CN1993639B - 光电集成电路元件和使用该光电集成电路元件的传送装置 - Google Patents

光电集成电路元件和使用该光电集成电路元件的传送装置 Download PDF

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Publication number
CN1993639B
CN1993639B CN2004800436797A CN200480043679A CN1993639B CN 1993639 B CN1993639 B CN 1993639B CN 2004800436797 A CN2004800436797 A CN 2004800436797A CN 200480043679 A CN200480043679 A CN 200480043679A CN 1993639 B CN1993639 B CN 1993639B
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CN
China
Prior art keywords
mentioned
photo
components
electric conversion
optical waveguide
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Expired - Fee Related
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CN2004800436797A
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English (en)
Chinese (zh)
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CN1993639A (zh
Inventor
松冈康信
肉仓正人
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Resonac Corp
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Hitachi Chemical Co Ltd
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Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of CN1993639A publication Critical patent/CN1993639A/zh
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Publication of CN1993639B publication Critical patent/CN1993639B/zh
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/421—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical component consisting of a short length of fibre, e.g. fibre stub
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)
CN2004800436797A 2004-09-29 2004-09-29 光电集成电路元件和使用该光电集成电路元件的传送装置 Expired - Fee Related CN1993639B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2004/014226 WO2006035499A1 (ja) 2004-09-29 2004-09-29 光電気集積回路素子およびそれを用いた伝送装置

Publications (2)

Publication Number Publication Date
CN1993639A CN1993639A (zh) 2007-07-04
CN1993639B true CN1993639B (zh) 2013-01-16

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Family Applications (1)

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CN2004800436797A Expired - Fee Related CN1993639B (zh) 2004-09-29 2004-09-29 光电集成电路元件和使用该光电集成电路元件的传送装置

Country Status (6)

Country Link
US (1) US7657136B2 (https=)
JP (1) JP4462269B2 (https=)
KR (1) KR100911508B1 (https=)
CN (1) CN1993639B (https=)
TW (1) TW200611434A (https=)
WO (1) WO2006035499A1 (https=)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006035499A1 (ja) * 2004-09-29 2006-04-06 Hitachi Chemical Co., Ltd. 光電気集積回路素子およびそれを用いた伝送装置
US8000608B2 (en) * 2005-03-23 2011-08-16 Phyworks Limited Integrated circuit for communications modules
JP4416050B2 (ja) * 2006-09-21 2010-02-17 日立化成工業株式会社 光導波路基板およびそれを用いた光電気混載回路実装基板
JP5107679B2 (ja) * 2007-11-13 2012-12-26 日本特殊陶業株式会社 光電気混載パッケージ及び光コネクタ並びにこれらを備えた光電気混載モジュール
KR20100102698A (ko) * 2008-02-08 2010-09-24 히다치 가세고교 가부시끼가이샤 광배선 인쇄 기판의 제조 방법 및 광배선 인쇄 회로 기판
US8989531B2 (en) 2009-03-30 2015-03-24 Kyocera Corporation Optical-electrical wiring board and optical module
WO2011033043A2 (en) * 2009-09-17 2011-03-24 Vti Immobilien & Treuhand Ag Connector and system
JP2011158666A (ja) * 2010-01-29 2011-08-18 Toshiba Corp 光電気フレキシブル配線モジュール及びその製造方法
JP2011227371A (ja) * 2010-04-22 2011-11-10 Nec Corp 半導体パッケージ
FR2963101B1 (fr) * 2010-07-22 2013-02-15 Commissariat Energie Atomique Detecteur de particules et procede de realisation d'un tel detecteur
US9107294B2 (en) 2010-07-26 2015-08-11 Hewlett-Packard Development Company, L.P. System including a module
JP5734709B2 (ja) * 2011-03-17 2015-06-17 富士通株式会社 光コネクタ及び電子情報機器
CN102809784B (zh) 2011-06-02 2014-08-27 富士康(昆山)电脑接插件有限公司 光背板组件
US8781267B2 (en) * 2012-01-27 2014-07-15 Telefonaktiebolaget L M Ericsson Optical physical interface module
JP2015121565A (ja) * 2012-03-02 2015-07-02 株式会社日立製作所 多チャンネル光モジュール及びそれを用いた情報処理装置
CN107748417B (zh) * 2013-04-12 2020-04-21 夏天 二极管模组的制作方法
US9551845B1 (en) * 2013-10-01 2017-01-24 Microsemi Storage Solutions (U.S.), Inc. Method for manufacturing optical engine packages and apparatus from which optical engine packages are manufactured
JP2015106099A (ja) * 2013-12-02 2015-06-08 住友ベークライト株式会社 光配線部品、光モジュール、光電気混載基板および電子機器
JP6664897B2 (ja) * 2015-07-22 2020-03-13 ルネサスエレクトロニクス株式会社 半導体装置
JP6231608B2 (ja) * 2016-04-21 2017-11-15 日本電信電話株式会社 光電子集積回路の実装方法
CN105807367B (zh) * 2016-05-27 2019-06-14 湖南大学 一种基于石墨烯光电器件的光电集成电路
JP6660820B2 (ja) * 2016-06-13 2020-03-11 日本電信電話株式会社 光デバイス
US10025044B1 (en) * 2017-01-17 2018-07-17 International Business Machines Corporation Optical structure
US10359565B2 (en) 2017-02-07 2019-07-23 Nokia Of America Corporation Optoelectronic circuit having one or more double-sided substrates
EP3732520B1 (en) * 2017-12-30 2024-01-24 Telescent Inc. Automated installation and reconfiguration of fiber optic and copper cables in large scale data centers
US10598860B2 (en) * 2018-03-14 2020-03-24 Globalfoundries Inc. Photonic die fan out package with edge fiber coupling interface and related methods
CN114114528B (zh) 2020-08-28 2023-06-02 深南电路股份有限公司 光纤线路板组件以及光电混合线路板
CN116324550A (zh) * 2020-10-20 2023-06-23 3M创新有限公司 用于边缘耦合的光学互连器
US12607809B2 (en) 2021-09-22 2026-04-21 Intel Corporation Optical waveguide edge coupling within a substrate
CN113949949A (zh) * 2021-09-30 2022-01-18 中航光电科技股份有限公司 一种基于转向设计的光波导路由交换设计方法
CN116299888A (zh) * 2021-12-14 2023-06-23 上海曦智科技有限公司 光互连装置及其制造方法
US12517299B2 (en) * 2023-02-03 2026-01-06 Advanced Semiconductor Engineering, Inc. Optoelectronic device and method of transmitting optical signal
US20250291137A1 (en) * 2024-03-15 2025-09-18 Oip Technology Pte Ltd Silicon photonic chip package module based on plastic encapsulation
CN119045131B (zh) * 2024-10-29 2025-02-07 武汉钧恒科技有限公司 一种800g qsfp-dd dr8硅光模块

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0642046A1 (en) * 1993-09-03 1995-03-08 Motorola, Inc. Intelligent opto-bus with display
CN1209555A (zh) * 1997-08-27 1999-03-03 三星电子株式会社 输入和输出光纤阵列在一块平面基座上的光纤阵列模件
US20030025962A1 (en) * 2000-09-21 2003-02-06 Shinji Nishimura Wavelength division multiplexed optical interconnection device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0215679A (ja) * 1988-07-04 1990-01-19 Ricoh Co Ltd 実装方法
WO1994006052A1 (fr) * 1992-09-10 1994-03-17 Fujitsu Limited Systeme de circuit optique et ses constituants
JPH08110435A (ja) * 1994-10-12 1996-04-30 Hitachi Ltd 半導体光結合装置
JP3803596B2 (ja) * 2002-03-14 2006-08-02 日本電気株式会社 パッケージ型半導体装置
JP2003344695A (ja) * 2002-05-22 2003-12-03 Sumitomo Electric Ind Ltd 光導波路モジュール
WO2006035499A1 (ja) * 2004-09-29 2006-04-06 Hitachi Chemical Co., Ltd. 光電気集積回路素子およびそれを用いた伝送装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0642046A1 (en) * 1993-09-03 1995-03-08 Motorola, Inc. Intelligent opto-bus with display
CN1209555A (zh) * 1997-08-27 1999-03-03 三星电子株式会社 输入和输出光纤阵列在一块平面基座上的光纤阵列模件
US20030025962A1 (en) * 2000-09-21 2003-02-06 Shinji Nishimura Wavelength division multiplexed optical interconnection device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP平8-110435A 1996.04.30

Also Published As

Publication number Publication date
WO2006035499A1 (ja) 2006-04-06
US20090003761A1 (en) 2009-01-01
KR100911508B1 (ko) 2009-08-10
JPWO2006035499A1 (ja) 2008-05-15
TWI376038B (https=) 2012-11-01
TW200611434A (en) 2006-04-01
JP4462269B2 (ja) 2010-05-12
CN1993639A (zh) 2007-07-04
KR20070030934A (ko) 2007-03-16
US7657136B2 (en) 2010-02-02

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Granted publication date: 20130116

Termination date: 20170929