KR20010063393A - Perfect plane surface process of film using hot press principles and the device - Google Patents

Perfect plane surface process of film using hot press principles and the device Download PDF

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Publication number
KR20010063393A
KR20010063393A KR1019990060464A KR19990060464A KR20010063393A KR 20010063393 A KR20010063393 A KR 20010063393A KR 1019990060464 A KR1019990060464 A KR 1019990060464A KR 19990060464 A KR19990060464 A KR 19990060464A KR 20010063393 A KR20010063393 A KR 20010063393A
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South Korea
Prior art keywords
film
chamber
jig
pressure
vacuum
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KR1019990060464A
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Korean (ko)
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배규호
방철용
오세태
조규태
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고석태
(주)케이.씨.텍
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Priority to KR1019990060464A priority Critical patent/KR20010063393A/en
Publication of KR20010063393A publication Critical patent/KR20010063393A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
    • B29C65/4835—Heat curing adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7841—Holding or clamping means for handling purposes
    • B29C65/7847—Holding or clamping means for handling purposes using vacuum to hold at least one of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
    • B29C66/024—Thermal pre-treatments
    • B29C66/0242—Heating, or preheating, e.g. drying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/47—Joining single elements to sheets, plates or other substantially flat surfaces
    • B29C66/472—Joining single elements to sheets, plates or other substantially flat surfaces said single elements being substantially flat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/74—Joining plastics material to non-plastics material
    • B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
    • B29C66/7422—Aluminium or alloys of aluminium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/74—Joining plastics material to non-plastics material
    • B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
    • B29C66/7428—Transition metals or their alloys
    • B29C66/74281—Copper or alloys of copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/74—Joining plastics material to non-plastics material
    • B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
    • B29C66/7428—Transition metals or their alloys
    • B29C66/74283—Iron or alloys of iron, e.g. steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/82—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps
    • B29C66/826—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps without using a separate pressure application tool, e.g. the own weight of the parts to be joined
    • B29C66/8266—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps without using a separate pressure application tool, e.g. the own weight of the parts to be joined using fluid pressure directly acting on the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/92—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools
    • B29C66/924—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/94—Measuring or controlling the joining process by measuring or controlling the time
    • B29C66/944—Measuring or controlling the joining process by measuring or controlling the time by controlling or regulating the time
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2677/00—Use of PA, i.e. polyamides, e.g. polyesteramides or derivatives thereof, for preformed parts, e.g. for inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
    • B29K2705/02—Aluminium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
    • B29K2705/08—Transition metals
    • B29K2705/10—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
    • B29K2705/08—Transition metals
    • B29K2705/12—Iron
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Fluid Mechanics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: A complete film sticking method without pores using a thermal compression principle and a sticking device thereof are provided to completely stick a film with regular sticking force without damages and to stick the film regardless of the surface shape of a film contacted body. CONSTITUTION: A complete film sticking device comprises a chamber(1) having a sealing space, with at least one jig(3) inside the sealing space; a worktable(7) putting a body(5) on, inside the jig; a vacuum pump(11) connected to the jig and controlled by a vacuum valve(9) to evacuate the jig; a compressor(15) connected to the chamber and controlled by a compression valve(13), to generate a pressure difference between the chamber and the jig with compressed gas; and a pressurizing cover(21) sealing the jig to stick the body, a sticking film(17) and a stuck film(19) with the pressure difference and equally pressurizing the films.

Description

열 압착 원리를 이용한 필름의 완전 평면 접착 방법 및 그 장치{PERFECT PLANE SURFACE PROCESS OF FILM USING HOT PRESS PRINCIPLES AND THE DEVICE}Fully Plane Bonding Method of Film Using Thermocompression Principle and Its Device {PERFECT PLANE SURFACE PROCESS OF FILM USING HOT PRESS PRINCIPLES AND THE DEVICE}

본 발명은 열 압착 원리를 이용한 필름의 완전 평면 접착 방법 및 그 장치에 관한 것으로, 좀더 상세하게는 필름 전체에 압력이 균일하게 압력이 작용하면서 필름이 접촉되는 몸체의 면에만 접착될 수 있도록 하여 필름의 손상이 없이 일정한 접착력으로 완전 평면 접착됨과 아울러 필름의 접촉되는 몸체, 특히 반도체 제조장치의 정전척의 표면 형상에 관계없이 완전 평면으로 접착될 수 있는 열 압착 원리를 이용한 필름의 완전 평면 접착 방법 및 그 장치에 관한 것이다.The present invention relates to a method and a device for completely flat bonding of a film using the principle of thermal compression, and more particularly, the film can be adhered only to the surface of the body to which the film is in contact while the pressure is uniformly applied to the entire film. Method of fully flat adhesion of film using the thermocompression principle that can be completely flat bonded with constant adhesion without any damage, and can be adhered completely flat regardless of the surface shape of the contact body of the film, especially the electrostatic chuck of the semiconductor manufacturing apparatus. Relates to a device.

일반적으로 필름을 금속 몸체에 접착하는 경우 대체적으로 열과 압력을 이용한 열 압착 방식이 주로 이용되고 있다.In general, when the film is adhered to the metal body, a thermal compression method using heat and pressure is generally used.

이러한 종래의 열 압착 방식은 물리적인 힘을 이용한 것으로, 이를 자세히 살펴보면 도 3 및 도 4와 같이 알루미늄 등으로 이루어진 지그(Jig)(105)에 완충제(104)를 이용하여 금속 몸체(101)를 고정시키고, 접착 필름(102)과 접착하려는 필름(Film)(107)을 사전에 가압하여 이루어진 제1접합부(110)를 금속 몸체(101)에 정확한 위치 선정을 하고, 금속 몸체(101)와 히터(108)의 사이에 완충제(104a)를 설치한다.The conventional thermal compression method uses a physical force, and in detail, fixing the metal body 101 using the buffer 104 to a jig 105 made of aluminum or the like as shown in FIGS. 3 and 4. The first bonding part 110 formed by pressing the adhesive film 102 and the film 107 to be bonded in advance is accurately positioned on the metal body 101, and the metal body 101 and the heater ( Between the buffers 108, a buffer 104a is provided.

이때, 유압 실린더(106)의 움직임이나 진동에 의하여 필름 위치가 달라질 수 있으므로 주의가 필요하며, 이형제 필름(103) 사이에 완충제(104)를 넣어 한 장으로 제2접합부(111)를 만든 다음 지그(105)를 올려 놓는다.At this time, the film position may be changed by the movement or vibration of the hydraulic cylinder 106, so care is required, and the second bonding portion 111 is made of one piece by inserting the buffer 104 between the release agent film 103 and then jig Put 105 on.

그리고 상기와 같이 열 압착의 접합 작업이 완료되면, 유압 실린더(106)를 천천히 이동하여 접착 필름(2)을 가압하여 완전히 금속 몸체(101)에 밀착되도록 한 후 히터(108)에 전기를 인가하여 예컨대, 180℃에서 2시간 가열하여 접착 필름(102)이 완전히 경화된 상태에서 완전히 냉각하여 상온(27℃)이 되었을 때 유압 실린더(106)의 압력을 제거한다.When the bonding operation of the thermocompression bonding is completed as described above, the hydraulic cylinder 106 is slowly moved to press the adhesive film 2 so as to completely adhere to the metal body 101, and then apply electricity to the heater 108. For example, when the adhesive film 102 is completely cured by heating at 180 ° C. for 2 hours, the pressure of the hydraulic cylinder 106 is removed when the adhesive film 102 reaches room temperature (27 ° C.).

그러면 상기한 필름(107)은 접착 필름(102)에 의하여 금속 몸체(101)에 완전히 접착되는데, 이때 상기한 접착 필름(102)이 금속 몸체(101)와 접착된제1접착부(110)만 사용되고 나머지 완충제(104)와 이형제 필름(103)로 이루어진 제2접착부(111)은 재사용이 불가하므로 폐기 처분된다.Then, the film 107 is completely adhered to the metal body 101 by the adhesive film 102, where only the first adhesive part 110 in which the adhesive film 102 is bonded to the metal body 101 is used. The second adhesive part 111 composed of the remaining buffer 104 and the release agent film 103 is not reused and disposed of.

그러나 종래의 열 압착 방식에 의한 접착 방식은 유압 실린더를 이용한 기구적인 힘에 의하여 필름과 금속 몸체에 접착 필름을 경화시켜 접착하게 되어 있으므로 유압 실린더에 의한 물리적인 압력을 전달할 경우 지그에 의한 균일한 압력 전달이 불가능하게 되며, 따라서 필름과 금속 사이의 기포를 완전하게 제거할 수 없으며, 이 기구적인 힘을 가하는 과정에서 필름의 손상 및 금속 몸체에 영향을 주어 불량을 발생하는 원인을 제공하게 되는 문제점이 있다.However, in the conventional thermal bonding method, since the adhesive film is cured to the film and the metal body by mechanical force using the hydraulic cylinder, the adhesive film is hardened by the jig when the physical pressure is transmitted by the hydraulic cylinder. It becomes impossible to transfer, therefore, it is impossible to completely remove the air bubbles between the film and the metal, and in the process of applying this mechanical force, the damage of the film and the metal body are affected, thereby providing a cause of failure. have.

또한, 상기한 지그를 여러번 사용할 경우 중심 부분이 변형되어 실린더의 압력이 필름 전체에 균일하게 전달되지 않는 경우가 많은데, 이 경우 지그를 자주 교체해야 하는 불편함이 많았다.In addition, when the jig is used many times, the center portion is deformed so that the pressure of the cylinder is not evenly transmitted to the entire film. In this case, the jig has to be frequently replaced.

특히, 반도체 제조장치에 사용되고 있는 정전척의 제조공정에 종래의 열 압착 방식에 의한 접착 방식을 사용할 경우 금속 몸체 표면의 미소한 형상에 의하여 필름은 완전한 평면 접착이 불가능하며, 따라서 도 4와 같이 필름이 금속 몸체 표면의 형상에 의하여 파인 부분(112)이 발생되는 문제점도 있다.In particular, when a conventional thermocompression bonding method is used in the manufacturing process of the electrostatic chuck used in the semiconductor manufacturing apparatus, the film may not be completely flat-bonded due to the minute shape of the metal body surface. There is also a problem in that the hollow portion 112 is generated by the shape of the metal body surface.

그리고 상기한 필름을 접착할 때 유압 실린더의 압력 충격을 완충하기 위하여 완충제를 사용하게 되어 있으므로 완충제에서 떨어져 나온 입자로 인하여 도 4와 같이 입자 필름의 표면에 입자 자국(113)이 발생되는 경우가 많이 발생되며, 또한 생산 비용 증가와 지그의 구조상 한번에 많은 양을 처리할 수 없는 문제점이 있었다.In addition, since the buffer is used to cushion the pressure shock of the hydraulic cylinder when the film is adhered, the particle marks 113 are often generated on the surface of the particle film as shown in FIG. 4 due to the particles separated from the buffer. There is also a problem that can not handle a large amount at a time due to the increase in production cost and the structure of the jig.

또한, 종래의 열 압착 방식의 경우 지그 평탄도 문제와 완충제의 공기 유입 및 필름과 금속 몸체 사이의 공기 유입 등으로 기포가 발생하는 것을 방지하기 위하여 대용량의 유압 실린더와 유압 펌프가 사용되므로 장치의 가격이 상승되는 문제점이 있다.In addition, in the conventional thermocompression method, a large capacity hydraulic cylinder and a hydraulic pump are used to prevent bubbles from being generated due to the jig flatness problem, the air inflow of the buffer, and the air inflow between the film and the metal body. There is a problem that is raised.

따라서 본 발명은 상기한 문제점을 해결하기 위하여 제안된 것으로서, 본 발명의 목적은 필름 전체에 압력이 균일하게 압력이 작용하면서 필름이 접촉되는 몸체의 면에만 접착될 수 있도록 하여 필름의 손상이 없이 일정한 접착력으로 완전 평면 접착됨과 아울러 필름의 접촉되는 몸체, 특히 반도체 제조장치의 정전척의 표면 형상에 관계없이 완전 평면으로 접착될 수 있는 열 압착 원리를 이용한 필름의 완전 평면 접착 방법 및 그 장치를 제공하는데 있다.Therefore, the present invention has been proposed to solve the above problems, the object of the present invention is that the pressure is uniformly applied to only the surface of the body that the film is in contact with the pressure acts uniformly throughout the film without damaging the film The present invention provides a method and apparatus for fully planar adhesion of a film using a thermocompression principle that can be adhered to a completely planar surface and adhered to a planar body regardless of the surface shape of an electrostatic chuck of a semiconductor manufacturing apparatus. .

상기의 목적을 달성하기 위하여 본 발명은, 내부에 일정한 크기의 밀폐 공간을 형성하고, 이 내부 공간에 적어도 하나 이상의 지그가 설치되는 챔버;In order to achieve the above object, the present invention, the chamber to form a sealed space of a predetermined size therein, at least one jig is installed in the inner space;

상기한 지그의 내부와 연결됨과 아울러 진공 밸브에 의하여 제어되고, 이 지그의 내부를 진공으로 형성하기 위한 진공펌프와;A vacuum pump connected to the inside of the jig and controlled by a vacuum valve, and configured to vacuum the inside of the jig;

상기한 챔버의 내부와 연결됨과 아울러 압축 밸브에 의하여 제어되고, 이 챔버의 내부로 일정한 압력의 압축 기체를 주입하여 챔버와 지그의 내부에 압력 차이를 발생하기 위한 압축기와;A compressor connected to the inside of the chamber and controlled by a compression valve and injecting a compressed gas of a constant pressure into the chamber to generate a pressure difference between the chamber and the jig;

상기한 지그의 상부에 결합되고, 상기한 챔버와 지그 내부와 압력 차이가 발생될 때 몸체와 접착 필름 및 접착 대상 필름을 접착시켜 줄 수 있도록 지그를 밀폐함과 아울러 이 압력 차이에 의하여 필름쪽으로 균일하게 가압하기 위한 가압덮개를 포함한다.It is coupled to the upper part of the jig, and seals the jig so as to bond the body, the adhesive film, and the object to be bonded when a pressure difference occurs between the chamber and the jig, and uniformly toward the film by this pressure difference. It includes a pressing cover for pressurizing.

또한, 본 발명은 몸체에 접착 필름을 정확히 고정하기 위해 몸체를 열풍식 건조기에 일정한 시간 동안 넣어 두었다가 접착 필름이 약간 점성을 띄게 되면 이 접착 필름에 접착 대상 필름을 정확한 위치에 접착시켜 주는 단계와;In addition, the present invention is to put the body in a hot air dryer for a certain time to accurately fix the adhesive film to the body, and if the adhesive film is slightly viscous to adhere the adhesive target film to the adhesive film in the correct position;

상기와 같이 접착 필름과 접착 대상 필름이 접착된 상태에서, 지그의 내부에 위치한 몸체에 올려 놓고 가압덮개로 덮어준 후 고정링으로 이 가압덮개를 고정시켜 지그의 내부를 밀폐하는 단계와;Sealing the inside of the jig by fixing the pressure cover with a fixing ring after placing it on a body located inside the jig and covering it with a pressure cover in a state where the adhesive film and the object to be bonded are bonded as described above;

상기한 지그의 내부를 진공펌프를 이용하여 진공으로 형성함과 아울러 이 지그가 내장되는 챔버의 내부를 압축기를 이용하여 일정한 압력으로 가압하는 단계와;Forming the inside of the jig into a vacuum by using a vacuum pump and pressurizing the inside of the chamber in which the jig is built to a predetermined pressure by using a compressor;

상기한 단계에서 지그의 내부와 챔버 내부에 압력 차이가 발생될 때 히터를 가동시켜 챔버 내부를 필름 전체가 일정한 온도를 유지할 수 있도록 일정한 온도까지 가열하고, 상기한 압력 차이에 의하여 가압덮개가 열적 분위기에 의하여 균일하게 가압되면서 필름을 몸체에 완전히 접착시켜 주는 단계를 포함한다.In the above step, when a pressure difference occurs inside the jig and inside the chamber, a heater is operated to heat the inside of the chamber to a constant temperature so that the entire film can be maintained at a constant temperature, and the pressure cover is in a thermal atmosphere by the pressure difference. By pressing the film evenly by the step of completely bonding to the body.

도 1은 본 발명에 따른 열 압착 원리를 이용한 필름의 완전 평면 접착 장치를 도시한 개략적인 단면도.1 is a schematic cross-sectional view showing a fully planar gluing apparatus of a film using the thermocompression principle according to the present invention.

도 2는 본 발명에 따른 열 압착 원리를 이용한 필름의 완전 평면 접착 방법에 의한 필름의 접착 상태를 도시한 일부 단면도.Figure 2 is a partial cross-sectional view showing the adhesion state of the film by the method of the complete planar adhesion of the film using the thermocompression principle according to the present invention.

도 3은 종래 기술에 의한 열 압착 원리를 이용한 필름의 접착 장치를 도시한 개략적인 단면도.Figure 3 is a schematic cross-sectional view showing the adhesion device of the film using the thermocompression principle according to the prior art.

도 4는 종래 기술에 의한 열 압착 원리를 이용한 필름의 접착 방법에 의한 필름의 접착 상태를 도시한 일부 단면도이다.4 is a partial cross-sectional view showing an adhesive state of a film by a method of bonding a film using a thermocompression principle according to the prior art.

이하, 첨부 도면을 참조하여 본 발명의 바람직한 실시예를 상세하게 설명하면 다음과 같다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 1은 본 발명에 따른 열 압착 원리를 이용한 필름의 완전 평면 접착 장치를 도시한 개략적인 단면도이며, 도 2는 본 발명에 따른 열 압착 원리를 이용한 필름의 완전 평면 접착 방법에 의한 필름의 접착 상태를 도시한 일부 단면도이다.1 is a schematic cross-sectional view showing a fully planar bonding apparatus for a film using the thermocompression principle according to the present invention, Figure 2 is a state of adhesion of the film by the method of a full planar bonding of the film using the thermocompression principle according to the invention Some cross-sectional view that shows.

본 발명에 따른 열 압착 원리를 이용한 필름의 완전 평면 접착 장치는 내부에 일정한 크기의 밀폐 공간을 형성하고, 이 내부 공간에 적어도 하나 이상의 지그(3)가 설치되는 챔버(CHAMBER)(1)와;The apparatus for completely flat bonding of a film using the thermocompression principle according to the present invention comprises: a chamber (CHAMBER) 1 in which an airtight space of a predetermined size is formed inside and at least one jig 3 is installed in the internal space;

상기한 지그(3)의 내부에 위치하고, 몸체(5)를 올려 놓기 위한 작업대(7)와;It is located inside the jig (3), and a work table (7) for placing the body (5);

상기한 지그(3)의 내부와 연결됨과 아울러 진공 밸브(9)에 의하여 제어되고, 이 지그(3)의 내부를 진공으로 형성하기 위한 진공펌프(11)와;A vacuum pump (11) connected to the inside of the jig (3) and controlled by a vacuum valve (9) to form the inside of the jig (3) in a vacuum;

상기한 챔버(1)의 내부와 연결됨과 아울러 압축 밸브(13)에 의하여 제어되고, 이 챔버(1)의 내부로 일정한 압력의 압축 기체를 주입하여 챔버(1)와 지그(3)의 내부에 압력 차이를 발생하기 위한 압축기(15)와;In addition to being connected to the inside of the chamber 1 and controlled by the compression valve 13, the compressed gas of a constant pressure is injected into the chamber 1 to the inside of the chamber 1 and the jig 3. A compressor 15 for generating a pressure difference;

상기한 지그(3)의 상부에 결합되고, 상기한 챔버(1)와 지그(3) 내부와 압력 차이가 발생될 때 몸체(5)와 접착 필름(17) 및 접착 대상 필름(19)을 접착시켜 줄 수 있도록 지그(3)를 밀폐함과 아울러 이 압력 차이에 의하여 필름(17,19)쪽으로 균일하게 가압하기 위한 가압덮개(21)를 포함한다.Bonded to the upper part of the jig (3), when the pressure difference between the chamber (1) and the jig (3) inside the body 5, the adhesive film 17 and the adhesive object film 19 is bonded In addition to sealing the jig (3) so that it can be made to include a pressure cover (21) for uniformly pressurized toward the film (17, 19) by this pressure difference.

상기한 진공펌프(11)가 작동될 때 지그(3) 내부의 진공은 20 TORR ~ 10-6TORR 로 되며, 상기한 압축기(15)가 작동될 때 챔버(1) 내부의 압력은 5 Kgf/cm2~ 20 Kgf/cm2로 되는 것이 바람직하다.When the vacuum pump 11 is operated, the vacuum inside the jig 3 becomes 20 TORR to 10 -6 TORR, and when the compressor 15 is operated, the pressure inside the chamber 1 is 5 Kgf /. it is in cm 2 ~ 20 Kgf / cm 2 being preferred.

상기한 몸체(5)는 알루미늄으로 형성하거나, 황동, 스테인레스강, 합금강, 탄소강 등으로 형성하며, 접착 필름(17)은 에폭시(Epoxy)계, 아크릴(Acryl)계, 페놀(Penol)계 등을 포함하는 열경화성 접착 필름으로 이루어지는 것이 바람직하다.The body 5 is formed of aluminum, or brass, stainless steel, alloy steel, carbon steel, and the like, the adhesive film 17 is epoxy (Epoxy), acrylic (Acryl), phenol (Penol), etc. It is preferable that it consists of a thermosetting adhesive film containing.

또한, 상기한 접착 필름(17)에 접착할려는 접착 대상 필름(19)은 폴리아미드(Polyamide) 필름과 같이 절연성을 띌 수 있는 필름 재질이면 어떠한 것이라도 무방하다.In addition, the adhesive target film 19 to be adhered to the adhesive film 17 may be any film material capable of exhibiting insulation such as a polyamide film.

또한, 상기한 챔버(1)에는 몸체(5)에 접착 필름(17)과 접착 대상 필름(19)을 접착할 경우 몸체(1)의 정확한 위치에 고정될 수 있도록 이 챔버(1)의 내부를 빠른 시간내에 일정한 온도로 가열하기 위한 히터(23)가 일정한 간격으로 설치된다.In addition, when the adhesive film 17 and the object to be bonded 19 to the body 5 is bonded to the chamber 1, the inside of the chamber 1 may be fixed to the correct position of the body 1. Heaters 23 for heating to a constant temperature within a short time are provided at regular intervals.

상기한 지그(3)의 상부에는 가압덮개(21)로 지그(3)를 덮어준 상태로 고정하기 위한 고정링(25)이 설치된다.A fixing ring 25 is installed on the jig 3 to fix the jig 3 with the pressing cover 21.

그리고 상기한 챔버(1)에는 히터(23)에 의하여 챔버(1)의 내부가 가열될 때 이 챔버(1) 내부의 온도가 균일하게 분포될 수 있도록 챔버(1) 내부의 공기를 교반하기 위한 교반팬(27)이 모터(29)에 의하여 구동되게 설치된다.In the chamber 1, when the inside of the chamber 1 is heated by the heater 23, the air inside the chamber 1 is stirred to uniformly distribute the temperature inside the chamber 1. The stirring fan 27 is installed to be driven by the motor 29.

또한, 상기한 챔버(1)의 외측에는 이 챔버91)의 냉각시 빠른 시간내에 온도를 낮추어줄 수 있도록 냉각수가 흐르는 냉각수관(미도시)이 일정한 간격으로 설치된다.In addition, a cooling water pipe (not shown) through which cooling water flows is installed at a predetermined interval on the outside of the chamber 1 so that the temperature of the chamber 91 can be lowered quickly during cooling of the chamber 91.

상기한 가압덮개(21)는 챔버(1) 내의 압력과 진공의 차이에 의하여 접착 필름(17)을 몸체(5)에 균일하게 가압하면서 접착할 수 있도록 얇은 스테인레스 강판 등으로 이루어진 얇은 막으로 형성되는 것이 바람직하다.The pressure cover 21 is formed of a thin film made of a thin stainless steel sheet or the like so that the adhesive film 17 can be uniformly pressed while adhering the adhesive film 17 to the body 5 due to the difference in pressure and vacuum in the chamber 1. It is preferable.

상기한 접착 필름(17)의 두께는 일정한 크기로 형성되는데, 진공과 압력 차이 및 열에 의하여 쉽게 변형되지 않도록 25㎛ 이상으로 형성되는 것이 바람직하다.The thickness of the adhesive film 17 is formed to a predetermined size, it is preferably formed to be 25㎛ or more so as not to be easily deformed by the vacuum and pressure difference and heat.

본 발명에 따른 열 압착 원리를 이용한 필름의 완전 평면 접착 방법은 몸체(5)에 접착 필름(17)을 정확히 고정하기 위해 몸체(5)를 열풍식 건조기에 일정한 시간(30분)동안 넣어 두었다가 접착 필름(17)이 약간 점성을 띄게 되면 이 접착 필름(17)에 접착 대상 필름(19)을 정확한 위치에 접착시켜 주는 단계와;In the completely planar bonding method of the film using the thermocompression principle according to the present invention, in order to accurately fix the adhesive film 17 to the body 5, the body 5 is put in a hot air dryer for a predetermined time (30 minutes) and then bonded. When the film 17 becomes slightly viscous, adhering the film to be bonded 19 to the adhesive film 17 at the correct position;

상기와 같이 접착 필름(17)과 접착 대상 필름(19)이 접착된 상태에서, 지그(3)의 내부에 위치한 몸체(5)에 올려 놓고 가압덮개(21)로 덮어준 후 고정링(25)으로 이 가압덮개(21)를 고정시켜 지그(3)의 내부를 밀폐하는 단계와;In the state in which the adhesive film 17 and the object to be bonded 19 is bonded as described above, and placed on the body (5) located inside the jig (3) and covered with a pressure cover (21) after fixing ring 25 Fixing the pressure cover 21 to seal the inside of the jig 3;

상기한 지그(3)의 내부를 진공펌프(11)를 이용하여 진공으로 형성함과 아울러 이 지그(3)가 내장되는 챔버(1)의 내부를 압축기(15)를 이용하여 일정한 압력으로 가압하는 단계와;The inside of the jig 3 is vacuum-formed using the vacuum pump 11 and the inside of the chamber 1 in which the jig 3 is built is pressurized at a constant pressure by using the compressor 15. Steps;

상기한 단계에서 지그(3)의 내부와 챔버(1) 내부에 압력 차이가 발생될 때 히터(23)를 가동시켜 챔버(1) 내부를 필름 전체가 일정한 온도를 유지할 수 있도록 일정한 온도(100℃)까지 가열하고, 상기한 압력 차이에 의하여 가압덮개(21)가 열적 분위기에 의하여 균일하게 가압되면서 필름(17,19)을 몸체(5)에 완전히 접착시켜 주는 단계를 포함한다.When the pressure difference occurs inside the jig 3 and inside the chamber 1 in the above step, the heater 23 is operated to maintain a constant temperature (100 ° C.) so that the entire film can be maintained in the chamber 1. Heating to), and the pressure cover 21 is uniformly pressed by the thermal atmosphere by the pressure difference, thereby completely adhering the films 17 and 19 to the body 5.

또한, 상기한 단계에서 히터(23)에 의하여 챔버(1)의 내부를 가열할 때 이 챔버(1) 내부의 온도가 균일하게 분포될 수 있도록 교반팬(27)을 회전시켜 주는 단계를 더욱 포함한다.In addition, when the inside of the chamber 1 is heated by the heater 23 in the above step, further comprising the step of rotating the stirring fan 27 so that the temperature inside the chamber 1 is uniformly distributed. do.

상기한 몸체(5)는 알루미늄으로 형성하거나, 황동, 스테인레스강, 합금강,탄소강 등으로 형성하며, 상기한 접착 필름(17)은 에폭시(Epoxy)계, 아크릴(Acryl)계, 페놀(Penol)계 등을 포함하는 열경화성 접착 필름으로 이루어지는 것이 바람직하다.The body 5 is formed of aluminum, or brass, stainless steel, alloy steel, carbon steel, etc., the adhesive film 17 is epoxy, acrylic, phenol-based It is preferable that it consists of a thermosetting adhesive film containing these things.

또한, 상기한 접착 필름(17)에 접착할려는 접착 대상 필름(19)은 폴리아미드(Polyamide) 필름과 같이 절연성을 띌 수 있는 필름 재질이면 어떠한 것이라도 무방하다.In addition, the adhesive target film 19 to be adhered to the adhesive film 17 may be any film material capable of exhibiting insulation such as a polyamide film.

상기한 지그(3) 내부의 진공은 20 TORR ~ 10-6TORR 로 10분 정도 유지되게 하며, 상기한 챔버(1) 내부의 압력은 주입 가스로 질소를 이용하는 경우 5 Kgf/cm2~ 20 Kgf/cm2로 15분을 유지하는 것이 바람직하다.The vacuum inside the jig 3 is maintained for about 10 minutes at 20 TORR to 10 -6 TORR, and the pressure inside the chamber 1 is 5 Kgf / cm 2 to 20 Kgf when using nitrogen as an injection gas. It is desirable to keep 15 minutes at / cm 2 .

또한, 상기한 접착 필름(17)이 몸체95)에 접착되었을 때 히터(23)를 가열하여 온도 100℃에서 30분을 유지한 후 냉각하여 상온(27℃)에서 지그(3) 내부와 챔버(1)에 가해진 진공과 압력을 각각 해제하는 것이 바람직하다.In addition, when the adhesive film 17 is bonded to the body 95, the heater 23 is heated to maintain the temperature at 100 ° C. for 30 minutes, and then cooled to cool the inside of the jig 3 and the chamber (at room temperature (27 ° C.)). It is preferable to release the vacuum and pressure applied in 1), respectively.

그리고 상기한 압축기(15)에 의하여 챔버(1)의 내부로 주입되는 기체로는 압력을 형성함과 아울러 화학적으로는 반응을 하지 않는 모든 기체 즉, 질소(N2), 아르곤(Ar), 헬륨(He) 등으로 이루어진다.In addition, the gas injected into the chamber 1 by the compressor 15 forms a pressure and chemically does not react, ie, nitrogen (N 2 ), argon (Ar), and helium. (He) and so on.

특히, 상기한 지그(3) 내부와 챔버(1)의 진공과 압력의 차이에 의한 열 압착 방식의 원리를 반도체 제조장치중 정전척의 제조공정에 이용할 경우,In particular, when the principle of the thermocompression method according to the difference between the vacuum and pressure in the jig 3 and the chamber 1 is used in the manufacturing process of the electrostatic chuck in the semiconductor manufacturing apparatus,

상기한 접착 필름(17)의 정확한 위치 선정과 가접을 위하여 상기한 몸체(5)를 40℃정도로 예열하며, 상기한 몸체(5)에 정확한 위치 고정과 필름(17,19)의 완전한 밀착을 위하여 진공을 10-3TORR 까지 가할 수 있는 지그(3)에 몸체(5)를 넣고 스테인레스에 호일을 이용하여 진공을 막는다.The body 5 is preheated to about 40 ° C. for accurate positioning and temporary welding of the adhesive film 17, and for accurate positioning of the adhesive film 17 and complete adhesion of the films 17 and 19. Place the body (5) in the jig (3) to apply a vacuum up to 10 -3 TORR and use a foil on the stainless steel to prevent the vacuum.

상기와 같이 이루어지는 본 발명의 열 압착 원리를 이용한 필름의 완전 평면 접착 장치 및 그 방법은 도 1에 도시된 바와 같이 진공(10-3TORR)과 압력(5~10 Kgf/cm2를 이용하여 몸체(5)에 접착 필름(17)과 접착 대상 필름(19)을 가접하여 진공을 가할 수 있는 지그(3)에 장착한다.The complete planar bonding apparatus of the film and the method using the thermal compression principle of the present invention made as described above is a body using a vacuum (10 -3 TORR) and pressure (5 ~ 10 Kgf / cm 2 ) as shown in FIG. The adhesive film 17 and the adhesive object film 19 are welded to (5), and it attaches to the jig | tool 3 which can apply a vacuum.

이때, 상기한 지그(3)는 가압할 수 있는 챔버(1) 내에 하나 또는 일정한 간격으로 복수개 위치한다.At this time, the jig (3) is located in one or a plurality of intervals in the chamber (1) that can be pressed.

또한, 상기한 몸체(5)에 접착 필름(17)과 접착 대상 필름(19)을 가접할 경우 몸체(5)의 정확한 위치에 고정될 수 있도록 이 필름을 열풍식 건조기에서 열을 받아 접착 필름(17)이 약간의 점성을 갖도록 한다.In addition, when the adhesive film 17 and the object to be bonded 19 to the body 5 is welded to the body 5, the film is heated in a hot air dryer so as to be fixed at the correct position of the body 5 and the adhesive film ( 17) Make it slightly viscous.

상기와 같이 가접된 몸체(5)를 지그(3)에 넣은 상태에서 가압덮개(21)로 지그(3)를 덮어준 후 고정링(25)으로 고정하여 지그(3)를 밀폐한다.Covering the jig (3) with a pressing cover 21 in the state in which the welded body (5) in the jig (3) as described above to fix the jig (3) by fixing with a fixing ring (25).

그리고 상기한 챔버(1)의 모든 상태를 점검하고, 진공펌프(11)를 가동하면서 진공 밸브(9)를 열어주는데, 이때 상기한 진공 밸브(9)를 조정하여 진공펌프(11)의 배기 공기량의 조절할 필요가 있다,Then, the state of the chamber 1 is checked and the vacuum valve 9 is opened while the vacuum pump 11 is operated. At this time, the vacuum valve 9 is adjusted to adjust the amount of exhaust air of the vacuum pump 11. Need to adjust,

상기와 같이 진공 배기를 시작하고 일정한 시간(2분) 후 압축기(15)를 가동하면서 압축밸브(13)를 열어서 챔버(1) 내부에 질소 가스를 주입하면,After the evacuation starts and the compressor 15 is opened after a certain time (2 minutes) as described above, when the compression valve 13 is opened to inject nitrogen gas into the chamber 1,

상기한 챔버(1) 내부와 지그(3) 내부의 압력 차이가 발생됨과 아울러 이 압력 차이에 의하여 도 1의 화살표와 같이 압력 흐름이 발생되어 가압덮개(21)가 하방으로 가압되면서 접착 필름(17)을 몸체(5)의 상면에 완전히 밀착되게 하는데, 이때 히터(23)를 가동하여 챔버(1) 내부의 온도를 100℃까지 올려준다.The pressure difference between the inside of the chamber 1 and the inside of the jig 3 is generated, and a pressure flow is generated as shown by the arrow of FIG. 1 by the pressure difference, and the pressure cover 21 is pressed downward, thereby adhering the adhesive film 17. ) Is completely in contact with the upper surface of the body (5), at this time to operate the heater 23 to raise the temperature inside the chamber (1) to 100 ℃.

그러면, 상기한 접착 필름(17)에는 질소 가스의 압력에 의하여 균일한 힘이 가해지며, 필름(17,19) 전체가 일정한 온도를 유지할 수 있게 된다.Then, a uniform force is applied to the adhesive film 17 by the pressure of nitrogen gas, and the entire film 17 and 19 can maintain a constant temperature.

또한, 상기한 챔버(1) 내부의 기체 흐름을 원활하게 하기 위하여 교반팬(27)을 회전시켜 챔버(1) 내부의 온도를 균일하게 유지한 상태에서 30분 후 온도를 천천히 내린다.In addition, in order to smooth the gas flow inside the chamber 1, the stirring fan 27 is rotated to slowly lower the temperature after 30 minutes while maintaining the temperature inside the chamber 1 uniformly.

상기한 챔버(1) 내부의 온도가 상온(27℃)으로 될 때 챔버의 내부에 가해지는 압력을 해제함과 아울러 지그93)의 진공을 파기하면, 접착 필름(17)이 경화되면서 몸체(5)에 완전히 접착되어 도 2와 같이 필름의 상면이 평면으로 되는 것이다.When the temperature inside the chamber 1 reaches room temperature (27 ° C.), when the pressure applied to the inside of the chamber is released and the vacuum of the jig 93 is released, the adhesive film 17 is cured and the body 5 ) Is completely adhered to the upper surface of the film as shown in FIG.

이와 같이 본 발명은 필름 전체에 압력이 균일하게 압력이 작용하면서 필름이 접촉되는 몸체의 면에만 접착될 수 있기 때문에 필름의 손상이 없이 일정한 접착력으로 완전 평면 접착됨과 아울러 필름의 접촉되는 몸체, 특히 반도체 제조장치의 정전척의 표면 형상에 관계없이 완전 평면으로 접착될 수 있는 효과가 있는 것이다.As described above, the present invention can be adhered only to the surface of the body to which the film is in contact while the pressure is uniformly applied to the entire film. Regardless of the surface shape of the electrostatic chuck of the manufacturing apparatus, there is an effect that can be bonded in a completely flat.

또한, 본 발명은 압력과 진공의 편차를 이용하여 필름 전체에 균일한 압력이 전달되며, 이 압력에 의한 온도가 균일하게 되므로 균일한 접착력과 진공에 의한필름과 몸체 사이의 기포를 완전히 제거할 수 있는 효과도 있다.In addition, the present invention is a uniform pressure is transmitted to the entire film by using the deviation of the pressure and vacuum, the temperature by this pressure is uniform, it is possible to completely remove the bubbles between the film and the body by the uniform adhesive force and vacuum. There is also an effect.

본 발명은 이형제 필름과 완충제가 필요하지 않기 때문에 생산 비용이 절감되며, 완충제에 의한 불순물 입자가 발생되지 않으므로 불량율이 감소되는 효과가 있다.In the present invention, since the release agent film and the buffer are not required, the production cost is reduced, and since the impurity particles by the buffer are not generated, the defective rate is reduced.

그리고 종래의 열 압착 방식의 경우 지그 평탄도 문제와 완충제의 공기 유입 및 필름과 몸체 사이의 공기 유입 등으로 기포가 발생하는 것을 방지하기 위하여 대용량의 유압 실린더와 유압 펌프가 사용되었으나, 본 발명에서는 5~10 Kgf/cm2정도의 압력이면 충분하므로 장치의 가격을 크게 절감할 수 있는 효과도 있다.In the conventional thermocompression bonding method, a large capacity hydraulic cylinder and a hydraulic pump are used to prevent bubbles from being generated due to jig flatness problem, air inflow of the buffer, and air inflow between the film and the body. A pressure of ~ 10 Kgf / cm 2 is sufficient, which can greatly reduce the cost of the device.

또한, 본 발명은 지그의 적층과 압력이 챔버 내의 전체에 가해지게 되므로 한번에 많은 양의 필름을 접착할 수 있으며, 따라서 생산성이 향상되는 효과가 있다.In addition, in the present invention, since the stacking and the pressure of the jig are applied to the whole of the chamber, a large amount of the film can be adhered at one time, thus improving productivity.

Claims (13)

내부에 일정한 크기의 밀폐 공간을 형성하고, 이 내부 공간에 적어도 하나 이상의 지그가 설치되는 챔버;A chamber in which an airtight space having a predetermined size is formed and at least one jig is installed in the internal space; 상기한 지그의 내부와 연결됨과 아울러 진공 밸브에 의하여 제어되고, 이 지그의 내부를 진공으로 형성하기 위한 진공펌프와;A vacuum pump connected to the inside of the jig and controlled by a vacuum valve, and configured to vacuum the inside of the jig; 상기한 챔버의 내부와 연결됨과 아울러 압축 밸브에 의하여 제어되고, 이 챔버의 내부로 일정한 압력의 압축 기체를 주입하여 챔버와 지그의 내부에 압력 차이를 발생하기 위한 압축기와;A compressor connected to the inside of the chamber and controlled by a compression valve and injecting a compressed gas of a constant pressure into the chamber to generate a pressure difference between the chamber and the jig; 상기한 지그의 상부에 결합되고, 상기한 챔버와 지그 내부와 압력 차이가 발생될 때 몸체와 접착 필름 및 접착 대상 필름을 접착시켜 줄 수 있도록 지그를 밀폐함과 아울러 이 압력 차이에 의하여 필름쪽으로 균일하게 가압하기 위한 가압덮개를 포함하는 열 압착 원리를 이용한 필름의 완전 평면 접착 장치.It is coupled to the upper part of the jig, and seals the jig so as to bond the body, the adhesive film, and the object to be bonded when a pressure difference occurs between the chamber and the jig, and uniformly toward the film by this pressure difference. Fully flat adhesive device of the film using the thermocompression principle comprising a pressing cover for pressurizing. 제1항에 있어서, 상기한 챔버에는 몸체에 접착 필름과 접착 대상 필름을 접착할 경우 몸체의 정확한 위치에 고정되게 접착 필름에 점성을 주도록 이 챔버의 내부를 빠른 시간내에 일정한 온도로 가열하기 위한 히터가 설치되는 열 압착 원리를 이용한 필름의 완전 평면 접착 장치.The heater of claim 1, wherein the chamber is heated to a predetermined temperature within a short time so as to give viscosity to the adhesive film to be fixed at an accurate position of the body when the adhesive film and the object to be bonded are adhered to the body. Device for the complete flat bonding of the film using the thermocompression principle that is installed. 제1항 또는 제2항에 있어서, 상기한 챔버에는 히터에 의하여 챔버의 내부가가열될 때 이 챔버 내부의 온도가 균일하게 분포될 수 있도록 챔버 내부의 공기를 교반하기 위한 교반팬이 회전 가능하게 설치되는 열 압착 원리를 이용한 필름의 완전 평면 접착 장치.The stirring chamber of claim 1 or 2, wherein the chamber is rotatable with a stirring fan for stirring the air in the chamber so that the temperature inside the chamber is uniformly distributed when the inside of the chamber is heated by the heater. Fully flat adhesive device for film using thermocompression principle installed. 제1항 내지 제3항중 어느 한항에 있어서, 상기한 챔버의 외측에는 이 챔버의 냉각시 빠른 시간내에 온도를 낮추어줄 수 있도록 냉각수가 흐르는 냉각수관이 설치되는 열 압착 원리를 이용한 필름의 완전 평면 접착 장치.The film according to any one of claims 1 to 3, wherein the outer surface of the chamber is provided with a planar adhesion of the film using a thermocompression principle, in which a coolant pipe through which a coolant flows is installed so as to lower the temperature in a short time during cooling of the chamber. Device. 제1항에 있어서, 상기한 접착 필름의 두께는 진공과 압력 차이 및 열에 의하여 쉽게 변형되지 않도록 25㎛ 이상으로 형성되는 열 압착 원리를 이용한 필름의 완전 평면 접착 장치.The apparatus of claim 1, wherein the adhesive film has a thickness of 25 μm or more so as not to be easily deformed by vacuum and pressure difference and heat. 몸체에 접착 필름을 정확히 고정하기 위해 몸체를 열풍식 건조기에 일정한 시간 동안 넣어 두었다가 접착 필름이 약간 점성을 띄게 되면 이 접착 필름에 접착 대상 필름을 정확한 위치에 접착시켜 주는 단계와;Placing the body in a hot air dryer for a predetermined time to accurately fix the adhesive film to the body, and then attaching the adhesive object film to the adhesive film at the correct position when the adhesive film becomes slightly viscous; 상기와 같이 접착 필름과 접착 대상 필름이 접착된 상태에서, 지그의 내부에 위치한 몸체에 올려 놓고 가압덮개로 덮어준 후 고정링으로 이 가압덮개를 고정시켜 지그의 내부를 밀폐하는 단계와;Sealing the inside of the jig by fixing the pressure cover with a fixing ring after placing it on a body located inside the jig and covering it with a pressure cover in a state where the adhesive film and the object to be bonded are bonded as described above; 상기한 지그의 내부를 진공펌프를 이용하여 진공으로 형성함과 아울러 이 지그가 내장되는 챔버의 내부를 압축기를 이용하여 일정한 압력으로 가압하는 단계와;Forming the inside of the jig into a vacuum by using a vacuum pump and pressurizing the inside of the chamber in which the jig is built to a predetermined pressure by using a compressor; 상기한 단계에서 지그의 내부와 챔버 내부에 압력 차이가 발생될 때 히터를 가동시켜 챔버 내부를 필름 전체가 일정한 온도를 유지할 수 있도록 일정한 온도까지 가열하고, 상기한 압력 차이에 의하여 가압덮개가 열적 분위기에 의하여 균일하게 가압되면서 필름을 몸체에 완전히 접착시켜 주는 단계를 포함하는 열 압착 원리를 이용한 필름의 완전 평면 접착 방법.In the above step, when a pressure difference occurs inside the jig and inside the chamber, a heater is operated to heat the inside of the chamber to a constant temperature so that the entire film can be maintained at a constant temperature, and the pressure cover is in a thermal atmosphere by the pressure difference. Fully adhered method of the film using the thermocompression principle comprising the step of completely bonding the film to the body while being uniformly pressed by. 제6항에 있어서, 상기한 단계에서 히터에 의하여 챔버의 내부를 가열할 때 이 챔버 내부의 온도가 균일하게 분포될 수 있도록 교반팬을 회전시켜 주는 단계를 더욱 포함하는 열 압착 원리를 이용한 필름의 완전 평면 접착 방법.The method of claim 6, further comprising rotating the stirring fan to uniformly distribute the temperature inside the chamber when the inside of the chamber is heated by the heater in the above step. Fully flat gluing method. 제6항에 있어서, 상기한 몸체는 알루미늄으로 형성하거나, 황동, 스테인레스강, 합금강, 탄소강 등으로 형성하는 열 압착 원리를 이용한 필름의 완전 평면 접착 방법.7. The method of claim 6, wherein the body is formed of aluminum, or made of brass, stainless steel, alloy steel, carbon steel, or the like. 제6항에 있어서, 접착 필름은 에폭시계, 아크릴계, 페놀계 등을 포함하는 열경화성 접착 필름으로 이루어지는 열 압착 원리를 이용한 필름의 완전 평면 접착 방법.7. The method of claim 6, wherein the adhesive film is made of a thermosetting adhesive film comprising epoxy, acrylic, phenol, or the like. 제6항 또는 제9항에 있어서, 상기한 접착 필름에 접착할려는 접착 대상 필름은 폴리아미드 필름과 같이 절연성을 띌 수 있는 필름 재질로 이루어지는 열 압착 원리를 이용한 필름의 완전 평면 접착 방법.10. The method of claim 6 or 9, wherein the film to be bonded to the adhesive film is made of an insulating material such as a polyamide film. 제6항에 있어서, 상기한 압축기에 의하여 챔버의 내부로 주입되는 기체로는 압력을 형성함과 아울러 화학적으로는 반응을 하지 않는 모든 기체 즉, 질소(N2), 아르곤(Ar), 헬륨(He) 등으로 이루어지는 열 압착 원리를 이용한 필름의 완전 평면 접착 방법.According to claim 6, The gas injected into the chamber by the compressor to form a pressure and does not react chemically all gases, that is, nitrogen (N 2 ), argon (Ar), helium ( He) and the like, the method of completely flat bonding of the film using the thermocompression principle. 제6항에 있어서, 상기한 지그 내부의 진공은 20 TORR ~ 10-6TORR 로 10분 정도 유지되게 하며, 상기한 챔버 내부의 압력은 주입 가스로 질소를 이용하는 경우 5 Kgf/cm2~ 20 Kgf/cm2로 15분을 유지하고, 상기한 접착 필름이 몸체에 접착되었을 때 히터를 가열하여 온도 100℃에서 30분을 유지한 후 냉각하여 상온(27℃)에서 지그 내부와 챔버에 가해진 진공과 압력을 각각 해제하는 열 압착 원리를 이용한 필름의 완전 평면 접착 방법.According to claim 6, wherein the vacuum inside the jig is maintained for 10 minutes at 20 TORR ~ 10 -6 TORR, the pressure inside the chamber is 5 Kgf / cm 2 ~ 20 Kgf when using nitrogen as the injection gas / cm 2 for 15 minutes, and when the adhesive film is adhered to the body, the heater is heated to maintain the temperature for 30 minutes at a temperature of 100 ℃ and then cooled and the vacuum applied to the inside of the jig and the chamber at room temperature (27 ℃) and Method of fully planar adhesion of a film using the thermocompression principle of releasing pressure respectively. 제6항 또는 제12항에 있어서, 상기한 지그 내부와 챔버의 진공과 압력의 차이에 의한 열 압착 방식의 원리를 반도체 제조장치중 정전척의 제조공정에 이용할 경우,The method according to claim 6 or 12, wherein the principle of the thermocompression method by the difference in vacuum and pressure in the inside of the jig and the chamber is used in the manufacturing process of the electrostatic chuck in the semiconductor manufacturing apparatus. 접착 필름의 정확한 위치 선정과 가접을 위하여 상기한 몸체를 40℃로 예열하며, 상기한 몸체에 정확한 위치 고정과 필름의 완전한 밀착을 위하여 진공을 10-3TORR 까지 가할 수 있는 지그에 몸체를 넣고 스테인레스에 호일을 이용하여 진공을 막는 열 압착 원리를 이용한 필름의 완전 평면 접착 방법.Preheat the body to 40 ℃ for accurate positioning and welding of the adhesive film, and place the body in a jig that can apply vacuum to 10 -3 torr for accurate positioning and perfect adhesion of the film. Method of fully flat adhesion of a film using the thermocompression principle of preventing vacuum by using a foil.
KR1019990060464A 1999-12-22 1999-12-22 Perfect plane surface process of film using hot press principles and the device KR20010063393A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020092040A (en) * 2001-06-01 2002-12-11 송호봉 Membrane press machine
KR100574382B1 (en) * 2004-05-04 2006-04-27 이지희 A vaccum pump type seal system
KR101511102B1 (en) * 2013-08-29 2015-04-10 김병진 Method of manufacturing anti-fogging products and anti-fogging products manufactured by thereof method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020092040A (en) * 2001-06-01 2002-12-11 송호봉 Membrane press machine
KR100574382B1 (en) * 2004-05-04 2006-04-27 이지희 A vaccum pump type seal system
KR101511102B1 (en) * 2013-08-29 2015-04-10 김병진 Method of manufacturing anti-fogging products and anti-fogging products manufactured by thereof method

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