CN1923654A - 粘接剂带卷 - Google Patents

粘接剂带卷 Download PDF

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Publication number
CN1923654A
CN1923654A CNA2006101219806A CN200610121980A CN1923654A CN 1923654 A CN1923654 A CN 1923654A CN A2006101219806 A CNA2006101219806 A CN A2006101219806A CN 200610121980 A CN200610121980 A CN 200610121980A CN 1923654 A CN1923654 A CN 1923654A
Authority
CN
China
Prior art keywords
mentioned
adhesive tapes
adhering part
agent coil
support film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2006101219806A
Other languages
English (en)
Chinese (zh)
Inventor
平尾充
川俣耕一
关贵志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to CN201110307866.3A priority Critical patent/CN102514986B/zh
Publication of CN1923654A publication Critical patent/CN1923654A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Storage Of Web-Like Or Filamentary Materials (AREA)
  • Adhesive Tapes (AREA)
  • Winding, Rewinding, Material Storage Devices (AREA)
  • Die Bonding (AREA)
CNA2006101219806A 2005-08-31 2006-08-30 粘接剂带卷 Pending CN1923654A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201110307866.3A CN102514986B (zh) 2005-08-31 2006-08-30 粘接剂带卷

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2005251268 2005-08-31
JP2005251268 2005-08-31
JP2006179765 2006-06-29
JP2006179765A JP4238885B2 (ja) 2005-08-31 2006-06-29 接着剤リール及び接着剤テープ

Related Child Applications (4)

Application Number Title Priority Date Filing Date
CN2009101684040A Division CN101665195B (zh) 2005-08-31 2006-08-30 一种粘接剂带以及粘结剂带的引出方法
CN201010003397A Division CN101792075A (zh) 2005-08-31 2006-08-30 粘接剂带卷
CN201110307866.3A Division CN102514986B (zh) 2005-08-31 2006-08-30 粘接剂带卷
CN2009101682990A Division CN101683934B (zh) 2005-08-31 2006-08-30 粘接剂带卷

Publications (1)

Publication Number Publication Date
CN1923654A true CN1923654A (zh) 2007-03-07

Family

ID=37978091

Family Applications (5)

Application Number Title Priority Date Filing Date
CN201110307866.3A Active CN102514986B (zh) 2005-08-31 2006-08-30 粘接剂带卷
CNA2006101219806A Pending CN1923654A (zh) 2005-08-31 2006-08-30 粘接剂带卷
CN2009101684040A Active CN101665195B (zh) 2005-08-31 2006-08-30 一种粘接剂带以及粘结剂带的引出方法
CN201010003397A Pending CN101792075A (zh) 2005-08-31 2006-08-30 粘接剂带卷
CN2009101682990A Active CN101683934B (zh) 2005-08-31 2006-08-30 粘接剂带卷

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201110307866.3A Active CN102514986B (zh) 2005-08-31 2006-08-30 粘接剂带卷

Family Applications After (3)

Application Number Title Priority Date Filing Date
CN2009101684040A Active CN101665195B (zh) 2005-08-31 2006-08-30 一种粘接剂带以及粘结剂带的引出方法
CN201010003397A Pending CN101792075A (zh) 2005-08-31 2006-08-30 粘接剂带卷
CN2009101682990A Active CN101683934B (zh) 2005-08-31 2006-08-30 粘接剂带卷

Country Status (4)

Country Link
JP (1) JP4238885B2 (ja)
KR (1) KR100889648B1 (ja)
CN (5) CN102514986B (ja)
TW (1) TW200715672A (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102017816A (zh) * 2008-04-28 2011-04-13 日立化成工业株式会社 电路连接材料、膜状粘接剂、粘接剂卷以及电路连接结构体
CN102037615A (zh) * 2009-02-27 2011-04-27 日立化成工业株式会社 粘接材料卷轴
CN102951498A (zh) * 2011-08-18 2013-03-06 日立化成工业株式会社 粘接材料卷盘及卷盘套件
CN104073178A (zh) * 2013-03-29 2014-10-01 第一毛织株式会社 包括导电粘合剂层的各向异性导电膜和半导体装置
CN109575829A (zh) * 2017-12-29 2019-04-05 宁波大榭开发区综研化学有限公司 一种段差多层复合膜和卷材及其制备方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5050832B2 (ja) * 2007-12-19 2012-10-17 日立化成工業株式会社 接着テープ用リール
WO2016136946A1 (ja) * 2015-02-27 2016-09-01 デクセリアルズ株式会社 リール体、フィルム連結体、フィルム巻装体、及びフィルム連結体の製造方法
JP2016160027A (ja) * 2015-02-27 2016-09-05 デクセリアルズ株式会社 接着フィルム用リール及びこれに使用される連結体
CN107298330B (zh) * 2016-04-14 2020-06-12 康菲德斯合股公司 在芯上布置材料幅的方法
JP6668164B2 (ja) * 2016-05-20 2020-03-18 デクセリアルズ株式会社 接着テープ構造体
CN114287054A (zh) * 2019-08-26 2022-04-05 琳得科株式会社 层叠体的制造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04332782A (ja) * 1991-05-07 1992-11-19 Sekisui Chem Co Ltd ロール状粘着テープ
JPH05330722A (ja) * 1992-05-25 1993-12-14 Nitto Denko Corp テープディスペンサー
JPH0724947U (ja) * 1993-10-07 1995-05-12 祐久 小松 粘着テープ
CH689482A5 (de) * 1995-07-31 1999-05-14 Tela Papierfabrik Ag Papierrolle mit einem Endblattverschluss.
JP4465788B2 (ja) * 2000-03-28 2010-05-19 日立化成工業株式会社 異方導電材テープ及びリール
EP1249729A3 (en) * 2001-04-12 2005-07-13 Fuji Photo Film Co., Ltd. Rolled article, and method of and apparatus for processing rolled article
DE10123980B4 (de) * 2001-05-17 2008-01-10 Tesa Ag Abschlussbandage
KR100838880B1 (ko) * 2002-07-30 2008-06-16 히다치 가세고교 가부시끼가이샤 접착재 테이프, 그 접속방법, 제조방법, 압착방법
JP4239585B2 (ja) * 2002-12-24 2009-03-18 日立化成工業株式会社 接着剤テープの接続方法及び接着剤テープ接続体
JP2004077789A (ja) * 2002-08-19 2004-03-11 Konica Minolta Holdings Inc 遮光フランジ部材

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102017816A (zh) * 2008-04-28 2011-04-13 日立化成工业株式会社 电路连接材料、膜状粘接剂、粘接剂卷以及电路连接结构体
CN102037615A (zh) * 2009-02-27 2011-04-27 日立化成工业株式会社 粘接材料卷轴
CN102037615B (zh) * 2009-02-27 2013-08-28 日立化成株式会社 粘接材料卷轴
CN102951498A (zh) * 2011-08-18 2013-03-06 日立化成工业株式会社 粘接材料卷盘及卷盘套件
CN104073178A (zh) * 2013-03-29 2014-10-01 第一毛织株式会社 包括导电粘合剂层的各向异性导电膜和半导体装置
CN104073178B (zh) * 2013-03-29 2016-03-16 第一毛织株式会社 包括导电粘合剂层的各向异性导电膜和半导体装置
CN109575829A (zh) * 2017-12-29 2019-04-05 宁波大榭开发区综研化学有限公司 一种段差多层复合膜和卷材及其制备方法
CN109575829B (zh) * 2017-12-29 2021-05-07 宁波大榭开发区综研化学有限公司 一种段差多层复合膜和卷材及其制备方法

Also Published As

Publication number Publication date
JP4238885B2 (ja) 2009-03-18
JP2007092028A (ja) 2007-04-12
CN101665195B (zh) 2012-07-25
CN102514986A (zh) 2012-06-27
KR100889648B1 (ko) 2009-03-19
CN101683934A (zh) 2010-03-31
CN101665195A (zh) 2010-03-10
CN101683934B (zh) 2012-06-13
KR20070026029A (ko) 2007-03-08
TW200715672A (en) 2007-04-16
CN101792075A (zh) 2010-08-04
CN102514986B (zh) 2016-04-27
TWI301339B (ja) 2008-09-21

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Application publication date: 20070307