CN1870287A - 有机发光显示器件及其制造方法 - Google Patents
有机发光显示器件及其制造方法 Download PDFInfo
- Publication number
- CN1870287A CN1870287A CNA2006100937058A CN200610093705A CN1870287A CN 1870287 A CN1870287 A CN 1870287A CN A2006100937058 A CNA2006100937058 A CN A2006100937058A CN 200610093705 A CN200610093705 A CN 200610093705A CN 1870287 A CN1870287 A CN 1870287A
- Authority
- CN
- China
- Prior art keywords
- line
- pixel region
- insulation layer
- inorganic insulation
- sealant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 88
- 239000000565 sealant Substances 0.000 claims abstract description 87
- 238000009413 insulation Methods 0.000 claims description 81
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 35
- 239000012212 insulator Substances 0.000 claims description 33
- 235000012239 silicon dioxide Nutrition 0.000 claims description 19
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 18
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 18
- 239000000377 silicon dioxide Substances 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 16
- 238000007789 sealing Methods 0.000 claims description 15
- 239000003795 chemical substances by application Substances 0.000 claims description 10
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 238000011049 filling Methods 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 239000011368 organic material Substances 0.000 claims description 5
- 238000000016 photochemical curing Methods 0.000 claims description 4
- 239000010409 thin film Substances 0.000 claims description 3
- 230000006378 damage Effects 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 155
- 238000005516 engineering process Methods 0.000 description 16
- 229910004298 SiO 2 Inorganic materials 0.000 description 11
- 239000010408 film Substances 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 5
- 239000011229 interlayer Substances 0.000 description 5
- 239000004952 Polyamide Substances 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 4
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 4
- 238000012536 packaging technology Methods 0.000 description 4
- 229920002647 polyamide Polymers 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 239000010937 tungsten Substances 0.000 description 4
- 238000010276 construction Methods 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000005984 hydrogenation reaction Methods 0.000 description 3
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- YXTPWUNVHCYOSP-UHFFFAOYSA-N bis($l^{2}-silanylidene)molybdenum Chemical compound [Si]=[Mo]=[Si] YXTPWUNVHCYOSP-UHFFFAOYSA-N 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- WQJQOUPTWCFRMM-UHFFFAOYSA-N tungsten disilicide Chemical compound [Si]#[W]#[Si] WQJQOUPTWCFRMM-UHFFFAOYSA-N 0.000 description 2
- 229910021342 tungsten silicide Inorganic materials 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 230000027756 respiratory electron transport chain Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Thin Film Transistor (AREA)
Abstract
Description
Claims (21)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR45159/05 | 2005-05-27 | ||
KR1020050045159A KR100645533B1 (ko) | 2005-05-27 | 2005-05-27 | 유기전계발광표시소자 및 그의 제조 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1870287A true CN1870287A (zh) | 2006-11-29 |
CN1870287B CN1870287B (zh) | 2010-07-14 |
Family
ID=37443882
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006100937058A Active CN1870287B (zh) | 2005-05-27 | 2006-05-26 | 有机发光显示器件及其制造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7834549B2 (zh) |
JP (1) | JP4558679B2 (zh) |
KR (1) | KR100645533B1 (zh) |
CN (1) | CN1870287B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104733504A (zh) * | 2015-03-18 | 2015-06-24 | 京东方科技集团股份有限公司 | Oled基板及制备方法、oled面板及显示装置 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100688792B1 (ko) * | 2006-01-27 | 2007-03-02 | 삼성에스디아이 주식회사 | 평판 표시장치 및 그의 제조방법 |
KR100759666B1 (ko) * | 2006-01-27 | 2007-09-17 | 삼성에스디아이 주식회사 | 평판 표시장치 및 그의 제조방법 |
EP2153479A1 (en) * | 2007-05-24 | 2010-02-17 | Koninklijke Philips Electronics N.V. | Encapsulation for an electronic thin film device |
KR101084179B1 (ko) * | 2009-12-28 | 2011-11-17 | 삼성모바일디스플레이주식회사 | 유기 발광 디스플레이 소자의 봉지 방법 |
KR101786801B1 (ko) * | 2010-12-22 | 2017-10-19 | 엘지디스플레이 주식회사 | 유기전계 발광소자용 기판 및 그 제조 방법 |
WO2013171966A1 (ja) * | 2012-05-14 | 2013-11-21 | シャープ株式会社 | 有機el表示装置 |
KR101960388B1 (ko) * | 2012-12-24 | 2019-03-20 | 엘지디스플레이 주식회사 | 유기 발광 다이오드 표시 장치 |
KR102195166B1 (ko) | 2013-12-26 | 2020-12-24 | 엘지디스플레이 주식회사 | 탑 에미션 방식의 유기 발광 표시 장치 및 탑 에미션 방식의 유기 발광 표시 장치 제조 방법 |
CN105206618B (zh) | 2015-08-26 | 2018-10-30 | 京东方科技集团股份有限公司 | 一种阵列基板、显示面板、显示装置及制作方法 |
KR102512718B1 (ko) | 2016-03-17 | 2023-03-23 | 삼성디스플레이 주식회사 | 박막트랜지스터 기판 및 이를 구비한 유기 발광 표시 장치, 박막트랜지스터 기판의 제조방법 |
KR20200074347A (ko) * | 2018-12-14 | 2020-06-25 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4238704A (en) | 1979-02-12 | 1980-12-09 | Corning Glass Works | Sealed beam lamp of borosilicate glass with a sealing glass of zinc silicoborate and a mill addition of cordierite |
JP3814810B2 (ja) | 1996-04-05 | 2006-08-30 | 日本電気硝子株式会社 | ビスマス系ガラス組成物 |
JPH1074583A (ja) | 1996-08-30 | 1998-03-17 | Sanyo Electric Co Ltd | 有機elディスプレイ及び有機elディスプレイの 製造方法 |
US6555025B1 (en) | 2000-01-31 | 2003-04-29 | Candescent Technologies Corporation | Tuned sealing material for sealing of a flat panel display |
JP4671551B2 (ja) * | 2000-07-25 | 2011-04-20 | 株式会社半導体エネルギー研究所 | 表示装置 |
US6822264B2 (en) * | 2001-11-16 | 2004-11-23 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device |
JP2003167528A (ja) | 2001-11-30 | 2003-06-13 | Optrex Corp | 液晶表示装置 |
JP3939140B2 (ja) | 2001-12-03 | 2007-07-04 | 株式会社日立製作所 | 液晶表示装置 |
KR100461634B1 (ko) | 2002-04-15 | 2004-12-14 | 엘지.필립스 엘시디 주식회사 | 유기전계 발광소자와 그 제조방법 |
JP2004102246A (ja) | 2002-07-18 | 2004-04-02 | Seiko Epson Corp | 電気光学装置、配線基板及び電子機器 |
KR20050094882A (ko) | 2003-01-27 | 2005-09-28 | 도시바 마쯔시따 디스플레이 테크놀로지 컴퍼니, 리미티드 | 유기 el 디스플레이의 제조 방법 |
JP4518747B2 (ja) | 2003-05-08 | 2010-08-04 | 三洋電機株式会社 | 有機el表示装置 |
SG142140A1 (en) | 2003-06-27 | 2008-05-28 | Semiconductor Energy Lab | Display device and method of manufacturing thereof |
KR100544123B1 (ko) | 2003-07-29 | 2006-01-23 | 삼성에스디아이 주식회사 | 평판표시장치 |
US7928654B2 (en) * | 2003-08-29 | 2011-04-19 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
JP4741177B2 (ja) * | 2003-08-29 | 2011-08-03 | 株式会社半導体エネルギー研究所 | 表示装置の作製方法 |
JP4683883B2 (ja) | 2003-08-29 | 2011-05-18 | 株式会社半導体エネルギー研究所 | 発光装置 |
KR100590252B1 (ko) * | 2004-03-17 | 2006-06-19 | 삼성에스디아이 주식회사 | 유기 전계 발광 표시 장치 |
KR100666265B1 (ko) * | 2004-10-18 | 2007-01-09 | 엘지이노텍 주식회사 | 형광체 및 이를 이용한 발광소자 |
US8164257B2 (en) * | 2006-01-25 | 2012-04-24 | Samsung Mobile Display Co., Ltd. | Organic light emitting display and method of fabricating the same |
-
2005
- 2005-05-27 KR KR1020050045159A patent/KR100645533B1/ko active IP Right Grant
-
2006
- 2006-05-24 US US11/440,500 patent/US7834549B2/en active Active
- 2006-05-25 JP JP2006145660A patent/JP4558679B2/ja active Active
- 2006-05-26 CN CN2006100937058A patent/CN1870287B/zh active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104733504A (zh) * | 2015-03-18 | 2015-06-24 | 京东方科技集团股份有限公司 | Oled基板及制备方法、oled面板及显示装置 |
US10033010B2 (en) | 2015-03-18 | 2018-07-24 | Boe Technology Group Co., Ltd. | OLED substrate and preparation method thereof, OLED panel, and display apparatus |
Also Published As
Publication number | Publication date |
---|---|
JP4558679B2 (ja) | 2010-10-06 |
US7834549B2 (en) | 2010-11-16 |
CN1870287B (zh) | 2010-07-14 |
KR100645533B1 (ko) | 2006-11-14 |
US20060267492A1 (en) | 2006-11-30 |
JP2006332060A (ja) | 2006-12-07 |
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C06 | Publication | ||
PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20090109 Address after: Gyeonggi Do, South Korea Applicant after: Samsung Mobile Display Co., Ltd. Address before: Gyeonggi Do, South Korea Applicant before: Samsung SDI Co., Ltd. |
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ASS | Succession or assignment of patent right |
Owner name: SAMSUNG MOBILE DISPLAY CO., LTD. Free format text: FORMER OWNER: SAMSUNG SDI CO., LTD. Effective date: 20090109 |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
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Owner name: SAMSUNG DISPLAY CO., LTD. Free format text: FORMER OWNER: SAMSUNG MOBILE DISPLAY CO., LTD. Effective date: 20121018 |
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C41 | Transfer of patent application or patent right or utility model | ||
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Effective date of registration: 20121018 Address after: Gyeonggi Do, South Korea Patentee after: Samsung Display Co., Ltd. Address before: Gyeonggi Do, South Korea Patentee before: Samsung Mobile Display Co., Ltd. |