CN104841649B - Semiconductor element test separator and its operating method - Google Patents
Semiconductor element test separator and its operating method Download PDFInfo
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- CN104841649B CN104841649B CN201510075988.2A CN201510075988A CN104841649B CN 104841649 B CN104841649 B CN 104841649B CN 201510075988 A CN201510075988 A CN 201510075988A CN 104841649 B CN104841649 B CN 104841649B
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- semiconductor element
- test
- test pallet
- pallet
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
Abstract
The present invention discloses a kind of separator that semiconductor element is electrically connected to tester side in the semiconductor element that test is produced.Separator of the invention re-starts at least a portion in all operationss of operator, thus apply impact to test pallet and guide the semiconductor element of improper placement correctly to dispose, wherein, the operator is used to operate the latch piece of the insert being provided on test pallet.Thus, with can significantly reduce the manual working of manager, and the effect of the operation ratio of separator is improved.
Description
Technical field
The present invention relates to test the separator used during the semiconductor element produced, more particularly to process improper placement
In the technology of the improper placement of the semiconductor element on test pallet.
Background technology
Testing, sorting machine is as following equipment disclosed in numerous open source literatures.That is, by by predetermined manufacture
After technique and the semiconductor element that manufactures move to test pallet (TEST TRAY) from client's pallet (CUSTOMER TRAY),
There is provided and support so that the semiconductor element for being carried on test pallet can be tested test-run a machine (TESTER) test (TEST), and according to survey
Test result and semiconductor element is classified by grade and client's pallet is moved to from test pallet.
With reference to No. 10-2013-0105104 (denomination of invention of KR published patent：Side dock testing, sorting machine, hereinafter referred to as
Be " prior art ") etc. understand, on test pallet be equipped be formed with can insert semiconductor element form placement peace
Insert (INSERT) between being empty (with reference to prior art Fig. 3).And, it is placed in the semiconductor of the accommodation space of insert
Element prevents the state for departing from from being fixed with by means of latch piece.
The latch piece of insert (is named in the prior art as shown in Fig. 5, Fig. 7 a and b of the prior art by operator
It is " opening device ") it is operated such that it is able to release the stationary state of semiconductor element.
Generally, after semiconductor element is grasped by pick and place device, the stationary state of latch piece is positioned in by operator institute
The accommodation space of the insert of releasing.Now, there are some abnormally to be grasped or fallen by pick and place device because of semiconductor element
There is no situation about normally disposing caused by impact etc..In the case, shot by camera as prior art and inserted
When entering the back side of part or finding the exception of insert above, interfered and stopped the operation of separator.Then, manager
The semiconductor element that will abnormally dispose is adjusted to after normal placement, restarts separator.
But, according to above-mentioned existing method, after being interfered, manager needs to process in person semiconductor element not
Good placement, thus it is very cumbersome.Also, correspondingly, the operation ratio of separator will decline.
The content of the invention
It is an object of the invention to provide a kind of technology of the improper placement that can automatically correct insert.
In order to achieve the above object, semiconductor of the invention surveys element test separator, including：Test pallet,
Possess multiple inserts, the insert has the latch piece of the disposed semiconductor element of fixation；Element shifter, described
Mobile semiconductor element between test pallet and other load units；Operator, transports for the operation of the element shifter
OK, so as to enable semiconductor element to move by operating the latch piece；Tray support body, supports the test pallet,
So that the latch piece can be operated by the operator；Information acquirer, obtains on being placed on the test pallet
The improper placement whether information of semiconductor element；Controller, judges according to the information obtained by described information getter
The improper placement of the semiconductor element being placed on the test pallet, when confirm be placed on the test pallet half
When the placement of conductor element is improper, the operator is set to re-operate at least one times；Connector, will be moved by the element
The semiconductor element that device moves to the test pallet is electrically connected to tester side.
Re-operating for the operator by means of the controller is latch piece for operating the test pallet
The operator all operationss in part operation.
The operator includes：Operation panel, the latch piece of the test pallet is operated by lifting；Lifter, makes institute
Operation panel is stated to be lifted, wherein, the re-operating for the operator by means of the controller is by running the liter
Drop device and lift the operation of the operation panel.
The operator includes：Operation panel, the latch piece of the test pallet is operated by lifting；First lifter,
Lifted the operation panel；Arranging plate, sets first lifter；Second lifter, is risen the arranging plate
Drop, wherein, the re-operating for the operator by means of the controller is to make first lifter or institute by operation
State at least one of the second lifter lifter and lift the operation of the operation panel.
The tray support body includes：First support part, supports the test pallet of propradation；Second support sector
Part, supports the test pallet of decline state；Driver, maintains or releases the holding state of first support part.
The operator includes：Multiple operation panels, correspond respectively to multiple regions of the test pallet, by lifting
Operate the latch piece in the multiple region；Lifter, lifts the multiple operation panel respectively, wherein, by means of the control
Re-operating for the operator of device is optionally to lift the position pair with the semiconductor element under improper placement state
The operation panel answered.
And, in order to achieve the above object, the operating method of semiconductor element test separator of the invention, bag
Include：First component moving step, test pallet is moved to by the semiconductor element for being located at the first load units；Placement confirms step
Suddenly, when semiconductor element is loaded onto on test pallet by first component moving step, what confirmation was loaded partly leads
Whether the placement of volume elements part is improper；Placement directing step, the peace of semiconductor element is confirmed by the placement verification step
When putting improper, impact is applied to test pallet and guides semiconductor element correctly to dispose；Connection Step, will be placed in test
Semiconductor element on pallet is electrically connected to tester side；Second component moving step, it is complete after by the Connection Step
Into semiconductor element test when, the semiconductor element on test pallet is moved to the second load units, first dress
Carrier unit and second load units can be identical load units or mutually different load units, and the placement confirms
Step and placement directing step are performed at least one times.
The placement directing step is carried out by the descending operation of operation panel, and the operation panel is to acting on fixed test
The latch piece of the semiconductor element on pallet is operated.
Test pallet links with the lifting of the operation panel and together lifts, and when test pallet is lifted, latch piece is in
Semiconductor element is set to be fixed on the status releasing on test pallet.
Had the effect that according to the present invention.
Firstly, since by means of the improper placement of the automatic calibrating semiconductor element of operator, therefore management can be reduced
The cumbersome operation of person, and manpower can be reduced.
Secondly as it is minimum to stop the operation of separator by automatic correction, therefore improve the operation of separator
Rate and increase processing capacity.
Brief description of the drawings
Fig. 1 is the schematic plan view according to semiconductor element test separator of the invention.
Fig. 2 is the stereogram to being applied to the test pallet of the separator of Fig. 1.
Fig. 3 is the summary section to being applied to the insert of the test pallet of Fig. 2.
Fig. 4 is the circulating path of the test pallet for explanatory diagram 2 with reference to figure.
Fig. 5 is the approximate three-dimensional map to being applied to the operator of the separator of Fig. 1.
Fig. 6 to Fig. 9 is the function of the operator for explanatory diagram 5 with reference to figure.
Figure 10 is the general positive map to being applied to the tray support body of the separator of Fig. 1.
Figure 11 and Figure 12 are the function of the tray support body for explanatory diagram 10 with reference to figure.
Figure 13 is the flow chart of the operating method to the separator of Fig. 1.
Figure 14 to Figure 16 is for illustrating as the example for re-operating of the operator of feature of the invention with reference to figure.
Symbol description
100：Semiconductor element test separator 110：First element shifter
120：Loading plate 130：Second element shifter
140：Test pallet 141：Insert
L：Latch piece 150：Operator
151a、151b：Operation panel 152：First lifter
153：Arranging plate 154：Second lifter
160：Tray support body 162：First support part
163：Second support part 164：Driver
170：Information acquirer CA：Controller
180：Connector 190：Unload support plate
Specific embodiment
Hereinafter, with reference to the accompanying drawings of as described above according to a preferred embodiment of the invention, for the brevity of explanation
The explanation for repeating is omitted or reduced as far as possible.
Fig. 1 is on semiconductor element test separator of the invention (hreinafter referred to as " separator ") 100
Schematic plan view.
As shown in figure 1, separator of the invention 100 includes：A pair first element shifters 110, a pair of loading plates
120th, a pair second element shifters 130, test pallet 140, operator 150, tray support body 160, information acquirer 170,
Controller CA, connector 180 and three unload support plate 190 etc..
First element shifter 110 is used to will be present in as the first client's pallet CT for loading key element1On semiconductor
Element is moved to and loads the loading plate 120 of key element as second, or will be present in unloading support plate 190 as the 4th loading key element
On semiconductor element move to vacant client's pallet CT2.Therefore, the first element shifter 110 can be moved in left-right direction, and
Can move by a small margin along the longitudinal direction.
Loading plate 120 can be moved along the longitudinal direction, and being moved rearwards by for semiconductor element is not tested to undertake.That is, load
Plate 120 is rearward moved in the state of moving forwards if semiconductor element has been loaded by the first element shifter 110,
So as to be located at the left lateral sides as the 3rd test pallet 140 for loading key element.
A pair second element shifters 130 are used to for the semiconductor element being located on loading plate 120 to shift to test pallet
140, or the semiconductor element being located on test pallet 140 is shifted to and unloads support plate 190.Therefore, the second element shifter 130 can
Move in left-right direction.
Above-mentioned the first element shifter 110 and the second element shifter 130 are partly led as can be picked up by vacuum suction
Volume elements part releases the pick and place device picked up, and is a kind of device known by numerous patent documents, therefore it is detailed to omit its
Describe in detail bright.
As shown in Fig. 2 test pallet 140 has the multiple inserts 141 that can load semiconductor element.In addition, such as Fig. 3
Shown, each insert 141 there are a pair of latch piece L, a pair of latch piece L to be used for fixation be loaded into partly leading in loading chute S
Volume elements part releases stationary state.
Also, the loopy moving of test pallet 140 is in job position WP and test position TP, and as shown in figure 4, in operation position
Put down or up at WP and test position TP, and moved along circulating path C.Wherein, job position WP refers to semiconductor element
It is loaded (loading) and is unloaded in test pallet 140 or from test pallet 140 by means of the second element shifter 130
The position of (unloading) is carried, test position TP refers to the semiconductor element for being loaded into test pallet 140 by means of connector
180 and be electrically connected to the position of test machine (not shown) side.
Operator 150 operates the latch piece L of the insert 141 for being provided to test pallet 140, so that semiconductor element can
The loading chute S of insert 141 is loaded on, or semiconductor element is departed from from loading chute S.Such operator 150
The lower section of the test pallet 140 of job position WP is lain in, and is included as illustrated in fig. 5：A pair of operation panels 151a, 151b；
A pair first lifters 152；Arranging plate 153；Second lifter 154；And support member 155.
Operation panel 151a, 151b have for operating multiple operation pin P of latch piece L, and are configured to lifting.
First lifter 152 lifts operation panel 151a, 151b, and can be made up of cylinder or motor.
Arranging plate 153 is provided with the first lifter 152.
Second lifter 154 lifts arranging plate 153, and can be made up of cylinder or motor.
Support member 155 is used to be supported when arranging plate 153 rises the lower end of test pallet 140.Then, arranging plate is worked as
153 and operation panel 151a, 151b rise (reference picture 6) after only operation panel 151a, 151b decline (reference picture 7) when, test
Pallet 140 will not decline.Certainly, in the state of Fig. 7, it is changed into the state that latch piece L fixes semiconductor element.
Operation to operator as described above 150 below is investigated.
Depart from from test pallet 140 or by semiconductor element when wanting to make semiconductor element to move in the state of Fig. 8
When part is moved and is loaded into test pallet 140, the first lifter 152 and the second lifter 153 start, so that arranging plate 153
Rise like that with operation panel 151a, 151b state as shown in Figure 6.Then, partly led in fixation originally as shown in (a) of Fig. 9
The latch piece L of the state of volume elements part D rotates lever l operated by operation pin P, so as to turn into half as shown in (b) of Fig. 9
Conductor element D can realize the state of the movement for loading or the movement for departing from.Moreover, it is achieved that semiconductor element D is to survey
Try the loading of pallet 140.
If loading is finished, operation panel 151a, 151b decline.Now, as shown in fig. 7, the border quilt of test pallet 140
Support member 155 is supported, therefore only operation panel 151a, 151b declines, and thus makes the behaviour by means of operation panel 151a, 151b
Released as state, the state that the semiconductor element of loading chute S is fixed will be loaded into such that it is able to revert to latch piece L.
Tray support body 160 supports test pallet 140, so as to be provided to the latch piece of the insert 141 of test pallet 140
The operation of L can be realized by means of operator 150.As shown in Figure 10, such tray support body 160 include retaining member 161,
A pair first support parts 162, a pair second support parts 163, a pair of drivers 164 and setting framework 165.
Retaining member 161 is used to prevent test pallet when operation panel 151a, 151b rise and operate latch piece L
140 depart from upward.
As shown in Figure 10, test pallet 140 of the support of the first support part 162 in propradation.Such first
Hold part 162 have both when test pallet 140 transfer from test position TP to job position WP come when guiding test pallet 140
Guide rail function, and be configured to by be incorporated into set framework 165 side on the basis of rotated.
Second support part 163 is provided to the downside of the first support part 162, and support as illustrated in fig. 11 in decline
The test pallet 140 of state.And, the second support part 163 also has both when test pallet 140 is from job position WP to test position
The guide rail function of guiding test pallet 140 when putting TP movements and going.
Driver 164 rotates the first support part 162.Then, as shown in (a), (b) of Figure 12, the first support part
162 rotate according to the working condition of driver 164, so as to support test pallet 140 or release to the branch of test pallet 140
Support.That is, test pallet 140 is supported by the first support part 162 under state shown in (a) in Figure 12, so as to prevent test from holding in the palm
The decline of disk 140, but if the solution as the state of (b) of Figure 12 removes the test pallet 140 based on the first support part 162
Support, then test pallet 140 be possible to decline.Should illustrate, when the test pallet 140 for carried out on circulating path C
Decline when, test pallet 140 will be in linkage with the decline of arranging plate 153 and with supported member 155 in the state of support
Drop.
Set framework 165 be provided with above-mentioned retaining member 161, the first support part 162, the second support part 163 with
And driver 164 etc..
Information acquirer 170 is by image mechanism into and loading above the test pallet 140 that finishes and obtain for shooting
Image information.
With standard picture information be compared the information obtained by information acquirer 170 by controller CA, so as to judge peace
Whether the semiconductor element for being placed in test pallet 140 normally disposes, and is confirming the semiconductor element that is placed in test pallet 140
During the improper placement of part, operator 150 is at least re-operated more than once.Now, re-operating for being carried out both can be with
Be operator 150 integrated operation in a part operation, or integrated operation or deformation operation.Grasped again to such
Work separately will set catalogue and illustrate.
Connector 180 will come the semiconductor element on test pallet 140 of test position TP from job position WP
Pressurize downwards and be electrically connected to test pusher side.
Unloading support plate 190 can move to undertake the forward movement of the semiconductor element being completed along the longitudinal direction.That is, unload
Plate 190 rearward move and if will be surveyed by the second element shifter 130 in the state of being located at the right side side of test pallet 140
The semiconductor element that examination is finished is loaded, then vacant client's pallet CT forwards2Side shifting.
The flow chart of reference picture 13 and briefly explain the operation of the separator 100 with construction as described above.
1st, semiconductor element is from client's pallet CT1Moved to loading plate 120<S1>
The semiconductor element that first element shifter 110 will not tested is from client's pallet CT1Before moving to side forwardly
The loading plate 120 of the state entered.
2nd, loading plate 120 is rearward moved<S2>
If semiconductor element is loaded in loading plate 120, loading plate 120 is rearward moved and is located at test pallet
140 left lateral sides.
3rd, semiconductor element is moved from loading plate 120 to test pallet 140<S3>
The semiconductor element for being located at loading plate 120 is set to move into place in operation position by means of the second element shifter 130
Put the test pallet 140 of WP.Here, in order that the loading of semiconductor element is appropriately completed, arranging plate 153 and operation panel
151a, 151b will rise.
Should illustrate, it is above-mentioned<S1>Extremely<S3>It is by client's pallet CT that explanation can be bundled2Semiconductor element move to
The process of test pallet 140.
4th, image information is obtained<S4>
If semiconductor element is finished to the loading of test pallet 140, test support is obtained by information acquirer 170
The upper surface image information of disk 140.
5th, it is confirmed whether it is improper placement<S5>
Controller CA confirms whether the placement of semiconductor element is abnormal by the image information for obtaining.
6th, good placement is guided<S6>
If it is determined that there occurs the improper placement of semiconductor element, then controller CA restarting operators 150 and
Test pallet 140 is applied to impact, so as to guide the good placement of semiconductor element.
Certainly, above-mentioned step<S4>To step<S6>May be repeated several times.
7th, test pallet 140 is moved from job position WP to test position TP<S7>
If semiconductor element is confirmed by image information is loaded into test pallet 140, operation panel well
151a, 151b and arranging plate 153 decline, accordingly, test pallet 140 also with supported member 155 drop in the state of support
The position supported by the second support part 163, then moves to test position TP.Here, in order that under test pallet 140
Drop, the holding state of test pallet 140 is released by rotating the first support part 162.
8th, semiconductor element is electrically connected to test machine<S8>
The semiconductor element pressurization that the test pallet 140 that connector 180 will be moved into test position TP is loaded, so that
Semiconductor element is electrically connected to test pusher side.
9th, test pallet 140 is moved from test position TP to job position WP<S9>
If semiconductor element is completed, the connection status by means of connector 180 is released from, then test support
Disk 140 moves to job position WP after rising.
10th, semiconductor element is moved from test pallet 140 to support plate 190 is unloaded<S10>
Second element shifter 130 will be completed in the state of arranging plate 153 and operation panel 151a, 151b rise
Semiconductor element is moved to from test pallet 140 and unloads support plate 190.
Should illustrate, if passing through step<S10>And semiconductor element is all moved to from test pallet 140 and unload support plate
190, then the second element shifter 130 then perform step<S3>.
11st, support plate 190 is unloaded to move forwards<S11>
If unloading the tested semiconductor element for finishing of support plate 190 to be loaded, unload support plate 190 and move forwards.
12nd, semiconductor element is from unloading support plate 190 to vacant client's pallet CT2It is mobile<S12>
In addition, the first element shifter 110 works and will be located at, the semiconductor element for unloading support plate 190 moves to vacant visitor
Family pallet CT2。
Should illustrate, above-mentioned step<S10>Extremely<S12>It is by the semiconductor element of test pallet 140 that explanation can be tied to
Part moves to vacant client's pallet CT2Process.
Then, confirm and there occurs semiconductor element by the image information obtained by means of information acquirer 170
Improper placement in the case of, be associated and each accompanying drawing of reference picture below 14 is by it with re-operating for operator 150
Re-operate a classification declaration.
<First re-operates example>
As shown in fig. 6, in the state of arranging plate 153 and operation panel 151a, 151b rise, confirming to be loaded into test support
During the improper placement of the semiconductor element on disk 140, controller CA the first lifters 152 of operation make operation panel 151a, 151b
It is more than lifting (rising after decline, also used with identical word meaning below) once.By this liter of operation panel 151a, 151b
Drop, impact (impact and operation panel 151a, 151b and test support that the re-operating of latch piece causes are applied to test pallet 140
The impact that the integration of disk causes), such that it is able to guide semiconductor element correctly to be disposed.
<Second re-operates example>
In the state of Fig. 6, when confirming the improper placement of the semiconductor element that is loaded on test pallet 140, control
Device CA confirms that the position of the improper placement that semiconductor element occurs is the first operation panel in a pair of operation panels 151a, 151b
The region that 151a is responsible for, or the region that the second operation panel 151b is responsible for, then optionally only make to be responsible for anon-normal
Often the operation panel 151a/51b in the region of placement is lifted.
<3rd operation example again>
In the state of Fig. 6, the second lifter 154 is driven together with the first lifter 152, so that arranging plate
153 and operation panel 151a, 151b all lift.Now, as shown in figure 14, because test pallet 140 is under retaining member 161
Slightly lifted between end and the upper end of the first support part 162, therefore can additionally produce the impact for thus causing.
Obviously, if necessary, being also implemented as only driving the second lifter 154 without driving the first lifter 152.
Should illustrate, in re-operating example first, as shown in figure 15, the upper end of test pallet 140 abuts to anti-delinking part
Part 161, the lower end of test pallet 140 abuts to support member 155, therefore will not occur such as the test support of the 3rd operation example again
The slight lifting of disk 140.
<4th operation example again>
In the state of Fig. 6, controller CA runs driver 164 and rotates the first support part 162 as illustrated in fig. 16.
Accordingly, the first support part 162 becomes to release the state to the support of test pallet 140.In the state of Figure 16, controller CA
Drive the second lifter 154 and lift arranging plate 153.Now, because test pallet 140 is also together to lift, therefore basis
It is capable of the improper placement of calibrating semiconductor element along with the impact of the lifting of test pallet 140.
Herein, although operation panel 151a, 151b are declined by the driving of the second lifter 154, but due to the second lifting
Device 152 is not driven, therefore latch piece L is in the state of fixed semiconductor element.
Obviously, if necessary, can be implemented such that the first lifter 152 or the second lifter 154 are driven.
And then, can be according to different implementation methods, above-mentioned re-operates example in the support part of operator 150 or first
162 running status has different applications within the scope of allowing.
And, in the above-described embodiments, illustrate semiconductor element and filled from the loading plate 120 as the second load units
Test pallet 140 is downloaded to, and support plate 190 is unloaded to from test pallet 140.But, according to different separators, also in the presence of from
Client's tray loading is unloaded to the situation of client's pallet from test pallet to after test pallet, even if in this case,
Can preferably using the present invention.
In addition, the operator 150 of the so-called improper placement for calibrating semiconductor element re-operates this technology
Feature, can not be misinterpreted as being applied only for the separator 100 of the structure with illustrated embodiment.That is, feature of the invention
Necessarily can be applied to the separator of the variform using technology semiconductor element being loaded on test pallet 140
In.
Therefore, as described above, although for detailed description of the invention carried out based on embodiment referring to the drawings, but
Above-described embodiment only only belongs to the preferred embodiments of the present invention, therefore present invention should not be construed as limited to above-described embodiment, this
The interest field of invention should be understood right and its equivalents.
Claims (9)
1. a kind of semiconductor element test separator, it is characterised in that including：
Test pallet, possesses multiple inserts, and the insert has the latch piece of the disposed semiconductor element of fixation；
Element shifter, the mobile semiconductor element between the test pallet and other load units；
Operator, lies in the lower section of the test pallet of job position, enters for the operation of the element shifter
Row descending operation, so as to enable semiconductor element to move by operating the latch piece；
Tray support body, supports the test pallet, can operate the latch piece by the operator；
Information acquirer, obtains the improper placement whether letter of the semiconductor element on being placed on the test pallet
Breath；
Controller, the semiconductor element being placed on the test pallet is judged according to the information obtained by described information getter
The improper placement of part, when the placement for confirming the semiconductor element being placed on the test pallet is improper, makes described
Operator is re-operated at least one times, semiconductor element is correctly disposed to apply impact to the test pallet；
Connector, tester is electrically connected to by the semiconductor element for moving to the test pallet by the element shifter
Side.
2. semiconductor element test separator according to claim 1, it is characterised in that by means of the controller
The operator re-operate be for operating all operationss of the operator of the latch piece of the test pallet in
Part operation.
3. semiconductor element test separator according to claim 1, it is characterised in that the operator includes：
Operation panel, the latch piece of the test pallet is operated by lifting；
Lifter, is lifted the operation panel,
Wherein, by means of the controller the operator re-operate be lifted by running the lifter it is described
The operation of operation panel.
4. semiconductor element test separator according to claim 1, it is characterised in that the operator includes：
Operation panel, the latch piece of the test pallet is operated by lifting；
First lifter, is lifted the operation panel；
Arranging plate, sets first lifter；
Second lifter, is lifted the arranging plate,
Wherein, the re-operating for the operator by means of the controller is by running first lifter or described
At least one of second lifter lifter and lift the operation of the operation panel.
5. semiconductor element test separator according to claim 1, it is characterised in that the tray support body bag
Include：
First support part, supports the test pallet of propradation；
Second support part, supports the test pallet of decline state；
Driver, maintains or releases the holding state of first support part.
6. semiconductor element test separator according to claim 1, it is characterised in that the operator includes：
Multiple operation panels, correspond respectively to multiple regions of the test pallet, in operating the multiple region by lifting
Latch piece；
Lifter, lifts the multiple operation panel respectively,
Wherein, the re-operating for the operator by means of the controller is optionally to lift and improper placement state
Under semiconductor element the corresponding operation panel in position.
7. a kind of operating method of semiconductor element test separator, it is characterised in that including：
First component moving step, test pallet is moved to by the semiconductor element for being located at the first load units；
Placement verification step, when semiconductor element is loaded onto on test pallet by first component moving step, really
Whether the placement for recognizing loaded semiconductor element is improper；
Placement directing step, by it is described placement verification step confirm semiconductor element placement it is improper when, to test hold in the palm
Disk applies impact and guides semiconductor element correctly to dispose；
Connection Step, the semiconductor element that will be placed on test pallet is electrically connected to tester side；
Second component moving step, when the test of semiconductor element is completed after by the Connection Step, test is held in the palm
Semiconductor element on disk is moved to the second load units,
First load units and second load units are identical load units or mutually different load units,
The placement verification step and placement directing step are performed at least one times.
8. the operating method of semiconductor element test separator according to claim 7, it is characterised in that the placement
Directing step is carried out by the descending operation of operation panel, and the operation panel is to the semiconductor element for fixing on test pallet
Latch piece operated.
9. the operating method of semiconductor element test separator according to claim 8, it is characterised in that test pallet
Lifting with the operation panel links and together lifts, and when test pallet is lifted, latch piece is in fixes semiconductor element
Status releasing on test pallet.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020140017788A KR102053082B1 (en) | 2014-02-17 | 2014-02-17 | Handler for semiconductor device test and operating method thereof |
| KR10-2014-0017788 | 2014-02-17 |
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| CN104841649A CN104841649A (en) | 2015-08-19 |
| CN104841649B true CN104841649B (en) | 2017-07-07 |
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| CN201510075988.2A Active CN104841649B (en) | 2014-02-17 | 2015-02-12 | Semiconductor element test separator and its operating method |
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|---|---|
| KR (1) | KR102053082B1 (en) |
| CN (1) | CN104841649B (en) |
| TW (1) | TWI519798B (en) |
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| KR102461013B1 (en) * | 2016-10-13 | 2022-11-01 | (주)테크윙 | Handler for testing electronic devices and method for adjusting teaching point thereof |
| KR102249305B1 (en) * | 2019-04-15 | 2021-05-07 | 주식회사 아테코 | Electronic device test handler |
| CN114472191A (en) * | 2020-11-12 | 2022-05-13 | 泰克元有限公司 | Sorter for processing electronic parts and method for confirming whether insert has defect |
| WO2023068768A1 (en) * | 2021-10-19 | 2023-04-27 | (주)테크윙 | Test handler and control method therefor |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100429875B1 (en) * | 2001-07-23 | 2004-05-04 | 삼성전자주식회사 | Method of inspecting collection states of semiconductor chips collected in tray |
| JP4137711B2 (en) * | 2003-06-16 | 2008-08-20 | 東京エレクトロン株式会社 | Substrate processing apparatus and substrate transfer means positioning method |
| CN101014509A (en) * | 2004-04-18 | 2007-08-08 | 安堤格里斯公司 | Wafer container door with particulate collecting structure |
| KR100892254B1 (en) * | 2006-07-20 | 2009-04-17 | (주)테크윙 | Test handler |
| JP5132904B2 (en) * | 2006-09-05 | 2013-01-30 | 東京エレクトロン株式会社 | Substrate positioning method, substrate position detection method, substrate recovery method, and substrate position deviation correction apparatus |
| KR101007934B1 (en) * | 2008-12-19 | 2011-01-14 | 세크론 주식회사 | Method and apparatus for transferring test trays |
| CN201399436Y (en) * | 2009-03-06 | 2010-02-10 | 江都市东元机电设备有限公司 | Semiconductor device testing and sorting machine |
| CN201655775U (en) | 2010-01-14 | 2010-11-24 | 嘉兴景焱智能装备技术有限公司 | Positioning mechanism for chip testing processor |
| KR101664220B1 (en) | 2011-11-29 | 2016-10-11 | (주)테크윙 | Test handler and method for operating the same |
| KR101334765B1 (en) * | 2012-04-18 | 2013-11-29 | 미래산업 주식회사 | Handling System for Semiconductor device |
| KR101347531B1 (en) * | 2013-01-22 | 2014-01-10 | 미래산업 주식회사 | Apparatus for spinning test tray of in-line test handler and in-line test handler |
-
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| Publication number | Publication date |
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| TWI519798B (en) | 2016-02-01 |
| KR20150096912A (en) | 2015-08-26 |
| TW201537192A (en) | 2015-10-01 |
| CN104841649A (en) | 2015-08-19 |
| KR102053082B1 (en) | 2020-01-08 |
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