CN1836257A - 检查印刷在工件上的沉淀的方法及检查系统 - Google Patents
检查印刷在工件上的沉淀的方法及检查系统 Download PDFInfo
- Publication number
- CN1836257A CN1836257A CNA2004800233650A CN200480023365A CN1836257A CN 1836257 A CN1836257 A CN 1836257A CN A2004800233650 A CNA2004800233650 A CN A2004800233650A CN 200480023365 A CN200480023365 A CN 200480023365A CN 1836257 A CN1836257 A CN 1836257A
- Authority
- CN
- China
- Prior art keywords
- image
- workpiece
- precipitation
- aperture
- pixel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/0008—Industrial image inspection checking presence/absence
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Quality & Reliability (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Theoretical Computer Science (AREA)
- Biochemistry (AREA)
- Pathology (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Image Processing (AREA)
- Screen Printers (AREA)
- Inking, Control Or Cleaning Of Printing Machines (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (45)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0314233.8 | 2003-06-19 | ||
GB0314233A GB2403003B (en) | 2003-06-19 | 2003-06-19 | Inspection system for and method of inspecting deposits printed on workpieces |
PCT/GB2004/002649 WO2004114217A2 (en) | 2003-06-19 | 2004-06-18 | Inspection system for and method of inspecting deposits printed on workpieces |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1836257A true CN1836257A (zh) | 2006-09-20 |
CN1836257B CN1836257B (zh) | 2011-10-26 |
Family
ID=27636866
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2004800233650A Active CN1836257B (zh) | 2003-06-19 | 2004-06-18 | 检查印刷在工件上的沉淀的方法及检查系统 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9791383B2 (zh) |
EP (1) | EP1639545A2 (zh) |
JP (2) | JP4990619B2 (zh) |
CN (1) | CN1836257B (zh) |
GB (1) | GB2403003B (zh) |
WO (1) | WO2004114217A2 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103476588A (zh) * | 2010-12-08 | 2013-12-25 | 伊利诺斯工具制品有限公司 | 用于通过组合式模板印刷机和分配器在基板上沉积粘性材料的方法 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005043833A1 (de) * | 2005-09-13 | 2007-03-29 | Ersa Gmbh | Vorrichtung zur Ermittlung der Relativposition zwischen zwei im Wesentlichen flächigen Elementen |
JP4919378B2 (ja) * | 2005-09-29 | 2012-04-18 | 富士フイルム株式会社 | 描画点データ取得方法および装置並びに描画方法および装置 |
US20070102477A1 (en) * | 2005-11-10 | 2007-05-10 | Speedline Technologies, Inc. | Imaging system and method for a stencil printer |
US20070102478A1 (en) * | 2005-11-10 | 2007-05-10 | Speedline Technologies, Inc. | Optimal imaging system and method for a stencil printer |
US7458318B2 (en) | 2006-02-01 | 2008-12-02 | Speedline Technologies, Inc. | Off-axis illumination assembly and method |
US7549371B2 (en) | 2006-07-10 | 2009-06-23 | Speedline Technologies, Inc. | Method and apparatus for clamping a substrate |
US7710611B2 (en) | 2007-02-16 | 2010-05-04 | Illinois Tool Works, Inc. | Single and multi-spectral illumination system and method |
US7861650B2 (en) | 2007-04-13 | 2011-01-04 | Illinois Tool Works, Inc. | Method and apparatus for adjusting a substrate support |
MX2010007742A (es) * | 2008-01-15 | 2010-08-06 | Targacept Inc | Preparacion y separacion enantiomerica de 7-(3-piridinil)-1,7-diaz aspiro[4,4]nonano y formas de sal novedosas del racemato y enantiomeros. |
US8215473B2 (en) * | 2008-05-21 | 2012-07-10 | Applied Materials, Inc. | Next generation screen printing system |
WO2015125173A1 (ja) * | 2014-02-19 | 2015-08-27 | ヤマハ発動機株式会社 | スクリーン印刷用検査データの作成ユニット、スクリーン印刷装置およびスクリーン印刷用検査データの作成方法 |
US11449980B2 (en) * | 2016-07-08 | 2022-09-20 | Ats Automation Tooling Systems Inc. | System and method for combined automatic and manual inspection |
DE102018201794B3 (de) * | 2018-02-06 | 2019-04-11 | Heidelberger Druckmaschinen Ag | Adaptive Bildglättung |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4578810A (en) * | 1983-08-08 | 1986-03-25 | Itek Corporation | System for printed circuit board defect detection |
JPH0740526A (ja) | 1993-07-27 | 1995-02-10 | Matsushita Electric Ind Co Ltd | 半田印刷装置 |
JP2982617B2 (ja) | 1994-06-27 | 1999-11-29 | 松下電器産業株式会社 | クリーム半田の印刷量検査方法 |
US5982927A (en) * | 1996-12-19 | 1999-11-09 | Cognex Corporation | Methods and apparatuses for in-line solder paste inspection |
US6317513B2 (en) * | 1996-12-19 | 2001-11-13 | Cognex Corporation | Method and apparatus for inspecting solder paste using geometric constraints |
GB2323664A (en) * | 1997-03-25 | 1998-09-30 | Dek Printing Machines Ltd | Viewing and imaging systems |
JPH10337843A (ja) * | 1997-06-09 | 1998-12-22 | Matsushita Electric Ind Co Ltd | スクリーン印刷方法及びその装置 |
DE19728144C2 (de) * | 1997-07-02 | 2001-02-01 | Ekra Eduard Kraft Gmbh | Verfahren und Vorrichtung zum Erzeugen von Testmustern |
JP3832062B2 (ja) | 1997-12-22 | 2006-10-11 | 松下電器産業株式会社 | クリーム半田の外観検査方法 |
JPH11344449A (ja) | 1998-05-29 | 1999-12-14 | Shimu:Kk | 外観検査方法 |
US6574358B1 (en) * | 1998-11-13 | 2003-06-03 | Cognex Technology And Investment Corporation | Automatic training of inspection sites for paste inspection |
US6687402B1 (en) * | 1998-12-18 | 2004-02-03 | Cognex Corporation | Machine vision methods and systems for boundary feature comparison of patterns and images |
US6606402B2 (en) * | 1998-12-18 | 2003-08-12 | Cognex Corporation | System and method for in-line inspection of stencil aperture blockage |
JP4187332B2 (ja) | 1998-12-24 | 2008-11-26 | 松下電器産業株式会社 | スクリーン印刷検査方法およびスクリーン印刷装置 |
JP2000238233A (ja) * | 1999-02-23 | 2000-09-05 | Fuji Mach Mfg Co Ltd | スクリーン検査方法,装置およびスクリーン印刷機 |
JP3252826B2 (ja) * | 1999-03-23 | 2002-02-04 | 株式会社日立製作所 | 回路パターン欠陥検査方法及びその装置 |
US6738505B1 (en) * | 1999-05-04 | 2004-05-18 | Speedline Technologies, Inc. | Method and apparatus for detecting solder paste deposits on substrates |
US6522776B1 (en) * | 1999-08-17 | 2003-02-18 | Advanced Micro Devices, Inc. | Method for automated determination of reticle tilt in a lithographic system |
JP3758463B2 (ja) * | 2000-05-09 | 2006-03-22 | 松下電器産業株式会社 | スクリーン印刷の検査方法 |
-
2003
- 2003-06-19 GB GB0314233A patent/GB2403003B/en not_active Expired - Lifetime
-
2004
- 2004-06-18 CN CN2004800233650A patent/CN1836257B/zh active Active
- 2004-06-18 WO PCT/GB2004/002649 patent/WO2004114217A2/en active Application Filing
- 2004-06-18 US US10/561,495 patent/US9791383B2/en active Active
- 2004-06-18 EP EP04743002A patent/EP1639545A2/en not_active Ceased
- 2004-06-18 JP JP2006516457A patent/JP4990619B2/ja active Active
-
2010
- 2010-11-18 JP JP2010258383A patent/JP2011081006A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103476588A (zh) * | 2010-12-08 | 2013-12-25 | 伊利诺斯工具制品有限公司 | 用于通过组合式模板印刷机和分配器在基板上沉积粘性材料的方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2007527506A (ja) | 2007-09-27 |
WO2004114217A3 (en) | 2005-09-15 |
GB0314233D0 (en) | 2003-07-23 |
GB2403003A (en) | 2004-12-22 |
EP1639545A2 (en) | 2006-03-29 |
GB2403003B (en) | 2006-06-07 |
JP4990619B2 (ja) | 2012-08-01 |
US20060222234A1 (en) | 2006-10-05 |
US9791383B2 (en) | 2017-10-17 |
CN1836257B (zh) | 2011-10-26 |
WO2004114217A2 (en) | 2004-12-29 |
JP2011081006A (ja) | 2011-04-21 |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: DEK INT GMBH Free format text: FORMER NAME: DEK INTERNAT GMBH |
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CP01 | Change in the name or title of a patent holder |
Address after: Zurich Patentee after: DTG INTERNATIONAL GmbH Address before: Zurich Patentee before: DEK INTERNATIONAL GmbH |
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CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Zurich Patentee after: DTG INTERNATIONAL GmbH Address before: Zurich Patentee before: DTG INTERNATIONAL GmbH |
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TR01 | Transfer of patent right |
Effective date of registration: 20170904 Address after: Singapore Singapore Patentee after: ASM ASSEMBLY SYSTEMS SINGAPORE Pte. Ltd. Address before: Zurich Patentee before: DTG INTERNATIONAL GmbH |