TW200700221A - Copper clad laminated sheet and its manufacturing method - Google Patents

Copper clad laminated sheet and its manufacturing method

Info

Publication number
TW200700221A
TW200700221A TW095116743A TW95116743A TW200700221A TW 200700221 A TW200700221 A TW 200700221A TW 095116743 A TW095116743 A TW 095116743A TW 95116743 A TW95116743 A TW 95116743A TW 200700221 A TW200700221 A TW 200700221A
Authority
TW
Taiwan
Prior art keywords
copper foil
laminated sheet
clad laminated
copper
copper clad
Prior art date
Application number
TW095116743A
Other languages
English (en)
Chinese (zh)
Other versions
TWI342827B (https=
Inventor
Shigeaki Tauchi
Hiroyuki Morita
Daisuke Taniguchi
Original Assignee
Nippon Steel Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co filed Critical Nippon Steel Chemical Co
Publication of TW200700221A publication Critical patent/TW200700221A/zh
Application granted granted Critical
Publication of TWI342827B publication Critical patent/TWI342827B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/022—Mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B32B2037/243—Coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
TW095116743A 2005-06-13 2006-05-11 Copper clad laminated sheet and its manufacturing method TW200700221A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005172060A JP4804806B2 (ja) 2005-06-13 2005-06-13 銅張積層板及びその製造方法

Publications (2)

Publication Number Publication Date
TW200700221A true TW200700221A (en) 2007-01-01
TWI342827B TWI342827B (https=) 2011-06-01

Family

ID=37518512

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095116743A TW200700221A (en) 2005-06-13 2006-05-11 Copper clad laminated sheet and its manufacturing method

Country Status (4)

Country Link
JP (1) JP4804806B2 (https=)
KR (1) KR101009825B1 (https=)
CN (1) CN1880061B (https=)
TW (1) TW200700221A (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8470450B2 (en) * 2007-12-27 2013-06-25 Jx Nippon Mining & Metals Corporation Method of producing two-layered copper-clad laminate, and two-layered copper-clad laminate
KR100958976B1 (ko) * 2008-02-01 2010-05-20 엘에스엠트론 주식회사 고굴곡성을 갖는 전해 동박 및 그 제조 방법
KR100965327B1 (ko) * 2008-02-28 2010-06-22 엘에스엠트론 주식회사 진동특성이 개선된 연성 동장적층판
TW201037105A (en) * 2009-03-23 2010-10-16 Nippon Mining Co Double layered flexible board, and copper electrolytic liquid for making the same
JP2010221586A (ja) * 2009-03-24 2010-10-07 Asahi Kasei E-Materials Corp 金属箔ポリイミド積層体
CN102298998A (zh) * 2010-06-23 2011-12-28 比亚迪股份有限公司 一种绝缘材料及其制备方法
JP6782561B2 (ja) 2015-07-16 2020-11-11 Ｊｘ金属株式会社 キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法
JP6006445B1 (ja) * 2015-07-27 2016-10-12 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6058182B1 (ja) * 2015-07-27 2017-01-11 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6190500B2 (ja) 2015-08-06 2017-08-30 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6200042B2 (ja) 2015-08-06 2017-09-20 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6339636B2 (ja) 2015-08-06 2018-06-06 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
CN108133886A (zh) * 2017-12-11 2018-06-08 上海申和热磁电子有限公司 一种dbc基板背面研磨的方法
KR102288594B1 (ko) 2021-02-26 2021-08-11 주식회사 이송이엠씨 박막 fmcl 제조 장치 및 박막 fmcl 제조 방법
JP2024000020A (ja) * 2022-06-20 2024-01-05 住友金属鉱山株式会社 銅張積層板およびフレキシブルプリント配線板
CN115179638B (zh) * 2022-06-29 2024-02-27 厦门爱谱生电子科技有限公司 一种柔性覆铜板的制作方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2985325B2 (ja) * 1991-02-18 1999-11-29 三菱瓦斯化学株式会社 薄銅張回路基板の製造法
JPH06232553A (ja) * 1993-01-29 1994-08-19 Hitachi Chem Co Ltd 積層用片面フレキシブル銅張板
JP3210796B2 (ja) * 1993-12-28 2001-09-17 株式会社日鉱マテリアルズ 印刷回路用高高温伸び銅箔
JPH09272994A (ja) * 1996-04-05 1997-10-21 Furukawa Electric Co Ltd:The ファインパターン用電解銅箔
JP3856582B2 (ja) * 1998-11-17 2006-12-13 日鉱金属株式会社 フレキシブルプリント回路基板用圧延銅箔およびその製造方法
JP3271757B2 (ja) * 1999-03-01 2002-04-08 日本電気株式会社 半導体装置の製造方法
JP3964073B2 (ja) * 1999-04-27 2007-08-22 株式会社フジクラ フレキシブルプリント基板及びその製造方法
JP2003193211A (ja) * 2001-12-27 2003-07-09 Nippon Mining & Metals Co Ltd 銅張積層板用圧延銅箔
JP2004017571A (ja) 2002-06-19 2004-01-22 Mitsui Chemicals Inc ポリイミド銅張積層板及びその製造方法
JP4219721B2 (ja) * 2003-03-31 2009-02-04 新日鐵化学株式会社 積層体の製造方法
JP4325337B2 (ja) * 2003-09-19 2009-09-02 日立化成工業株式会社 樹脂組成物、それを用いたプリプレグ、積層板及び多層プリント配線板

Also Published As

Publication number Publication date
JP4804806B2 (ja) 2011-11-02
JP2006346874A (ja) 2006-12-28
KR20060129965A (ko) 2006-12-18
KR101009825B1 (ko) 2011-01-19
CN1880061B (zh) 2011-07-20
TWI342827B (https=) 2011-06-01
CN1880061A (zh) 2006-12-20

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees