TWI349958B - Substrate treating apparatus - Google Patents

Substrate treating apparatus

Info

Publication number
TWI349958B
TWI349958B TW095142361A TW95142361A TWI349958B TW I349958 B TWI349958 B TW I349958B TW 095142361 A TW095142361 A TW 095142361A TW 95142361 A TW95142361 A TW 95142361A TW I349958 B TWI349958 B TW I349958B
Authority
TW
Taiwan
Prior art keywords
treating apparatus
substrate treating
substrate
treating
Prior art date
Application number
TW095142361A
Other languages
English (en)
Other versions
TW200741839A (en
Inventor
Tomoaki Aihara
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200741839A publication Critical patent/TW200741839A/zh
Application granted granted Critical
Publication of TWI349958B publication Critical patent/TWI349958B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW095142361A 2005-11-21 2006-11-16 Substrate treating apparatus TWI349958B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005335836A JP4666494B2 (ja) 2005-11-21 2005-11-21 基板処理装置

Publications (2)

Publication Number Publication Date
TW200741839A TW200741839A (en) 2007-11-01
TWI349958B true TWI349958B (en) 2011-10-01

Family

ID=38089219

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095142361A TWI349958B (en) 2005-11-21 2006-11-16 Substrate treating apparatus

Country Status (5)

Country Link
US (1) US8178821B2 (zh)
JP (1) JP4666494B2 (zh)
KR (1) KR100778957B1 (zh)
CN (1) CN100559550C (zh)
TW (1) TWI349958B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI501310B (zh) * 2013-03-15 2015-09-21 Screen Holdings Co Ltd 基板處理裝置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101561218B (zh) * 2008-04-16 2010-12-08 富葵精密组件(深圳)有限公司 真空氮气烘箱
JP5226456B2 (ja) * 2008-10-15 2013-07-03 大日本スクリーン製造株式会社 基板乾燥装置及びその温調方法
JP7312656B2 (ja) * 2019-09-24 2023-07-21 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3347814B2 (ja) * 1993-05-17 2002-11-20 大日本スクリーン製造株式会社 基板の洗浄・乾燥処理方法並びにその処理装置
JP3333032B2 (ja) * 1994-01-25 2002-10-07 株式会社千代田製作所 超音波処理を行なう容器中の液体の温度調節方法と装置
JPH08264265A (ja) * 1995-03-23 1996-10-11 Sekisui Plastics Co Ltd ヒータおよびその使用方法
JPH08334235A (ja) * 1995-06-09 1996-12-17 Matsushita Electric Ind Co Ltd 加熱装置
US6050275A (en) * 1996-09-27 2000-04-18 Tokyo Electron Limited Apparatus for and method of cleaning objects to be processed
TW353777B (en) * 1996-11-08 1999-03-01 Tokyo Electron Ltd Treatment device
KR100328797B1 (ko) * 1997-04-14 2002-09-27 다이닛뽕스크린 세이조오 가부시키가이샤 기판건조장치및기판처리장치
JP3151613B2 (ja) * 1997-06-17 2001-04-03 東京エレクトロン株式会社 洗浄・乾燥処理方法及びその装置
KR19990010200A (ko) * 1997-07-15 1999-02-05 윤종용 감압식 건조 장치를 이용하는 반도체장치 건조방법
JPH11121429A (ja) * 1997-10-08 1999-04-30 Dainippon Screen Mfg Co Ltd 基板乾燥装置およびそれを備えた基板処理装置
US6027760A (en) * 1997-12-08 2000-02-22 Gurer; Emir Photoresist coating process control with solvent vapor sensor
US6729040B2 (en) * 1999-05-27 2004-05-04 Oliver Design, Inc. Apparatus and method for drying a substrate using hydrophobic and polar organic compounds
JP3448613B2 (ja) 1999-06-29 2003-09-22 オメガセミコン電子株式会社 乾燥装置
JP2001176833A (ja) * 1999-12-14 2001-06-29 Tokyo Electron Ltd 基板処理装置
US6286231B1 (en) 2000-01-12 2001-09-11 Semitool, Inc. Method and apparatus for high-pressure wafer processing and drying
US6558477B1 (en) * 2000-10-16 2003-05-06 Micron Technology, Inc. Removal of photoresist through the use of hot deionized water bath, water vapor and ozone gas
JP2002317069A (ja) * 2001-04-18 2002-10-31 Potto Japan Kk 廃プラスチックの減容溶融機
US20020174882A1 (en) * 2001-05-25 2002-11-28 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus and substrate processing method
US6878216B2 (en) * 2001-09-03 2005-04-12 Tokyo Electron Limited Substrate processing method and substrate processing system
KR100456527B1 (ko) * 2001-12-11 2004-11-09 삼성전자주식회사 마란고니 효과를 증대시키기 위한 건조 장비 및 건조 방법
JP4076365B2 (ja) 2002-04-09 2008-04-16 シャープ株式会社 半導体洗浄装置
JP3676756B2 (ja) * 2002-05-30 2005-07-27 大日本スクリーン製造株式会社 基板の洗浄・乾燥処理装置
JP2004063513A (ja) 2002-07-25 2004-02-26 Matsushita Electric Ind Co Ltd 半導体基板の洗浄乾燥方法
JP3964862B2 (ja) 2003-12-22 2007-08-22 島田理化工業株式会社 洗浄乾燥装置および洗浄乾燥方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI501310B (zh) * 2013-03-15 2015-09-21 Screen Holdings Co Ltd 基板處理裝置
US11621176B2 (en) 2013-03-15 2023-04-04 SCREEN Holdings Co., Ltd. Substrate processing apparatus

Also Published As

Publication number Publication date
US20070113744A1 (en) 2007-05-24
CN100559550C (zh) 2009-11-11
KR20070053611A (ko) 2007-05-25
CN1971841A (zh) 2007-05-30
KR100778957B1 (ko) 2007-11-22
JP4666494B2 (ja) 2011-04-06
TW200741839A (en) 2007-11-01
JP2007142262A (ja) 2007-06-07
US8178821B2 (en) 2012-05-15

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees