JP2003095216A - Taping method for electronic component and electronic component assembly - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a taping method for electronic components, by which built-in components of a semiconductor element, such as CSP (chip size package), QFP (quad flat pack), BGA (ball grid array), etc., are transported, stored, or supplied to an electronic component mounting machine in good condition, and moisture absorption by the sealing materials of the built-in components is prevented without fail, and to provide an electronic component assembly manufactured using the taping method. SOLUTION: A plurality of the built-in components 1 of the semiconductor element are subjected to a dry process individually. Then, each built-in component 1 is sequentially housed in each one of plurality of recessed housing parts 11a formed on the carrier tape 11 in the length direction at every a distance. Each housing part 11a is filled with an inert gas and sealed up, and a cover tape 12 is fixed so as to cover the opening of each housing part 11a in an airtight manner.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to CSP, QFP,
And a method of taping an electronic component, in which semiconductor element built-in components such as BGA are stored in a plurality of storage portions of a carrier tape and are transported and stored in a form that can be supplied to an electronic component mounting machine,
And an electronic component assembly manufactured by the taping method and having the semiconductor element built-in component housed in each of the housing parts of the carrier tape.

[0002]

2. Description of the Related Art Conventionally, a chip-type electronic component for surface mounting has a carrier tape in which a storage portion formed in a concave shape capable of storing the electronic component is continuously formed, and the carrier tape can be sealed. The cover tape is wrapped in a package consisting of a cover tape, and these electronic components are transported and stored in a state of being housed in a carrier tape. When the electronic component mounting machine mounts these electronic components on a circuit board, the cover tape is used. After peeling off, these electronic components are automatically taken out from the respective storage portions of the carrier tape and mounted on the circuit board.

Further, the electrodes of electronic parts housed in such a carrier tape are oxidized during transportation and storage, and an oxide film is formed on the surface thereof. If it is mounted on the circuit board as it is by melting the solder, the wettability of the electrode surface and the molten solder may become poor due to the oxide film of the electrode, resulting in poor bonding. In order to prevent the influence of such oxidation of the electrodes, the electronic parts may be encapsulated while enclosing an inert gas such as nitrogen gas when accommodating the electronic parts in the package.

On the other hand, in electronic parts such as highly integrated semiconductor device built-in parts such as CSP, QFP, and BGA, the electronic circuit is sealed with a sealing material in order to protect the internal electronic circuit. Has been applied. This sealing improves the moisture resistance and impact resistance of the electronic components, and improves the reliability of the entire electronic circuit device in which these electronic components are mounted on the circuit board.

However, in an electronic component such as such a semiconductor element built-in component, when the sealing material absorbs moisture in the atmosphere and the moisture remains in the sealing material, these electronic components are not used. When solder is melted when mounting components on the circuit board, residual moisture in the encapsulant is heated and volume-expanded in a high temperature atmosphere for melting the solder, causing cracks in the encapsulant and The humidity resistance and impact resistance of the electronic components after mounting are reduced, and the electronic components may become defective,
In some cases, the reliability of the entire electronic circuit device was reduced.

In order to solve such a problem, conventionally,
A plurality of electronic components are placed on a heat-resistant tray, and each electronic component is heated together with the tray to perform a baking treatment, which is an example of a drying treatment for removing moisture in the encapsulant, and the baking treatment is performed. After storing each electronic component in the carrier tape storage unit and sealing it with the cover tape, it is transported and stored, and then the electronic component mounter covers the electronic component on the circuit board. After the tape was peeled off, these electronic components were automatically taken out from the respective storage portions of the carrier tape and mounted on the circuit board.

[0007]

However, since such a semiconductor device built-in component is handled in a clean room, which is an environment in which the temperature, humidity, and dust density in the air are controlled, the above-mentioned baking treatment is performed. The equipment to be performed must be placed in a clean room, which allows
The problem that heat generated by the baking process affects the control temperature of the clean room,
Further, since the electronic components arranged on the tray are collectively subjected to the baking process, the baking device becomes large in size, and such a large device must be installed in the clean room. There is a problem that it is difficult to save space.

Further, in the above baking process,
After each electronic component is placed on the tray, it is baked in a batch, and then each electronic component that has undergone the baking process for each tray is taken out from the baking processing device and sequentially stored in the storage section of the carrier tape. Since it is sealed, the waiting time between the baking process and the sealing is different between the electronic component first taken out from the tray and the electronic component finally taken out, and the electronic component taken out last In parts,
There is a problem that the waiting time becomes longer than that of the electronic component taken out first, and the sealing material of the baked electronic component absorbs moisture again during the waiting time.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to solve the above-mentioned problems, and to improve the handleability of transportation, storage, and supply to electronic component mounting machines of semiconductor element built-in components such as CSP, QFP, and BGA. An object of the present invention is to provide an electronic component taping method and an electronic component assembly manufactured by the taping method, which make it possible to prevent moisture absorption of a sealing material in these semiconductor-embedded components while ensuring good performance.

[0010]

In order to achieve the above object, the present invention is configured as follows.

According to the first aspect of the present invention, a plurality of recessed accommodating portions for accommodating semiconductor element built-in components as electronic components are formed in each accommodating portion of the carrier tape formed at regular intervals in the longitudinal direction. A method of taping an electronic component in which a semiconductor device-embedded component is housed and the carrier tape is wound on a reel, wherein the semiconductor device-embedded component is conveyed from a supply tray in which the semiconductor device-embedded component is supplied to the storage unit In the process, after each of the semiconductor element built-in parts is individually dried, the semiconductor element built-in parts are sequentially stored in the storage parts, and an inert gas is filled in the storage parts. By fixing the cover tape so as to cover the openings of the storage parts, the storage parts are individually sealed, and the carrier tape is wound on the reel. It provides a taping method of the electronic component characterized by Rukoto.

According to the second aspect of the present invention, in the drying treatment, at least one of the upper surface and the lower surface of each of the semiconductor element built-in components is heated so that each of the semiconductor element built-in components is heated. A method for taping an electronic component according to the first aspect, which reduces the water content, is provided.

According to a third aspect of the present invention, there is provided a method for taping an electronic component according to the second aspect, wherein the heating is performed by using a heat source.

According to a fourth aspect of the present invention, the semiconductor device-embedded component is moved from the supply tray in the process of transporting the semiconductor device-embedded component from the supply tray to which the semiconductor device-embedded component is supplied to the storage units. Each of the semiconductor element-embedded parts is sucked and held by the component holding member, and the semiconductor element-embedded parts are moved to the pedestal to be dried, and the semiconductor element-embedded parts of the semiconductor element-embedded component are mounted on the gantry. The semiconductor device-embedded component, which has been subjected to the drying treatment and has been subjected to the drying treatment by the component holding member for insertion, is suction-held from the mount and is stored in the respective storage portions on the carrier tape. Any one of the first to third aspects
And a method for taping an electronic component according to claim 1.

According to the fifth aspect of the present invention, before the storage of the carrier tape in the storage portions, a visual inspection is performed on each of the semiconductor element built-in parts, and an abnormality is detected in the visual inspection. The electronic component taping method according to any one of the first to fourth aspects, in which only the respective semiconductor element built-in components that have not been stored are stored in the respective storage units.

According to a sixth aspect of the present invention, each of the storage parts is formed by enclosing the inert gas in each of the storage parts of the carrier tape in which each of the semiconductor element built-in parts is stored and fixing the cover tape. The sealing is provided in the electronic component taping method according to any one of the first to fifth aspects, which is performed in a chamber filled with the inert gas.

According to a seventh aspect of the present invention, each of the semiconductor element-embedded parts is stored after the semiconductor element-embedded parts are taken out from the supply tray to which the semiconductor element-embedded parts are supplied. Each of the above-mentioned operations up to the above-mentioned sealing of each storage section by fixing the cover tape in each storage section of the carrier tape is carried out in a room filled with the above-mentioned inert gas. According to another aspect of the present invention, there is provided a method of taping an electronic component.

According to an eighth aspect of the present invention, the semiconductor device-embedded component is manufactured by the electronic component taping method according to any one of the first to seventh aspects, and each of the semiconductor element-embedded components is the carrier tape. An electronic component assembly housed in each housing is provided.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below in detail with reference to the drawings.

According to one embodiment of the present invention, a plurality of electronic parts are individually subjected to a baking process as an example of a drying process, and immediately thereafter, a storage part for the electronic parts is continuously formed in each of the carrier tapes. The present invention relates to a taping method for electronic components, which are individually housed in a unit, filled with an inert gas, and sealed with a cover tape. In addition, an electronic component assembly manufactured by this taping method, in which each electronic component is stored in each storage portion of the carrier tape, can be moved and stored, and each electronic component in the electronic component assembly can be stored. When mounting components on a circuit board, attach the electronic component assembly to the electronic component mounter, remove the cover tape, and then automatically remove each electronic component from each storage part of the carrier tape. Mounted on the circuit board.

FIG. 1 is a schematic explanatory view schematically showing a method of taping an electronic component according to an embodiment of the present invention. In FIG. 1, C which is an example of a semiconductor device built-in component
A plurality of rectangular plate-shaped electronic components 1 such as SP, QFP, and BGA are arranged in the supply tray 2 so that they can be supplied, with the surface having the plurality of electrodes 1a as the lower surface. In each of these electronic components 1, the electronic circuit is resin-sealed with a plastic resin, which is an example of a sealing material, in order to protect the electronic circuit formed by the built-in semiconductor element. This improves the moisture resistance and impact resistance of the electronic component 1, and improves the reliability of the entire electronic circuit device in which these electronic components 1 are mounted on the circuit board. Note that these electronic components 1 need to be handled in an environment required for the taping work, for example, in a clean room where the temperature, humidity, and dust density in the air are controlled. Each operation of the electronic component taping method according to the embodiment is performed in a clean room.

Further, as shown in FIG. 1, a disc-shaped pallet 4 which is an example of a pedestal on which the electronic component 1 is subjected to a baking process or the like is formed along the outer periphery of the disc surface. A total of 6 rectangular openings 4a are provided at each angle, for example, every 60 degrees.
a is formed to be slightly smaller than the outer shape of the electronic component 1. As a result, when the electronic component 1 is placed on the opening 4a, the peripheral portion of the lower surface of the electronic component 1 is supported by the peripheral portion of the opening 4a. Also, the pallet 4 is
Since the center of the disk is rotated about the rotation axis intermittently at each of the above angles, and the rotation pitch thereof is 60 degrees, for example, the intermittent rotation of the pallet 4 causes the pallet 4 to stop at each stop. The opening 4a is always stopped only at the determined position.

At these defined stop positions on the pallet 4, the electronic component 1 placed on each opening 4a.
Predetermined work is performed on the pallet 4 shown in FIG. 1 in order from the left side of the drawing, and the electronic component supply position 41 at which the electronic component 1 is supplied onto the opening 4 a of the pallet 4 and the electronic component supply position 41. The baking processing position 42 where the baking processing of the component 1 is performed, the inspection position 43 where the appearance inspection of the electronic component 1 is performed, and the electronic component 1 that has been subjected to each of the above operations.
The electronic component take-out position 44 from which the pallet 4 is taken out from the opening 4a is included in these stop positions.

At the electronic component supply position 41 on the pallet 4, the electronic component 1 arranged in the supply tray 2 is moved by the moving nozzle 3 which is an example of the moving component holding member.
It is supplied by being held by suction and moved.

Further, at the baking processing position 42 on the pallet 4, a far-infrared irradiation section 5a and a far-infrared irradiation section, which are examples of a heat source irradiation section in which a heat source for baking the electronic component 1 is used, are used. 5 b is provided, and the far-infrared irradiation unit 5 a is arranged so as to irradiate the far-infrared rays from above the pallet 4 and the far-infrared irradiation unit 5 b from below the pallet 4 to the electronic component 1 at the baking processing position 42. .

At the inspection position 43 on the pallet 4, an inspection camera 6 for inspecting the appearance of the electronic component 1 is arranged above the pallet 4, and the image of the electronic component 1 located at the inspection position 43 is inspected. An image is taken by the camera 6, and it is inspected based on the taken image information whether the appearance of the electronic component 1 is normal.

At the electronic component taking-out position 44 on the pallet 4, the electronic component 1 located at the electronic component taking-out position 44 is sucked and held by the inserting nozzle 7 which is an example of the inserting component holding member and moved. As a result, the electronic component 1 is taken out from the pallet 4.

The electronic components 1 supplied to the electronic component supply position 41 on the pallet 4 by the intermittent rotation of the pallet 4.
Is first sent to the baking processing position 42, then to the inspection position 43, and then to the electronic component take-out position 44 to take out the electronic component 1 from the pallet 4.
Further, at each of the above-mentioned work positions from the electronic component supply position 41 to the electronic component take-out position 44 on the pallet 4, it is possible to simultaneously perform a predetermined work at each work position by intermittent rotation of the pallet 4. Has become. Therefore, the intermittent rotation is performed by the electronic component supply position 41, the baking processing position 42, the inspection position 43, and the electronic component take-out position 44.
This is performed after all the predetermined operations in step 1 are completed.

Next, as shown in FIG. 1, on the side opposite to the supply tray 2 with respect to the pallet 4, a plurality of concave storage portions 11a capable of storing the electronic components 1 are provided at regular intervals in the longitudinal direction. The formed carrier tape 11 is supplied in a state of being wound on a reel 16, the carrier tape 11 is rewound by rotating the reel 16, and the carrier tape 11 is sent out and the reel 17
The carrier tape 11 is wound by rotating. The rotations of the reel 16 and the reel 17 are performed intermittently and in synchronization with each other.
The carrier tape 11 is reeled by the intermittent rotation.
A constant tension is applied between the reel 6 and the reel 17, and the carrier tape 11 is intermittently fed so that the formation intervals of the storage portions 11a become the feed pitch.

Due to this intermittent feeding of the carrier tape 11, each storage portion 11a is always stopped only at a predetermined position between the reels 16 and 17. One of the determined stop positions is set as a storage position 45 in which the electronic component 1 is stored in the storage portion 11a of the carrier tape 11, and the insertion nozzle 7 is inserted from the electronic component extraction position 44 on the pallet 4. The electronic component 1 sucked and held by and taken out is moved above the carrier tape 11 sent between the reel 16 and the reel 17, and the storage portion of the carrier tape 11 in which the electronic component 1 is located at the storage position 45. It is stored in 11a.

Further, the carrier tape 11 which is intermittently sent between the reels 16 and 17 is sent so as to pass through the tape sealing device 13 as shown in FIG. The tape sealing device 13 includes a gas supply nozzle 14 for supplying nitrogen gas, which is an example of an inert gas, to each storage portion 11a of the carrier tape 11 so as to be able to be filled, and each storage portion 11a of the carrier tape 11 filled with nitrogen gas. The cover tape 12 is placed so as to cover the opening of the above, and the cover tape 12 is fixed by thermocompression bonding, and a crimping tool 15 for sealing each storage portion 11a is provided. The electronic tape 1 is sealed in the tape sealing device 13 with respect to the carrier tape 11 which is intermittently sent between the reels 16 and 17.

Regarding each working section or working position described above, the supply tray 2 of the electronic component 1 and the pallet 4 are provided.
The electronic component supply position 41, the electronic component take-out position 44, and the storage position 45 on the carrier tape 11 are arranged in a straight line so that the supply tray 2 moves onto the pallet 4 and the pallet 4 moves toward the storage position. The moving distance of the electronic component 1 to the 45 can be shortened, and efficient work can be performed.

Next, the structures of the carrier tape 11 and the cover tape 12 will be described in detail based on an example.

FIG. 4 shows that the electronic component 1 is stored in each storage portion 11a of the carrier tape 11 used in the above embodiment.
FIG. 5 is a partial plan view of the carrier tape in a state where nitrogen gas is sealed and sealed with the cover tape 12, and FIG. 5 is a partial perspective view of the carrier tape 11 with the cover tape 12 fixed to the carrier tape 11. 4 and 5, the carrier tape 11 has concave storage portions 11a formed at regular intervals in the longitudinal direction, and the electronic components 1 are stored in the storage portions 11a. In this state, the upper part of each storage portion 11a is covered with the cover tape 12.

Here, as the material of the carrier tape 11,
A material having moisture resistance is used, and as an example, a plastic-based material or a conductive carbon film is used.
Furthermore, a case where an alumina (Al ₂ O ₃ , aluminum oxide) vapor deposition film is attached to the surface of the film may be used. A material having a moisture proof property is also used as the material of the cover tape 12, and as an example, an alumina (Al ₂ O ₃ , aluminum oxide) vapor deposition film is attached to the surface of a plastic film in a single layer or multiple layers. The combination is used.

The cover tape 12 is mounted and fixed on the carrier tape 11 as shown in FIGS. As shown in FIG. 4, in the joint portion of the carrier tape 11 and the cover tape 12, the joint regions 12 c are continuously formed along the longitudinal direction of the cover tape 12 at both end portions in the width direction of the cover tape 12. On the bottom,
Bonding regions 11c corresponding to the bonding regions 12c are respectively formed on the upper surface of the carrier tape 11, and the bonding regions 11c are formed so as to be located outside each of the storage portions 11a. In addition, each storage portion 1 of the carrier tape 11
A joining region 11b is formed on the upper surface of the carrier tape 11 between the 1a along the width direction of the carrier tape 11 so as to connect the joining regions 11c, and a joining region 12b corresponding to the joining region 11b is formed. It is formed on the lower surface of the cover tape 12. As an example, the bonding areas 11b and 11c on the upper surface of the carrier tape 11 and the bonding areas 12b and 12c on the lower surface of the cover tape 12 are fixed by thermocompression bonding, so that the storage portions 11a are As an example, as a result of being fixed to the cover tape 12 over the entire circumference thereof, each storage portion 11a is individually and independently sealed, and in each storage portion 11a, intrusion of moisture from the outside or nitrogen gas Spills are less likely to occur.

In order to take out the electronic components 1 sealed in the storage portions 11a together with the nitrogen gas, the cover tape 12 is sequentially peeled off from the carrier tape 11. In this case, the carrier tape 11 is used. The joint area 11c and the joint area 12c on both sides of the cover tape 12 in the width direction are formed continuously in the longitudinal direction of the cover tape 12, but are formed with a width sufficiently shorter than the width of the cover tape 12. Cover tape 12
By peeling off along the longitudinal direction,
It can be peeled off more easily than when peeled off from other directions.

The joint regions 11b and 12b of the carrier tape 11 and the cover tape 12 are formed to have a length substantially the same as the width of the cover tape 12 in the direction orthogonal to the direction in which the cover tape 12 is peeled off. The cover tape 12 is partially formed along the longitudinal direction of the cover tape 12, and the formation width thereof is smaller than the formation widths of the joining region 11c and the joining region 12c. Even when peeling it off, it does not become difficult to peel it off.

In addition, the joint region 11b and the joint region 12b.
Has a formation width narrower than the formation widths of the bonding region 11c and the bonding region 12c. As long as the bonding region 11c and the bonding region 12c are compared with each other, the bonding is easily broken. Since the region 12b is a joining region for individually and independently sealing the adjacent storage units 11a, the joining region 11b and the joining region 12b between the adjacent storage units 11a in one storage unit 11a are joined together. Even if only one of them is destroyed, only the sealed space between the one storage part 11a and the adjacent storage part 11a is connected to each other.
The one storage portion 11a and the adjacent storage portion 11a remain sealed from the outside. Further, for example, the joint area 11c and the joint area 12 in one storage portion 11a.
Even if only the joint of c is destroyed and water intrusion or nitrogen gas outflow occurs, in the adjacent storage portion 11a,
Since the bonding region 11b, the bonding region 12b, the bonding region 11c, and the bonding region 12c are kept sealed from the outside, the influence of the destruction of the bonding between the bonding region 11c and the bonding region 12c in the one housing portion 11a is affected. It does not extend.

Next, a specific procedure in the electronic component taping method for sealing the electronic component 1 using the carrier tape 11 and the cover tape 12 described above will be described.

First, as shown in FIG. 1, the moving nozzle 3 is aligned so that one electronic component 1 can be sucked and held from among the electronic components 1 that can be supplied in the supply tray 2. After that, the moving nozzle 3 is lowered, and the electronic component 1 is sucked and held by the tip surface of the moving nozzle 3 to be raised, and the electronic component 1 is taken out from the supply tray 2.

Next, as shown in FIG. 2 (a), the moving nozzle 3 that holds the electronic component 1 by suction on the tip surface is moved from above the supply tray 2 to above the pallet 4 to move the electronic components. After aligning the component 1 so that it can be placed in the opening 4a at the electronic component supply position 41 on the pallet 4, the moving nozzle 3 is lowered to place the electronic component 1 on the opening 4a and move it. The suction holding of the electronic component 1 by the nozzle 3 is released. At this time, the rotation of the pallet 4 which is intermittently performed is in an intermittently stopped state. In addition, in the alignment that allows the electronic component 1 to be arranged in the opening 4a at the electronic component supply position 41 by the moving nozzle 3, the alignment may be performed by θ rotation correction as necessary. After that, the moving nozzle 3 moves up and moves to above the supply tray 2, and the work of taking out the next electronic component 1 arranged on the supply tray 2 is started.

Next, as shown in FIG. 2B, after the electronic component 1 is placed on the opening 4a at the electronic component supply position 41 of the pallet 4, the pallet 4 is intermittently rotated. That is, the rotation of the pallet 4 is stopped when the electronic component 1 is located at the baking processing position 42. After that, the far-infrared irradiation units 5a and 5b irradiate the upper and lower surfaces of the electronic component 1 with far-infrared rays, heat the sealing material of the electronic component 1 for a predetermined time, and absorb moisture absorbed on the surface and inside thereof. Evaporate to reduce water content. After a predetermined time,
Irradiation of the far infrared rays to the electronic component 1 by the far infrared ray irradiation units 5a and 5b is stopped.

The irradiation time and the irradiation intensity of the far infrared rays to the electronic component 1 can be adjusted, and the type of the electronic component 1 to be irradiated changes and the characteristics of the electronic component 1 change. Also, it is possible to irradiate far infrared rays by adjusting the irradiation time and irradiation intensity to be optimum. Further, instead of irradiating the far infrared rays on the upper surface and the lower surface of the electronic component 1 described above, the far infrared ray may be radiated on only one of the upper surface and the lower surface of the electronic component 1.

After that, the rotation of the pallet 4 is started again, and as shown in FIG.
When the pallet 4 is located at position 3, the rotation of the pallet 4 is stopped, the image of the electronic component 1 is captured by the inspection camera 6, and it is inspected based on the captured image information whether the appearance of the electronic component 1 is abnormal. .

After that, the rotation of the pallet 4 is started, and the rotation of the pallet 4 is stopped when the electronic component 1 is located in the electronic component take-out section 44. Next, as shown in FIG. 2D, after the insertion nozzle 7 is positioned so that the electronic component 1 arranged on the pallet 4 can be sucked and held, the insertion nozzle 7 is lowered, The electronic component 1 is sucked and held by the tip end surface of the insertion nozzle 7 and lifted,
Is taken out from the pallet 4. Here, the electronic component 1 determined to have no abnormality in the appearance inspection by the inspection camera 6 is sucked and held by the insertion nozzle 7 and above the carrier tape 11 sent between the reel 16 and the reel 17. Moved to. On the other hand, the electronic component 1 determined to have an abnormality is sucked and held by the insertion nozzle 7 and moved to a defective product recovery box or the like, or the electronic nozzle 1 is not sucked and held by the insertion nozzle 7 and is kept as it is. Is moved by the rotation of the electronic component pick-up unit 44, is sucked and held by another nozzle or the like at a place different from the electronic component take-out section 44, and is moved to a defective product collection box or the like to be collected as a defective part.

Next, in FIG. 1, the insertion nozzle 7 holding the electronic component 1 by suction moves above the pallet 4 and above the carrier tape 11 delivered between the reels 16 and 17. To be done. After that, FIG.
As shown in (e), the intermittent feeding of the carrier tape 11 causes the intermittent feeding to be stopped when the storage portion 11 a is located at the storage position 45, and the carrier tape 11 is stored at the storage position 45. After aligning the insertion nozzle 7 with respect to the storage portion 11a so that the electronic component 1 can be stored in the portion 11a, the insertion nozzle 7 is lowered to dispose the electronic component 1 in the storage portion 11a of the carrier tape 11. At the same time, the suction holding of the insertion nozzle 7 to the electronic component 1 is released. After that, the insertion nozzle 7 rises and moves above the pallet 4, and the work of taking out the next electronic component 1 placed on the pallet 4 is started.

After that, the carrier tape 11 in a state where the electronic component 1 is housed in the housing portion 11a is intermittently fed, and is fed into the tape sealing device 13 shown in FIG.
As shown in (f), each storage portion 11 a of the carrier tape 11 sent into the tape sealing device 13 is filled with nitrogen gas by the nitrogen gas supplied from the gas supply nozzle 14.

Further, the cover tape 12 capable of sealing each storage portion 11a is supplied to the tape sealing device 13 in a state of being wound on the reel 18, and the cover tape 12 is rewound by rotating the reel 18. This cover tape 12 is sent out so that it can be placed on the carrier tape 11. As shown in FIG. 3G, after the cover tape 12 is attached to the upper surface of the carrier tape 11 having the storage portions 11a filled with nitrogen gas, the openings of the storage portions 11a are continuously covered. When the storage portion 11a whose opening is covered with the cover tape 12 is located below the crimping tool 15, the intermittent feeding of the carrier tape 11 is intermittently stopped. After that, the crimping tool 15 descends so that the joining region 12b and the joining region 12c of the cover tape 12 are joined to the joining region 11b and the joining region 1 which are formed around the opening of the storage portion 11a of the carrier tape 11.
Fix by thermocompression bonding to 1c. Then, the crimping tool 15 rises.

As a result, as shown in FIGS. 3 (h) and 4, each of the housing portions 11a of the carrier tape 11 is heated in the joining regions 11b and 11c of the carrier tape 11 in the joining regions 12b and 12c. The cover tapes 12 that have been pressure-bonded are individually sealed, and each electronic component 1 is sealed in each storage portion 11a in a state where nitrogen gas is sealed.

Thereafter, as shown in FIG. 1, the carrier tape 11 is intermittently fed, is fed from the tape sealing device 13, and the reel 17 is rotated. It is wound around the reel 17 together with the cover tape 12 in a sealed state.

As a result, the electronic component 1 has the carrier tape 11 and the cover tape 12 in a state where the nitrogen gas is sealed.
As a result, the electronic components 1 can be stored and the like as an electronic component assembly in a moisture-proof and anti-oxidation environment.

The electronic component 1 can be stored and the like in the state of the electronic component assembly. As an example, the electronic component assembly has a temperature of 5 to 40 ° C. and a humidity of 20 to 60%.
The quality of the electronic component 1 can be maintained in a good state by storing under the management conditions such as RH and storage period within 6 months.

When mounting the electronic component 1 thus enclosed in the concave housing portion 11a together with the nitrogen gas on the circuit board or the like by the electronic component mounting machine, the electronic component assembly is mounted on the electronic component mounting machine. Each electronic component 1 is attached so that it can be supplied, and the reel 17 in which the carrier tape 11 is wound is rotated to rewind the carrier tape 11,
In order to take out the electronic component 1, the cover tape 12 is peeled off from the carrier tape 11 in order, and each storage unit 1
Each electronic component 1 is automatically taken out from 1a by the electronic component mounter and mounted on the board.

In the tape sealing device 13 of the above embodiment, instead of filling the nitrogen gas supplied from the gas supply nozzle 14 into each storage portion 11a of the carrier tape 11, the inside is filled with nitrogen gas. As an example of the chamber, when the inside of the tape sealing device 13 is filled with nitrogen gas, or all the operations from the baking process of each electronic component 1 to the storage of each electronic component 1 and the winding of the carrier tape 11 after sealing May be performed in a room filled with nitrogen gas.

Further, instead of the case where the gas sealed with the electronic component 1 is an inert gas, for example, nitrogen gas, a dry dry inert gas, for example, dry nitrogen gas is used. As a result, the electronic component 1 can be stored in a more dried space,
It is possible to improve the moisture-proof and anti-oxidation environment of the electronic component 1.

When it is not necessary to consider the oxidation prevention of the electrodes 1a and the like of the electronic component 1, dry gas is used instead of the inert gas such as nitrogen gas as the gas to be sealed together with the electronic component 1. This may be the case. Even in this case, the electronic component 1 can be stored or the like in a state where the moisture-proof environment is maintained.

According to the above embodiment, between the baking process of the electronic component 1 and the storage and sealing of the electronic component 1 in the carrier tape 11, a plurality of electronic components are arranged on the tray as in the conventional case, and the baking treatment device is arranged. Inside the tray, each electronic component is collectively heated and baked.
After the tray is taken out from the baking processing device, the electronic components are not sequentially stored in the respective storage portions of the carrier tape and then sealed, but the far infrared irradiation portions 5a and 5b individually apply far infrared rays to the electronic components 1. After the baking processing is performed by irradiating with, the electronic parts 1 subjected to the baking processing are sequentially stored in the storage parts 11 of the carrier tape 11.
The electronic components 1 are stored in a and sealed, that is, after the baking process is performed individually, the electronic components 1 that have been subjected to the baking process are sequentially stored and sealed. Due to variations in the waiting time between the electronic component and the electronic component that is finally taken out and the baking process being performed until the electronic component is sealed, the electronic component that is finally taken out is the electronic device that is taken out first. It is possible to eliminate the problem that the waiting time becomes longer than that of the component, and the sealing material of the electronic component baked during the waiting time absorbs moisture again. Therefore, baked CSP and QF
It is possible to securely seal the encapsulant of the semiconductor element-embedded component such as P and BGA after the baking process without absorbing moisture again, and to reliably prevent the encapsulant of the semiconductor element-embedded component from absorbing moisture. It is possible to provide a taping method for parts.

Further, in the past, a large baking processing apparatus, which was necessary because the electronic components arranged on the tray were collectively subjected to the baking processing, was changed to a small apparatus by individually performing the baking processing. Since the baking process can be performed, the amount of heat generated by the above device can be reduced, and the installation space for the above device can be reduced. Therefore, the temperature control of the clean room where such a device is installed can be performed. It is possible to provide a taping method for electronic components that can reduce the effect of the above and can save the space in the clean room and that is easy to handle in the clean room.

Further, the baking processing of the electronic parts 1 is performed by far-infrared irradiation units 5a and 5b individually for each electronic part 1.
Since it is performed by irradiating far infrared rays, the irradiation time and the irradiation intensity of far infrared rays to the electronic component 1 can be adjusted, the type of the electronic component 1 to be irradiated changes, and the characteristics of the electronic component 1 change. Even in such a case, it is possible to irradiate far infrared rays by adjusting the optimum irradiation time and irradiation intensity, and it is possible to provide a taping method for electronic components that can handle more types of electronic components. .

By properly combining the arbitrary embodiments of the aforementioned various embodiments, the effects possessed by them can be produced.

[0062]

EFFECTS OF THE INVENTION According to the first to third aspects of the present invention, a plurality of electronic components as in the prior art are provided between the drying process of the semiconductor element built-in component and the storage and sealing work on the carrier tape. Is placed on the tray and each electronic component is collectively heated in the drying treatment device for each tray to perform the drying treatment, and then each electronic component is sequentially stored in each storage portion of the carrier tape. After performing a drying treatment individually for each semiconductor element built-in component,
The semiconductor element-embedded parts that have been subjected to the drying treatment are sequentially stored in the respective storage portions of the carrier tape and sealed, that is, after the drying treatment is individually performed, the drying treatment is performed. Since each of the semiconductor device built-in components thus stored is sequentially housed and hermetically sealed, the conventional drying treatment that has occurred between the electronic component first taken out from the tray and the electronic component finally taken out from the tray is performed. Due to the variation in the waiting time from the time until it is sealed, the electronic component taken out last has a longer waiting time than the electronic component taken out first, and during this waiting time, it was dried. The problem that the sealing material of the electronic component absorbs moisture again can be eliminated. Therefore, it is possible to seal the semiconductor element-embedded parts such as the CSP, QFP, and BGA that have been dried without moisture absorption again after the drying treatment. It is possible to provide a taping method for electronic components that can reliably prevent moisture absorption.

Further, in the past, a large-sized drying processing device, which was required because the electronic components arranged on the tray were collectively dried, was downsized by individually performing the drying processing. Since the drying process can be performed by the device described above, the amount of heat generated by the device can be reduced, and the installation space for the device can also be reduced. Therefore, such a device is installed. It is possible to reduce the influence on the temperature control of the clean room, save space in the clean room, and provide a taping method for electronic components that is easy to handle in the clean room.

Further, since the drying treatment of each of the semiconductor element built-in parts is performed by individually heating each of the semiconductor element built-in parts, the heating time to each semiconductor element built-in part, for example, Irradiation time and irradiation intensity of the heat source in use of the heat source is adjustable, even if the type of each semiconductor element built-in component changes, the characteristics of each semiconductor element built-in component parts, etc.
It is possible to irradiate the heat source by adjusting the optimum irradiation time and irradiation intensity, and it is possible to provide a taping method for electronic components that can be applied to more various types of semiconductor device built-in components.

According to the fourth aspect of the present invention, in the process of transporting each of the semiconductor element-embedded components from the tray to which the semiconductor element-embedded component is supplied to each of the accommodating parts, a moving component is used. While moving each of the semiconductor element built-in components from the tray on the gantry that is subjected to the drying treatment by the holding member, the semiconductor element built-in electronic component that has been dried by the insertion component holding member Supplying the semiconductor element-embedded parts onto the gantry for moving from the pedestal to the storages, that is, performing the drying treatment, and the semiconductor element-embedded after the drying treatment. By carrying out the storage work of the parts in the respective storage parts in parallel, the respective semiconductor element built-in parts are individually dried, and then sequentially stored on the carrier tape. And it is possible to seal, it is possible to obtain the same effect as by the first embodiment.

According to the fifth aspect of the present invention, the semiconductor element-embedded parts are individually subjected to the drying treatment, and then an appearance inspection is conducted, and no abnormality is detected. Since only the built-in parts are stored in the carrier tape, the stored semiconductor device built-in parts do not include defective products in appearance, and the electronic components of the semiconductor device built-in parts stored in the carrier tape are stored. It is possible to improve the handleability at the time of mounting by the component mounter.

According to the sixth or seventh aspect of the present invention, similar to the conventional taping method for electronic parts, the above-mentioned semiconductor element built-in parts are made to contain the respective semiconductor element built-in parts by using an inert gas and the respective storage parts of the carrier tape. By sealing the inside of the semiconductor element-containing component after sealing, it is possible to prevent oxidation of each electrode in the above-described semiconductor element-containing component and further prevent moisture absorption into the semiconductor element-containing component.

According to the eighth aspect of the present invention, the first
According to the electronic component taping methods of the aspects to the seventh aspect, it becomes possible to manufacture an electronic component assembly capable of obtaining the same effects as the effects described in the above respective aspects.

[Brief description of drawings]

FIG. 1 is a schematic explanatory diagram of a taping method for an electronic component according to an embodiment of the present invention.

FIG. 2 is a diagram showing a method of taping an electronic component according to the above embodiment, and is a cross-sectional view of the electronic component and each part on the pallet.

FIG. 3 is a diagram showing a method of taping an electronic component according to the above embodiment, and is a cross-sectional view of an electronic component and a carrier tape.

FIG. 4 is a partial plan view of a carrier tape and a cover tape used in the electronic component taping method according to the embodiment.

FIG. 5 is a partial perspective view of a carrier tape and a cover tape used in the electronic component taping method according to the embodiment.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Electronic component, 1a ... Electrode, 2 ... Supply tray, 3 ... Moving nozzle, 4 ... Pallet, 5a ... Far-infrared irradiation part, 5b
... far-infrared irradiation part, 6 ... inspection camera, 7 ... insertion nozzle, 11 ... carrier tape, 11a ... storage part, 11b ...
Joining area, 11c ... Joining area, 12 ... Cover tape, 1
2b ... Bonding area, 12c ... Bonding area, 13 ... Tape sealing device, 14 ... Gas supply nozzle, 15 ... Crimping tool, 41
... electronic component supply position, 42 ... baking processing position, 43
... inspection position, 44 ... electronic component take-out position, 45 ... storage position.

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) B65D 81/20 B65D 81/20 F 81/24 81/24 Z 85/86 85/38 PF term (reference) ) 3E053 AA10 BA10 DA03 FA05 JA10 3E067 AA11 AB41 AC04 BA33A BB14A BB25A EA32 FA01 FC01 GA19 GD10 3E096 AA06 BA08 CA15 DA26 EA02 EA11 FA02 FA22

Claims (8)

[Claims] 1. A carrier tape (1) having a plurality of recessed storage portions (11a) for storing the semiconductor element built-in component (1) as an electronic component at regular intervals in the longitudinal direction.
1) A method of taping an electronic component in which the semiconductor element built-in component (1) is housed in each housing portion (11a) and the carrier tape (11) is wound on a reel (17). In the process of transporting the semiconductor element built-in component (1) from the supply tray (2) to which (1) is supplied to each of the storage sections (11a), the semiconductor element built-in component (1) is individually After performing the drying treatment, the semiconductor element built-in parts (1) are sequentially stored in the storage parts (11a), and the storage parts (11a) are filled with an inert gas, and the storage parts (11a) are stored. By fixing the cover tape (12) so as to cover the opening of (11a), each of the accommodating parts (11a) is individually sealed, and the carrier tape (11) is wound on the reel (17). Taping method of the electronic component to be butterflies. 2. The drying treatment comprises heating at least one of the upper surface and the lower surface of each of the semiconductor element built-in components (1) to obtain an amount of water in each semiconductor element built-in component (1). The method of taping an electronic component according to claim 1, wherein: 3. The taping method for an electronic component according to claim 2, wherein the heating is performed by using a heat source. 4. The storage section (1) from the supply tray (2) to which the semiconductor device built-in component (1) is supplied.
1a) in the process of transporting each semiconductor device-containing component (11), the semiconductor device-containing component (1) is sucked and held from the supply tray (2) by the moving component holding member (3),
The semiconductor element-embedded component (1) is moved onto the pedestal (4) that is subjected to the drying treatment, and the semiconductor element-embedded component (1) is placed on the pedestal (4).
Is subjected to the above-mentioned drying treatment, and the above-mentioned semiconductor-device-embedded components (1) subjected to the above-mentioned drying treatment are adsorbed and held on the mount (4) by the insertion component holding member (7), and the carrier is The electronic component taping method according to any one of claims 1 to 3, wherein the tape (11) is stored in each of the storage portions (11a). 5. Before the carrier tape (11) is housed in the housing parts (11a), a visual inspection is performed on each of the semiconductor element built-in parts (1), and an abnormality is detected in the visual inspection. The taping method for an electronic component according to any one of claims 1 to 4, wherein only the semiconductor element built-in component (1) that has not been stored is stored in each of the storage portions (11a). 6. The storage parts (1) of the carrier tape (11) in which the semiconductor device built-in parts (1) are stored.
The sealing of the respective accommodating portions (11a) by enclosing the inert gas in 1a) and fixing the cover tape (12) is performed in a chamber (13) filled with the inert gas. 6. The electronic component taping method according to any one of 1 to 5. 7. The semiconductor element-embedded component (1) is obtained by taking out the semiconductor element-embedded component (1) from the supply tray (2) to which the semiconductor element-embedded component (1) is supplied. The stored carrier tape (11)
Each of the above-mentioned operations up to the above-mentioned hermetically closing of each of said storage parts (11a) by fixing said cover tape (12) in each of said storage parts (11a) is performed in a room filled with said inert gas. 6. The electronic component taping method according to any one of 1 to 5. 8. The semiconductor device-embedded component (1) manufactured by the electronic component taping method according to claim 1, wherein each of the semiconductor element-embedded components (1) is the carrier tape (11).
An electronic component assembly configured to be housed in each of the housing units (11a).