifter 152.
Should illustrate, in first again operational example, as shown in figure 15, the upper end of test pallet 140 abuts to retaining member 161, the lower end of test pallet 140 abuts to support component 155, and therefore the slight lifting as the 3rd test pallet 140 of operational example again can not occur.
< the 4th operational example > again
Under the state of Fig. 6, controller CA runs driver 164 and rotates the first holding components 162 as illustrated in fig. 16.Accordingly, the first holding components 162 becomes the state removed the support of test pallet 140.In the state of Figure 16, controller CA drives the second lifter 154 and lifting arranges plate 153.Now, because test pallet 140 is also together elevated, therefore can the improper arrangement of calibrating semiconductor element according to the impact along with the lifting of test pallet 140.
At this, although operation panel 151a, 151b are declined by the driving of the second lifter 154, because the second lifter 152 is not driven, therefore latch piece L is in the state of fixing semiconductor element.
Obviously, if be necessary, can be implemented as and the first lifter 152 or the second lifter 154 are all driven.
And then, can according to different embodiments, within the scope that above-mentioned operational example again allows in the running status of operator 150 or the first holding components 162, there is different application.
And, in the above-described embodiments, illustrate semiconductor element and be loaded onto test pallet 140 from the loading plate 120 as the second load units, and be unloaded to support plate 190 from test pallet 140.But, according to different separators, after also existing from client's tray loading to test pallet, be unloaded to the situation of client's pallet from test pallet, even if in this case, also can advantageous applications the present invention.
In addition, so-called this technical characteristic of operation being again used for the operator 150 of the improper arrangement of calibrating semiconductor element, can not be misinterpreted as the separator 100 being only applied to the structure with illustrated embodiment.That is, feature of the present invention necessarily all can be applicable to utilize in the separator of variform semiconductor element being loaded into the technology on test pallet 140.
Therefore, as mentioned above, although pin detailed description of the invention is carried out based on the embodiment with reference to accompanying drawing, but above-described embodiment only belongs to the preferred embodiments of the present invention, therefore should not be construed as the present invention and be confined to above-described embodiment, interest field of the present invention should be understood to right and its equivalents.
Claims (9)
1. a semiconductor element test separator, is characterized in that, comprising:
Test pallet, possesses multiple insert, and described insert has the latch piece of fixing settled semiconductor element;
Element shifter, mobile semiconductor element between described test pallet and other load units;
Operator, runs in order to the operation of described element shifter, thus by operation described latch piece, semiconductor element is moved;
Tray support body, supports described test pallet, can operate described latch piece by described operator;
Information acquirer, obtains the improper arrangement whether information about the semiconductor element be placed on described test pallet;
Controller, the improper arrangement being placed in the semiconductor element on described test pallet is judged according to the information obtained by described information acquirer, when the arrangement confirming the semiconductor element be placed on described test pallet is improper, described operator is operated at least one times again;
Connector, is electrically connected to tester side by the semiconductor element moving to described test pallet by described element shifter.
2. semiconductor element test separator according to claim 1, is characterized in that, the operation again by means of the described operator of described controller is the part operation in all operations of the described operator of latch piece for operating described test pallet.
3. semiconductor element test separator according to claim 1, is characterized in that, described operator comprises:
Operation panel, operates the latch piece of described test pallet by being elevated;
Lifter, makes described operation panel be elevated,
Wherein, the operation again by means of the described operator of described controller is the operation being elevated described operation panel by running described lifter.
4. semiconductor element test separator according to claim 1, is characterized in that, described operator comprises:
Operation panel, operates the latch piece of described test pallet by being elevated;
First lifter, makes described operation panel be elevated;
Plate is set, described first lifter is set;
Second lifter, makes the described plate that arranges be elevated,
Wherein, be at least one lifter by running in described first lifter or described second lifter by means of the operation again of the described operator of described controller and be elevated the operation of described operation panel.
5. semiconductor element test separator according to claim 1, is characterized in that, described tray support body comprises:
First holding components, supports the described test pallet of propradation;
Second holding components, supports the described test pallet of decline state;
Driver, maintains or removes the holding state of described first holding components.
6. semiconductor element test separator according to claim 1, is characterized in that, described operator comprises:
Multiple operation panel, corresponds respectively to multiple regions of described test pallet, operates the latch piece in described multiple region by being elevated;
Lifter, is elevated described multiple operation panel respectively,
Wherein, the operation again by means of the described operator of described controller is optionally elevated the operation panel corresponding with the position of the semiconductor element under improper arrangement state.
7. a method of operating for semiconductor element test separator, is characterized in that, comprising:
First component moving step, moves to test pallet by the semiconductor element being positioned at the first load units;
Settle and confirm step, when semiconductor element is loaded onto on test pallet by described first component moving step, confirm that whether the arrangement of the semiconductor element loaded is improper;
Settle and guide step, time improper by the described arrangement settling confirmation step to confirm semiconductor element, apply to impact to test pallet and guide semiconductor element correctly to settle;
Connection Step, is electrically connected to tester side by the semiconductor element be placed on test pallet;
Second component moving step, when completing the test of semiconductor element after described Connection Step, moves to the second load units by the semiconductor element on test pallet,
Described first load units and described second load units are identical load units or mutually different load units,
Described arrangement confirms step and settles to guide step to perform at least one times.
8. the method for operating of semiconductor element test separator according to claim 7, it is characterized in that, described arrangement guides step to be undertaken by the descending operation of operation panel, and the latch piece of described operation panel to the semiconductor element on fixing test pallet operates.
9. the method for operating of semiconductor element test separator according to claim 8, it is characterized in that, the lifting of test pallet and described operation panel links and is together elevated, and when test pallet is elevated, latch piece is in and makes semiconductor element be fixed on status releasing on test pallet.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2014-0017788 | 2014-02-17 | ||
| KR1020140017788A KR102053082B1 (en) | 2014-02-17 | 2014-02-17 | Handler for semiconductor device test and operating method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104841649A true CN104841649A (en) | 2015-08-19 |
| CN104841649B CN104841649B (en) | 2017-07-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510075988.2A Active CN104841649B (en) | 2014-02-17 | 2015-02-12 | Semiconductor element test separator and its operating method |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR102053082B1 (en) |
| CN (1) | CN104841649B (en) |
| TW (1) | TWI519798B (en) |
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| TW201537192A (en) | 2015-10-01 |
| TWI519798B (en) | 2016-02-01 |
| CN104841649B (en) | 2017-07-07 |
| KR102053082B1 (en) | 2020-01-08 |
| KR20150096912A (en) | 2015-08-26 |
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