CN1918190A - 紫外发光二极管控制回路和用于紫外固化的控制器 - Google Patents
紫外发光二极管控制回路和用于紫外固化的控制器 Download PDFInfo
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Abstract
提供了一种紫外固化设备和方法,通过衬底上的紫外发光二极管芯片的至少一个阵列高效地减小在其上具有紫外固化涂层、油墨或粘合剂的紫外固化产品、制品或其它物体的固化时间。有利地,紫外发光二极管芯片在比紫外发光二极管芯片的正常操作电流(例如1.2安培)下从(2)到(4)倍(例如3.6安培)的电流下驱动,从而使紫外发光二极管芯片在远大于它们在其正常操作电流下的强度(曲线图的Y轴)下发射紫外线。为了增强的结果,紫外发光二极管芯片在设备和系统的操作期间被冷却,这样紫外发光二极管芯片就可以在更高的电流下被驱动更长的一段时间。
Description
发明背景
1.技术领域
本发明涉及用于在其中具有紫外线(紫外)光学引发剂的油墨、涂层和粘合剂的更快速的紫外固化的方法和设备,紫外线(紫外)光学引发剂在暴露至紫外线时,会将油墨、涂层和粘合剂中的单体转换为连接聚合物以固化单体材料。更具体地,本发明涉及如下的方法和设备:在紫外发光二极管(LED)芯片的2-4倍的正常电流额定值下驱动它们,以获得大于紫外发光二极管在其正常电流额定值下操作时多达8倍的光强度的提高,且具有更大的光强度,更迅速地固化油墨、涂层或粘合剂。
2.背景技术
以前,已经提出将紫外发光二极管用于供给紫外线来固化油墨、涂层和粘合剂。然而,固化的速度通常受到紫外线的光强度的限制。另外,当紫外发光二极管芯片在其操作过程中加热时,光强度会降低。
发明内容
如下文更详细地描述的那样,本发明的方法和设备提供了用于从阵列或多个阵列中的紫外发光二极管芯片向紫外固化产品、制品、油墨、涂层、粘合剂或将被固化的其它物体施加高强度紫外线因此减少固化时间的技术和结构。这是通过如下措施实现的:使用大于紫外发光二极管芯片的正常操作电流2-4倍的电流驱动它们并且同时使用热泵冷却紫外发光二极管芯片,这样它们就可以在高操作电流下驱动足够长的时间以在紫外发光二极管芯片过热和发射光的光强度降低之前实现快速的固化。包括光强度传感器和热传感器和控制器的控制回路用于控制紫外线输出。
依照本发明的一个示教,提供了一种用于降低固化其上具有紫外固化涂层、油墨或胶粘的紫外固化产品、制品或其它物体的固化时间的方法,该方法包括下列步骤:将在其上具有紫外固化涂层、油墨或粘合剂的紫外固化产品、制品或其它物体定位在紫外发光二极管芯片的阵列或多个阵列的紫外线光路下方、附近或邻近和其中;在比那些紫外发光二极管芯片的正常操作电流高2到4倍的电流下电驱动紫外发光二极管芯片,从而使紫外发光二极管芯片在比在其正常操作电流下驱动时高得多的强度下发射紫外线;并且,冷却安装、固定和支撑紫外发光二极管芯片的衬底,这样紫外发光二极管芯片就可以在较高电流下驱动比未冷却时更长的一段时间。
另外,依照本发明的示教之一,提供了:一种用于降低固化在其上具有紫外固化涂层、油墨或粘合剂的紫外固化产品、制品或其它物体的固化时间的系统,包括紫外固化站;紫外固化站处、邻接或附近的紫外发光二极管芯片的至少一个阵列;用于将在其上或其中具有紫外固化涂层、油墨或粘合剂的紫外固化产品、制品或其它物体放置在紫外发光二极管芯片的至少一个阵列的紫外线光路的正常区域下方、附近或邻近的定位机构;紫外控制电路,用于在比紫外发光二极管芯片的正常操作电流高大约2到大约4倍的电流下电驱动紫外发光二极管芯片,从而使紫外发光二极管芯片在比它们在其正常操作电流下驱动时高得多的强度下发射紫外线;并且,冷却装置或机构,用于有效地冷却安装、固定和支撑紫外发光二极管芯片的衬底,这样紫外发光二极管芯片就可以在较高电流下驱动比未冷却时更长的一段时间。
在下面的详细说明和权利要求中结合附图提供了本发明的更详细的解释。
附图说明
图1是设备的透视图,该设备是依照本发明的示教构成的并且使用热泵来冷却一个或多个阵列的紫外发光二极管,这些紫外发光二极管被电驱动超出其正常额定值,还使用反馈回路,反馈回路包括用于在紫外发光二极管的温度达到预定或特定水平和/或从紫外发光二极管发射的紫外线减少到预定或特定水平之下时关闭紫外发光二极管的控制器。
图2是显示施加到一种类型的紫外发光二极管阵列上的作为紫外线强度和时间的函数的电流的曲线图。
图3是一个四行紫外发光二极管芯片的模阵列的平面图。
具体实施方式
在此将描述用于实践本发明的优选实施例和最佳方式的具体说明。
现在参见更详细地显示的附图,在图1中显示了紫外发光二极管固化站10,紫外发光二极管固化站10邻近并且在传送带11上方放置。
在传送带11上显示了多个紫外固化产物、制品或其它物体,在这种情况下为光盘(CD)12,每个光盘12均具有顶侧14,顶侧14已经涂抹镀层和/或印有固化涂层和/或紫外固化油墨。
在紫外固化站10上或在它附近放置有产品检测系统16。检测系统可以包括光学检测系统,光学检测系统具有电眼传感器18,电眼传感器18探测和检测来自光发射器20的光束,用于检测光盘12或其它紫外固化产品、制品或物体出现在紫外固化站10和紫外线光路的正常区域中的时间。
检测系统16可以采用其它形式,例如运动检测器系统。另外,当紫外固化涂层或印刷产品包括磁化金属时,可以使用磁性检测器系统。检测系统还可包括压力传感器或重量检测器。
紫外固化站包括导热衬底22(图1),导热衬底22在器下侧安装有紫外发光二极管芯片26的几个阵列24(图3),紫外发光二极管芯片26经由导线28和30连接至控制器32。检测系统16还通过导线(或多根导线)34连接到控制器32上。当检测系统16向控制器32发出印刷或涂层光盘12或其它紫外固化产品、制品或物体出现在于其下侧上具有紫外发光二极管芯片26的多个阵列24(图3)的衬底22下方的信号时,控制器32就依照本发明的示教,使紫外发光二极管芯片26(图1)通过导线28和30通电并且电驱动超过它们的正常额定值,且优选地在超过紫外发光二极管芯片26的额定电流从2倍到4倍范围的数量中。然后向固化站10中的光盘12或其它紫外固化产品、制品或物体发射和导引高强度的紫外线。
优选地,在其下侧具有紫外发光二极管芯片26的阵列24(图3)放置得尽可能靠近光盘12(图1)或其它紫外固化产品、制品或物体,因为光强度会随着紫外光束从紫外发光二极管芯片的发射点到将被固化的物体必须传播的紫外光束的距离的增大而指数地降低。
当紫外发光二极管芯片26(图3)被驱动超出它们的正常额定值范围时,它们将迅速地变热。因此,从紫外发光二极管芯片发射的紫外发光二极管光的强度就会显著地降低。为了能够使紫外发光二极管芯片26被驱动超出它们的正常额定值,冷却装置例如热泵36(图1)安装在衬底22上,热泵36通过驱动紫外发光二极管芯片26超出它们的正常操作范围来助于耗散和抽走在它们中生成的热。热泵36通过导线(或多根导线)37连接至控制器32但是在紫外固化站10中进行紫外固化期间通常始终保持为ON。在一个实施例中,紫外发光二极管芯片26的阵列24(图3)通过导电粘合剂固定到导热衬底22(图1)上以将来自紫外发光二极管芯片26(图3)的热更好地传导至导热衬底22并且由此传导至热泵36的较冷的侧面(图1)。
热泵36可以是由New Jersey州Trenton市的MELCOR CORPORATION出售的Melcor Thermoelectric热泵。
最初,热泵36(图1)的较冷侧面将冷却安装紫外发光二极管芯片的导热衬底22。然而,鉴于被驱动超出其正常操作范围的紫外发光二极管芯片生成的大量的热,所以可能会超过热泵的正常容量。因此,为了进一步耗散热,热泵36的较热的侧面在其上安装有散热器38。散热器38通常具有从热泵36向外延伸的多个、一组或阵列的散热翅片40,散热翅片40用于将热辐射到环境空气中以通过对流耗散热。另外,为了助于热从翅片40的耗散,电动机操作风扇42通过导线(或多根导线)44连接至控制器32。风扇42的操作可以由导线(或多根导线)44连接至风扇42的控制器32进行控制。通常风扇42在紫外固化站10中发生紫外固化过程中始终保持为ON。
为了控制紫外发光二极管芯片的操作,光强度传感器46(图1)可以置于紫外发光二极管芯片26的阵列24的下方并且通过导线(或多根导线)48连接至控制器32。通过在散热器38上或其附近的热传感器50可以获得进一步的检测和控制,且散热器38通过导线(或多根导线)52连接至控制器32。
期望地,连接至控制器32(图1)的紫外发光二极管芯片26(图3)、光传感器46和热传感器50构成控制回路。
如图3所示,一个由四行61、62、63和64的紫外发光二极管芯片26组成的板阵列24置于模板66上。模板66大约为四英寸长并且在其上具有连接至紫外发光二极管芯片26的两个总线带68和70。
在一行61中的紫外发光二极管芯片26(图3)可以与在其它行62、63和64中的紫外发光二极管芯片26交错,这样就从紫外发光二极管芯片的行61-64的交错阵列中的每个紫外发光二极管芯片26发射出重叠的光束。这样,就可以保证紫外线在光盘14(图1)的印刷和/或涂层或其它紫外固化产品、制品或物体上的更完全和均匀的照明和发射。
在控制回路的操作中,一旦产品检测系统16(图1)检测到在衬底22(图1)的下侧上的紫外发光二极管芯片26的阵列24(图3)下面出现紫外固化产品、制品或其它物体例如光盘12,控制器32就会启动,通电并且打开紫外发光二极管芯片26(图3)并且驱动它们,且驱动时在紫外发光二极管芯片26的正常操作范围的从2到4倍的数量中,且通常为它们的正常操作范围的3倍。
例如,如图2的曲线图所示,一旦一组紫外发光二极管芯片通常在1.2安培下驱动,控制器就在3.6安培下驱动它们直至光强度开始在大约2秒钟的时间周期中降低。
根据经验,现已发现,当紫外发光二极管芯片被驱动超出其正常范围时,例如3倍于其正常操作范围时,同紫外发光二极管芯片在其大约为1.2安培的正常电流额定值时驱动时发射的光强度相比,它们会以大于多达8倍的强度发射光线。光强度中的这一差别显示在图2的曲线图中。
光强度中的降低可以由光传感器46(图1)检测出来。
散热器38的温度的增高可以由热传感器(温度传感器)50检测出来。当光强度的降低被光传感器检测到低于特定值和/或当超过另一个值的温度中的升高被温度传感器检测到时,控制器32会减小、降低或关闭经由导体28、30向衬底22下侧上的紫外发光二极管芯片26(图3)的电流的供给。
同时,热泵36(图1)工作来从衬底22中耗散和抽出热并且因此冷却紫外发光二极管芯片26(图3)。通常,通过热泵36、从散热器38的散热翅片40的热的辐射和耗散以及通过由风扇42经过散热翅片推动的冷却空气的组合操作,衬底22(图1)可以在大约2秒钟中充分地冷却。
降低的通电时间(断电时间)或关机时间可以与传送带11(图1)的运动同步,传送带11花费大约2秒钟来将后续的光盘或其它紫外固化产品、制品或物体移动到固化站10中电眼传感器18前方和衬底22下方。
针对后续的光盘12(图1)重复上述循环和过程。
经验性试验已经显示,使用本发明的控制回路和控制器,在超过紫外发光二极管芯片26(图3)的正常操作范围的三(3)倍操作它们看上去并不会不利地影响它们的操作寿命而可以实现更短的固化时间。
如果需要的话,可以提供用于摆动衬底的摆动机构来进一步摆动衬底22(图1)以确保紫外固化光线平均和更均匀的应用于紫外固化产品、制品或其它物体例如光盘12,这种摆动机构显示和描述在相关申请的交叉引用中提及的本申请人的早期申请中,且这些申请包含在此作为参考。
在本发明的紫外固化系统和方法的许多优点中的一些优点为:
1.优越的性能;
2.更佳质量的产品;
3.优良的固化;
4.更快的固化;
5.更均匀的固化;
6.提高的质量控制;
7.易于操作;
8.使用和安装简单;
9.经济;
10.高效;和
11.有效。
用于紫外固化的紫外发光二极管控制回路和控制器及其操作方法提供了许多优点,其中的一些优点已经描述在上文中并且其它一些优点是本发明所固有的。有利地,本发明的紫外固化系统和方法实现了令人惊奇的良好而意外的结果。
虽然已经显示和描述了本发明的实施例,但是应当理解,对部件、零件、设备、装置、工序(方法)及其应用的不同改进和置换以及重新配置可以由本领域的技术人员做出而不脱离本发明的示教。因此,本发明的范围将仅仅限制为所附权利要求所限的范围。
Claims (8)
1.一种用于降低固化在其上具有紫外固化涂层、油墨或粘合剂的紫外固化产品、制品或其它物体的固化时间的方法,其特征在于所述方法包括:
将在其上具有紫外固化涂层、油墨或粘合剂的紫外固化产品、制品或其它物体定位在紫外发光二极管芯片的至少一个阵列的紫外线光路附近或其中;
在比紫外发光二极管芯片的正常操作电流高大约2到大约4倍的电流下电驱动紫外发光二极管芯片,从而使紫外发光二极管芯片在比它们在其正常操作电流下驱动时高得多的强度下发射紫外线;并且
冷却紫外发光二极管芯片的衬底,这样紫外发光二极管芯片就可以在较高的电流下被驱动比未冷却时更长的一段时间。
2.如权利要求1所述的方法,其特征在于,衬底的冷却是通过:
热泵,其较冷侧面置于衬底的附近;和/或
散热器,位于热泵的较热侧面;和/或
散热器,在热泵的较热侧面上具有散热翅片;和/或
使用风扇在散热翅片上吹送的冷却空气。
3.如上述权利要求中任一项所述的方法,其特征在于,所述方法包括:
检测由紫外发光二极管芯片发射的紫外线的光强度;和/或
当紫外线强度减小到预定水平下方时减小通向紫外发光二极管芯片的电流的水平;和/或
当散热器的温度超过特定水平时检测散热器的温度并且减小通向紫外发光二极管芯片的电流的水平;和/或
检测在其上具有紫外固化涂层、油墨或粘合剂的紫外固化产品、制品或其它物体置于紫外发光二极管芯片的紫外线光路的正常区域的时间;和/或
在这种检测后对紫外发光二极管芯片通电;和/或
摆动衬底以将紫外线大体上均匀地应用于紫外固化产品、制品或其它物体。
4.如上述权利要求中任一项所述的方法,其特征在于,所述方法包括:
对紫外发光二极管芯片通电超过一部分工作循环而同时大体上连续地执行冷却,这样紫外发光二极管芯片的衬底就可以大体上连续地冷却;和/或
调节工作循环,这样工作循环就取决于传送带将紫外固化产品、制品或其它物体移动到紫外发光二极管芯片的阵列的紫外线光路中的速度;和/或
暂停对紫外发光二极管芯片通电和断电,这样其中紫外发光二极管芯片断电的工作循环的部分就大于其中紫外发光二极管芯片通电的工作循环的部分;和/或
控制紫外发光二极管芯片的工作循环的周期,这样紫外发光二极管芯片为ON的工作循环的周期与紫外发光二极管芯片为OFF的工作循环的周期就大体上相等;和/或
在电流大约为紫外发光二极管芯片正常操作电流的3倍的电流下驱动紫外发光二极管芯片;和/或
当在紫外发光二极管芯片的电流额定值的大约2到大约4倍下驱动时,提高从紫外发光二极管芯片发射的紫外线的光强度大于紫外发光二极管芯片在正常电流额定值下驱动时的光强度多达8倍。
5.一种用于降低在其上具有紫外固化涂层、油墨或粘合剂的紫外固化产品、制品或其它物体的固化时间的紫外固化系统,供如上述权利要求中任一项所述的方法使用,其特征在于,所述紫外固化系统包括:
紫外固化站;
在邻近紫外固化站的衬底上的紫外发光二极管芯片的至少一个阵列;
定位机构,用于将在其上具有紫外固化涂层、油墨或粘合剂的紫外固化产品、制品或其它物体置于紫外发光二极管芯片的至少一个阵列的紫外线光路中;
控制电路,用于在比紫外发光二极管芯片的正常操作电流高大约2到大约4倍的电流下电驱动紫外发光二极管芯片,从而使紫外发光二极管芯片在比它们在其正常操作电流下驱动时高得多的强度下发射紫外线;以及
冷却装置,用于冷却紫外发光二极管芯片,这样紫外发光二极管芯片就可以在较高的电流下被驱动比未冷却时更长的一段时间。
6.如权利要求5所述的紫外固化系统,其特征在于:
冷却装置是其较冷侧面安装在衬底附近的热泵;和/或
散热器安装在热泵的较热侧面上;和/或
散热器具有散热翅片的阵列;和/或
风扇放置成在散热翅片上方吹送冷空气。
7.如权利要求5或6所述的紫外固化系统,其特征在于:
光传感器连接至控制电路中的控制器并且置于从紫外发光二极管芯片发射的紫外线的紫外线光路附近,用于检测从紫外发光二极管芯片发射的紫外线的强度;和/或
当紫外线强度减小到特定水平下方时控制器可以操作以减小通向紫外发光二极管芯片的电流的水平;和/或
热传感器连接至控制器并且邻近散热器放置以用于检测散热器的温度;和/或
当散热器的温度超过预定水平时控制器可以操作以减小通向紫外发光二极管芯片的电流的水平;和/或
产品检测系统连接至控制器并且置于紫外固化站附近,用于检测在其上具有紫外涂层、油墨或粘合剂的紫外固化产品、制品或其它物体置于紫外固化站中紫外发光二极管芯片的阵列的紫外线光路的正常区域的时间;和/或
在产品检测系统的检测之后控制器可以操作来向紫外发光二极管芯片通电;和/或
产品检测系统包括至少一个包括光学传感器、运动检测器、压力传感器或重量检测器的装置;和/或
控制器是通电紫外发光二极管芯片超过工作循环的一部分的可编程控制器而冷却由冷却装置大体上连续地执行;和/或
当在紫外发光二极管芯片的电流额定值的大约2到大约4倍的范围中驱动时,紫外发光二极管芯片以大于紫外发光二极管芯片在正常电流额定值下驱动时多达大约8倍的光强度的发射光线。
8.如上述权利要求5、6或7中任一项所述的紫外固化系统,其特征在于:
定位机构包括传送带;和/或
工作循环取决于传送带将紫外固化产品、制品或其它物体放置在紫外发光二极管芯片的至少一个阵列下方的适当位置的速度;和/或
工作循环包括其中供给紫外发光二极管的电流的水平减小的减小电流部分;和/或
工作循环包括其中紫外发光二极管芯片通电的通电部分;和/或
在工作循环期间紫外发光二极管芯片操作,这样紫外发光二极管芯片为ON的工作循环的周期与紫外发光二极管芯片为OFF的工作循环的周期就大体上相等;和/或
控制器在大约为紫外发光二极管芯片正常操作电流的3倍的电流下驱动紫外发光二极管芯片。
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CNA2004800401143A Pending CN1918190A (zh) | 2004-01-07 | 2004-11-16 | 紫外发光二极管控制回路和用于紫外固化的控制器 |
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JP2021170650A (ja) * | 2015-03-02 | 2021-10-28 | 株式会社飯田照明 | 紫外線照射装置 |
JP7170349B2 (ja) | 2015-03-02 | 2022-11-14 | 株式会社飯田照明 | 紫外線照射装置 |
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Also Published As
Publication number | Publication date |
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CN1976953A (zh) | 2007-06-06 |
CA2552812A1 (en) | 2005-07-28 |
EP1704170A1 (en) | 2006-09-27 |
CN1980961A (zh) | 2007-06-13 |
WO2005068509A1 (en) | 2005-07-28 |
US20040166249A1 (en) | 2004-08-26 |
US7211299B2 (en) | 2007-05-01 |
EP1704170A4 (en) | 2008-08-27 |
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