TW200611434A - Photoelectric integrated circuit element and transmission apparatus using the same - Google Patents
Photoelectric integrated circuit element and transmission apparatus using the sameInfo
- Publication number
- TW200611434A TW200611434A TW094102147A TW94102147A TW200611434A TW 200611434 A TW200611434 A TW 200611434A TW 094102147 A TW094102147 A TW 094102147A TW 94102147 A TW94102147 A TW 94102147A TW 200611434 A TW200611434 A TW 200611434A
- Authority
- TW
- Taiwan
- Prior art keywords
- integrated circuit
- conversion elements
- circuit element
- photoelectric conversion
- photoelectric
- Prior art date
Links
- 230000005540 biological transmission Effects 0.000 title abstract 2
- 238000006243 chemical reaction Methods 0.000 abstract 5
- 230000003287 optical effect Effects 0.000 abstract 5
- 230000006866 deterioration Effects 0.000 abstract 1
- 230000010354 integration Effects 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/421—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical component consisting of a short length of fibre, e.g. fibre stub
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Couplings Of Light Guides (AREA)
- Optical Integrated Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2004/014226 WO2006035499A1 (ja) | 2004-09-29 | 2004-09-29 | 光電気集積回路素子およびそれを用いた伝送装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200611434A true TW200611434A (en) | 2006-04-01 |
| TWI376038B TWI376038B (https=) | 2012-11-01 |
Family
ID=36118651
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094102147A TW200611434A (en) | 2004-09-29 | 2005-01-25 | Photoelectric integrated circuit element and transmission apparatus using the same |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7657136B2 (https=) |
| JP (1) | JP4462269B2 (https=) |
| KR (1) | KR100911508B1 (https=) |
| CN (1) | CN1993639B (https=) |
| TW (1) | TW200611434A (https=) |
| WO (1) | WO2006035499A1 (https=) |
Families Citing this family (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006035499A1 (ja) * | 2004-09-29 | 2006-04-06 | Hitachi Chemical Co., Ltd. | 光電気集積回路素子およびそれを用いた伝送装置 |
| US8000608B2 (en) * | 2005-03-23 | 2011-08-16 | Phyworks Limited | Integrated circuit for communications modules |
| JP4416050B2 (ja) * | 2006-09-21 | 2010-02-17 | 日立化成工業株式会社 | 光導波路基板およびそれを用いた光電気混載回路実装基板 |
| JP5107679B2 (ja) * | 2007-11-13 | 2012-12-26 | 日本特殊陶業株式会社 | 光電気混載パッケージ及び光コネクタ並びにこれらを備えた光電気混載モジュール |
| KR20100102698A (ko) * | 2008-02-08 | 2010-09-24 | 히다치 가세고교 가부시끼가이샤 | 광배선 인쇄 기판의 제조 방법 및 광배선 인쇄 회로 기판 |
| US8989531B2 (en) | 2009-03-30 | 2015-03-24 | Kyocera Corporation | Optical-electrical wiring board and optical module |
| WO2011033043A2 (en) * | 2009-09-17 | 2011-03-24 | Vti Immobilien & Treuhand Ag | Connector and system |
| JP2011158666A (ja) * | 2010-01-29 | 2011-08-18 | Toshiba Corp | 光電気フレキシブル配線モジュール及びその製造方法 |
| JP2011227371A (ja) * | 2010-04-22 | 2011-11-10 | Nec Corp | 半導体パッケージ |
| FR2963101B1 (fr) * | 2010-07-22 | 2013-02-15 | Commissariat Energie Atomique | Detecteur de particules et procede de realisation d'un tel detecteur |
| US9107294B2 (en) | 2010-07-26 | 2015-08-11 | Hewlett-Packard Development Company, L.P. | System including a module |
| JP5734709B2 (ja) * | 2011-03-17 | 2015-06-17 | 富士通株式会社 | 光コネクタ及び電子情報機器 |
| CN102809784B (zh) | 2011-06-02 | 2014-08-27 | 富士康(昆山)电脑接插件有限公司 | 光背板组件 |
| US8781267B2 (en) * | 2012-01-27 | 2014-07-15 | Telefonaktiebolaget L M Ericsson | Optical physical interface module |
| JP2015121565A (ja) * | 2012-03-02 | 2015-07-02 | 株式会社日立製作所 | 多チャンネル光モジュール及びそれを用いた情報処理装置 |
| CN107748417B (zh) * | 2013-04-12 | 2020-04-21 | 夏天 | 二极管模组的制作方法 |
| US9551845B1 (en) * | 2013-10-01 | 2017-01-24 | Microsemi Storage Solutions (U.S.), Inc. | Method for manufacturing optical engine packages and apparatus from which optical engine packages are manufactured |
| JP2015106099A (ja) * | 2013-12-02 | 2015-06-08 | 住友ベークライト株式会社 | 光配線部品、光モジュール、光電気混載基板および電子機器 |
| JP6664897B2 (ja) * | 2015-07-22 | 2020-03-13 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP6231608B2 (ja) * | 2016-04-21 | 2017-11-15 | 日本電信電話株式会社 | 光電子集積回路の実装方法 |
| CN105807367B (zh) * | 2016-05-27 | 2019-06-14 | 湖南大学 | 一种基于石墨烯光电器件的光电集成电路 |
| JP6660820B2 (ja) * | 2016-06-13 | 2020-03-11 | 日本電信電話株式会社 | 光デバイス |
| US10025044B1 (en) * | 2017-01-17 | 2018-07-17 | International Business Machines Corporation | Optical structure |
| US10359565B2 (en) | 2017-02-07 | 2019-07-23 | Nokia Of America Corporation | Optoelectronic circuit having one or more double-sided substrates |
| EP3732520B1 (en) * | 2017-12-30 | 2024-01-24 | Telescent Inc. | Automated installation and reconfiguration of fiber optic and copper cables in large scale data centers |
| US10598860B2 (en) * | 2018-03-14 | 2020-03-24 | Globalfoundries Inc. | Photonic die fan out package with edge fiber coupling interface and related methods |
| CN114114528B (zh) | 2020-08-28 | 2023-06-02 | 深南电路股份有限公司 | 光纤线路板组件以及光电混合线路板 |
| CN116324550A (zh) * | 2020-10-20 | 2023-06-23 | 3M创新有限公司 | 用于边缘耦合的光学互连器 |
| US12607809B2 (en) | 2021-09-22 | 2026-04-21 | Intel Corporation | Optical waveguide edge coupling within a substrate |
| CN113949949A (zh) * | 2021-09-30 | 2022-01-18 | 中航光电科技股份有限公司 | 一种基于转向设计的光波导路由交换设计方法 |
| CN116299888A (zh) * | 2021-12-14 | 2023-06-23 | 上海曦智科技有限公司 | 光互连装置及其制造方法 |
| US12517299B2 (en) * | 2023-02-03 | 2026-01-06 | Advanced Semiconductor Engineering, Inc. | Optoelectronic device and method of transmitting optical signal |
| US20250291137A1 (en) * | 2024-03-15 | 2025-09-18 | Oip Technology Pte Ltd | Silicon photonic chip package module based on plastic encapsulation |
| CN119045131B (zh) * | 2024-10-29 | 2025-02-07 | 武汉钧恒科技有限公司 | 一种800g qsfp-dd dr8硅光模块 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0215679A (ja) * | 1988-07-04 | 1990-01-19 | Ricoh Co Ltd | 実装方法 |
| WO1994006052A1 (fr) * | 1992-09-10 | 1994-03-17 | Fujitsu Limited | Systeme de circuit optique et ses constituants |
| US5345527A (en) * | 1993-09-03 | 1994-09-06 | Motorola, Inc. | Intelligent opto-bus with display |
| JPH08110435A (ja) * | 1994-10-12 | 1996-04-30 | Hitachi Ltd | 半導体光結合装置 |
| KR19990018425A (ko) * | 1997-08-27 | 1999-03-15 | 윤종용 | 동일 평면기판상에 입출력 광섬유 어레이가 위치하는 광섬유 어레이 모듈 |
| JP2002101051A (ja) * | 2000-09-21 | 2002-04-05 | Hitachi Ltd | 波長多重光インタコネクション装置 |
| JP3803596B2 (ja) * | 2002-03-14 | 2006-08-02 | 日本電気株式会社 | パッケージ型半導体装置 |
| JP2003344695A (ja) * | 2002-05-22 | 2003-12-03 | Sumitomo Electric Ind Ltd | 光導波路モジュール |
| WO2006035499A1 (ja) * | 2004-09-29 | 2006-04-06 | Hitachi Chemical Co., Ltd. | 光電気集積回路素子およびそれを用いた伝送装置 |
-
2004
- 2004-09-29 WO PCT/JP2004/014226 patent/WO2006035499A1/ja not_active Ceased
- 2004-09-29 US US11/658,587 patent/US7657136B2/en not_active Expired - Fee Related
- 2004-09-29 KR KR1020077002128A patent/KR100911508B1/ko not_active Expired - Fee Related
- 2004-09-29 CN CN2004800436797A patent/CN1993639B/zh not_active Expired - Fee Related
- 2004-09-29 JP JP2006537601A patent/JP4462269B2/ja not_active Expired - Fee Related
-
2005
- 2005-01-25 TW TW094102147A patent/TW200611434A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CN1993639B (zh) | 2013-01-16 |
| WO2006035499A1 (ja) | 2006-04-06 |
| US20090003761A1 (en) | 2009-01-01 |
| KR100911508B1 (ko) | 2009-08-10 |
| JPWO2006035499A1 (ja) | 2008-05-15 |
| TWI376038B (https=) | 2012-11-01 |
| JP4462269B2 (ja) | 2010-05-12 |
| CN1993639A (zh) | 2007-07-04 |
| KR20070030934A (ko) | 2007-03-16 |
| US7657136B2 (en) | 2010-02-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW200611434A (en) | Photoelectric integrated circuit element and transmission apparatus using the same | |
| WO2003083544A3 (en) | Integrated optoelectrical circuit package with optical waveguide interconnects | |
| WO2004008532A3 (en) | High power mcm package | |
| TW200511612A (en) | Mount for semiconductor light emitting device | |
| TW201130110A (en) | Multi-layer semiconductor package | |
| HK1124724A2 (en) | Led lighting device and method of manufacturing the same | |
| WO2005034198A3 (en) | Methods and apparatus for an led light engine | |
| MXPA03006691A (es) | Conector de energia en microplaqueta. | |
| ATE401760T1 (de) | Modulare led-lampe | |
| TW200731863A (en) | Light emitting device with light emitting cells arrayed | |
| EP2365363A3 (en) | Photoelectric converter | |
| FR2824180B1 (fr) | Module de condensateur et dispositif semi-conducteur utilisant le module de condensateur | |
| WO2009048965A3 (en) | Printed circuit board assembly carrier for an optical electrical device | |
| DE50213208D1 (de) | Steckverbinder für elektronische Bauelemente | |
| US11057034B2 (en) | Semiconductor relay module | |
| TW200802957A (en) | Light emitting diode module | |
| TW200610110A (en) | LSI package possessing interface function with exterior, circuit device including the same, and manufacturing method of circuit device | |
| TW200719776A (en) | Circuit board with optical component embedded therein | |
| JP2007227551A (ja) | 半導体光センサ装置 | |
| CN107450134A (zh) | 光模块及通信设备 | |
| EP4109744A3 (en) | Photovoltaic module and photovoltaic system | |
| TWI514699B (zh) | 光纖連接器 | |
| CN207133476U (zh) | 光模块及通信设备 | |
| CN113242642A (zh) | 一种光模块用的背光监控结构 | |
| JP2019083587A (ja) | 半導体リレーモジュール |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |