CN103786911B - Wafer belt-braiding device and wafer braid method - Google Patents
Wafer belt-braiding device and wafer braid method Download PDFInfo
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Abstract
A kind of wafer belt-braiding device, for picking out qualified wafer in wafer stack and with carrier band, it being carried out braid operation with cover strip, described wafer belt-braiding device includes screening installation and braid equipment, described screening installation is used for picking out qualified wafer, and transfer it to described braid equipment, described braid equipment is connected with screening installation, for qualified wafer is carried out braid operation.The present invention also provides for a kind of wafer braid method.Described wafer belt-braiding device and wafer braid method can operate with braid by effective coordination Wafer Sort, accurately select qualified wafer, and judge rapidly to adjust carrier band position to place described qualified wafer, thus carry out braid encapsulation in time, accelerate braid speed, it is provided that work efficiency.
Description
Technical field
The present invention relates to a kind of wafer processing apparatus and processing method, a kind of automatization combines Wafer Sort and the integrated device of braid function and using method thereof.
Background technology
Wafer is the base stock manufacturing integrated circuit.Manufacture wafer operation and specifically include that first by element silicon purification (99.999%) in addition, then these pure silicons are grown into silicon crystal bar, afterwards through programs such as photomechanical production, polishing, sections, polysilicon is melted pull-out silicon single crystal rod, finally cuts into the veryyest thin wafer.
Together, the most each wafer is certified products to the preliminary wafer stack cut.It is necessary to pick out the most qualified wafer, and carries out a large amount of qualified wafer picked out arranging encapsulation, ultimately generate and facilitate the wafer of shipping storage to wrap up.Wafer current, especially bare crystalline, relevant select and encapsulation technology is the most immature, it is impossible to effectively carry out associative operation.
Summary of the invention
Based on this, it is necessary to provide a kind of high efficiency that wafer especially bare crystalline carries out the wafer belt-braiding device of sorting and braid operation.
There is a need to provide a kind of wafer braid method.
A kind of wafer belt-braiding device, for picking out qualified wafer and with carrier band, it being carried out braid operation with cover strip in wafer stack.Described wafer belt-braiding device includes screening installation, braid equipment and controller.Described screening installation is used for picking out qualified wafer.Described controller is electrically connected described screening installation and described braid equipment, transfers described qualified wafer to the braid equipment being positioned at vacant state for controlling screening installation.Described braid equipment is for carrying out braid operation to described qualified wafer.
Disclosed wafer belt-braiding device and using method thereof can operate with braid by effective coordination Wafer Sort, accurately select qualified wafer, and judge rapidly to adjust carrier band position to place described qualified wafer, thus carry out braid encapsulation in time, accelerate braid speed, it is provided that work efficiency.
[accompanying drawing explanation]
Fig. 1 is in the first embodiment of the present invention, the schematic perspective view one of wafer belt-braiding device.
Fig. 2 is enlarged diagram at the A in Fig. 1.
Fig. 3 is in the first embodiment of the present invention, the schematic perspective view two of wafer belt-braiding device.
Fig. 4 is enlarged diagram at the B in Fig. 3.
Fig. 5 is enlarged diagram at the C in Fig. 3.
Fig. 6 is in the first embodiment of the present invention, the operation principle block diagram of wafer belt-braiding device.
Fig. 7 is in the second embodiment of the present invention, the schematic perspective view of wafer belt-braiding device.
Fig. 8 is in the first embodiment of the present invention, the workflow diagram of wafer belt-braiding device.
Description of reference numerals:
| Wafer belt-braiding device | 100、100a | Screening installation | 10、10a |
| The brilliant parts in top | 11、11a | First plummer | 111、111a |
| Mobile element | 112 | First monitoring parts | 12 |
| Charge coupling camera | 121、211 | Display unit | 13 |
| Input block | 14 | Keyboard | 141 |
| Mouse | 142 | Transfer member | 15 |
| Support arm | 151 | Vacuum slot | 152 |
| Braid equipment | 20、20a | Second monitoring parts | 21 |
| Carrier tape features | 22、22a | Carrier band dish | 221 |
| Second plummer | 222 | Pressing end | 2221 |
| Second suspended axle | 223 | Cover strip parts | 23、23a |
| Cover strip dish | 231 | Transmit wheel | 232 |
| Pillar | 233 | First suspended axle | 234 |
| Pressing parts | 24 | Heater | 241 |
| Pressure head | 242 | Coiling parts | 25、25a |
| Pedestal | 30 | Controller | 40 |
| Processing unit | 41 | Memory element | 42 |
| Charging tray | 901、901a | Wafer stack | 902 |
| Surveying wafer | 903 | Qualified wafer | 904 |
| Cover strip | 905、905a | Carrier band | 906、906a |
| Carry hole | 907 | Hole, location | 908 |
| Packaging belt | 909、909a | Molding load plate | 910 |
| First control signal | S1 | Second control signal | S2 |
| 3rd control signal | S3 | 4th control signal | S4 |
[detailed description of the invention]
In conjunction with shown in Fig. 1 to Fig. 5, the wafer belt-braiding device 100 that present pre-ferred embodiments discloses is for the qualified wafer 904 picked out on charging tray 901 in wafer stack 902, and qualified wafer 904 carries out braid operation to generate molding load plate 910.Wafer belt-braiding device 100 includes screening installation 10, braid equipment 20, pedestal 30 and controller 40.Pedestal 30 houses controller 40, and carries screening installation 10 and braid equipment 20.Controller 40 electrically connects with screening installation 10 and braid equipment 20, to control screening installation 10 and the running of braid equipment 20.During work, the every characterisitic parameter at survey wafer 903 in screening installation 10 test wafer heap 902, such as length and width size, wavelength, luminous intensity, lighting angle and running voltage etc., wherein pick out qualified wafer 904.Controller 40 judges braid equipment 20 current state and to adjust current state be vacant state, then controls screening installation 10 and transfers qualified wafer 904 to the braid equipment 20 being positioned at vacant state.Braid equipment 20 is connected with screening installation 10, with carry 906 with cover strip 905 qualified wafer 904 is carried out braid operation.Wherein braid equipment 20 has two states, and one is glove state, and it two is vacant state.Wherein glove state refers to that the current location carrying 906 on braid equipment 20 has placed wafer, and vacant state then refers to that the current location carrying 906 on braid equipment 20 is room, does not place wafer.In the present embodiment, wafer refers to bare crystalline.
Screening installation 10 includes pushing up brilliant parts the 11, first monitoring parts 12, display unit 13, input block 14 and transfer member 15.Wherein, brilliant parts the 11, first monitoring parts 12 in top, display unit 13, input block 14 and transfer member 15 are pedestal 30 and are supported.Refer to Fig. 6, controller 40 electrically connects each parts in screening installation 10, to control the running of each parts of screening installation 10.
The brilliant parts 11 in top are used for carrying wafer stack 902.First monitoring parts 12, for monitoring the wafer stack 902 being positioned on the brilliant parts 11 in top, to survey every characterisitic parameter of wafer 903 reality in test wafer heap 902, is called for short wafer actual parameter.Display unit 13 is liquid crystal display (LCD), and it is used for showing function choosing-item frame, surveying the information such as wafer 903 image.Input block 14 for inputting wafer canonical parameter or other operational orders of qualified wafer to controller 40.Controller 40 receives and stores the wafer canonical parameter that input block 14 is inputted, and obtains and analyze wafer actual parameter, thus produces the first control signal S1.Transfer member 15 receives the first control signal S1, captures qualified wafer 904.
The brilliant parts 11 in top include the first plummer 111 and mobile element 112.First plummer 111 is arranged on mobile element 112.It is removably disposed charging tray 901 on first plummer 111.Mobile element 112 is arranged on described pedestal 30, can vertically move up and down and can move along orthogonal two horizontal directions.First monitoring parts 12 includes that charge coupling camera 121 is surveying the image of wafer 903 with shooting, and is corresponding wafer actual parameter by video conversion.Input block 14 includes keyboard 141 and mouse 142, to input canonical parameter and other instructions.Controller 40 includes processing unit 41 and memory element 42.Memory element 42 is used for storing canonical parameter.Processing unit 41 is used for receiving wafer actual parameter, transfers the wafer canonical parameter being positioned at memory element 42, and contrasts wafer actual parameter and wafer canonical parameter, to judge whether wafer actual parameter meets the requirements.If wafer actual parameter meets the requirements, then processing unit 41 produces the first control signal S1；If wafer actual parameter is undesirable, then processing unit 41 produces defective notification signal.The liquid crystal display of described display unit 13 shows according to defective notification signal is surveying the underproof information of wafer 903.Transfer member 15 includes support arm 151 and vacuum slot 152.Controller 40 drives vacuum slot 152 to draw qualified wafer 904 with the first control signal S1.
Braid equipment 20 includes the second monitoring parts 21, carrier tape features 22, cover strip parts 23, pressing parts 24 and coiling parts 25.Second monitoring parts 21, carrier tape features 22, cover strip parts 23, pressing parts 24 and coiling parts 25 are connected with controller 40 respectively.Carrier tape features 22 is used for depositing carrier band 906.Carrier band 906 is 0.3mm ground paper band, and its surface is provided with the through hole that two row are parallel, is respectively and carries hole 907 and hole 908, location.Carry hole 907 for placing the qualified wafer 904 that transfer member 16 captures.Hole, location 908 is for regulating the position of carrier band 906, to guarantee that qualified wafer 904 can accurately be positioned in load hole 907.Cover strip parts 23 are arranged at the top of carrier tape features 22, on the i.e. second plummer 222, and are supported by carrier tape features 22.Pressing parts 24 and coiling parts 25 are arranged at one end of carrier tape features 22 and pressing parts 24 between carrier tape features 22 and coiling parts 25.Coiling parts 25 are used for drawing packaging belt 909 away from carrier tape features 22, and packaging belt 909 carry out coiled manipulations to generate molding load plate 910.Controller 40 is additionally operable to drive the second monitoring parts 21, carrier tape features 22, cover strip parts 23, pressing parts 24 and coiling parts 25.
When braid equipment 20 is positioned at glove state, in the load hole 907 of the current location of carrier band 906, place wafer；When braid equipment 20 is positioned at vacant state, wafer is not placed in the load hole 907 of the current location of carrier band 906.Second monitoring parts 21 includes the charge coupling camera 211 image carrying hole 907 with the current location of shooting carrier band 906, and is corresponding load hole actual parameter by video conversion.The memory element 42 of controller 40 also stores the load hole canonical parameter carrying hole 907 not placing wafer；Processing unit 41 receives and carries hole actual parameter, transfers the load hole canonical parameter being positioned at memory element 42, and contrasts load hole actual parameter and carry hole canonical parameter, to judge to carry whether hole actual parameter meets the requirements.If it is undesirable to carry hole actual parameter, then processing unit 41 produces the second control signal S2；If carrying hole actual parameter to meet the requirements, then processing unit 42 produces the 3rd control signal S3.Controller 40 controls braid equipment 20 with the second control signal S2 and moves carrier band 906, thus changes the load hole 907 of carrier band 906 current locations, to guarantee that wafer is not placed in the load hole 907 being positioned at current location.Controller 40 drives the support arm 151 of screening installation 10 to rotate with the 3rd control signal S3, make absorption have the vacuum slot 152 of qualified wafer 904 to move to the position carrying hole 907 corresponding to carrier band 906 current locations, and then make vacuum slot 1652 discharge qualified wafer 904 and be positioned in the load hole 907 of current location by qualified wafer 904.
Cover strip parts 23 also include pillar 233 and the first suspended axle 234.Pillar 233 is vertically arranged on carrier tape features 22.Cover strip dish 231 is fixedly arranged on described first suspended axle 234.First suspended axle 234 is extended in the horizontal direction by the free end of pillar 233 and forms.Cover strip 905 is coiled on cover strip dish 231.Cover strip 905 is to have the film of stickiness after heating.It is provided with through hole in the middle of cover strip dish 231, and is set on the first suspended axle 234 via through hole, can rotate around the first suspended axle 234.Cover strip parts 23 also include that three are transmitted wheel 232, transmit wheel 232 and are respectively arranged on the cylinder of pillar 233.Cover strip 905 is discharged by described cover strip dish 231, and by transmitting wheel 232 traction to pressing parts 24.Carrier tape features 22 also includes the second suspended axle 223.Second suspended axle 223 is connected with the second plummer 222.Carrier band 906 is coiled on carrier band dish 221.It is provided with through hole in the middle of carrier band dish 221, and is set on the second suspended axle 223 via through hole, can rotate around the second suspended axle 223.It is laid on the second plummer 222 by the carrier band 906 discharged on carrier band dish 221, and draws to pressing parts 24.Second plummer 222 has pressing end 2221, and its pressing end 2221 is provided with pressing parts 24.Pressing parts 24 include heater 241 and pressure head 242.Heater 241 is arranged on the pressing end 2221 of the second plummer 222.Pressure head 242 is extended obliquely downward to the position being close to the second plummer 222 by heater 241.The temperature of heater 241 is arranged can be adjusted according to practical situation, and in the present embodiment, the heating-up temperature of heater 241 is that room temperature is to 170 DEG C.
When practical operation, the cover strip 905 discharged is towed through heater 241, is sent to below pressure head 242 via after 241 heating；Simultaneously, the carrier band 906 discharged is towed pressure head 242 and the lower section of cover strip 905 being sent to be positioned at its pressing end 2221 by second plummer 222 one end, and is placed its qualified wafer 904 drawn in the load hole 907 of carrier band 906 by vacuum slot 162 during transmitting.Cover strip 905 after heating below is pressed together on the carrier band 906 being provided with qualified wafer 904 by the pressure head 242 of pressing parts 24, thus forms packaging belt 907.Described packaging belt 907 is towed and is sent to coil parts 25.
Coiling parts 25 can carry out coiled manipulations according to the 4th control signal S4 that controller 40 provides to packaging belt 907.In the present embodiment, the 4th control signal S4 includes the information such as braid speed, and braid speed is 1r/s.In other embodiments, the 4th control signal S4 can set other braid speed according to different situations.
As it is shown in fig. 7, the wafer belt-braiding device 100a that it is another preferred embodiment of the present invention.Wafer belt-braiding device 100a is with the difference of previous embodiment wafer belt-braiding device 100: wafer belt-braiding device 100a includes screening installation 10a and braid equipment 20a；Wherein the top crystalline substance parts 11a of screening installation 10a includes three the first plummer 111a, to hold three charging tray 901a simultaneously；Wherein braid equipment 20a includes that two carrier tape features 22a are to hold two carrier band 906a, two cover strip parts 23a to hold two cover strips 905a and two coiling parts 25a to carry out the coiled manipulations of two packaging belt 909a simultaneously.Real work, when all qualified wafer on a charging tray 901a in three charging tray 901a all completes sorting operation, the brilliant parts 11a in top will rotate next charging tray 901a is adjusted to carry out the position of sorting operation in order, and the charging tray 901a completing sorting operation will be located in idle condition to be replaced the operation of wafer.Additionally, when one of two carrier band 906a are placed the operation of qualified wafer by wafer belt-braiding device 100a, the state confirmation operation carrying hole of the current location of another carrier band can be carried out simultaneously.Due to, the present embodiment uses greater number of first plummer and greater number of carrier tape features, cover strip parts and coiling parts, therefore with speed up processing, thus can improve work efficiency.
As shown in Figure 8, it is the using method of aforementioned wafer belt-braiding device 100.Wherein, this using method includes step in detail below.
Step 802, wafer belt-braiding device 100 arranges wafer canonical parameter and carries hole canonical parameter.
Step 804, wafer belt-braiding device 100 shoots at the image surveying wafer 903, and converting image is wafer actual parameter.
Step 806, wafer belt-braiding device 100 contrasts wafer actual parameter and wafer canonical parameter, to judge whether wafer actual parameter meets the requirements.If wafer actual parameter is undesirable, enter step 808；If wafer actual parameter meets the requirements, enter step 812.In the present embodiment, wafer actual parameter meets the requirements and refers to that wafer actual parameter is equal with wafer canonical parameter.In other embodiments, wafer actual parameter meet the requirements can refer to the difference of wafer actual parameter and wafer canonical parameter in an acceptable numerical range, numerical range herein can be the meansigma methods of many experiments data, it is also possible to be empirical value in the industry.
Step 808, wafer belt-braiding device 100 shows is surveying the underproof information of wafer 903.
Step 810, wafer belt-braiding device 100 is changed and is being surveyed wafer 903, and returns step 804.
Step 812, wafer belt-braiding device 100 produces the first control signal S1.
Step 814, wafer belt-braiding device 100 drives vacuum slot 152 to draw qualified wafer 904 with the first control signal S1.So far step, wafer belt-braiding device 100 sub-elects qualified wafer 904 from wafer stack.
Step 816, the image carrying hole 907 of wafer belt-braiding device 100 shooting carrier band current location, converting image is for carrying hole actual parameter.
Step 818, wafer belt-braiding device 100 contrast carries hole actual parameter and carries hole canonical parameter, to judge to carry whether hole actual parameter meets the requirements.If it is undesirable to carry hole actual parameter, enter step 820；If carrying hole actual parameter to meet the requirements, enter step 824.In the present embodiment, load hole actual parameter meets the requirements and refers to that load hole actual parameter is equal with carrying hole canonical parameter.In other embodiments, load hole actual parameter meets the requirements and can refer to carry hole actual parameter and carry the difference of hole canonical parameter in an acceptable numerical range, and numerical range herein can be the meansigma methods of many experiments data, it is also possible to be empirical value in the industry.
Step 820, wafer belt-braiding device 100 produces the second control signal S2.
Step 822, wafer belt-braiding device 100 controls braid equipment 20 with the second control signal S2 and moves carrier band 906, thus change the load hole 907 of carrier band 906 current locations, and returns step 816.
Step 824, wafer belt-braiding device 100 produces the 3rd control signal S3.
Step 826, wafer belt-braiding device 100 drives the support arm 151 of screening installation 10 to rotate with the 3rd control signal S3, make absorption have the vacuum slot 152 of qualified wafer 904 to move to the position carrying hole 907 corresponding to carrier band 906 current locations, and then make vacuum slot 152 discharge qualified wafer 904 and be positioned in the load hole 907 of current location by qualified wafer 904.
Step 828, cover strip 905 is pressed together on the carrier band 906 being provided with qualified wafer 904 by wafer belt-braiding device 100, to form packaging belt 909.
Step 830, wafer belt-braiding device 100 carries out coiled manipulations to packaging belt 909.
Embodiment described above only have expressed the several embodiments of the present invention, and it describes more concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that, for the person of ordinary skill of the art, without departing from the inventive concept of the premise, it is also possible to make some deformation and improvement, these broadly fall into protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (23)
1. a wafer belt-braiding device, for picking out qualified wafer and with carrier band, it being carried out braid behaviour with cover strip in wafer stack
Make, it is characterised in that described wafer belt-braiding device includes screening installation, braid equipment and controller, and described screening installation is used for
Picking out qualified wafer, described controller is electrically connected described screening installation and described braid equipment, is used for controlling screening installation
Transferring described qualified wafer to being positioned at the braid equipment of vacant state, described braid equipment is for carrying out braid to described qualified wafer
Operation；Described controller is additionally operable to judge described braid equipment current state, and is glove shape in described braid equipment current state
Adjusting described braid equipment during state is vacant state.
Wafer belt-braiding device the most according to claim 1, it is characterised in that described wafer belt-braiding device also include pedestal with
House described controller and carry described screening installation and described braid equipment.
Wafer belt-braiding device the most according to claim 2, it is characterised in that described screening installation includes pushing up brilliant parts, institute
State the brilliant parts in top to be arranged on pedestal, be used for carrying wafer stack.
Wafer belt-braiding device the most according to claim 3, it is characterised in that the quantity of described top crystalline substance parts is at least one.
Wafer belt-braiding device the most according to claim 3, it is characterised in that described screening installation includes the first monitoring parts,
Described first monitoring parts is arranged on described pedestal, for monitoring that the wafer stack being positioned on the brilliant parts in top is with in test wafer heap one
At the wafer actual parameter surveying wafer.
Wafer belt-braiding device the most according to claim 5, it is characterised in that described screening installation includes display unit, institute
State display unit for showing function choosing-item frame and surveying wafer state.
Wafer belt-braiding device the most according to claim 6, it is characterised in that described screening installation includes input block, institute
State input block for inputting the wafer canonical parameter of qualified wafer.
Wafer belt-braiding device the most according to claim 7, it is characterised in that described controller is additionally operable to receive described input
The wafer canonical parameter of the qualified wafer of parts, and store described wafer canonical parameter, obtain and according to described wafer canonical parameter
Wafer actual parameter is analyzed in comparison, produces the first control signal.
Wafer belt-braiding device the most according to claim 8, it is characterised in that described screening installation includes transfer member, institute
State transfer member and receive the first control signal, capture described qualified wafer.
Wafer belt-braiding device the most according to claim 9, it is characterised in that described braid equipment includes cover strip parts, load
Tape member, coiling parts and pressing parts, wherein said cover strip parts are used for depositing described cover strip, and described carrier tape features is used for depositing
Putting described carrier band, described pressing parts are used for being pressed together on described carrier band to generate packaging belt by described cover strip, described coiling parts
For described packaging belt being carried out coiled manipulations to generate molding load plate.
11. wafer belt-braiding devices according to claim 10, it is characterised in that described cover strip parts, described carrier tape features,
The quantity of described coiling parts and described pressing parts is respectively at least one.
12. wafer belt-braiding devices according to claim 11, it is characterised in that described controller is electrically connected described lid
Tape member, described carrier tape features, described pressing parts and described coiling parts.
13. wafer belt-braiding devices according to claim 12, it is characterised in that it is described to place that described carrier band has load hole
Qualified wafer, described carrier tape features also includes second monitoring parts image carrying hole with the described carrier band current location of shooting, and turns
Changing image is to carry hole actual parameter, and described controller storage has the load hole canonical parameter carrying hole not placing wafer, with described load hole
Described load hole actual parameter is analyzed in the comparison of canonical parameter, and when described load hole actual parameter does not meets described load hole canonical parameter
Produce the second control signal, produce the 3rd control signal when described load hole actual parameter meets described load hole canonical parameter.
14. wafer belt-braiding devices according to claim 13, it is characterised in that described controller controls according to described second
Signal controls braid equipment and moves described carrier band, thus changes the load hole of carrier band current location.
15. wafer belt-braiding devices according to claim 13, it is characterised in that described controller controls according to the described 3rd
Signal drives the described transfer member of described screening installation to move the position to the described load hole corresponding to described carrier band current location,
And then make described transfer member discharge described qualified wafer and be positioned in described load hole by described qualified wafer.
16. 1 kinds of wafer braid methods, it is characterised in that described wafer braid method includes:
Step 1, sub-elects qualified wafer from wafer stack；
Step 2, confirms that wafer is not placed in the load hole of carrier band current location；
Step 3, transfers the position in the most corresponding described load hole with described carrier band of described qualified wafer；
Step 4, is positioned over described qualified wafer in described load hole.
17. wafer braid methods according to claim 16, it is characterised in that described step 2 farther includes: step
5, it is judged that whether the described load hole of described carrier band current location places wafer, if not placing wafer, then enter step 3, if placing
Wafer, then enter step 6；
Step 6, mobile described carrier band is to change the load hole of described carrier band current location, and returns step 5.
18. wafer braid methods according to claim 17, it is characterised in that described step 1 farther includes:
Step 7, arranges wafer canonical parameter；
Step 8, shoots at the image surveying wafer, changes described image into wafer actual parameter；
Step 9, contrasts described wafer actual parameter and described wafer canonical parameter, to judge whether described wafer actual parameter accords with
Close requirement；If wafer actual parameter is undesirable, enter step 10；If wafer actual parameter meets the requirements, enter step 12；
Step 10, display is described is surveying the underproof information of wafer；
Step 11, changes and is surveying wafer, and return step 8；
Step 12, produces the first control signal；
Step 13, is driven by described first control signal to draw qualified wafer.
19. wafer braid methods according to claim 18, it is characterised in that described step 5 farther includes:
Step 14, arranges load hole canonical parameter；
Step 15, the load hole image of shooting carrier band current location, and converting image is for carrying hole actual parameter；
Step 16, contrast carries hole actual parameter and carries hole canonical parameter, to judge to carry whether hole actual parameter meets the requirements；If carrying
Hole actual parameter is undesirable, enters step 6；If carrying hole actual parameter to meet the requirements, enter step 3.
20. wafer braid methods according to claim 18, it is characterised in that wafer actual parameter meets the requirements finger wafer
Actual parameter is equal with wafer canonical parameter.
21. wafer braid methods according to claim 18, it is characterised in that wafer actual parameter meets the requirements finger wafer
The difference of actual parameter and wafer canonical parameter is in an acceptable numerical range.
22. wafer braid methods according to claim 19, it is characterised in that load hole actual parameter meets the requirements and refers to carry hole
Actual parameter is equal with carrying hole canonical parameter.
23. wafer braid methods according to claim 19, it is characterised in that load hole actual parameter meets the requirements and refers to carry hole
The difference of actual parameter and load hole canonical parameter is in an acceptable numerical range.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210423536.5A CN103786911B (en) | 2012-10-30 | 2012-10-30 | Wafer belt-braiding device and wafer braid method |
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| CN201210423536.5A CN103786911B (en) | 2012-10-30 | 2012-10-30 | Wafer belt-braiding device and wafer braid method |
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| CN103786911B true CN103786911B (en) | 2016-09-28 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107176321A (en) * | 2016-03-11 | 2017-09-19 | 上海安缔诺科技有限公司 | A kind of new volume to volume smart card module encapsulating structure |
| CN115642098B (en) * | 2022-09-14 | 2023-12-26 | 深圳源明杰科技股份有限公司 | Chip mounting and positioning method, device, equipment and readable storage medium |
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| JP2003095216A (en) * | 2001-09-20 | 2003-04-03 | Matsushita Electric Ind Co Ltd | Taping method for electronic component and electronic component assembly |
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| JP4101016B2 (en) * | 2002-10-24 | 2008-06-11 | 株式会社リコー | Appearance inspection method and appearance inspection mechanism of electronic components in carrier tape |
| CN201354156Y (en) * | 2009-02-17 | 2009-12-02 | 力浦电子实业股份有限公司 | Wafer packaging machine |
| CN201399436Y (en) * | 2009-03-06 | 2010-02-10 | 江都市东元机电设备有限公司 | Semiconductor device testing and sorting machine |
| CN203318726U (en) * | 2012-10-30 | 2013-12-04 | 厦门市弘瀚电子科技有限公司 | Wafer taping device |
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