KR101009825B1 - 동장적층판 및 그 제조방법 - Google Patents

동장적층판 및 그 제조방법 Download PDF

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Publication number
KR101009825B1
KR101009825B1 KR1020060052691A KR20060052691A KR101009825B1 KR 101009825 B1 KR101009825 B1 KR 101009825B1 KR 1020060052691 A KR1020060052691 A KR 1020060052691A KR 20060052691 A KR20060052691 A KR 20060052691A KR 101009825 B1 KR101009825 B1 KR 101009825B1
Authority
KR
South Korea
Prior art keywords
copper foil
micrometers
insulating layer
copper
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020060052691A
Other languages
English (en)
Korean (ko)
Other versions
KR20060129965A (ko
Inventor
시게아키 타우치
히로유키 모리타
다이스케 타니구치
Original Assignee
신닛테츠가가쿠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신닛테츠가가쿠 가부시키가이샤 filed Critical 신닛테츠가가쿠 가부시키가이샤
Publication of KR20060129965A publication Critical patent/KR20060129965A/ko
Application granted granted Critical
Publication of KR101009825B1 publication Critical patent/KR101009825B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/022—Mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B32B2037/243—Coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
KR1020060052691A 2005-06-13 2006-06-12 동장적층판 및 그 제조방법 Expired - Fee Related KR101009825B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2005-00172060 2005-06-13
JP2005172060A JP4804806B2 (ja) 2005-06-13 2005-06-13 銅張積層板及びその製造方法

Publications (2)

Publication Number Publication Date
KR20060129965A KR20060129965A (ko) 2006-12-18
KR101009825B1 true KR101009825B1 (ko) 2011-01-19

Family

ID=37518512

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060052691A Expired - Fee Related KR101009825B1 (ko) 2005-06-13 2006-06-12 동장적층판 및 그 제조방법

Country Status (4)

Country Link
JP (1) JP4804806B2 (https=)
KR (1) KR101009825B1 (https=)
CN (1) CN1880061B (https=)
TW (1) TW200700221A (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8470450B2 (en) * 2007-12-27 2013-06-25 Jx Nippon Mining & Metals Corporation Method of producing two-layered copper-clad laminate, and two-layered copper-clad laminate
KR100958976B1 (ko) * 2008-02-01 2010-05-20 엘에스엠트론 주식회사 고굴곡성을 갖는 전해 동박 및 그 제조 방법
KR100965327B1 (ko) * 2008-02-28 2010-06-22 엘에스엠트론 주식회사 진동특성이 개선된 연성 동장적층판
TW201037105A (en) * 2009-03-23 2010-10-16 Nippon Mining Co Double layered flexible board, and copper electrolytic liquid for making the same
JP2010221586A (ja) * 2009-03-24 2010-10-07 Asahi Kasei E-Materials Corp 金属箔ポリイミド積層体
CN102298998A (zh) * 2010-06-23 2011-12-28 比亚迪股份有限公司 一种绝缘材料及其制备方法
JP6782561B2 (ja) 2015-07-16 2020-11-11 Ｊｘ金属株式会社 キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法
JP6006445B1 (ja) * 2015-07-27 2016-10-12 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6058182B1 (ja) * 2015-07-27 2017-01-11 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6190500B2 (ja) 2015-08-06 2017-08-30 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6200042B2 (ja) 2015-08-06 2017-09-20 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6339636B2 (ja) 2015-08-06 2018-06-06 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
CN108133886A (zh) * 2017-12-11 2018-06-08 上海申和热磁电子有限公司 一种dbc基板背面研磨的方法
KR102288594B1 (ko) 2021-02-26 2021-08-11 주식회사 이송이엠씨 박막 fmcl 제조 장치 및 박막 fmcl 제조 방법
JP2024000020A (ja) * 2022-06-20 2024-01-05 住友金属鉱山株式会社 銅張積層板およびフレキシブルプリント配線板
CN115179638B (zh) * 2022-06-29 2024-02-27 厦门爱谱生电子科技有限公司 一种柔性覆铜板的制作方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06232553A (ja) * 1993-01-29 1994-08-19 Hitachi Chem Co Ltd 積層用片面フレキシブル銅張板
JPH09272994A (ja) * 1996-04-05 1997-10-21 Furukawa Electric Co Ltd:The ファインパターン用電解銅箔
JP2000212661A (ja) 1998-11-17 2000-08-02 Nippon Mining & Metals Co Ltd フレキシブルプリント回路基板用圧延銅箔およびその製造方法
JP2004017571A (ja) 2002-06-19 2004-01-22 Mitsui Chemicals Inc ポリイミド銅張積層板及びその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2985325B2 (ja) * 1991-02-18 1999-11-29 三菱瓦斯化学株式会社 薄銅張回路基板の製造法
JP3210796B2 (ja) * 1993-12-28 2001-09-17 株式会社日鉱マテリアルズ 印刷回路用高高温伸び銅箔
JP3271757B2 (ja) * 1999-03-01 2002-04-08 日本電気株式会社 半導体装置の製造方法
JP3964073B2 (ja) * 1999-04-27 2007-08-22 株式会社フジクラ フレキシブルプリント基板及びその製造方法
JP2003193211A (ja) * 2001-12-27 2003-07-09 Nippon Mining & Metals Co Ltd 銅張積層板用圧延銅箔
JP4219721B2 (ja) * 2003-03-31 2009-02-04 新日鐵化学株式会社 積層体の製造方法
JP4325337B2 (ja) * 2003-09-19 2009-09-02 日立化成工業株式会社 樹脂組成物、それを用いたプリプレグ、積層板及び多層プリント配線板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06232553A (ja) * 1993-01-29 1994-08-19 Hitachi Chem Co Ltd 積層用片面フレキシブル銅張板
JPH09272994A (ja) * 1996-04-05 1997-10-21 Furukawa Electric Co Ltd:The ファインパターン用電解銅箔
JP2000212661A (ja) 1998-11-17 2000-08-02 Nippon Mining & Metals Co Ltd フレキシブルプリント回路基板用圧延銅箔およびその製造方法
JP2004017571A (ja) 2002-06-19 2004-01-22 Mitsui Chemicals Inc ポリイミド銅張積層板及びその製造方法

Also Published As

Publication number Publication date
JP4804806B2 (ja) 2011-11-02
JP2006346874A (ja) 2006-12-28
KR20060129965A (ko) 2006-12-18
CN1880061B (zh) 2011-07-20
TWI342827B (https=) 2011-06-01
CN1880061A (zh) 2006-12-20
TW200700221A (en) 2007-01-01

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