JP2014160743A - Bonding apparatus and cleaning method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prolong a maintenance period in a bonding apparatus which uses a press plate and bonds a wafer to a support plate through an adhesive.SOLUTION: A bonding apparatus 100 laminates a substrate, an adhesion layer, and a support supporting the substrate in this order and applies pressing force to the laminated body to bond the substrate to the support through the adhesion layer. The bonding apparatus 100 comprises: a pair of plate members 4; and plasma generation means which generates plasma between the pair of plate members 4. The bonding apparatus 100 generates the plasma between the plate members to clean the plate members and thereby eliminates contamination of the plate members without stopping the operation of the bonding apparatus. Thus, a maintenance period of the bonding apparatus is prolonged.

Description

  The present invention relates to a sticking device for sticking a substrate and a support in a laminate in which a substrate and a support are laminated, and a cleaning method for the sticking device.

  As mobile phones, digital AV devices, IC cards, etc. have become more sophisticated, the demand for higher integration of chips in packages has increased by reducing the size and thickness of semiconductor silicon chips (hereinafter referred to as chips). ing. In order to achieve high integration of chips in the package, it is necessary to reduce the thickness of the chip to a range of 25 μm or more and 150 μm or less.

  However, a semiconductor wafer (hereinafter referred to as a wafer) serving as a base of a chip is thinned by grinding, its strength is weakened, and the wafer is likely to be cracked or warped. Further, since it is difficult to automatically transport a wafer whose strength has been reduced by making it thin, it has to be transported manually, and the handling thereof is complicated.

  Therefore, a wafer support system that maintains the strength of the wafer and prevents the occurrence of cracks and warpage of the wafer by bonding a plate made of glass or hard plastic, which is called a support plate, to the wafer to be ground has been developed. . Since the strength of the wafer can be maintained by the wafer support system, the transport of the thinned semiconductor wafer can be automated.

  The wafer and the support plate are bonded together using an adhesive tape, a thermoplastic resin, an adhesive, or the like. Patent Document 1 discloses a sticking device that uses a press plate to bond a wafer and a support plate via an adhesive.

JP 2007-158122 A (released on June 21, 2007)

  As a result of investigations by the present inventors, in the pasting apparatus in which the wafer and the support plate are bonded together via an adhesive using a press plate in the prior art, the adhesive protruding from between the wafer and the support plate is May contaminate the press plate. Therefore, in such a sticking apparatus, in order to remove contamination of the press plate, it is necessary to periodically stop the operation of the sticking apparatus, perform maintenance, and clean the inside. However, it is preferable that this maintenance cycle is long.

  The present invention has been made in view of the above problems, and a technique for extending a maintenance cycle in a bonding apparatus that bonds a wafer and a support plate with an adhesive using a press plate. The main purpose is to provide

  In order to solve the above-described problem, the pasting device according to the present invention applies the pressing force to a laminate formed by laminating a substrate, an adhesive layer, and a support that supports the substrate in this order. A pasting apparatus for pasting a substrate and the support through the adhesive layer, comprising: a pair of plate members that sandwich the laminate; and plasma generating means for generating plasma between the pair of plate members It is characterized by.

  Further, the cleaning method for a sticking device according to the present invention includes applying a pressing force to a laminate formed by laminating a substrate, an adhesive layer, and a support that supports the substrate in this order, thereby supporting the substrate and the support. A method of cleaning a sticking device that attaches a body to each other through the adhesive layer, wherein plasma is generated between a pair of plate members that sandwich the laminate, thereby contacting the laminate in the pair of plate members It includes a plasma generation step for cleaning the surface.

  According to the present invention, contamination of the plate member can be removed by generating plasma between the plate members to clean the plate member without stopping the operation of the sticking apparatus. Therefore, the maintenance cycle of the sticking device can be lengthened.

It is a schematic diagram explaining the structure of the sticking apparatus which concerns on one Embodiment of this invention. It is a schematic diagram explaining the washing | cleaning method using the sticking apparatus which concerns on one Embodiment of this invention. It is a schematic diagram explaining the structure of the sticking apparatus which concerns on other embodiment of this invention.

  The sticking device according to the present invention applies a pressing force to a laminate formed by laminating a substrate, an adhesive layer, and a support that supports the substrate in this order, thereby bonding the substrate and the support to each other. A pasting device for pasting through a layer, comprising a pair of plate members for sandwiching the laminate, and a plasma generating means for generating plasma between the pair of plate members.

[Laminate]
The laminate to be affixed is formed by laminating a substrate, an adhesive layer containing, for example, a thermoplastic resin, and a support plate (support) that supports the substrate in this order. That is, the laminated body is formed by applying an adhesive to one of the substrate and the support plate, or after adhering an adhesive tape to which the adhesive is applied to form an adhesive layer. And an adhesive layer and a support plate are laminated in this order. And after a laminated body is laminated | stacked beforehand and formed, it is mounted (set) in the predetermined position of a sticking apparatus by conveyance apparatuses, such as a robot arm, for example. It is more preferable that the laminate is temporarily fixed so that the relative position between the substrate and the support plate is not shifted in a state where the laminate is formed in advance. Alternatively, the laminated body is placed (set) at a predetermined position of the sticking device by, for example, forming a substrate and a support plate on the plate member of the sticking device by a transport device such as a robot arm. Also good.

  In addition, the forming method and forming apparatus for forming the laminate, that is, the method for forming the adhesive layer and the apparatus for forming the adhesive layer, and the method for superimposing the substrate and the support plate and the apparatus for superimposing are not particularly limited. Various methods and apparatuses can be employed. In the present invention, the laminated body only needs to be formed by laminating the substrate, the adhesive layer, and the support plate in this order when the pressing force is applied by the sticking device.

  The substrate is subjected to processes such as thinning, conveyance, and mounting while being supported (attached) to a support plate. The substrate is not limited to a wafer substrate, and may be any substrate such as a ceramic substrate, a thin film substrate, or a flexible substrate that needs to be supported by a support plate.

  The support plate is a support that supports the substrate, and is attached to the substrate via an adhesive layer. Therefore, the support plate only needs to have a strength necessary to prevent breakage or deformation of the substrate during a process such as thinning, transporting, and mounting of the substrate, and is desirably lighter. From the above viewpoint, the support plate is more preferably made of glass, silicon, acrylic resin, ceramics, silicon wafer, or the like.

  The adhesive which comprises the said contact bonding layer should just contain the thermoplastic resin which heat fluidity improves by heating, for example as an adhesive material. Examples of the thermoplastic resin include acrylic resins, styrene resins, maleimide resins, hydrocarbon resins, and elastomers.

  The method for forming the adhesive layer, that is, the method for applying the adhesive to the substrate or the support plate, or the method for forming the adhesive tape by applying the adhesive to the substrate is not particularly limited. Examples of the method for applying the adhesive include a spin coating method, a dipping method, a roller blade method, a doctor blade method, a spray method, and a coating method using a slit nozzle.

  The thickness of the adhesive layer may be set as appropriate according to the type of substrate and support plate to be attached, the treatment applied to the substrate after being attached, etc., but within the range of 10 μm or more and 150 μm or less. It is preferable that it is within a range of 15 μm or more and 100 μm or less.

  When the support plate is peeled from the substrate, a solvent is supplied to the adhesive layer to dissolve the adhesive layer. Thereby, a board | substrate and a support plate can be isolate | separated. At this time, if the support plate has a through-hole penetrating in the thickness direction, it is more preferable because the solvent can be easily supplied to the adhesive layer through the through-hole.

  Further, a layer other than the adhesive layer may be further formed between the substrate and the support plate as long as the attachment is not hindered. For example, a separation layer that is altered by irradiation with light may be formed between the support plate and the adhesive layer. Since the separation layer is formed, the substrate and the support plate can be easily separated by irradiating light after processes such as thinning, transporting, and mounting of the substrate.

[First embodiment]
A sticking apparatus according to an embodiment (first embodiment) of the present invention will be described below with reference to FIG. As shown to Fig.1 (a), the sticking apparatus 100 which concerns on one Embodiment of this invention is equipped with the vacuum vessel 5 which accommodated the upper press unit and the lower press unit. The upper press unit includes a central support member 8 suspended from the upper part of the vacuum vessel 5, and a metal base plate 1, a heat insulating material 2, a heater 3, and an upper conductive press that are sequentially connected downward from the central support member 8. It consists of a plate (plate member, plasma generating means) 4. The lower press unit is composed of a center support member 7 erected from the lower part of the vacuum vessel 5, and a metal base plate 1, a heat insulating material 2, a heater 3, and a lower conductive press connected in order from the center support member 8 upward. It consists of a plate 4. There is a gap between the pair of conductive press plates 4, and a laminate to be attached is set in the gap. Further, the upper press unit is provided with a gas introduction path 6 for circulating gas therein.

  The vacuum vessel 5 can be sealed, and the inside of the vacuum vessel 5 can be put into a reduced pressure environment by a suction device (not shown). By setting the inside of the vacuum vessel 5 to a reduced pressure environment, conditions for bonding the substrate and the support plate and conditions for generating plasma can be obtained.

  The pair of conductive press plates 4 is made of a rigid body having conductivity. For example, although not limited thereto, a material in which a conductor such as a metal is kneaded into a ceramic such as alumina can be used. The pair of conductive press plates 4 are configured to sandwich and press the laminate by the force from the center support member 7 and the center support member 8 applied via the metal base plate 1. Moreover, as shown in FIG.1 (b), a high frequency voltage can be applied to a pair of electroconductive press plate 4 from a high frequency power supply. Thereby, the pair of conductive press plates 4 also operate as plasma generation electrodes. That is, the high frequency power source and the pair of conductive press plates 4 constitute plasma generating means in the present embodiment.

  The heater 3 is composed of a heating device such as a ribbon heater or a surface heater, for example, and heats the laminated body by heating the conductive press plate 4 when the conductive press plate 4 applies a pressing force to the laminated body. Thereby, when using the contact bonding layer containing a thermoplastic resin, the contact bonding layer of a laminated body can be fuse | melted and a board | substrate and a support plate can be adhere | attached successfully. The heating temperature of the heater 3 may be set as appropriate according to the glass transition temperature of the thermoplastic resin or the like. For example, the laminated body may be set to be heated in a range of 50 ° C. or higher and 300 ° C. or lower.

  The heat insulating material 2 prevents the heat of the heater 3 from being conducted to the metal base plate 1. By providing the heat insulating material 2, the metal base plate 1 can be prevented from being distorted by the heat of the heater 3.

  The metal base plate 1 is made of a metal such as stainless steel and supports the conductive press plate 4. Further, the force applied from the center support member 7 and the center support member 8 is uniformly transmitted to the conductive press plate 4.

  The gas introduction path 6 has an opening (gas introduction port) on the surface of the upper conductive press plate 4 facing the laminate, and a gas used for generating plasma is supplied with a pair of conductive presses. It can be introduced into the gap between the plates 4. The number of openings of the gas introduction path 6 on the surface facing the laminate of the upper conductive press plate 4 is not particularly limited, and there is no problem as long as it is 1 or more. For example, the range is 4 or more and 16 or less. It can be. The gas introduction path 6 only needs to be provided so that gas can be supplied to the gap between the pair of conductive press plates 4, and may be provided inside the lower press unit, for example.

  As the gas introduced from the gas introduction path 6, oxygen gas can be typically used. Alternatively, a mixed gas in which nitrogen gas, hydrogen gas, a fluorine compound, or the like is mixed with oxygen gas can be used. Although the kind and ratio of the gas to be used will be described in detail below, they may be appropriately selected depending on the cause of the conductive press plate 4 and the degree of contamination.

[Cleaning method]
A cleaning method using the sticking device according to an embodiment of the present invention will be described below with reference to FIG. As shown in FIG. 2, the sticking apparatus 100 applies a pressing force to a laminate 30 in which a substrate, an adhesive layer, and a support plate that supports the substrate are laminated in this order, whereby a substrate, a support plate, 2 (FIG. 2A), the cleaning method according to the present embodiment is performed when the dirt 16 is generated during the above-described bonding in the bonding apparatus 100 (FIG. 2B). A plasma generating step (in which a pressing surface of the pair of conductive press plates 4 (the surface facing the laminate 30 in FIG. 2A)) is cleaned by generating plasma between the pair of conductive press plates 4 ( 2C) is included. Thereby, the stain | pollution | contamination 16 can be suitably removed from the press surface in a pair of electroconductive press plate 4 (FIG.2 (d)).

  As shown in FIG. 2A, the sticking device 100 performs a sticking process in a state where the laminate 30 is placed between a pair of conductive press plates 4 (sticking step). The laminated body 30 that has been bonded is transported to a further process by transporting means (not shown) such as a robot arm.

  FIG. 2B shows a state in which the pair of conductive press plates 4 is contaminated with the dirt 16 caused by the adhesive or the like protruding from the laminated body 30. That is, in the process shown in FIG. 2A, when a pressing force is applied to the laminated body 30, an adhesive that adheres the substrate and the support protrudes outside the laminated body 30, and the conductive press plate 4 Dirt 16 is produced by the adhesion. Not only the adhesive protruding from the laminate 30, but also the carbide of the adhesive, the material of the separation layer constituting the laminate 30, and other dust mixed in the vacuum container 5 correspond to the dirt 16. The dirt 16 is an organic substance, for example.

  FIG. 2 (c) cleans the pressing surfaces of the pair of conductive press plates 4 (surfaces facing the laminate 30 in the bonding step) by generating plasma between the pair of conductive press plates 4. (Plasma generation process). Plasma is passed between the pair of conductive press plates 4 from the gas inlet provided on the lower surface of the upper conductive press plate 4 (the surface facing the laminate 30 in the bonding process) via the gas introduction path 6. By supplying a high-frequency voltage between the pair of conductive press plates 4 using a high-frequency power source (not shown) while supplying the processing gas, plasma is generated between the pair of conductive press plates 4 and dirt 16 is removed. It can be removed efficiently. Moreover, since plasma is generated only between the pair of conductive press plates 4, it is possible to prevent other members in the vacuum vessel 5 from being damaged by the plasma.

  The gas used in the plasma generation step can be appropriately selected depending on the cause and degree of contamination. The conditions for the plasma generation process include vacuum density, gas flow rate, high-frequency voltage between the pair of conductive press plates 4, width provided between the pair of conductive press plates 4, and the like. Can do. Further, the conductive press plate 4 can be appropriately removed by adjusting the processing time of the plasma generation process according to the degree of the dirt 16.

  As the gas introduced from the gas introduction path 6, oxygen gas can be typically used. Further, a mixed gas in which at least one selected from nitrogen gas, hydrogen gas, fluorine compound, and the like is mixed with oxygen gas can also be used. Examples of the fluorine compound include carbon tetrafluoride, methane trifluoride, and sulfur hexafluoride. The content of gas other than oxygen gas in the mixed gas (gas) is particularly preferably less than 1%. By containing a gas other than oxygen gas within the range in the mixed gas, the cleaning property of the conductive press plate 4 by plasma without damaging the conductive press plate 4 by the plasma generated using the mixed gas. Can be improved. What is necessary is just to select suitably the kind and ratio of gas to be used according to the cause and state of dirt of the conductive press plate 4. For example, when the dirt 16 attached to the conductive press plate 4 is caused by the adhesive of the laminated body 30, oxygen gas can be suitably used. Further, when the adhesive that contaminates the conductive press plate 4 is carbonized by heating with the heater 3, a mixed gas containing less than 5% carbon tetrafluoride in the oxygen gas with respect to the total mixed gas Can be suitably used. Moreover, when the stain | pollution | contamination 16 originates in the separated layer of the laminated body 30, the mixed gas which made oxygen gas contain less than 10% of nitrogen gas with respect to the whole mixed gas can be used suitably, for example. . For example, when using a mixed gas in which hydrogen is contained in oxygen gas, it is preferable to add hydrogen at a ratio of 5% to 20% with respect to the entire mixed gas. At this time, a gas in which hydrogen and nitrogen are mixed may be added to the oxygen gas.

  The internal pressure of the vacuum vessel 5 is preferably in the range of 0.1 to 5 torr, and more preferably in the range of 0.5 to 2 torr. By setting the range of the pressure inside the vacuum vessel 5 within the range, abnormal discharge such as arcing in the conductive press plate 4 acting as a plasma generating electrode can be prevented, and the pair of conductive press plates 4 A sufficient amount of gas can be held to generate a plasma during this period.

  The flow rate of the gas used for generating the plasma depends on the size of the conductive press plate 4, but is preferably in the range of 1 liter / minute to 5 liters / minute, more preferably 2 liters / minute to 4 liters / minute. More preferably, it is in the range of liters / minute or less. By setting the flow rate of the gas used for generating the plasma within the range, the dirt 16 can be suitably removed by the plasma.

  A high frequency voltage is applied between the pair of conductive press plates 4 as shown in FIG. The frequency of the high-frequency voltage is not particularly limited, but a high-frequency voltage within a range of 1 MHz or more and 27.12 MHz or less can be suitably used. Moreover, it is preferable that the width | variety provided between a pair of electroconductive press plates 4 in a plasma generation process exists in the range of 5 cm or more and 10 cm or less. By setting the width provided between the pair of conductive press plates 4 in the plasma generation step within the range, it is possible to suitably generate plasma without hindering introduction of gas from the gas introduction path 6. Further, the generated plasma can be suitably held between the pair of conductive press plates 4.

  The processing time of the plasma generation step varies depending on the degree of the dirt 16, but if the thickness of the dirt 16 is about 10 μm, it can be removed in about 5 minutes. Therefore, it can transfer to the process of manufacturing the next laminated body rapidly.

  FIG. 2D shows the inside of the vacuum container 5 of the sticking apparatus 100 after the dirt 16 is cleaned by the plasma generation process. In the plasma generation process, it is possible to clean and remove dirt on the order of several microns, which is difficult to determine visually by plasma. Therefore, the unevenness | corrugation derived from the stain | pollution | contamination 16 which cannot be judged visually can also be removed, and the surface which contact | connects the laminated body 30 of the electroconductive press plate 4 can be maintained very smooth.

  In addition, what is necessary is just to set so that it may transfer to a plasma generation process, after manufacturing the said laminated body 30 by the fixed number (number of times) as a manufacturing process of the laminated body 30.

  The cleaning method using the sticking device 100 can remove the dirt 16 quickly and reliably by generating plasma between the pair of conductive press plates 4. Further, the plasma generation process of the cleaning method can be automatically and continuously incorporated into the manufacturing process of the laminate 30. For this reason, the effort which opens the vacuum container 5 of the sticking apparatus 100, and wash | cleans by a human hand can be reduced significantly. Therefore, the time during which the sticking apparatus 100 cannot be operated due to maintenance such as cleaning can be significantly reduced. Further, it is not necessary to clean the conductive press plate 4 heated to a high temperature by the heater 3 by a human hand, and therefore the conductive press plate 4 can be cleaned safely.

[Second Embodiment]
A sticking apparatus according to another embodiment (second embodiment) of the present invention will be described below with reference to FIG. For convenience of explanation, members having the same functions as those described in the embodiment are given the same reference numerals, and descriptions thereof are omitted. 3A is a side view showing a schematic configuration of the sticking apparatus 200, FIG. 3B is a top view of the sticking apparatus 200, and FIG. 3C is a plasma generation provided in the sticking apparatus 200. It is a figure which shows schematic structure of an electrode.

  As shown in FIG. 3A, the sticking device 200 includes a vacuum container 5 in which an upper press unit and a lower press unit are stored, like the sticking device 100. However, instead of the pair of conductive press plates 4, a pair of insulating press plates (plate members) 9 are installed. Then, as shown in FIGS. 3A and 3B, the attaching device 200 includes an annular high-frequency voltage application electrode (first electrode) provided so as to surround the gap between the pair of insulating press plates 9 from the outside. And an annular ground electrode (second annular electrode) 12. As shown in FIGS. 3B and 3C, the high-frequency voltage application electrode 11 and the ground electrode 12 have an insulating electrode fixing ring 13 on the side opposite to the side facing the pair of insulating press plates 9. Is provided. The electrode fixing ring 13 is driven in a direction perpendicular to the surface of the insulating press plate 9 by the driving means 14.

  The insulating press plate 9 is made of an insulator such as ceramics. The insulating press plate 9 is used in place of the pair of conductive press plates 4 in the first embodiment to apply a pressing force so as to sandwich the laminate in the sticking device 200.

  As shown in FIG. 3B, in the sticking apparatus 200 according to the second embodiment, a high frequency voltage is applied to the high frequency voltage application electrode 11 and the ground electrode 12 from a high frequency power source. 11 and the ground electrode 12 function as plasma generation electrodes. That is, the high-frequency power source, the high-frequency voltage application electrode 11 and the ground electrode 12 constitute plasma generation means in this embodiment. The high frequency voltage application electrode 11 and the ground electrode 12 are provided so as to surround the gap between the pair of insulating press plates 9 from the outside. With this configuration, plasma is suitably generated in the gap between the pair of insulating press plates 9 as in the case of using the pair of conductive press plates 4 in the sticking device 100 according to the first embodiment. be able to.

  As the high-frequency voltage application electrode 11 and the ground electrode 12, for example, a plate electrode, a comb electrode, a coil electrode, or the like can be used. Of these electrodes, the comb electrode is particularly preferably used for the high-frequency voltage application electrode 11 and the ground electrode. By using a comb electrode, plasma can be generated efficiently. Note that in this specification, the comb electrode refers to an electrode in which comb-like portions of two types of comb-like electrodes having different potentials are arranged in parallel and alternately.

  The high-frequency voltage application electrode 11 and the ground electrode 12 may be at least one set, but may be two or more sets. The width (interval) between the pair of insulating press plates 9 in the plasma generation step is a pair of conductive press plates in the attaching device 100 according to the first embodiment from the viewpoint of gas introduction efficiency and plasma generation efficiency. As in the range of the width (interval) between 4, it is preferably in the range of 5 cm or more and 10 cm or less. Therefore, if it can be within the range of the width, one or more sets of the high-frequency voltage application electrode 11 and the ground electrode 12 can be provided. Particularly when an annular flat plate electrode is used for the high-frequency voltage application electrode 11 and the ground electrode 12, it is preferable to provide two or more sets of electrodes as plasma generation electrodes. By providing a plurality of plasma generation electrodes, plasma can be generated more efficiently.

  The high frequency voltage application electrode 11 and the ground electrode 12 include an electrode fixing ring 13 as an insulating member on the side opposite to the side facing the pair of insulating press plates 9. The electrode fixing ring 13 is made of an insulating member such as ceramics, ceramics, porcelain, or polyimide resin. By providing the insulating electrode fixing ring 13, plasma is prevented from being generated inside the vacuum vessel 5 other than the gap between the pair of insulating press plates 9. Thereby, it is possible to prevent the members inside the vacuum vessel 5 other than the pair of insulating press plates 9 from being damaged by the plasma. The inner diameter of the electrode fixing ring 13 is preferably larger than the outer diameter of the insulating press plate 9 in the range of 2 mm to 10 mm. By making the inner diameter of the electrode fixing ring 13 larger than the outer diameter of the insulating press plate 9, the driving means 14 does not come into contact with the metal base plate 1 from the insulating press plate 9 and the plane of the insulating press plate 9. The electrode fixing ring 13 can be moved in the vertical direction. For this reason, in the process of bonding the laminated body, the laminated body can be smoothly conveyed onto the plane of the insulating press plate 9 by a conveying device such as a robot arm.

  The gas used in the plasma generation process and the conditions for the plasma generation process include the pressure inside the vacuum vessel 5, the gas flow rate, the high-frequency voltage between the high-frequency voltage application electrode 11 and the ground electrode 12, and a pair of conductive press plates 9. The width or the like provided between the two is a condition according to the first embodiment. Moreover, the pressing surface of the conductive press plate 9 (the surface facing the laminate in the pasting step) can be appropriately cleaned by adjusting the processing time of the plasma generation step according to the degree of the dirt 16.

  The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention.

  The sticking device according to the present invention can be widely used, for example, in a manufacturing process of a miniaturized semiconductor device.

DESCRIPTION OF SYMBOLS 1 Metal base plate 2 Heat insulation material 3 Heater 4 Conductive press plate (plate member, plasma generation means)
5 Vacuum container 6 Gas introduction path 7 Center support member 8 Center support member 9 Insulating press plate (plate member)
11 High frequency voltage application electrode (first annular electrode, plasma generating means)
12 Ground electrode (second annular electrode, plasma generating means)
DESCRIPTION OF SYMBOLS 13 Electrode fixing ring 14 Drive means 16 Dirt 30 Laminated body 100 Sticking apparatus 200 Sticking apparatus

Claims (10)

A pasting apparatus that applies the pressing force to a laminate formed by laminating a substrate, an adhesive layer, and a support that supports the substrate in this order, thereby attaching the substrate and the support via the adhesive layer. Because
A pair of plate members sandwiching the laminate,
Plasma generating means for generating plasma between the pair of plate members;
A pasting device comprising:   The sticking apparatus according to claim 1, wherein the plasma generating unit is configured to clean the surfaces of the pair of plate members that are in contact with the laminated body by generating the plasma. The pair of plate members have conductivity,
The sticking apparatus according to claim 1 or 2, wherein the plasma generating means generates the plasma by applying a high-frequency voltage between the pair of plate members. The pair of plate members are insulators,
The plasma generation means includes a plasma generation electrode for generating the plasma so as to surround the gap between the pair of plate members from the outside, and by applying a high frequency voltage to the plasma generation electrode, The sticking apparatus according to claim 1 or 2, wherein the plasma is generated.   The sticking apparatus according to claim 4, wherein the plasma generating means includes an insulating member on a side opposite to a side facing the pair of plate members in the plasma generating electrode. The plasma generating electrode includes at least one set of a first annular electrode and a second annular electrode,
The pasting apparatus according to claim 4 or 5, wherein the plasma generating means applies a high-frequency voltage between the first and second annular electrodes.   The sticking device according to any one of claims 1 to 6, wherein a gas introduction port is provided on a surface of at least one of the pair of plate members in contact with the laminate. A pasting apparatus that applies the pressing force to a laminate formed by laminating a substrate, an adhesive layer, and a support that supports the substrate in this order, thereby attaching the substrate and the support via the adhesive layer. A method of cleaning,
A cleaning method for a sticking apparatus, comprising: a plasma generation step of cleaning a surface of the pair of plate members contacting the laminate by generating plasma between the pair of plate members sandwiching the laminate.   9. The cleaning method for a sticking apparatus according to claim 8, wherein in the plasma generation step, a gas containing a fluorine compound in a range exceeding 0% and less than 1% is introduced between the pair of plate members. .   The plasma generating step is characterized in that a mixed gas of oxygen gas and nitrogen gas containing nitrogen gas in a range of more than 0% and less than 10% is introduced between the pair of plate members. 9. A method for cleaning a sticking device according to 8.

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