JP6959776B2 - Protective film forming device - Google Patents

Description

The present invention relates to a protective film forming apparatus for forming a protective film on a substrate.

An optical disk such as a DVD is provided with a recording layer formed by depositing a reflective film on a disk-shaped substrate having a hole in the center and a recording layer made of a translucent film provided on the recording layer. .. The following methods are known as methods for manufacturing such optical discs. That is, a recording surface is formed on one side of each of the two substrates. A reflective film is vapor-deposited on the recording surface of one substrate to form a recording layer, and a translucent film is vapor-deposited on the recording surface of the other substrate to form a recording layer.

Then, the recording layers of these two substrates are opposed to each other and bonded together with an adhesive. After the adhesive is cured, the other substrate is peeled off at the interface with the translucent film to transfer the recording layer made of the translucent film to the adhesive side.

For this peeling, a technique using a hole provided in the center of the substrate is used. That is, a technique is known in which compressed air is supplied from the central hole to separate the translucent film from the substrate (see, for example, Patent Document 1).

Japanese Patent No. 4020665

By the way, in a display panel of a mobile terminal typified by a smartphone, a protective film made of an adhesive such as an ultraviolet curable resin may be formed on the surface of a substrate such as a touch panel, which is a component of the display panel. Then, it is conceivable to apply the technique of Patent Document 1 to the formation of such a protective film. That is, protection made of an adhesive is formed by pressing the other substrate against the substrate coated with the adhesive to form a layer of the adhesive, then curing the adhesive and peeling the other substrate. Form a film.

In the case of a substrate having a hole in the center such as an optical disk, it can be peeled off by supplying compressed air to the hole in the center. However, the conventional technique cannot be applied to a substrate having no in-plane holes because there is no supply port for compressed air.

Further, since the three steps of pressing, curing, and peeling for forming the protective film are performed at the same position, the cycle time for manufacturing each product becomes long. If the adhesive has a strong adhesive force or the size of the substrate is large, it is necessary to take time for peeling, and the cycle time becomes longer.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a protective film forming apparatus capable of efficiently forming a protective film on a substrate.

The present invention is a protective film forming apparatus that presses a molded plate against a substrate coated with an adhesive to form a protective film made of the adhesive on the substrate, and the molded plate protrudes from the substrate in a plan view. The jig is provided so as to hold the molded plate and the substrate so as to be relatively movable between a separation position so as to face each other and separated from each other and a crimping position where the molded plate is pressed against the substrate. The tool, the molded plate held by the jig, and the substrate are bonded to each other by relatively moving to the crimping position, and the adhesive between the crimped molded plate and the substrate is cured. a bonding unit having a curing unit which is held in the jig, and the forming plate in which the adhesive is cured between the said shaped plate which is crimped by Awa together by bonding unit and the substrate The substrate is relatively moved to the separation position to peel off the substrate on which the protective film in which the adhesive is cured is formed from the molded plate, and a plurality of the jigs are supported. and bonding by the bonding portion between the molded plate and the substrate held by Kano the jig, due to the release portion of said molding plates held at one of the other said jig and said substrate a release in parallel so as to be executed, have a, a conveying unit for executing the conveyance to the stripping unit from the transport to the bonding unit to the bonding unit of the jig,
The peeling portion moves the molded plate to the separation position when the adhesive between the crimped molding plate and the substrate is relatively moved to the separation position. It is provided with an elastic member that elastically supports the substrate, and a release tool that presses a region of the substrate that protrudes from the molded plate and moves the substrate in a direction that separates the substrate from the molded plate .

The jig includes a base on which the substrate is mounted, a forming plate support member supporting the molding plate, wherein the elastic member is the molded plate support, away from the base Elastically support the position.

The elastic member may have an elastic force larger than the adhesive force of the protective film to the molded plate.

A vacuum chamber capable of depressurizing is configured inside, and the vacuum chamber has a vacuum chamber including the transport portion and the bonding portion, and the peeling portion uses the jig to the outside of the vacuum chamber and the vacuum chamber. has a delivery device for the Shi receiving pass between the transport portion of the inner, the delivery device includes a holder for holding the jig, and the peeling device may have a.

The delivery device may have a moving mechanism for relatively moving the holder and the release tool.

The transport unit includes a rotating body capable of transporting the jig at a position in the vacuum chamber where the jig is taken in and out of the vacuum chamber and a bonding position where the jig is bonded by the bonding portion, and the curing unit. It has a holder that holds the tool and is supported so as to be relatively movable with respect to the rotating body in a direction orthogonal to the rotating surface of the rotating body, and a position for inserting and removing the jig in the vacuum chamber. The peeling part is provided with an opening for delivering the jig to and from the transporting part by the delivery device, and the delivery device includes the holding tool and a holding plate having the peeling tool. The holder has a push-up portion that drives the holder to advance and retreat toward the opening of the vacuum chamber, and when the jig is delivered, the push-up portion causes the holder to move in and out of the vacuum chamber around the opening. By abutting against the inner wall of the vacuum chamber, the airtightness between the inside and the outside of the vacuum chamber is maintained, and the holding plate is attached to the outer surface of the vacuum chamber around the opening when the jig is conveyed and when the substrates are bonded. The airtightness between the inside and the outside of the vacuum chamber may be maintained by contacting the vacuum chamber.

According to the present invention, it is possible to obtain a protective film forming apparatus capable of efficiently forming a protective film on a substrate.

It is a schematic view which looked at the molded plate and the substrate applied to an embodiment from the upper surface. It is a side view which shows the procedure of bonding and peeling a molded plate and a substrate of an embodiment. It is a schematic diagram which looked at the protective film forming apparatus of an embodiment from the upper surface. It is a schematic side view which made a part of the vacuum chamber of the protective film forming apparatus of FIG. 3 a cross section. It is a schematic view (a) which looked at the jig of an embodiment from the top surface, and is the side view (b) which looked at from the long side direction. FIG. 5A is a side view (a) seen from the short side direction of the jig of FIG. 5, and is a schematic cross-sectional view seen from the arrow view BB direction. FIG. 5 is a side view showing a state (a) in which the holder is in the locked position and a state (b) in the released position of the gripping mechanism of the embodiment. It is a schematic view seen from the upper surface which shows the positional relationship between a holding plate, a holding tool and a peeling tool, and a jig and a substrate. It is a partial cross-sectional schematic diagram which shows the peeling part before carrying a jig into a vacuum chamber. It is a schematic side view which shows the protective film forming apparatus at the time of carrying in a jig which made a part of the vacuum chamber a cross section. It is a partial cross-sectional schematic view which shows the peeling part of FIG. It is a schematic side view which shows the protective film forming apparatus after carrying in the jig which made a part of the vacuum chamber a cross section. It is a partial cross-sectional schematic view which shows the peeling part of FIG. It is a partial cross-sectional schematic diagram which shows the bonding part which the jig was conveyed. It is a partial cross-sectional schematic diagram which shows the state which the jig is raised in the bonded part, and the molded plate is in contact with a transmission member. It is a partial cross-sectional schematic view which shows the state which the jig is raised in the bonded part, and the substrate is crimped to a molded plate through an adhesive. It is a partial cross-sectional schematic diagram which shows the state which the jig is lowered in the bonded part and is accommodated in a holder. It is a partial cross-sectional schematic diagram which shows the state which the jig was carried to the peeling part after bonding. It is a partial cross-sectional schematic diagram which shows the state which the jig is raised in the peeling part. It is a partial cross-sectional schematic diagram which shows the state which the holder is raised in the peeling part. It is a partial cross-sectional schematic diagram which shows the state which the jig was taken out in the peeling part.

Hereinafter, the protective film forming apparatus according to the embodiment of the present invention will be described with reference to the drawings. It should be noted that the drawings are merely schematic views, and some members of the apparatus configuration may be described only in one of the drawings and may be omitted in the other drawings.

[Substrate and protective film]
In the protective film forming apparatus according to the present embodiment, as shown in FIGS. 1 and 2 (a) to 2 (d), the molded plate G and the substrate S are bonded to each other with the adhesive R interposed therebetween, and the substrate S is bonded. This is an apparatus for forming a protective film P made of an adhesive R on a substrate S by peeling from a molding plate G together with an agent R. Note that FIG. 1 is a schematic view showing the positional relationship between the molded plate G and the substrate S as seen from the upper surface, and FIGS. 2 (a) and 2 (b) show a procedure for bonding the molded plate G and the substrate S. 2 (c) and 2 (d) are schematic views showing a procedure for peeling the molded plate G and the substrate S. In FIG. 2, the left column is a front view and the right column is a right side view.

The molding plate G is a plate-like body for molding the adhesive R. Here, it is a rectangular glass plate having translucency, and more specifically, it is a transparent and rectangular glass plate in a plan view. The lower surface of the molding plate G for forming the adhesive R is formed flat, and the lower surface is arranged so as to be parallel to the horizontal plane. Further, the molded plate G has a thickness that does not easily deform when the adhesive R is molded or when the adhesive R is peeled off from the formed protective film P, for example, in the case of a mobile display device manufacturing application. Has a thickness of about 5 mm to 10 mm.

The substrate S is a rectangular object that forms the protective film P, and is, for example, a touch panel or a cover panel thereof. Such a substrate S is generally configured to be incorporated in a flat-panel display device represented by a liquid crystal display or an organic EL display, that is, a so-called flat panel display. The substrate S corresponds to a display panel, a backlight, a light guide plate for a backlight, and the like, in addition to the above-mentioned touch panel and cover panel.

Such a substrate S is incorporated into the housing individually or in a pre-laminated state. For example, a protective cover configured as a composite panel in which a touch panel is laminated may be used. As described above, there are various forms of the substrate S, and the substrate S constituting the display device is referred to as a display device member.

In the present embodiment, the substrate S will be described as a member constituting the display device, but the present invention is not limited to this, and can be applied to any substrate on which a protective film needs to be formed. Is. Further, the present embodiment is suitable for a substrate S having no holes and cannot be peeled off by supplying compressed air, but is also applicable to a substrate S having holes.

As shown in FIG. 1, the substrate S is provided with a coated region S1 to which the adhesive R is applied and an uncoated region S2 to which the adhesive R is not applied. The coated region S1 is provided in the central portion of the substrate S, and the uncoated region S2 is provided around the uncoated region S2. The uncoated region S2 may be provided at a portion that protrudes when the substrate S is superposed on the molded plate G, even if it is not the entire circumference of the coated region S1. Here, the uncoated areas S2 are provided at at least two locations along two opposite sides.

The region on the substrate S is divided into a film-formed region and a non-film-formed region by the formation of the protective film P. When the protective film P is formed, the adhesive R is expanded by bonding the molded plate G and the substrate S, so that the film-formed region is larger than the coated region S1 and the uncoated region is the uncoated region. It is smaller than S2. In the present embodiment, the adhesive R is applied in a size slightly smaller than the protective film P, and is slightly spread by being pressed against the molding plate G to be molded as the protective film P. Therefore, the film-forming region is slightly larger than the coating region S1, but the difference is small, so that it will be described as having no effect on the formation or peeling of the protective film P. If there is a large difference in size between the coating region S1 and the film-forming region, the molded plate G is configured so that a part of the film-unformed region protrudes, and the adhesive is adjusted to match the film-forming region. It suffices to make it possible to secure a size in which R can be formed in the forming plate G. That is, for example, even when the adhesive R applied in a dot shape or a linear shape is pressed against the molding plate G and spreads, the molding plate G having a size such that a protective film P is formed with the substrate S. And.

Further, the portion of the substrate S that protrudes from the molded plate G allows a portion that protrudes from the molded plate G on the substrate S side, but normally, a part of the uncoated region S2 of the substrate S protrudes. As described above, the molded plate G is formed in accordance with the substrate S2. Further, in FIG. 1, the adhesive R is shown to be smaller than the coating area S1 for the purpose of distinguishing between the two, but in reality, the shape and size of the coating area S1 and the applied adhesive R are the same. do.

Specifically, the substrate S can be a so-called mother glass for collectively creating a plurality of touch panels, cover panels, and the like. The substrate S is finally individualized for each product substrate such as a touch panel or a cover panel, but in consideration of convenience in the production process until it is individualized, the outer peripheral portion is a margin that is not used as a product. The margin portion is an uncoated region S2 and a film unformed region.

The adhesive R is a resin, and here, it is an ultraviolet irradiation curable resin. The adhesive R may be a material of the protective film P and may be in a state of being bonded to the substrate S after curing, and must have a function of bonding the substrate S to another object before curing. No.

[Protective film forming device]
FIG. 3 is a schematic view of the protective film forming apparatus as viewed from above. FIG. 4 is a schematic cross-sectional view seen from the direction of arrow AA in FIG. In this specification, the directions and positional relationships may be referred to as "upper" and "lower", but "upper" and "lower" refer to the positional relationship in the protective film forming apparatus. It does not refer to the positional relationship or direction when the protective film forming device is installed. Further, the jig 100 in FIGS. 4, 10 and 12 is only described for the purpose of illustrating the case where the jig 100 is present at each position, and is not always present at the illustrated position.

The protective film forming apparatus is an apparatus for forming a protective film P made of the adhesive R by crimping the molded plate G and the substrate S via the adhesive R. The protective film forming apparatus includes a jig 100, a vacuum chamber 1, a bonding portion 2, a peeling portion 3, a transport portion 4, a carry-in / out portion 5, and a control device 6.

The jig 100 is a mechanical portion that holds the molded plate G and the substrate S so as to be relatively movable between a separated position separated from each other and a crimping position crimped via an adhesive R. The vacuum chamber 1 is a container capable of evacuating the inside, and evacuates the periphery of the molding plate G and the substrate S held by the jig 100 carried into the inside.

The bonding portion 2 is bonded by relatively moving the molded plate G held by the jig 100 and the substrate S to the crimping position. The peeling portion 3 is held by the jig 100 and is peeled off by relatively moving the molded plate G and the substrate S bonded by the bonding portion to a separation position. The transport unit 4 supports a plurality of jigs 100, and is bonded by the bonding unit 2 between the molded plate G and the substrate S held by one of the jigs 100, and is attached to any of the other jigs 100. The jig 100 is conveyed between the bonding portion 2 and the peeling portion 3 so that the holding molding plate G and the substrate S can be peeled by the peeling portion 3 in parallel. The carry-in / out unit 5 carries in / out the jig 100 into and out of the vacuum chamber 1.

The configuration of each part of the protective film forming apparatus as described above will be described more specifically.
(jig)
The configuration of the jig 100 will be described with reference to FIGS. 5 and 6. 5 (a) is a schematic view seen from the upper surface of the jig 100, FIG. 5 (b) is a schematic view seen from the right side surface of the jig 100, and FIG. 6 (a) is a schematic view seen from the front of the jig 100. FIG. 6 (b) is a schematic cross-sectional view seen from the direction of arrow BB in FIG. 5 (a).

The jig 100 is configured as a unit in which the substrate S on which the protective film P is formed and the molding plate G for forming the adhesive R are carried in and out of the vacuum chamber 1 as a set, and the substrate S and the jig 100 are formed. It is used for bonding molded plates G. The jig 100 on which the substrate S is mounted is sequentially carried into the protective film forming apparatus, the substrate S is pressure-bonded to the molding plate G via the adhesive R, and the adhesive R is cured to become the protective film P and becomes the protective film. After the substrate S is peeled off from the molded plate G together with P, the substrate S is sequentially carried out.

The jig 100 includes a base plate 101, a base 102, a molded plate support member 103, an elastic member 104, a guide 105, and a detachable tool 106. The base plate 101 is a rectangular flat plate and serves as a base for the jig 100. The base 102 is, for example, a rectangular parallelepiped block body, which is provided on the base plate 101, and the upper surface thereof is a mounting surface on which the substrate S is placed.

The molded plate support member 103 is a member that supports the molded plate G. The molded plate support member 103 is provided so as to face the base plate 101, and supports the molded plate G so as to be able to move up and down with respect to the base plate 101. Specifically, the molded plate support member 103 is composed of a pair of long plate-shaped bodies 103a and 103b, and is provided with a step on which one side portion of the molded plate G, specifically, the short side portion is placed. There is. The molded plate support member 103 is provided so that the elongated plates 103a and 103b are parallel to each other and face the base plate 101, and the short side of the molded plate G is supported by the stepped portion.

The base 102 faces the molded plate G supported by the molded plate supporting member 103, and is placed so that the substrate S protrudes from the molded plate G in a plan view. As described above, the molded plate G is formed in a shape and size such that a part of the uncoated region S2 of the substrate S protrudes from the molded plate G. Since this protruding region is a region that is pressed during peeling, it is preferable that the region is at least along two opposite sides for stable peeling. However, it may be a region along one side or a region along three or four sides. In the present embodiment, the protruding region is a region constituting the uncoated region S2 and the film unformed region. As described above, since the region of the adhesive R changes due to the bonding, the uncoated region S2 and the film unformed region have a slightly different portion. Therefore, the protruding region is the uncoated region S2 and the film unformed region. Does not exactly match.

The elastic member 104 is a member provided on the base plate 101 and having elasticity to support the molded plate support member 103. Specifically, one end of the elastic member 104 is fixed to the base plate 101, and the other end is fixed to the lower surface of the molded plate support member 103. A plurality of elastic members 104 are provided, and here, two springs are provided for each of the elongated plate-shaped bodies 103a and 103b. The elastic member 104 is a compression spring that urges the molded plate support member 103 and the base plate 101, and expands and contracts in the vertical direction.

The elastic member 104 has an elastic force larger than the adhesive force of the protective film P to the molded plate G. That is, the elastic force larger than the adhesive force of the protective film P to the molded plate G is the repulsive force generated by the elastic force of the compressed spring, that is, the force to peel the protective film P from the molded plate G. It means that it is larger than the force required to peel the protective film P from the molded plate G. Therefore, the elastic member 104 that satisfies this condition is used.

The guide 105 is provided between the molded plate support member 103 and the base plate 101, and regulates the expansion / contraction direction of the elastic member 104. For example, the guide 105 has a multi-cylinder structure and can be expanded and contracted in the vertical direction by expanding and contracting the elastic member 104.

The attachment / detachment tool 106 is a member to which the member holding the jig 100 is attached / detached. The attachment / detachment tool 106 is provided so as to project from the center of each side of the edge portion of the base plate 101 toward the molding plate G side. The attachment / detachment tool 106 is formed with a hole H to which the claw N of the holding tool 362a of the peeling portion 3 described later is locked.

(Vacuum chamber)
As shown in FIG. 4, the vacuum chamber 1 is a container whose inside can be evacuated. An exhaust device (not shown) is provided in the vacuum chamber 1, and a vacuum state is formed inside the exhaust device. That is, the inside of the vacuum chamber 1 constitutes a vacuum chamber. The vacuum chamber is a cylindrical sealed space inside the vacuum chamber 1.

On the upper surface of the vacuum chamber 1, an opening 1a and an opening 1b are arranged side by side at positions sandwiching the center thereof. The position of the opening 1a corresponds to the bonding portion 2, and the position of the opening 1b corresponds to the peeling portion 3. The opening 1a is closed and sealed by a window portion 221 described later.

The opening 1b is provided corresponding to a position where the jig 100 is taken in and out of the vacuum chamber 1. That is, the opening 1b is a rectangular hole having a size that allows the jig 100 to be taken in and out of the vacuum chamber 1. Further, a space is formed between the opening 1b and the jig 100 so that a holder 362a for holding the jig 100 and a release tool 363 for peeling the substrate S can be inserted and removed.

(Transport section)
The transport unit 4 is a device provided in the vacuum chamber 1 and having a rotating body 41 on which a pair of jigs 100 are mounted, and transports the jig 100 between the bonding portion 2 and the peeling portion 3. That is, the transfer unit 4 can transfer the position where the jig 100 is taken in and out of the vacuum chamber 1 and the bonding position by the bonding unit 2. The rotating body 41 is a circular plate-shaped rotating table that rotates along a horizontal rotating surface. A pair of holder holes 41a are formed in the rotating body 41. The pair of holder holes 41a are rectangular holes that are arranged side by side with the rotation center of the rotating body 41 interposed therebetween and are formed at positions corresponding to the openings 1a and 1b, respectively.

The transport unit 4 has a motor 42 and a holder 43 in addition to the rotating body 41. The motor 42 is a drive source that applies a driving force to the rotating body 41 and rotates the rotating body 41 around its center. The holder 43 is a member that supports the jig 100 inside. The holder 43 is supported so as to be relatively movable in a direction orthogonal to the rotating surface of the rotating body 41. That is, they are removably supported by each of the pair of holder holes 41a formed in the rotating body 41.

The holder 43 is a bottomed square cylindrical member having a rectangular horizontal cross section, and has a size inside that can accommodate the jig 100. A flange 43a having a peripheral edge protruding outward is formed on the upper edge of the holder 43. The holder 43 is inserted into the holder hole 41a, and the flange 43a comes into contact with the peripheral edge of the holder hole 41a to be supported by the rotating body 41. Although not shown, a sealing member such as an O-ring is disposed between the upper surface of the flange 43a and the ceiling of the vacuum chamber 1 on the periphery of the opening 1b. As a result, when the holder 43 rises and comes into contact with the ceiling of the vacuum chamber 1, the opening 1b is hermetically sealed.

At the bottom of the holder 43, an opening 43b smaller than the base plate 101 of the jig 100 is formed. Therefore, the bottom of the jig 100 can be supported by the bottom of the peripheral edge of the opening 43b. Further, the opening 43b has a size that allows the pressing plate 211 and the protruding portion 321 described later to be inserted and removed.

(Attachment part)
The bonding portion 2 has a crimping portion 21 and a hardening portion 22. The crimping portion 21 is a mechanism for crimping the substrate S against the molding plate G held by the jig 100, and is also a mechanism for pressing the adhesive R applied to the substrate S against the molding plate G for molding. The crimping portion 21 has a pressing plate 211, a rod 212, and a drive source 213. The pressing plate 211 pushes up the jig 100 by entering the holder 43 in the vertical direction from below, presses the molded plate G against the window portion 221 on the ceiling side of the vacuum chamber 1, and presses the substrate S against the elastic member 104. It is a member that is crimped to the molded plate G against the urging force of.

The rod 212 is a rod-shaped member that is airtightly inserted into the vacuum chamber 1 and one end of which is connected to the pressing plate 211. The drive source 213 is a mechanism connected to the other end of the rod 212 to move the rod 212 forward and backward. As the drive source 213, for example, an air cylinder can be used.

The curing portion 22 is a device that cures the adhesive R between the crimped molded plate G and the substrate S. The cured portion 22 has a window portion 221 and an irradiation portion 222. The window portion 221 is a constituent portion that airtightly seals the inside of the vacuum chamber 1 and transmits energy for curing the adhesive R. The window portion 221 has an annular block 221a, a fixing member 221b, and a transmission member 221c.

The annular block 221a is a rectangular annular member, and is provided so that its outer edge rests on the edge of the opening 1a of the vacuum chamber 1. The fixing member 221b is a rectangular annular block body, and a step is provided around the central hole thereof, and the transmission member 221c is fixed by being supported by the step. The transmission member 221c is a member that transmits energy for curing the adhesive R. For the transmission member 221c, for example, quartz glass is used.

The irradiation unit 222 is a device that irradiates energy for curing the adhesive R. The irradiation unit 222 is provided at a position facing the upper side of the transmission member 221c. The irradiation unit 222 irradiates the vacuum chamber 1 with energy via the transmission member 221c and the molding plate G. In the present embodiment, the energy emitted by the irradiation unit 222 is ultraviolet rays. The transmission member 221c has a size capable of irradiating the entire adhesive R under the molded plate G with energy from the irradiation unit 222.

The vacuum chamber 1 includes a jig regulating portion that regulates the movement of the jig 100 by the crimping portion 21. When the holder 43 on which the jig 100 is placed rises, the jig regulation unit contacts the molding plate G and regulates the ascending movement. Here, the jig regulating portion is a fixing member 221b and a transmission member 221c fixed to the vacuum chamber 1.

(Peeling part)
The peeling portion 3 has a push upper portion 31 and a delivery portion 35. The push-up portion 31 is a mechanism for moving the holder 43 and the jig 100 forward and backward toward the opening 1b of the vacuum chamber 1. The push-up portion 31 has a push-up body 32, a rod 33, and a drive source 34. The push-up body 32 has a protruding portion 321 and an expanding portion 322. The projecting portion 321 is a member that pushes up the bottom portion of the jig 100 by entering the holder 43 in the vertical direction and allows the upper portion of the jig 100 to enter the opening 1b.

The extension portion 322 is a collar-shaped portion in which the bottom edge of the protrusion 321 is extended outward, and following the push-up of the jig 100 by the protrusion 321, the bottom portion of the holder 43 is pushed up to push up the upper portion of the holder 43. It is brought into contact with the ceiling, which is the inner wall of the vacuum chamber 1 around the opening 1b. Although not shown, a sealing member such as an О ring is provided between the expansion portion 322 and the bottom surface of the holder 43, although not shown. As a result, when the expansion portion 322 rises and comes into contact with the bottom surface of the holder 43, the hole inside the holder 43 is airtightly sealed. That is, when the jig 100 is delivered, the holder 43 is brought into contact with the inner wall of the vacuum chamber 1 around the opening 1b by the push-up portion 31 to maintain the airtightness between the inside and the outside of the vacuum chamber 1.

The rod 33 is a rod-shaped member that is airtightly inserted into the vacuum chamber 1 and one end of which is connected to the push-up body 32. The drive source 34 is a mechanism connected to the other end of the rod 33 to move the rod 33 forward and backward. As the drive source 34, for example, an air cylinder can be used.

The delivery unit 35 is a delivery device that delivers the jig 100 between the vacuum chamber 1 and the outside thereof. The delivery unit 35 has a holding unit 36 and a transport mechanism 37. The holding portion 36 is a mechanism for holding the jig 100. The holding portion 36 has a holding plate 361, a gripping mechanism 362, a release tool 363, and an elevating mechanism 364.

The holding plate 361 is a rectangular plate larger than the opening 1b, and can move between a sealing position where the opening 1b is contacted and sealed by descending and an open position where the opening 1b is opened by ascending. It is provided in. Although not shown, a sealing member such as an О ring is arranged between the holding plate 361 and the top surface of the vacuum chamber 1 on the periphery of the opening 1b. As a result, when the holding plate 361 descends and comes into contact with the top surface of the vacuum chamber 1, the opening 1b is hermetically sealed. That is, when the jig 100 is conveyed and when the substrate S is bonded, the holding plate 361 comes into contact with the outer surface (top surface) of the vacuum chamber 1 around the opening 1b, so that the inside and outside of the vacuum chamber 1 can be contacted. Keep the airtightness.

The vacuum chamber 1 has a load lock chamber that allows the jig 100 to be taken in and out while maintaining the internal vacuum state. That is, the sealed space sealed by the opening 1b, the holding plate 361, the holder 43, and the expansion portion 322 constitutes a load lock chamber that can switch between a vacuum state and an open state to the atmosphere by an exhaust device (not shown). There is.

As shown in FIGS. 7 and 8, the gripping mechanism 362 is a mechanism for gripping the jig 100. FIG. 7 is a side view showing the gripping mechanism 362 and the release tool 363, and FIG. 8 is a plan view of the holder 362a and the release tool 363 seen through from the upper surface of the holding plate 361. The gripping mechanism 362 includes a holder 362a, a slider 362b, a spring 362c, a cam follower 362d, and an inclined cam 362e. The holder 362a is a member that holds the jig 100. The holder 362a is provided so as to project from below the holding plate 361 toward the jig 100, and a claw N that locks into the hole H of the attachment / detachment 106 is formed. A total of four holders 362a are provided in the vicinity of each side of the holding plate 361, corresponding to the attachment / detachment tool 106 of the jig 100.

The slider 362b is an elongated rectangular parallelepiped member, and is attached to the lower surface of the holding plate 361 so as to be slidable in the horizontal direction. One end of the slider 362b is attached to the holder 362a, and the other end extends to the center of the holding plate 361. The spring 362c is a member that urges each slider 362b in a direction toward the center of the holding plate 361.

The cam follower 362d is a rotating roller provided at the other end of the slider 362b. The inclined cam 362e is a substantially conical member provided at the center of the holding plate 361 so as to be able to advance and retreat in the vertical direction. The inclined cam 362e is urged in the direction of being pulled into the holding plate 361, that is, in the upward direction by an urging member such as a spring (not shown), and when pressed by the block of the elevating mechanism 364 described later, the urging member is urged. A portion protruding from the lower surface of the holding plate 361 against the force extends downward. The cam follower 362d is pressed against the inclined surface of the inclined cam 362e by urging the slider 362b by the spring 362c.

Therefore, as shown in FIG. 7A, when the inclination cam 362e protrudes little, the slider 362b is urged toward the center side of the holding plate 361 by the spring 362c, and the holder 362a is the jig 100. It is in the locking position to lock the attachment / detachment tool 106. Then, as shown in FIG. 7B, when the inclined cam 362e protrudes, the inclined surface urges the cam follower 362d in a direction away from the center of the holding plate 361, so that the slider 362b slides and moves. The holder 362a moves to the release position where the attachment / detachment tool 106 of the jig 100 is released.

The release tool 363 is a member that moves the substrate S held by the jig 100 in the direction of pulling it away from the molding plate G. The release tool 363 has an urging plate 363a and a rod 363b. The urging plate 363a is a member that urges the substrate S in the direction of pulling it away from the molded plate G. The rod 363b is a member that supports the urging plate 363a at a position protruding downward from the holding plate 361.

In the present embodiment, the urging plate 363a is a pair of elongated rectangular members, and as shown in FIG. 8, when the jig 100 on the holder 43 comes downward, the uncoated region S2 of the substrate S Corresponding to, it is provided along two opposite sides protruding from the molded plate G. Hereinafter, these two opposite sides are also referred to as protruding sides.

The rod 363b is a columnar shape extending in a direction orthogonal to the substrate S, and a plurality of rods 363b are provided at equal intervals along the protruding sides. Here, a total of eight rods 363b, four on each protruding side, are provided. Therefore, the release tool 363 does not physically interfere with the molded plate support member 103 provided along the two sides orthogonal to the protruding side (see FIGS. 5 and 8).

The push-up portion 31 constitutes a common moving mechanism for relatively moving the holder 362a and the release tool 363 with the jig 100. That is, when the jig 100 is pushed up by the push-up portion 31, the holder 362a and the release tool 363 move relative to the jig 100 to hold the jig 100 and release the substrate S from the molded plate G. The operations can be performed in parallel or continuously.

The push-up portion 31 is configured to push up the jig 100 and the holder 43. That is, the jig 100 is pushed up by a predetermined amount in advance by the protruding portion 321 and then the holder 43 is further pushed up together with the jig 100 by the expanding portion 322. This is because if there is no portion for pushing the jig 100 against the holder 43 in advance by the protruding portion 321, it is necessary to extend the holder 362a into the holder 43 in order to bring the holder 362a to the attachment / detachment tool 106 of the jig 100. However, in that case, even if the holder 43 is lowered, the holder 362a may not be completely removed from the holder 43, and the rotating body 41 may not be able to rotate.

The elevating mechanism 364 is a mechanism for elevating and lowering the holding plate 361 together with the gripping mechanism 362 and the release tool 363. The elevating mechanism 364 has, for example, a vertical guide rail and a block that moves in the vertical direction by a ball screw that is rotated by a drive source, and a holding plate 361 is connected to this block.

The transport mechanism 37 is a mechanism for transporting the jig 100 between the carry-in / out portion 5 and the vacuum chamber 1. The transport mechanism 37 has an arm 371 and a motor 372. The arm 371 is a prismatic member extending in the horizontal direction, and a pair of elevating mechanisms 364 are provided at both ends. The motor 372 is a device provided near the opening 1b outside the vacuum chamber 1 and rotates the arm 371 on a horizontal plane.

In the arm 371, the gripping mechanism 362 of the holding plate 361 supported by the elevating mechanism 364 holds the jig 100 and rotates to convey the jig 100 between the loading / unloading portion 5 and the vacuum chamber 1. .. As described above, the holding and releasing of the jig 100 is performed by engaging and disengaging the holding tool 362a of the gripping mechanism 362 that moves up and down by the raising and lowering mechanism 364 to and from the attachment / detachment tool 106.

(Loading / unloading section)
The carry-in / out section 5 is attached to the vacuum chamber 1. The loading / unloading section 5 has a rotary table 51 and a motor 52. The rotary table 51 is a circular plate-like body. A pair of mounting tables 511 are formed on the rotary table 51. The mounting table 511 is a rectangular table on which the jig 100 is placed so as to be arranged side by side with the rotation center of the rotary table 51 interposed therebetween. The mounting table 511 moves between the attachment / detachment position where the worker attaches / detaches the substrate S to / from the jig 100 and the delivery position which comes below the holding plate 361 of the holding portion 36 by the rotation of the rotary table 51. The mounting table 511 is provided with grooves, protrusions, and the like for restricting and positioning the position of the jig 100 so that the jig 100 can be gripped by the gripping mechanism 362. The motor 52 is a drive source that applies a driving force to the rotary table 51 to rotate the rotary table 51 around a circular center.

(Control device)
The control device 6 is a device that controls the operation of each part of the protective film forming device (see FIG. 3). The control device 6 can be configured by, for example, a dedicated electronic circuit, a computer operating with a predetermined program, or the like. The control content of each part is programmed in the control device 6, and is executed by a processing device such as a PLC or a CPU.

For example, the control device 6 controls the speed at which the adhesive R (protective film P) is peeled from the molded plate G by the release tool 363 by controlling the speed at which the push-up body 32 is moved. Further, the control device 6 can control the time from bonding to peeling by controlling the rotation speed of the rotating body 41 by the transport unit 4.

[motion]
The operation of the protective film forming apparatus according to the present embodiment will be described with reference to FIGS. 9 to 20 in addition to the above drawings. As shown in FIG. 9, the opening 1b of the vacuum chamber 1 is sealed by the holder 43, and the expansion portion 322 of the push-up body 32 seals the opening 43b inside the holder 43, so that the vacuum chamber 1 is vacuumed. The inside of the chamber 1 is kept airtight. The inside of the vacuum chamber 1 is in a vacuum state by the exhaust device.

(Carry-in)
First, the carrying of the jig 100 into the vacuum chamber 1 will be described. As shown in FIGS. 3 and 4, the jig 100 is mounted on the mounting table 511 provided on the rotary table 51 of the loading / unloading section 5 with the base plate 101 facing down. Then, as shown in FIG. 5, the molded plate G is supported by the molded plate supporting member 103 in advance by the work of the worker, and the substrate S coated with the adhesive R on the surface is placed on the base 102. Shall be. Therefore, the molded plate G is on the upper side and the substrate S is on the lower side. The adhesive R is applied in the coating area S1 with a uniform thickness by, for example, a coating device such as a screen printing method before setting the substrate S on the jig 100.

The substrate S faces the molded plate G, and the uncoated region S2 protrudes from the molded plate G when viewed in a plan view. At this time, the elastic member 104 is shrunk because a load is applied by the molded plate supporting member 103 and the molded plate G, and has a length shorter than the natural length (hereinafter, referred to as a specified length).

When the rotary table 51 rotates in the attachment / detachment position, the jig 100 comes to the delivery position below the holding portion 36 of the delivery portion 35 (see FIG. 3). When the elevating mechanism 364 lowers the holding plate 361, the claw N of the holder 362a of the gripping mechanism 362 is locked in the hole H of the attachment / detachment tool 106 of the jig 100. Then, the jig 100 is lifted by raising the lifting mechanism 364. The motor 372 of the transfer mechanism 37 rotates the arm 371 to transfer the jig 100 directly above the opening 1b of the vacuum chamber 1 as shown in FIG.

As shown in FIG. 10, the elevating mechanism 364 is lowered and the holding plate 361 seals the opening 1b. Then, as shown in FIG. 11, the jig 100 is placed on the protruding portion 321 in the vacuum chamber 1. The load lock chamber, which is a closed space sealed by the opening 1b, the holding plate 361, the holder 43, and the expansion portion 322, is exhausted by the exhaust device and is in a vacuum state. As shown in FIG. 7B, the block of the elevating mechanism 364 moves the holder 362a to the released position by urging the inclined cam 362e.

Then, as shown in FIG. 12, when the drive source 34 lowers the push-up body 32, the holder 43 is lowered, inserted into the holder hole 41a of the rotating body 41, and supported by the rotating body 41. Further, when the push-up body 32 is further lowered and the protruding portion 321 of the push-up body 32 is separated from the opening 43b, the jig 100 is separated from the holder 362a and held by the holder 43 as shown in FIG. Since the opening 1b is sealed by the holding plate 361, the vacuum state inside the vacuum chamber 1 is maintained.

The holder 43 accommodating the jig 100 in this way is conveyed to the bonding portion 2 by the conveying portion 4. That is, as the rotating body 41 is rotated by the motor 42, the jig 100 housed in the holder 43 comes between the hardened portion 22 and the crimping portion 21 as shown in FIG.

(Lasting)
Next, the crimping portion 21 attaches the substrate S and the molded plate G via the adhesive R. That is, the pressing plate 211 is raised by the drive source 213. In this ascending process, as shown in FIG. 15, the jig 100 is pushed up from the holder 43, the molded plate support member 103 comes into contact with the fixing member 221b, and the molded plate G reaches the transmission member 221c. That is, the molded plate G comes into surface contact with the transmission member 221c.

Further, when the pressing plate 211 rises, the rising of the molded plate supporting member 103 is restricted by the fixing member 221b, so that the elastic member 104 shrinks and the adhesive R on the substrate S shrinks, as shown in FIG. Contact the molding plate G. Then, the adhesive R is spread and spread between the molded plate G and the substrate S, so that the substrate S and the molded plate G are bonded to each other (see FIGS. 2A and 2B).

The ascending of the pressing plate 211 by the drive source 213 is stopped at a preset height. In this state, the irradiating device 222 irradiates the adhesive R with ultraviolet rays as shown in FIG. The ultraviolet rays pass through the transmission member 221c and the molding plate G via the annular block 221a and reach the adhesive R. As a result, the adhesive R is cured, and a protective film P made of the adhesive R is formed between the molded plate G and the substrate S. Here, the preset height is, for example, a height at which the adhesive R spread by pressing against the molded plate G spreads over the entire film forming region. In the process of raising the pressing plate 211 described above, the adhesive R is formed by the molding plate G. More specifically, the adhesive R is molded between the time when the adhesive R on the substrate S comes into contact with the molding plate G and the time when the pressing plate 211 reaches a preset height. By this molding operation, the adhesive R is molded so as to spread over the entire film forming region and flatly. That is, the operation of bonding the substrate S and the molding plate G also serves as the molding operation of the adhesive R.

After that, when the drive source 213 lowers the pressing plate 211, the jig 100 is lowered and is housed in the holder 43 again, as shown in FIG. At this time, since the adhesive R has already been cured, the protective film P is adhered to the substrate S and also to the molded plate G. Therefore, the substrate S is held in a state of being attached to the molding plate G side.

(Peeling)
After forming the protective film P, the transport unit 4 returns the jig 100, which has completed the bonding operation, to the peeling unit 3. That is, the rotating body 41 is rotated to move the jig 100 directly under the opening 1b (see FIGS. 12 and 18). In this state, when the drive source 34 starts to ascend the push-up body 32, as shown in FIG. 19, the protruding portion 321 of the push-up body 32 enters through the opening 43b below the holder 43 and enters the bottom of the jig 100. Since it is pushed up, the upper part of the jig 100 penetrates toward the opening 1b. As the push-up body 32 continues to rise, the expansion portion 322 comes into contact with the lower surface of the holder 43 with a delay of the difference between the thickness of the bottom of the holder 43 and the step between the protrusion portion 321 and the expansion portion 322. The holder 43 starts to rise together with the jig 100. Then, as shown in FIG. 20, the upper portion of the holder 43 abuts on the ceiling of the vacuum chamber 1 on the periphery of the opening 1b, and the ascending stops. As a result, the opening 1b is sealed by the holder 43, and the opening 43b inside the holder 43 is sealed by the expansion portion 322. The sealed space sealed by the opening 1b, the holding plate 361, the holder 43, and the expansion portion 322 is brought into an atmospheric pressure state by venting by the exhaust device.

At this time, the urging plate 363a of the release tool 363 relatively pushes down the edge portion of the substrate S, which is the uncoated region S2 along the protruding side of the substrate S (see FIG. 2C). Since the adhesive R has already been cured, the protective film P is adhered to the substrate S and also to the molded plate G. Therefore, even if the uncoated region S2 at the end of the substrate S is relatively pushed down, the protective film P tries to stay in place temporarily without being peeled off from the molded plate G. Then, a force in the direction of peeling from the molded plate G acts intensively on the end portion of the protective film P facing the protruding side, so that the substrate S warps and peels from the molded plate G in order from the end of the protective film P. .. Since the elastic member 104 has an elastic force larger than the adhesive force of the protective film P to the molded plate G, the molded plate G stays against the force applied to the protective film P to peel off.

Further, when the jig 100 is pushed up, the peeling of the protective film P from the molded plate G starting from the side near the end of the substrate S gradually extends to the central portion, and finally the entire protective film P is formed on the molded plate. Peel off from G (see FIG. 2 (d)). Since the lower surface of the molded plate G is flat, the surface of the formed protective film P is flat. As described above, the substrate S having the protective film P formed on the surface can be obtained. The length of the elastic member 104 at this time is not more than the specified length. Further, in parallel with this, when the attachment / detachment tool 106 of the jig 100 rises and comes into contact with the holder 362a, the holder 362a is once pushed outward against the spring 362c, and then the claw of the holder 362a. The holder 362a returns with the urging force of the spring 362c so that N fits into the hole H of the attachment / detachment tool 106. As a result, the claw N of the holder 362a of the gripping mechanism 362 is locked in the hole H of the attachment / detachment tool 106.

(take out)
First, the load lock chamber, which is a closed space sealed by the opening 1b, the holding plate 361, the holder 43, and the expansion portion 322, is brought to atmospheric pressure by the exhaust device. In this state, as shown in FIG. 21, the elevating mechanism 364 raises the holding plate 361 to separate the holding portion 36 from the opening 1b. The jig 100 gripped by the gripping mechanism 362 is lifted from the holder 43, detached from the holder 43, and taken out of the vacuum chamber 1. At this time, since the holder 43 seals the opening 1b and the expansion portion 322 of the push-up portion 31 seals the hole inside the holder 43, the inside of the vacuum chamber 1 is kept airtight. That is, the inside of the vacuum chamber 1 is maintained in a vacuum.

The transfer mechanism 37 moves the jig 100 taken out from the vacuum chamber 1 to the carry-in / out portion 5 by rotating the arm 371. As the elevating mechanism 364 descends, the jig 100 is placed on the mounting table 511 of the loading / unloading section 5 (see FIG. 10). The block of the elevating mechanism 364 moves the holder 362a to the release position by urging the inclined cam 362e, and then ascends to leave the jig 100 on the mounting table 511.

(Carrying out)
The loading / unloading section 5 rotates the rotary table 51 by operating the motor 52 to move the jig 100 to the attachment / detachment position. At this attachment / detachment position, the operator removes the substrate S on which the protective film P is formed.

Although the above description has focused on one jig 100, when the jig 100 is transported from the bonding portion 2 to the peeling portion 3 by the transport portion 4 described above, and when the jig 100 is transported from the peeling portion 3 by the transport mechanism 37, the loading / unloading portion is performed from the peeling portion 3. When transporting the jig 100 to the delivery position of 5, and further, when transporting the jig 100 from the delivery position to the attachment / detachment position by the carry-in / out section 5, the other holder 43 of the transport section 4 and the other of the transport mechanism 37 A jig 100 on which a substrate S to be bonded (molding of adhesive R and formation of protective film P) is placed is held on the other mounting table 511 of the holding portion 36 and the loading / unloading portion 5, respectively. Therefore, the carrying-in operation of these jigs 100 is performed in parallel.

Therefore, by continuously performing the above-mentioned operations, the substrate S can be bonded and peeled in parallel. "Parallel" means that there is a portion where the operation times of bonding and peeling overlap, that is, the operation time of both being performed at the same time is included. This includes cases where the start time and the end time match, and cases where one or both of the start time and the end time deviate from each other. That is, when the substrate S after being bonded in the bonding portion 2 is conveyed to the peeling portion 3 together with the jig 100, the jig 100 carried into the vacuum chamber 1 then comes to the bonding portion 2. Then, when the substrate S is taken out from the vacuum chamber 1 in the peeling portion 3, the substrate S that has come to the bonding portion 2 is crimped to the molded plate G in parallel with the step of peeling the substrate S from the molded plate G together with the protective film P. The adhesive R can be cured.

After the jig 100 is carried out, the substrate S is replaced every time the protective film P is formed, but the molded plate G may be reused or replaced. For example, the used molded plate G may be used again as one set together with another substrate S, or the used molded plate G may be replaced to make a new molded plate G and the substrate S into one set. Jig 100 may be used. Further, if a part of the protective film P remains peeled off on the molded plate G after the protective film P is formed, it may be cleaned and reused. The replacement frequency and cleaning frequency of the molded plate G can be changed as appropriate.

(Action effect)
The present embodiment is a protective film forming apparatus for forming a protective film P made of an adhesive S by crimping a molded plate G and a substrate S via an adhesive R, wherein the molded plate G and the substrate S are combined with each other. The jig 100 that holds the jig 100 so as to be relatively movable between the separation position separated from each other and the crimping position that is crimped via the adhesive R, and the molded plate G and the substrate S held by the jig 100. , The bonding portion 2 to be bonded by moving it relative to the crimping position, and the molded plate G and the substrate S held by the jig 100 and bonded by the bonding portion 2 are peeled off by relatively moving to a separation position. The peeling portion 3 and the plurality of jigs 100 are supported, and the molding plate G held by one of the jigs 100 and the substrate S are bonded by the bonding portion 2, and any of the other jigs 100. The jig 100 is conveyed to the bonding portion 2 and from the bonding portion 2 to the peeling portion 3 so that the peeling of the molded plate G and the substrate S held in the above can be performed in parallel by the peeling portion 3. It has a transport unit 4 for executing the transport of the above.

As a result, a plurality of jigs 100 pair the molded plate G and the substrate S and move between the bonding portion 2 and the peeling portion 3, so that the molding plate G and the substrate S can be bonded and peeled together. It can be performed at different positions of the bonding portion 2 and the peeling portion 3. Therefore, the time for laminating to form the protective film P and the time for peeling can be overlapped, and peeling is performed to prevent deformation of the substrate S and cracking of the protective film P. It is possible to prevent the cycle time from increasing even if it takes time, and it is possible to efficiently form the protective film P.

For example, when the bonding by the bonding portion 2 and the peeling by the peeling portion 3 are performed at the same position, it takes about 15 seconds from the start of bonding to the completion of curing of the adhesive R, and the peeling takes 5 seconds. If it takes a certain amount, the cycle time is about 20 seconds. Further, if it is necessary to take more than 5 seconds in order to prevent the substrate S or the like from being deformed or cracked at the time of peeling, the cycle time becomes longer. In the present invention, by overlapping the time from the start of bonding to the completion of curing (15 seconds) and the time of peeling (5 seconds), the processing can be performed in less than 20 seconds. Further, even if the peeling time is longer than 5 seconds, if the time is less than 15 seconds, the cycle time can be set to less than 15 seconds. , The occurrence of deformation and cracking can be further prevented.

Further, since the molding plate G is provided on each of the plurality of jigs 100 to which the molding plate G moves, the used molding plate G can be cleaned while the jig 100 is being carried out from the protective film forming apparatus. As a result, the molded plate G can be replaced without stopping the apparatus, and the productivity can be improved.

The bonding portion 2 has a curing portion 22 that cures the adhesive R between the crimped molded plate G and the substrate S. Therefore, the curing treatment can be overlapped with the time for peeling, and can be efficiently formed.

The jig 100 supports a base 102 on which the substrate S is placed and a molded plate G provided so as to face the base 102 and protrude from the base S on the base 102 in a plan view. It has a molded plate support member 103, and an elastic member 104 that elastically supports the molded plate support member 103 at a position separated from the base 102. Therefore, the peeling portion 3 can be peeled from the molded plate G by urging the protruding portion of the substrate S. This is suitable for peeling off a substrate on which no holes are formed.

The elastic member 104 has an elastic force larger than the adhesive force of the protective film P to the molded plate G. Therefore, after the substrate S is bonded to the molded plate G by the bonding portion 2 against the urging force of the elastic member 104, the substrate S is separated from the molded plate G by the peeling portion 3 in order to peel the substrate S. When urging, the substrate S can be peeled off together with the protective film P while maintaining the position of the molded plate G by the elastic force (repulsive force) of the elastic member 104.

The peeling portion 3 has a delivery portion 35 that delivers the jig 100 to the transport portion 4, and the delivery portion 35 forms a holder 362a that holds the jig 100 and a substrate S that is held by the jig 100. It has a release tool 363 that moves the plate G in a pulling direction. Therefore, the jig 100 can be delivered between the delivery unit 35 and the transfer unit 4, the jig 100 can be held by the holder 362a, and the substrate S can be peeled off by the release tool 363.

The peeling portion 3 has a moving mechanism for relatively moving the holder 362a and the peeling tool 363 between the jig 100 and the jig 100. Therefore, it is not necessary to operate the holder 362a and the release tool 363 by separate mechanisms, and a simple configuration can be achieved. The peeling portion 3 presses the region of the substrate S protruding from the molded plate G by the peeling tool 363, and moves relative to the peeling tool 363 by a moving mechanism along the direction of pulling the peeling tool 363 away from the molded plate G. Therefore, the protruding region of the substrate S from the molded plate G can be first warped, and the protective film P can be gradually peeled off from the edge of the protective film P with respect to the molded plate G, so that the protective film P can be easily peeled off. As a result, it is possible to prevent the protective film P from remaining on the molded plate G.

The substrate S has a rectangular shape, and a plurality of release tools 363 are provided along two opposite sides protruding from the molded plate G of the substrate S. Therefore, the protective film P can be peeled off cleanly by peeling the protective film P not from one point but from the opposite sides. In other words, it is possible to prevent the protective film P from remaining on the molded plate G. Further, since the substrate S is urged by the surface of the urging plate 363a, the urging force can be uniformly applied and the unevenness of the peeled portion can be prevented.

A vacuum chamber capable of depressurizing is configured inside, and the vacuum chamber has a vacuum chamber 1 having a transport portion 4 and a bonding portion 2. The rotating body 41 capable of transporting the jig 100 at the position of taking in and out and the bonding position of bonding by the bonding portion 2 and the rotating surface of the rotating body 41 are held with respect to the rotating body 41. It has a holder 43 that is supported so as to be relatively movable in a direction orthogonal to the vacuum chamber 1, and the vacuum chamber 1 corresponds to a position where the jig 100 is taken in and out. An opening 1b for delivering the jig 100 is provided between the two, and the delivery portion 35 drives the holding plate 361 having the holding tool 362a and the peeling tool 363 and the holder 43 toward the opening 1b of the vacuum chamber 1. When the jig 100 is delivered, the holder 43 comes into contact with the inner wall of the vacuum chamber 1 around the opening 1b, so that the inside and the outside of the vacuum chamber 1 are brought into contact with each other. When the jig 100 is conveyed and the substrate S is bonded, the holding plate 361 comes into contact with the outer surface of the vacuum chamber 1 around the opening 1b, so that the inside and outside of the vacuum chamber 1 can be contacted. It is supposed to keep the airtightness of.

Therefore, by bonding the substrate S to the molding plate G in vacuum, air bubbles in the atmosphere can be eliminated from the adhesive R, and while maintaining the vacuum in the vacuum chamber, molding is performed in parallel with the bonding. The substrate S can be peeled off from the plate G, and can be carried in or out of the vacuum chamber 1.

[Other Embodiments]
The present invention is not limited to the above embodiments, but also includes other embodiments shown below. The present invention also includes a combination of all or any of the above embodiments and the following other embodiments. Furthermore, various omissions, replacements, and changes can be made to these embodiments without departing from the scope of the invention, and modifications thereof are also included in the present invention.

(1) As the drive mechanism and drive source for driving each part in the above embodiment, various techniques can be applied as long as the above-mentioned movement of members can be realized. For example, instead of the air cylinder, a ball screw mechanism driven by a motor can be used.

(2) In the above embodiment, the release tool 363 is configured to hold the substrate S by the surface of the urging plate 363a, but any other configuration can be used as long as it is a member capable of urging the substrate S in the direction of peeling. You may. For example, the release tool 363 may be composed of a rod-shaped rod. By forming a roundness or an inclination at the tip of the rod, the contact surface between the substrate S and the rod may be made small to prevent the rod from hindering the deformation of the substrate S in the warping direction. It is conceivable that a plurality of rods are provided along the protruding side. In this case, the warpage of the substrate S may be adjusted by making the lengths of the plurality of rods different. For example, if three rods are provided along the protruding sides on both sides and the rods are made shorter than the outside of the rod in the middle of each side, the outer rod first contacts the uncoated area S2 of the substrate S. Since it warps, the warp of the substrate S can be adjusted.

(3) In the above embodiment, the holder 362a has a mode in which the claw N is locked in the hole H of the attachment / detachment tool 106, but the holder 362a is other as long as it is a member capable of holding the jig 100. It may have the configuration of. For example, a hole may be formed in the holder 362a and the claws of the attachment / detachment 106 may be locked.

(4) In the above embodiment, the molded plate G may be subjected to a treatment on the surface in contact with the adhesive R so that the adhesive force with the protective film P is weaker than that with the substrate S. Examples of such a treatment include a fluorine coating agent and a PTFE coating. By performing such a treatment, the effect of preventing the protective film P from remaining peeled can be expected. Further, in order to peel off the protective film P from the molded plate G, when the substrate S is made of a resin such as polycarbonate, the adhesive R may enter the gaps of minute irregularities on both sides of the resin, or the adhesive may be used. Since the solvent contained in R dissolves the resin surface and a relatively strong bonding force can be obtained, it is sufficient to use glass or the like having a high surface flatness and not being dissolved in the solvent as the molded plate G. It can be peeled off.

(5) In the above embodiment, the resin forming the protective film P is an ultraviolet curable resin, but it may be a thermosetting resin, a radiation curable resin, or a resin that is dried and cured. In these cases, the molded plate G and the transmissive member 221c do not necessarily have to have translucency.
(6) In the above embodiment, the single transport unit 4 transports the jig 100 to the bonding portion 2 and from the bonding portion 2 to the peeling portion 3, but each of them is carried out. It may be carried out by using an individual transport unit. That is, the jig 100 is conveyed to the bonding portion 2 by using the first conveying portion, and the jig 100 is conveyed from the bonding portion 2 to the peeling portion 3 by a second conveying portion different from the first conveying portion. It may be carried out by using the transport unit of.

1 Vacuum chamber 1a, 1b Opening 2 Bonding part 21 Crimping part 211 Pressing plate 212 Rod 213 Drive source 22 Hardening part 221 Window part 221a Circular block 221b Fixing member 221c Transmission member 222 Irradiating part 3 Peeling part 31 Pushing upper part 32 Pushing body 321 Projection part 322 Expansion part 33 Rod 34 Drive source 35 Delivery part 36 Holding part 361 Holding part 362 Holding part 362 Holding mechanism 362a Holding mechanism 362b Slider 362c Spring 362d Cam follower 362e Inclined cam 363 Release tool 363a Bias plate 363b Rod 364 Lifting mechanism 37 Arm 372 Motor 4 Conveyor 41 Rotating body 41a Holder hole 42 Motor 43 Holder 43a Flange 43b Opening 5 Loading / unloading section 51 Rotating table 511 Mounting table 52 Motor 6 Control device 100 Jig 101 Base plate 102 Base 103 Molded plate support member 104 Elastic Member 105 Guide G Molded plate H Hole N Claw P Protective film R Adhesive S Substrate S1 Coating area S2 Uncoated area

Claims (6)

A protective film forming device that presses a molded plate against a substrate coated with an adhesive to form a protective film made of the adhesive on the substrate.
The molded plate is provided so as to protrude from the substrate in a plan view.
A jig that holds the molded plate and the substrate so as to face each other and is separated from each other so as to be relatively movable between a separation position and a crimping position where the molded plate is pressed against the substrate.
A cured portion that cures the adhesive between the crimped molded plate and the substrate by adhering the molded plate and the substrate held by the jig by moving them relative to the crimping position. With the bonding part that has
The held to a jig, relative to the said adhesive and said shaped plate which is cured substrate between said molding plate which is crimped by Awa bonding the substrate by the bonding unit, in the separation position A peeling portion that is moved to peel off the substrate on which the protective film in which the adhesive is cured is formed from the molded plate.
Supporting a plurality of said jigs, any of the held in a jig the said molded plate and the bonding by the bonding portion between the substrate, the held to any other of said jig formed as in parallel and peeling by the peeling portion of the plate-substrate becomes feasible to execute the transport to the stripping unit from the transport to the bonding unit to the bonding unit of the jig Transport section and
Have a,
The peeling portion moves the molded plate to the separation position when the adhesive between the crimped molding plate and the substrate is relatively moved to the separation position. It is characterized by including an elastic member that elastically supports the substrate, and a release tool that presses a region of the substrate that protrudes from the molded plate and moves the substrate in a direction that separates the substrate from the molded plate. Protective film forming device. The jig is
The base on which the substrate is placed and
A forming plate support member supporting the molding plate,
Have,
The elastic member is
The molded plate support member is elastically supported at a position separated from the base.
Protective film forming apparatus according to claim 1, wherein a. The protective film forming apparatus according to claim 1 or 2 , wherein the elastic member has an elastic force larger than the adhesive force of the protective film to the molded plate. A vacuum chamber capable of depressurizing is configured inside, and the vacuum chamber has a vacuum chamber including the transport portion and the bonding portion.
The peeled part is
It said jig having a delivery device for receiving pass Shi to between the conveying portion of the vacuum chamber and the outside of the vacuum chamber,
The delivery device is
A holder for holding the jig and
With the release tool
The protective film forming apparatus according to any one of claims 1 to 3 , wherein the protective film forming apparatus has. The peeled part is
The protective film forming apparatus according to claim 4 , further comprising a moving mechanism for relatively moving the holder and the release tool between the jigs. The transport unit
In the vacuum chamber, a rotating body capable of transporting the jig at a position where the jig is taken in and out of the vacuum chamber and a bonding position where the jig is bonded by the bonding portion.
A holder that holds the jig and is supported so as to be relatively movable with respect to the rotating body in a direction orthogonal to the rotating surface of the rotating body.
Have,
The vacuum chamber is provided with an opening corresponding to a position where the jig is taken in and out so that the peeling portion can deliver the jig to and from the transport portion by the delivery device.
The delivery device is
The holder, the holding plate having the release tool, and
A push-up that drives the holder forward and backward toward the opening of the vacuum chamber, and
Have,
At the time of delivery of the jig, the holder is brought into contact with the inner wall of the vacuum chamber around the opening by the push-up portion, so that the airtightness between the inside and the outside of the vacuum chamber is maintained, and the jig is delivered. 4. The fourth aspect of the present invention is that the holding plate comes into contact with the outer surface of the vacuum chamber around the opening to maintain airtightness between the inside and the outside of the vacuum chamber during transportation and bonding of the substrates. The protective film forming apparatus according to the above.

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