CN1801457A - Stickup device of support plate - Google Patents
Stickup device of support plate Download PDFInfo
- Publication number
- CN1801457A CN1801457A CNA2005101285926A CN200510128592A CN1801457A CN 1801457 A CN1801457 A CN 1801457A CN A2005101285926 A CNA2005101285926 A CN A2005101285926A CN 200510128592 A CN200510128592 A CN 200510128592A CN 1801457 A CN1801457 A CN 1801457A
- Authority
- CN
- China
- Prior art keywords
- support plate
- pressing plate
- chamber
- sticker
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims (4)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004344677 | 2004-11-29 | ||
JP2004344677A JP4679890B2 (en) | 2004-11-29 | 2004-11-29 | Support plate pasting device |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1801457A true CN1801457A (en) | 2006-07-12 |
CN100454481C CN100454481C (en) | 2009-01-21 |
Family
ID=36634580
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005101285926A Active CN100454481C (en) | 2004-11-29 | 2005-11-29 | Stickup device of support plate |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4679890B2 (en) |
KR (1) | KR101193308B1 (en) |
CN (1) | CN100454481C (en) |
TW (1) | TWI431679B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101314269B (en) * | 2007-05-30 | 2011-03-30 | 罗伯特别克勒有限公司 | Multi-level laminating press |
US8454357B2 (en) | 2007-11-30 | 2013-06-04 | Komax Holding Ag | Hotplate with lifting elements |
CN107331604A (en) * | 2016-04-29 | 2017-11-07 | 上海微电子装备(集团)股份有限公司 | A kind of bonding apparatus |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006000687B4 (en) | 2006-01-03 | 2010-09-09 | Thallner, Erich, Dipl.-Ing. | Combination of a carrier and a wafer, device for separating the combination and methods for handling a carrier and a wafer |
KR100861109B1 (en) | 2006-12-27 | 2008-09-30 | 세메스 주식회사 | Apparatus for processing substrate and method of processing substrate using the same |
JP5209947B2 (en) * | 2007-12-13 | 2013-06-12 | 東京応化工業株式会社 | Adhesive treatment method |
JP5145126B2 (en) * | 2008-06-11 | 2013-02-13 | 株式会社アルバック | Bonding apparatus and bonding method |
JP5515250B2 (en) * | 2008-07-31 | 2014-06-11 | 富士通株式会社 | Dust collecting mechanism and substrate cutting device |
JP5159566B2 (en) * | 2008-11-06 | 2013-03-06 | リンテック株式会社 | Sheet peeling apparatus and peeling method |
EP2660851B1 (en) | 2009-03-18 | 2020-10-14 | EV Group GmbH | Device and method for releasing a wafer from a holder |
EP2706562A3 (en) * | 2009-09-01 | 2014-09-03 | EV Group GmbH | Device and method for releasing a semiconductor wafer from a carrier substrate by tilting a film frame |
EP2523208B1 (en) | 2010-04-23 | 2013-06-12 | EV Group GmbH | Device and method for releasing a product substrate from a holder substrate |
CN102034725B (en) * | 2010-09-30 | 2013-01-30 | 东莞宏威数码机械有限公司 | Automatic substrate positioning and loading device |
JP2012104518A (en) * | 2010-11-05 | 2012-05-31 | Sumitomo Heavy Ind Ltd | Substrate delivery mechanism of sealing device and substrate delivery method of sealing device |
JP5149977B2 (en) * | 2011-04-15 | 2013-02-20 | リンテック株式会社 | Semiconductor wafer processing method |
JP2014160743A (en) * | 2013-02-19 | 2014-09-04 | Tokyo Ohka Kogyo Co Ltd | Bonding apparatus and cleaning method of the same |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH081898B2 (en) * | 1988-11-02 | 1996-01-10 | 三菱電機株式会社 | Wafer sticker |
JPH0582493A (en) * | 1991-03-11 | 1993-04-02 | Hitachi Ltd | Wafer bonding device and method of bonding wafer using the device |
KR100357881B1 (en) | 1999-03-09 | 2002-10-25 | 앰코 테크놀로지 코리아 주식회사 | Manufacturing apparatus of semiconductor device and its control method |
JP3607143B2 (en) * | 1999-11-19 | 2005-01-05 | 株式会社タカトリ | Method and apparatus for attaching protective tape to semiconductor wafer |
JP3742000B2 (en) * | 2000-11-30 | 2006-02-01 | 富士通株式会社 | Press machine |
JP2002192394A (en) * | 2000-12-28 | 2002-07-10 | Mitsubishi Gas Chem Co Inc | Press working method for inorganic substrate and press device therefor |
JP2003273049A (en) * | 2002-03-18 | 2003-09-26 | Toshiba Ceramics Co Ltd | Vacuum bonding device of wafer |
JP2004153159A (en) * | 2002-10-31 | 2004-05-27 | Enzan Seisakusho:Kk | Protection member adhering method for semiconductor wafer and its device |
TWI222671B (en) * | 2003-04-25 | 2004-10-21 | Fujitsu Ltd | Apparatus for fabricating bonded substrate |
JP4549648B2 (en) * | 2003-09-30 | 2010-09-22 | 信越半導体株式会社 | Semiconductor bonding equipment |
-
2004
- 2004-11-29 JP JP2004344677A patent/JP4679890B2/en active Active
-
2005
- 2005-11-28 KR KR1020050114163A patent/KR101193308B1/en active IP Right Grant
- 2005-11-29 CN CNB2005101285926A patent/CN100454481C/en active Active
- 2005-11-29 TW TW094141913A patent/TWI431679B/en active
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101314269B (en) * | 2007-05-30 | 2011-03-30 | 罗伯特别克勒有限公司 | Multi-level laminating press |
CN101314270B (en) * | 2007-05-30 | 2012-07-04 | 罗伯特别克勒有限公司 | Method and device for laminating essentially plate-shaped workpieces under the effect of pressure and heat |
US8454357B2 (en) | 2007-11-30 | 2013-06-04 | Komax Holding Ag | Hotplate with lifting elements |
CN101444986B (en) * | 2007-11-30 | 2013-08-14 | 库迈思控股股份公司 | Hotplate with lifting element |
CN107331604A (en) * | 2016-04-29 | 2017-11-07 | 上海微电子装备(集团)股份有限公司 | A kind of bonding apparatus |
US10780684B2 (en) | 2016-04-29 | 2020-09-22 | Shanghai Micro Electronics Equipment (Group) Co., Ltd. | Bonding device |
Also Published As
Publication number | Publication date |
---|---|
KR101193308B1 (en) | 2012-10-19 |
TWI431679B (en) | 2014-03-21 |
TW200629395A (en) | 2006-08-16 |
KR20060059825A (en) | 2006-06-02 |
JP2006156679A (en) | 2006-06-15 |
JP4679890B2 (en) | 2011-05-11 |
CN100454481C (en) | 2009-01-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230609 Address after: Kanagawa, Japan Patentee after: Process Equipment Business Division Preparation Co.,Ltd. Patentee after: E.T. System Engineering Co.,Ltd. Address before: Kawasaki, Japan Patentee before: TOKYO OHKA KOGYO CO.,LTD. Patentee before: E.T. System Engineering Co.,Ltd. Effective date of registration: 20230609 Address after: Ibaraki Patentee after: Ameco Technology Co.,Ltd. Patentee after: E.T. System Engineering Co.,Ltd. Address before: Kanagawa, Japan Patentee before: Process Equipment Business Division Preparation Co.,Ltd. Patentee before: E.T. System Engineering Co.,Ltd. |