CN1935722A - 涂敷装置和涂敷方法 - Google Patents
涂敷装置和涂敷方法 Download PDFInfo
- Publication number
- CN1935722A CN1935722A CNA2006101270041A CN200610127004A CN1935722A CN 1935722 A CN1935722 A CN 1935722A CN A2006101270041 A CNA2006101270041 A CN A2006101270041A CN 200610127004 A CN200610127004 A CN 200610127004A CN 1935722 A CN1935722 A CN 1935722A
- Authority
- CN
- China
- Prior art keywords
- gap nozzle
- coating
- substrate
- placement section
- benchmark
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1015—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
- B05C11/1018—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target responsive to distance of target
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
Landscapes
- Engineering & Computer Science (AREA)
- Coating Apparatus (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
Claims (4)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005273083A JP4803714B2 (ja) | 2005-09-21 | 2005-09-21 | 塗布装置及び塗布方法 |
JP2005273083 | 2005-09-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1935722A true CN1935722A (zh) | 2007-03-28 |
CN100569686C CN100569686C (zh) | 2009-12-16 |
Family
ID=37953496
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006101270041A Active CN100569686C (zh) | 2005-09-21 | 2006-09-19 | 涂敷装置和涂敷方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4803714B2 (zh) |
KR (1) | KR100739310B1 (zh) |
CN (1) | CN100569686C (zh) |
TW (1) | TW200716264A (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103771719A (zh) * | 2014-01-16 | 2014-05-07 | 北京京东方光电科技有限公司 | 一种涂布装置 |
CN111940229A (zh) * | 2019-05-14 | 2020-11-17 | 东京应化工业株式会社 | 涂布装置以及涂布方法 |
CN112341005A (zh) * | 2019-08-08 | 2021-02-09 | 中外炉工业株式会社 | 涂敷装置及涂敷方法 |
CN113083616A (zh) * | 2021-04-07 | 2021-07-09 | 深圳市曼恩斯特科技股份有限公司 | 一种涂布挤压模头面密度外部调节装置 |
CN113534112A (zh) * | 2021-09-16 | 2021-10-22 | 常州铭赛机器人科技股份有限公司 | 一种弧形透明工件激光测高校准方法 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5416925B2 (ja) * | 2008-06-24 | 2014-02-12 | 東京応化工業株式会社 | 塗布装置 |
JP5621486B2 (ja) * | 2009-10-06 | 2014-11-12 | 三菱化学株式会社 | シリカ系多孔質体の製造方法 |
JP5470474B2 (ja) * | 2013-02-04 | 2014-04-16 | 東京応化工業株式会社 | 塗布装置 |
CN104138825B (zh) * | 2013-05-08 | 2016-05-04 | 冠伟科技股份有限公司 | 点胶机定位方法 |
KR102641446B1 (ko) * | 2017-07-19 | 2024-02-28 | 주식회사 탑 엔지니어링 | 디스펜싱 장치 |
CN109293251B (zh) * | 2018-09-29 | 2021-06-18 | 芜湖中义玻璃有限公司 | 一种玻璃表面高效喷涂装置 |
JP7077994B2 (ja) * | 2019-02-28 | 2022-05-31 | 株式会社豊田自動織機 | 塗工装置及び塗工装置の位置合わせ方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06343912A (ja) * | 1993-06-10 | 1994-12-20 | Seikosha Co Ltd | ディスペンサの駆動方法 |
JP3645586B2 (ja) * | 1994-06-08 | 2005-05-11 | 大日本スクリーン製造株式会社 | 処理液塗布装置 |
JP2000167467A (ja) * | 1998-12-02 | 2000-06-20 | Sanken Electric Co Ltd | ディスペンサ移動制御装置 |
JP3022562B1 (ja) * | 1999-06-25 | 2000-03-21 | 中外炉工業株式会社 | テ―ブル型ダイコ―タ |
JP2003093946A (ja) | 2001-09-25 | 2003-04-02 | Shimadzu Corp | 液体コーティング装置 |
JP2004335728A (ja) * | 2003-05-07 | 2004-11-25 | Hoya Corp | 基板塗布装置及び基板塗布方法 |
JP2004351261A (ja) * | 2003-05-27 | 2004-12-16 | Canon Inc | 塗布装置および塗布方法 |
JP4105613B2 (ja) * | 2003-09-04 | 2008-06-25 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP4372606B2 (ja) | 2004-04-16 | 2009-11-25 | 東京エレクトロン株式会社 | 塗布膜形成装置 |
JP4523442B2 (ja) | 2005-02-10 | 2010-08-11 | 東京エレクトロン株式会社 | 塗布膜形成装置および塗布膜形成方法、コンピュータプログラム |
KR101097519B1 (ko) | 2005-06-25 | 2011-12-22 | 엘지디스플레이 주식회사 | 도포액 도포장치 및 이를 이용한 도포막의 형성방법 |
-
2005
- 2005-09-21 JP JP2005273083A patent/JP4803714B2/ja active Active
-
2006
- 2006-08-04 TW TW095128700A patent/TW200716264A/zh unknown
- 2006-09-19 CN CNB2006101270041A patent/CN100569686C/zh active Active
- 2006-09-20 KR KR1020060091423A patent/KR100739310B1/ko active IP Right Grant
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103771719A (zh) * | 2014-01-16 | 2014-05-07 | 北京京东方光电科技有限公司 | 一种涂布装置 |
CN103771719B (zh) * | 2014-01-16 | 2015-09-09 | 北京京东方光电科技有限公司 | 一种涂布装置 |
CN111940229A (zh) * | 2019-05-14 | 2020-11-17 | 东京应化工业株式会社 | 涂布装置以及涂布方法 |
CN112341005A (zh) * | 2019-08-08 | 2021-02-09 | 中外炉工业株式会社 | 涂敷装置及涂敷方法 |
CN112341005B (zh) * | 2019-08-08 | 2023-02-03 | 中外炉工业株式会社 | 涂敷装置及涂敷方法 |
CN113083616A (zh) * | 2021-04-07 | 2021-07-09 | 深圳市曼恩斯特科技股份有限公司 | 一种涂布挤压模头面密度外部调节装置 |
CN113534112A (zh) * | 2021-09-16 | 2021-10-22 | 常州铭赛机器人科技股份有限公司 | 一种弧形透明工件激光测高校准方法 |
CN113534112B (zh) * | 2021-09-16 | 2022-01-14 | 常州铭赛机器人科技股份有限公司 | 一种弧形透明工件激光测高校准方法 |
Also Published As
Publication number | Publication date |
---|---|
KR100739310B1 (ko) | 2007-07-12 |
JP4803714B2 (ja) | 2011-10-26 |
KR20070033279A (ko) | 2007-03-26 |
CN100569686C (zh) | 2009-12-16 |
JP2007083131A (ja) | 2007-04-05 |
TWI308085B (zh) | 2009-04-01 |
TW200716264A (en) | 2007-05-01 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230608 Address after: Kanagawa, Japan Patentee after: Process Equipment Business Division Preparation Co.,Ltd. Address before: Kanagawa Patentee before: TOKYO OHKA KOGYO Co.,Ltd. Effective date of registration: 20230608 Address after: Ibaraki Patentee after: Ameco Technology Co.,Ltd. Address before: Kanagawa, Japan Patentee before: Process Equipment Business Division Preparation Co.,Ltd. |