CN1971841A - 基板处理装置 - Google Patents
基板处理装置 Download PDFInfo
- Publication number
- CN1971841A CN1971841A CNA2006101493980A CN200610149398A CN1971841A CN 1971841 A CN1971841 A CN 1971841A CN A2006101493980 A CNA2006101493980 A CN A2006101493980A CN 200610149398 A CN200610149398 A CN 200610149398A CN 1971841 A CN1971841 A CN 1971841A
- Authority
- CN
- China
- Prior art keywords
- mentioned
- chamber
- treatment
- adjustment
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 52
- 239000003960 organic solvent Substances 0.000 claims abstract description 11
- 239000011261 inert gas Substances 0.000 claims abstract description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 52
- 239000012530 fluid Substances 0.000 claims description 26
- 230000028016 temperature homeostasis Effects 0.000 claims description 18
- 230000001105 regulatory effect Effects 0.000 claims description 12
- 230000003028 elevating effect Effects 0.000 claims description 11
- 230000002093 peripheral effect Effects 0.000 claims description 11
- 230000001276 controlling effect Effects 0.000 claims description 9
- 230000008520 organization Effects 0.000 claims description 8
- 239000007788 liquid Substances 0.000 abstract description 6
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 48
- 230000004087 circulation Effects 0.000 description 29
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 18
- 238000001816 cooling Methods 0.000 description 9
- 229910052757 nitrogen Inorganic materials 0.000 description 9
- 238000010586 diagram Methods 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- 238000007599 discharging Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 235000014347 soups Nutrition 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
Claims (11)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005335836 | 2005-11-21 | ||
JP2005335836A JP4666494B2 (ja) | 2005-11-21 | 2005-11-21 | 基板処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1971841A true CN1971841A (zh) | 2007-05-30 |
CN100559550C CN100559550C (zh) | 2009-11-11 |
Family
ID=38089219
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006101493980A Expired - Fee Related CN100559550C (zh) | 2005-11-21 | 2006-11-21 | 基板处理装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8178821B2 (zh) |
JP (1) | JP4666494B2 (zh) |
KR (1) | KR100778957B1 (zh) |
CN (1) | CN100559550C (zh) |
TW (1) | TWI349958B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101561218B (zh) * | 2008-04-16 | 2010-12-08 | 富葵精密组件(深圳)有限公司 | 真空氮气烘箱 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5226456B2 (ja) * | 2008-10-15 | 2013-07-03 | 大日本スクリーン製造株式会社 | 基板乾燥装置及びその温調方法 |
JP6017999B2 (ja) * | 2013-03-15 | 2016-11-02 | 株式会社Screenホールディングス | 基板処理装置 |
JP7312656B2 (ja) * | 2019-09-24 | 2023-07-21 | 株式会社Screenホールディングス | 基板処理装置 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3347814B2 (ja) * | 1993-05-17 | 2002-11-20 | 大日本スクリーン製造株式会社 | 基板の洗浄・乾燥処理方法並びにその処理装置 |
JP3333032B2 (ja) * | 1994-01-25 | 2002-10-07 | 株式会社千代田製作所 | 超音波処理を行なう容器中の液体の温度調節方法と装置 |
JPH08264265A (ja) * | 1995-03-23 | 1996-10-11 | Sekisui Plastics Co Ltd | ヒータおよびその使用方法 |
JPH08334235A (ja) * | 1995-06-09 | 1996-12-17 | Matsushita Electric Ind Co Ltd | 加熱装置 |
US6050275A (en) * | 1996-09-27 | 2000-04-18 | Tokyo Electron Limited | Apparatus for and method of cleaning objects to be processed |
TW353777B (en) * | 1996-11-08 | 1999-03-01 | Tokyo Electron Ltd | Treatment device |
KR100328797B1 (ko) * | 1997-04-14 | 2002-09-27 | 다이닛뽕스크린 세이조오 가부시키가이샤 | 기판건조장치및기판처리장치 |
JP3151613B2 (ja) | 1997-06-17 | 2001-04-03 | 東京エレクトロン株式会社 | 洗浄・乾燥処理方法及びその装置 |
KR19990010200A (ko) | 1997-07-15 | 1999-02-05 | 윤종용 | 감압식 건조 장치를 이용하는 반도체장치 건조방법 |
JPH11121429A (ja) * | 1997-10-08 | 1999-04-30 | Dainippon Screen Mfg Co Ltd | 基板乾燥装置およびそれを備えた基板処理装置 |
US6027760A (en) * | 1997-12-08 | 2000-02-22 | Gurer; Emir | Photoresist coating process control with solvent vapor sensor |
US6729040B2 (en) * | 1999-05-27 | 2004-05-04 | Oliver Design, Inc. | Apparatus and method for drying a substrate using hydrophobic and polar organic compounds |
JP3448613B2 (ja) | 1999-06-29 | 2003-09-22 | オメガセミコン電子株式会社 | 乾燥装置 |
JP2001176833A (ja) | 1999-12-14 | 2001-06-29 | Tokyo Electron Ltd | 基板処理装置 |
US6286231B1 (en) | 2000-01-12 | 2001-09-11 | Semitool, Inc. | Method and apparatus for high-pressure wafer processing and drying |
US6558477B1 (en) * | 2000-10-16 | 2003-05-06 | Micron Technology, Inc. | Removal of photoresist through the use of hot deionized water bath, water vapor and ozone gas |
JP2002317069A (ja) * | 2001-04-18 | 2002-10-31 | Potto Japan Kk | 廃プラスチックの減容溶融機 |
US20020174882A1 (en) * | 2001-05-25 | 2002-11-28 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing apparatus and substrate processing method |
US6878216B2 (en) * | 2001-09-03 | 2005-04-12 | Tokyo Electron Limited | Substrate processing method and substrate processing system |
KR100456527B1 (ko) * | 2001-12-11 | 2004-11-09 | 삼성전자주식회사 | 마란고니 효과를 증대시키기 위한 건조 장비 및 건조 방법 |
JP4076365B2 (ja) | 2002-04-09 | 2008-04-16 | シャープ株式会社 | 半導体洗浄装置 |
JP3676756B2 (ja) * | 2002-05-30 | 2005-07-27 | 大日本スクリーン製造株式会社 | 基板の洗浄・乾燥処理装置 |
JP2004063513A (ja) | 2002-07-25 | 2004-02-26 | Matsushita Electric Ind Co Ltd | 半導体基板の洗浄乾燥方法 |
JP3964862B2 (ja) | 2003-12-22 | 2007-08-22 | 島田理化工業株式会社 | 洗浄乾燥装置および洗浄乾燥方法 |
-
2005
- 2005-11-21 JP JP2005335836A patent/JP4666494B2/ja not_active Expired - Fee Related
-
2006
- 2006-11-07 KR KR1020060109440A patent/KR100778957B1/ko not_active IP Right Cessation
- 2006-11-15 US US11/560,121 patent/US8178821B2/en not_active Expired - Fee Related
- 2006-11-16 TW TW095142361A patent/TWI349958B/zh not_active IP Right Cessation
- 2006-11-21 CN CNB2006101493980A patent/CN100559550C/zh not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101561218B (zh) * | 2008-04-16 | 2010-12-08 | 富葵精密组件(深圳)有限公司 | 真空氮气烘箱 |
Also Published As
Publication number | Publication date |
---|---|
KR100778957B1 (ko) | 2007-11-22 |
TWI349958B (en) | 2011-10-01 |
US8178821B2 (en) | 2012-05-15 |
KR20070053611A (ko) | 2007-05-25 |
JP2007142262A (ja) | 2007-06-07 |
US20070113744A1 (en) | 2007-05-24 |
JP4666494B2 (ja) | 2011-04-06 |
CN100559550C (zh) | 2009-11-11 |
TW200741839A (en) | 2007-11-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: DAINIPPON SCREEN MFG. CO., LTD. Free format text: FORMER NAME: DAINIPPON MESH PLATE MFR. CO., LTD. Owner name: SCREEN GROUP CO., LTD. Free format text: FORMER NAME: DAINIPPON SCREEN MFG. CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Kyoto City, Kyoto, Japan Patentee after: Skilling Group Address before: Kyoto City, Kyoto, Japan Patentee before: DAINIPPON SCREEN MFG Co.,Ltd. Address after: Kyoto City, Kyoto, Japan Patentee after: DAINIPPON SCREEN MFG Co.,Ltd. Address before: Kyoto City, Kyoto, Japan Patentee before: Dainippon Screen Mfg. Co.,Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091111 Termination date: 20161121 |
|
CF01 | Termination of patent right due to non-payment of annual fee |