CN1880061B - 覆铜叠层板及其制造方法 - Google Patents

覆铜叠层板及其制造方法 Download PDF

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Publication number
CN1880061B
CN1880061B CN2006100935743A CN200610093574A CN1880061B CN 1880061 B CN1880061 B CN 1880061B CN 2006100935743 A CN2006100935743 A CN 2006100935743A CN 200610093574 A CN200610093574 A CN 200610093574A CN 1880061 B CN1880061 B CN 1880061B
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CN
China
Prior art keywords
copper foil
copper
insulating layer
laminate
clad laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN2006100935743A
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English (en)
Chinese (zh)
Other versions
CN1880061A (zh
Inventor
田内茂显
森田浩行
谷口大辅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Chemical and Materials Co Ltd
Original Assignee
Nippon Steel Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co Ltd filed Critical Nippon Steel Chemical Co Ltd
Publication of CN1880061A publication Critical patent/CN1880061A/zh
Application granted granted Critical
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/022—Mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B32B2037/243—Coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
CN2006100935743A 2005-06-13 2006-06-06 覆铜叠层板及其制造方法 Active CN1880061B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005172060 2005-06-13
JP2005-172060 2005-06-13
JP2005172060A JP4804806B2 (ja) 2005-06-13 2005-06-13 銅張積層板及びその製造方法

Publications (2)

Publication Number Publication Date
CN1880061A CN1880061A (zh) 2006-12-20
CN1880061B true CN1880061B (zh) 2011-07-20

Family

ID=37518512

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2006100935743A Active CN1880061B (zh) 2005-06-13 2006-06-06 覆铜叠层板及其制造方法

Country Status (4)

Country Link
JP (1) JP4804806B2 (https=)
KR (1) KR101009825B1 (https=)
CN (1) CN1880061B (https=)
TW (1) TW200700221A (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8470450B2 (en) * 2007-12-27 2013-06-25 Jx Nippon Mining & Metals Corporation Method of producing two-layered copper-clad laminate, and two-layered copper-clad laminate
KR100958976B1 (ko) * 2008-02-01 2010-05-20 엘에스엠트론 주식회사 고굴곡성을 갖는 전해 동박 및 그 제조 방법
KR100965327B1 (ko) * 2008-02-28 2010-06-22 엘에스엠트론 주식회사 진동특성이 개선된 연성 동장적층판
TW201037105A (en) * 2009-03-23 2010-10-16 Nippon Mining Co Double layered flexible board, and copper electrolytic liquid for making the same
JP2010221586A (ja) * 2009-03-24 2010-10-07 Asahi Kasei E-Materials Corp 金属箔ポリイミド積層体
CN102298998A (zh) * 2010-06-23 2011-12-28 比亚迪股份有限公司 一种绝缘材料及其制备方法
JP6782561B2 (ja) 2015-07-16 2020-11-11 Ｊｘ金属株式会社 キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法
JP6006445B1 (ja) * 2015-07-27 2016-10-12 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6058182B1 (ja) * 2015-07-27 2017-01-11 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6190500B2 (ja) 2015-08-06 2017-08-30 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6200042B2 (ja) 2015-08-06 2017-09-20 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6339636B2 (ja) 2015-08-06 2018-06-06 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
CN108133886A (zh) * 2017-12-11 2018-06-08 上海申和热磁电子有限公司 一种dbc基板背面研磨的方法
KR102288594B1 (ko) 2021-02-26 2021-08-11 주식회사 이송이엠씨 박막 fmcl 제조 장치 및 박막 fmcl 제조 방법
JP2024000020A (ja) * 2022-06-20 2024-01-05 住友金属鉱山株式会社 銅張積層板およびフレキシブルプリント配線板
CN115179638B (zh) * 2022-06-29 2024-02-27 厦门爱谱生电子科技有限公司 一种柔性覆铜板的制作方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2985325B2 (ja) * 1991-02-18 1999-11-29 三菱瓦斯化学株式会社 薄銅張回路基板の製造法
JPH06232553A (ja) * 1993-01-29 1994-08-19 Hitachi Chem Co Ltd 積層用片面フレキシブル銅張板
JP3210796B2 (ja) * 1993-12-28 2001-09-17 株式会社日鉱マテリアルズ 印刷回路用高高温伸び銅箔
JPH09272994A (ja) * 1996-04-05 1997-10-21 Furukawa Electric Co Ltd:The ファインパターン用電解銅箔
JP3856582B2 (ja) * 1998-11-17 2006-12-13 日鉱金属株式会社 フレキシブルプリント回路基板用圧延銅箔およびその製造方法
JP3271757B2 (ja) * 1999-03-01 2002-04-08 日本電気株式会社 半導体装置の製造方法
JP3964073B2 (ja) * 1999-04-27 2007-08-22 株式会社フジクラ フレキシブルプリント基板及びその製造方法
JP2003193211A (ja) * 2001-12-27 2003-07-09 Nippon Mining & Metals Co Ltd 銅張積層板用圧延銅箔
JP2004017571A (ja) 2002-06-19 2004-01-22 Mitsui Chemicals Inc ポリイミド銅張積層板及びその製造方法
JP4219721B2 (ja) * 2003-03-31 2009-02-04 新日鐵化学株式会社 積層体の製造方法
JP4325337B2 (ja) * 2003-09-19 2009-09-02 日立化成工業株式会社 樹脂組成物、それを用いたプリプレグ、積層板及び多層プリント配線板

Also Published As

Publication number Publication date
JP4804806B2 (ja) 2011-11-02
JP2006346874A (ja) 2006-12-28
KR20060129965A (ko) 2006-12-18
KR101009825B1 (ko) 2011-01-19
TWI342827B (https=) 2011-06-01
CN1880061A (zh) 2006-12-20
TW200700221A (en) 2007-01-01

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