CN1946823A - 粘接薄膜、柔性敷金属叠层板及其制备方法 - Google Patents

粘接薄膜、柔性敷金属叠层板及其制备方法 Download PDF

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Publication number
CN1946823A
CN1946823A CN 200580013179 CN200580013179A CN1946823A CN 1946823 A CN1946823 A CN 1946823A CN 200580013179 CN200580013179 CN 200580013179 CN 200580013179 A CN200580013179 A CN 200580013179A CN 1946823 A CN1946823 A CN 1946823A
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China
Prior art keywords
film
adhesive film
heating
polyimide
furnace
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Pending
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CN 200580013179
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English (en)
Chinese (zh)
Inventor
小野和宏
藤原宽
松胁崇晃
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Kaneka Corp
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Kaneka Corp
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Publication of CN1946823A publication Critical patent/CN1946823A/zh
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  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN 200580013179 2004-05-13 2005-04-26 粘接薄膜、柔性敷金属叠层板及其制备方法 Pending CN1946823A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004144107 2004-05-13
JP144107/2004 2004-05-13
JP209113/2004 2004-07-15
JP209104/2004 2004-07-15

Related Child Applications (2)

Application Number Title Priority Date Filing Date
CN201010287758XA Division CN101979451B (zh) 2004-05-13 2005-04-26 粘接薄膜、柔性敷金属叠层板及其制备方法
CN2010102877819A Division CN101942280A (zh) 2004-05-13 2005-04-26 粘接薄膜、柔性敷金属叠层板及其制备方法

Publications (1)

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CN1946823A true CN1946823A (zh) 2007-04-11

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CN 200580013179 Pending CN1946823A (zh) 2004-05-13 2005-04-26 粘接薄膜、柔性敷金属叠层板及其制备方法

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JP (1) JP5758456B2 (https=)
CN (1) CN1946823A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110933846A (zh) * 2019-11-29 2020-03-27 盐城维信电子有限公司 一种卷料柔性线路板背靠背制程制作方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6704463B2 (ja) * 2016-10-14 2020-06-03 株式会社カネカ グラファイトフィルムの製造方法
EP3822056B1 (en) * 2019-11-18 2024-05-08 Heraeus Noblelight Ltd. System for treatment of a multi-layered cushioning product and operating method for a system for expanding a multi-layered cushioning product

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6241024A (ja) * 1985-08-19 1987-02-23 Kanegafuchi Chem Ind Co Ltd 加熱収縮性の改良されたポリイミドフイルム
JP3351265B2 (ja) * 1995-10-03 2002-11-25 宇部興産株式会社 芳香族ポリイミドフィルム及び銅箔積層フィルム
JP4035243B2 (ja) * 1998-12-03 2008-01-16 株式会社カネカ 銅張積層板用の多層ボンディングシートの製造方法
JP3994696B2 (ja) * 2000-10-02 2007-10-24 宇部興産株式会社 線膨張係数を制御したポリイミドフィルム及び積層体
JP2003174247A (ja) * 2001-09-28 2003-06-20 Ube Ind Ltd カバーレイフィルムおよび該フィルムを用いた回路基板
JP3932506B2 (ja) * 2002-01-10 2007-06-20 東レ・デュポン株式会社 ポリイミドフィルム、印刷回路および金属配線板
JP2004068002A (ja) * 2002-06-13 2004-03-04 Du Pont Toray Co Ltd ポリイミド混交フィルムの製造方法およびこれを基材とした金属配線回路板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110933846A (zh) * 2019-11-29 2020-03-27 盐城维信电子有限公司 一种卷料柔性线路板背靠背制程制作方法

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JP2013249480A (ja) 2013-12-12
JP5758456B2 (ja) 2015-08-05

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Application publication date: 20070411