CN1842910A - 复合电子部件 - Google Patents
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Abstract
一种复合电子部件,具有多层配线板,第一电源端子电极,第二电源端子电极,外连接电源电极,表面安装部件,绝缘体和电源图案。第一和第二电源端子电极设置在多层配线板的第一面上。外连接电源电极设置在与多层配线板的第一面相对的第二面上,并且与第一电源端子电极相连。表面安装部件设置在多层配线板的第一面上并且在表面安装部件第一而上与第一和第二电源端子电极相连。绝缘体用其第一面覆盖至少与表面安装部件的第一面相对的第二面、第一电源端子电极和第二电源端子电极。电源图案设置在与绝缘体的第一面相对的第二面上,且与第一和第二电源端子电极相连。
Description
技术领域
本发明涉及一种通过把表面安装部件安装在多层配线板上而提供的复合电子部件。
背景技术
图4是示意示出了常规复合电子部件的剖面图。所述常规复合电子部件具有在多层配线板(此后称为”基板”)1上安装诸如需要控制电压的半导体器件的表面安装部件(此后称为”部件”)3。在基板1的表面,设置了电源端子电极(此后称为”电极”)2,且安装有与电极2相连接的部件3。
关于这类复合电子部件,有时对部件3施加同步控制的多个的控制电压。在这种情况下,所述常规复合电子部件的控制,乃是通过把设置在所述基板1下表面的外接电源端子4分为若干分支电路而得到简化。分支电路之一的走线位于基板1内。例如,在PCT公布第H05-500136号的日文翻译中公开了上面提到的复合电子部件。
对于使用于诸如移动电话和无线局域网(LAN)的小型无线通信装置,将其小型化的要求一直在增强。为迎合这一要求,需要把所述常规复合电子部件微型化。因而,很有必要需要各种控制的部件3安装在基板1上。但是,在基板1内的电源路径的走线部分5引起与设置在基板1内的其它电路电极6作不必要的高频耦合。因此,有必要增大电极间的距离,这使所述常规复合电子部件微型化变得困难。
发明内容
一种本发明的复合电子部件具有:多层配线板;第一电源端子电极,第二电源端子电极,外连接电源电极,表面安装部件,绝缘体和电源图案。第一和第二电源端子电极设置在多层配线板的第一面上。外连接电源电极设置在与多层配线板的第一面相对的第二面上,并且与第一电源端子电极连接。表面安装部件设置在多层配线板的第一面上,并且在表面安装部件第一面上连接第一和第二电源端子电极。绝缘体用其第一面覆盖至少与表面安装部件的第一面相对的第二面、第一电源端子电极和第二电源端子电极。电源图案设置在与绝缘体的第一面相对的第二面上,且与第一和第二电源端子电极相连。按照以上所描述的结构,电源图案,作为从连接外连接电源与第一电源端子电极的路径分支出来的电源路径,位于多层配线板之外。于是,抑制了多层配线板内的不希望的耦合,从而可以达到把所述复合电子部件微型化。
附图说明
图1是示意说明本发明实施例中的复合电子部件的剖面图。
图2A是说明图1所示复合电子元件的制作方法的剖面图。
图2B是说明图1所示的复合电子元件在图2A后续阶段的制作方法的剖面图。
图2C是说明图1所示的复合电子元件在图2B后续阶段的制作方法的剖面图。
图2D是说明图1所示的复合电子元件在图2C后续阶段的制作方法的剖面图。
图2E是说明图1所示的复合电子元件在图2D后续阶段的制作方法的剖面图。
图3示意说明本发明所述实施例中复合电子部件另一种结构的剖面图。
图4是示意说明常规复合电子部件的剖面图。
图中:1-多层配线板,2-电源端子电极,3-表面安装部件,4-电源端子,5-走线部分,6-电路电极,7-多层配线板,7A-上表面,7B-下表面,8-表面安装部件,8A-上表面,8B-下表面,9-电路电极,10-第一电源端子电极,11-第二电源端子电极,12-外接电源端子,13-绝缘体,13A-上表面,13B-下表面,13C、13D-侧面,14、16、20、25-通孔,15-电源图案,17-介电体,17A-上表面,17B-下表面,18-接地电极,19-外接地电极,21-内接地电极,21A-内电极,22-大尺寸板,22A-上表面,22B-下表面,23-大尺寸绝缘体,24-大尺寸介电体,31、32-导电层,33-绝缘层。
具体实施方式
图1是示意说明按照本发明实施例在多层配线板上安装有表面安装部件的复合电子部件的构成的剖面图。多层配线板(此后称为“基板”)7通过堆叠树脂绝缘层而形成。在层与层之间有电路电极(此后称为“电极”)9,用于形成使用了电容、电感等的高频电路。在作为基板7的第一面的上表面7A上,设置有第一和第二电源端子电极(此后称为“电极”)10、11;同时,在作为与第一面相对的第二面的下表面7B上,设置有外接电源端子(此后称为“端子”)12。电极10与端子12通过通孔25相连。通过从电极10、11输入的控制电压,表面安装部件(此后称为“部件”)8被控制以进行其操作。特别地,施加来自电极10、11的控制电压受到同步控制。
所述复合电子部件具有需要作同步控制的电极10、11和电源图案15。绝缘体13利用作为其第一面的下表面13B,覆盖至少部件8的上表面8A以及电极10、11。电源图案15设置在作为与绝缘体13的下表面13B相对的第二面的上表面13A上,且通过作为第一通孔的通孔14与电极10相连。另一方面,通过作为第二通孔的通孔16,电极11与电源图案15相连。部件8在其下表面8B处,与基板7的上表面7A上所设置的电极10,11相连。部件8的下表面8B定义为第一面,与下表面8B相对的上表面8A定义为第二面。根据这一构成,电极11与电极10且然后与端子12相连。
在上述结构里,对应于走线部分的电源图案15处于基板7之外,该走线部分是从连接端子12与电极10的路径引出并通向电极11。因而,可以抑制基板7内出现的多余的耦合,且在基板7内设置的电极9可以高密度地分布。因此,可以实现复合电子部件微型化。
当电源图案15暴露在所述复合电子部件的表面上时,处理高频波的复合电子部件会对其附着的外围设备产生作用。于是,最好把介电体17这样地设置,用作为第一面的下表面17B来覆盖电源图案15,并且把接地电极(此后称为“电极”)18设置在与介电体17的下表面17B相对、作为第二面的上表面17A上。
通过以上描述的结构,在保证了所述复合电子部件的屏蔽特性的同时,电源图案15和电极18可以间隔介电体17而被彼此相对地设置。其结果是,在电源图案15和电极18之间产生接地电容。连接到电极10、11的这个接地电容作为用于部件8的干扰减小的旁路电容。这就不需要在电极10、11周围安排电容元件,所述复合电子部件可以作进一步微型化。
通过以下结构,可以很容易地保证电极18的接地路径。即,把外接地电极(此后称为”电极”)19设置在基板7的下表面7B上。进而,把内接地电极(此后称为”电极”)21设置在基板7内层里,以使之通过通孔20与电极19相连。电极21的边缘暴露在基板7的侧面7C,且该暴露部分连接接地电极18。侧面7C是上表面7A和下表面7B之间的面。
通孔14、16一般用具有高导电率的银系等材料的电极浆料所形成。这里用通孔14、16形成施加控制电压的路径。所以,如果代替高导电率的电极浆料,把电阻成分添加到通孔14、16中的至少一个,则可以在通孔14、16中一个提供所述部件8用的上拉(pull-up)电阻或下拉(pull-down)电阻。因而,可以使所述复合电子部件进一步微型化。在把电阻成分添加到通孔14、16时,通过将含电阻成分的浆料添加到高导电率的电极浆料,可以按需控制通孔14、16的电阻成分的值。另外,通孔14、16也可以用具有电阻成分的浆料形成。具有电阻成分的浆料可以用例如碳、LaB6陶瓷来制备。
参照图2A至图2E来描述实现以上所提及构成的制作方法。首先,如图2A所示,把部件8合适地安装在大尺寸板22上,旨在可以制作多片基板7。在作为大尺寸板22的第一面的上表面22A上,在预定位置上预先设置多组电极10、11。在作为与上表面22A相对的第二面的下表面22B上,预先设置多组电极19和端子12。电极19通过通孔20与内电极(此后称为”电极”)21A相连,同时端子12通过通孔25与电极10相连。
然后,如图2B所示,大尺寸绝缘体23安装在此中间产品的上方。预先在大尺寸绝缘体23上形成容纳部件8用的凹部、以及在与电极10相连通的位置上提供通孔14。接着,在其表面上,有选择地形成适当的电源图案15。此后,如图2C所示,大尺寸介电体24安装在其上,且集成在一起。对大尺寸绝缘体23,例如,使用无机填充剂和热固性树脂材料的混合物。与其同样有代表性的材料是硅填充剂和环氧树脂材料混合而形成的复合材料。对大尺寸介电体24,例如可以由与大尺寸绝缘体23一样的无机填充剂和热固性树脂材料来形成,而其填充剂,则使用具有相对电容率高的诸如钛酸钡的材料。
其次,如图2D所示,在大尺寸板22上进行半切割(half-dicing),使得朝向下表面22C那一侧的部分保留着而未切割。此时,这样形成电极21,使电极21A的边缘暴露出来。也就是说,在电极21A的边缘实现半切割,或者在半切割时电极21A的一部分也被切掉。此后,在所述中间产品的表面上方形成电极18。然后,如图2E所示,通过把所述中间产品分成单片,便可以获得多个本实施例的所述复合电子部件。
针对本发明的所述复合电子部件,到此只举例说明了一种结构,其中只有一个部件8,其连接于需要同步控制的电极10、11并安装在基板7上。但是,本发明并不限于这一结构。即使在电极10、11之外还有多个电源端子电极、且需要同步控制的电源端子电极彼此相连的结构,本发明也可以得到类似的操作效果。对于多个不同的部件8安装在基板7上、且需要在多个部件之间的同步控制的电源端子电极彼此相连的结构,本发明也可以得到类似的操作效果。
在以上的描述中,电极10通过通孔14与电源图案15相连,同时电极11通过通孔16与电源图案15相连。本发明并不限于此。例如,如图3所示,在绝缘体13上表面13A和下表面13B之间的侧面13C上,作为绝缘体13的第三面,可以设置导电层31以将电极10和电源图案15连接在一起,另外,在与侧面13C对向的作为第四面的侧面13D上,还可以设置把电极11和电源图案15连在一起的导电层32。该布置也是可以的。导电层31定义为第一导电层,而导电层32定义为第二导电层。在此情况,通过在导电层31、32上提供绝缘层33,将电极18与导电层31、32绝缘。此外,在此情况下,通过用电阻形成导电层31、32,可以获得如图1所示结构的相同效果。
工业应用
由于本发明的复合电子部件能够被微型化,适用于特别需要微型化的无线通信,诸如无线局域网(LAN)卡和移动电话等。
Claims (7)
1.一种复合电子部件,包括:
多层配线板;
第一电源端子电极和第二电源端子电极,设置在所述多层配线板的第一面上;
外连接电源电极,设置在与所述多层配线板的第一面相对的第二面上并且与所述第一电源端子电极相连;
表面安装部件,安装在所述多层配线板的所述第一面上,并且在所述表面安装部件的第一面上与第一电源端子电极和第二电源端子电极相连;
绝缘体,其第一面覆盖至少与所述表面安装部件的所述第一面相对的第二面、所述第一电源端子电极和第二电源端子电极;以及
电源图案,设置在与所述绝缘体的所述第一面相对的第二面上,且与所述第一电源端子电极和所述第二电源端子电极相连。
2.如权利要求1所述的复合电子部件,还包括:
介电体,其第一面覆盖所述电源图案;以及
接地电极,设置在与所述介电体的所述第一面相对的第二面上。
3.如权利要求2所述的复合电子部件,还包括:
设置在所述多层配线板内层里的内接地电极,所述内接地电极具有在所述多层配线板的所述第一面和所述第二面之间的第三面上显露出来的边缘部分,所述边缘部分与所述接地电极相连;以及
设置在所述多层配线板的所述第二面上的外连接接地电极,并且与所述内接地电极相连。
4.如权利要求1所述的复合电子部件,还包括:
设置在所述绝缘体内的第一通孔,用于连接所述第一电源端子电极与所述电源图案;以及
设置在所述绝缘体内的第二通孔,用于连接所述第二电源端子电极与所述电源图案。
5.如权利要求4所述的复合电子部件,其特征在于:
所述第一通孔和所述第二通孔中的至少一个是电阻。
6.如权利要求1所述的复合电子部件,还包括:
第一导电层,设置在所述绝缘体的所述第一面和所述第二面之间的第三面上,用于将所述第一电源端子电极与所述电源图案相连;以及
第二导电层,设置在与所述绝缘体的第三面相对的第四面上,用于将所述第二电源端子电极与所述电源图案相连。
7.如权利要求6所述的复合电子元件,其特征在于:
所述第一导电层和所述第二导电层中的至少一个是电阻。
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JP2004172141A JP4552524B2 (ja) | 2004-06-10 | 2004-06-10 | 複合型電子部品 |
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US (1) | US7187071B2 (zh) |
EP (1) | EP1648028A4 (zh) |
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WO (1) | WO2005122247A1 (zh) |
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CN101617575B (zh) * | 2007-02-20 | 2011-06-22 | 日立化成工业株式会社 | 挠性多层配线板 |
CN101666815B (zh) * | 2008-09-03 | 2012-09-05 | 三菱电机株式会社 | 检查用夹具 |
CN102763206A (zh) * | 2010-02-19 | 2012-10-31 | 松下电器产业株式会社 | 模块的制造方法 |
CN105474538A (zh) * | 2013-08-13 | 2016-04-06 | 株式会社村田制作所 | 复合电子部件 |
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WO2006011320A1 (ja) * | 2004-07-30 | 2006-02-02 | Murata Manufacturing Co., Ltd. | 複合型電子部品及びその製造方法 |
WO2008132814A1 (ja) * | 2007-04-18 | 2008-11-06 | Panasonic Corporation | 部品内蔵基板と、これを用いた電子モジュール及び電子機器 |
TWI420640B (zh) * | 2008-05-28 | 2013-12-21 | 矽品精密工業股份有限公司 | 半導體封裝裝置、半導體封裝結構及其製法 |
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US20170040266A1 (en) | 2015-05-05 | 2017-02-09 | Mediatek Inc. | Fan-out package structure including antenna |
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KR20220000087A (ko) * | 2020-06-25 | 2022-01-03 | 삼성전기주식회사 | 전자 소자 모듈 |
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-
2004
- 2004-06-10 JP JP2004172141A patent/JP4552524B2/ja not_active Expired - Fee Related
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2005
- 2005-04-28 WO PCT/JP2005/008140 patent/WO2005122247A1/ja not_active Application Discontinuation
- 2005-04-28 CN CNB2005800009058A patent/CN100437986C/zh not_active Expired - Fee Related
- 2005-04-28 EP EP05737236A patent/EP1648028A4/en not_active Withdrawn
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101617575B (zh) * | 2007-02-20 | 2011-06-22 | 日立化成工业株式会社 | 挠性多层配线板 |
CN101666815B (zh) * | 2008-09-03 | 2012-09-05 | 三菱电机株式会社 | 检查用夹具 |
CN102763206A (zh) * | 2010-02-19 | 2012-10-31 | 松下电器产业株式会社 | 模块的制造方法 |
CN105474538A (zh) * | 2013-08-13 | 2016-04-06 | 株式会社村田制作所 | 复合电子部件 |
CN105474538B (zh) * | 2013-08-13 | 2018-03-16 | 株式会社村田制作所 | 复合电子部件 |
Also Published As
Publication number | Publication date |
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US7187071B2 (en) | 2007-03-06 |
EP1648028A1 (en) | 2006-04-19 |
WO2005122247A1 (ja) | 2005-12-22 |
CN100437986C (zh) | 2008-11-26 |
EP1648028A4 (en) | 2010-05-26 |
US20060244123A1 (en) | 2006-11-02 |
JP2005353790A (ja) | 2005-12-22 |
JP4552524B2 (ja) | 2010-09-29 |
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