JPH07314461A - Method and device for releasing composite type optical element from mold - Google Patents

Abstract

PURPOSE:To enable mold release to be carried out without applying necessary force or more to a composite type optical element and to provide a nondefective product free from deformation and damage by adding a loading point to the outer circumference of the molded composite type optical element and also releasing the optical element from a mold while moving the loading point. CONSTITUTION:Resin 4 is discharged on the upper surface of base material 1 plased on a supporting stand 5 and thereafter a composite type element is formed by lowering a mold 2. After this formation is finished, an annular structure 3 is lowered and the projection part 3a of the annular structure 3 is allowed to abut against the outer circumference of the base material 1. Load is intensively applied to the abutted loading point 6 and then a clue for activating a mold release is generated by an air layer. Thereby the base material 1 is bent and an interval between the base material 1 and the annular structure 3 is spread. The annular structure 3 is rotated in this state. The loading point 6 on which the abutting part 3a of the annular structure 3 is allowed to abut is moved on the outer circumference of the base material 1 by this rotation and the composite type optical element is mold-released from the mold 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold releasing method and apparatus which are carried out after molding a composite optical element comprising an optical substrate and an energy curable resin formed on the surface of the substrate.

[0002]

2. Description of the Related Art Conventionally, after molding a composite optical element,
A process called mold release for separating the molded product from the mold was necessary. However, since the resin is in close contact with the mold surface, it was not an easy process. That is, if an attempt is made to release a molded product molded by a mold having a general integral structure of φ20 mm from the mold,
A force of 0-80 kgf is required. Since this is simply done by pulling in a direction perpendicular to the molding surface, the above-mentioned releasing force is generated, and the molded product is deformed or damaged. Furthermore, if a mechanism for generating such a force has to be mounted on the molding apparatus, it is inevitable that the apparatus becomes large.

Therefore, in order to solve the above-mentioned drawbacks, for example, the following invention has been proposed in Japanese Patent Application Laid-Open No. 4-244819. In the above invention, as shown in FIG.
A mold 93 for molding the resin 92 is fitted to the support 94. The support body 94 is provided with a plurality of guide slits 94a. The leg portion 95a of the annular release operation member 95 is slidably fitted in the guide slit 94a.
In the apparatus having the above-described configuration, the mold release operation member 95 applies a concentrated load to a part of the base material 91 to concentrate stress, thereby releasing the mold.

[0004]

However, in the invention described in the above-mentioned JP-A-4-244819, the base material 9 is used.
Although it is possible to release the mold with a comparatively small force by applying a concentrated load to a part of 1 to concentrate the stress, but rather than peeling the resin 92 from the mold 93 by the stress concentration, It is owed much to the fact that the material 91 is deformed to form an air layer between the mold 93 and the resin 92 so that the material 91 is separated.

Further, the resin 92 does not become a rigid body even after being hardened, and has a toughness, and even if a load is applied to a part of the base material 91, only a part of the base material 91 triggers the release. No such air layer appears. In order to completely release the mold, the amount of movement of the annular mold release operating member 95 is increased to increase the base material 91.
It is necessary to further increase the load applied to. That is, since the load can be applied only to a part of the base material 91, a force more than the appearance of the air layer is applied to the base material 91, which leads to deformation or damage as a molded product. .

It is an object of the inventions according to claims 1, 2, 3, and 4 to provide a mold releasing method and apparatus for a composite type optical element, which can easily release a molded product from a mold with a lower force. Especially.

[0007]

SUMMARY OF THE INVENTION In releasing the molded composite type optical element from the mold, the present invention provides:
While adding a load point to the outer periphery of the composite optical element,
A method of releasing a composite optical element is characterized by releasing the mold while moving the load point. Further, in a mold releasing device for releasing a molded composite optical element from a mold, an annular ring which has a protrusion and rotates coaxially with the optical axis of the composite optical element and moves in the optical axis direction. A mold releasing apparatus for a composite type optical element, comprising a structure. Furthermore, in a mold releasing device for releasing the molded composite optical element from the mold, a plurality of air cylinders are arranged at equal intervals along the outer periphery of the mold. It is a mold release device.

1 to 3 are conceptual views showing the present invention.
Reference numeral 1 is a base material, and the base material 1 is placed on a holding table 5.
After the resin 4 is discharged onto the upper surface of the substrate 1, the mold 2 is lowered to mold the composite optical element. After the molding is completed, the annular structure 3 is lowered to bring the protrusion 3a of the annular structure 3 into contact with the outer periphery of the base material 1 (see FIG. 1). Then, a concentrated load is applied to the abutting load point 6 and a trigger is given by the air layer for releasing. The inclusion of the air layer means that the base material 1 is bent and the space between the base material 1 and the annular structure 3 can be expanded. In that state, the annular structure 3 is rotated (see FIG. 2). By the rotation, the load point 6 with which the projecting portion 3a of the annular structure 3 abuts moves on the outer periphery of the base material 1 and is released (see FIG. 3).

The portion where the mold 2 and the resin 4 are first peeled off is not applied with a force greater than that required for peeling, and the force moves to different points on the outer circumference of the base material. Due to the movement of the load point 6, an air layer enters the entire circumference between the mold 2 and the resin 4, and the mold is easily released. Therefore, more force than required for peeling is not concentrated on one point, so that the mold can be released without deformation or damage.

[0010]

Embodiment 1 FIGS. 4 to 6 show an apparatus used in this embodiment, FIG. 4 is a partially cutaway side view, and FIGS. 5 and 6 are partial side views showing a molding process. In addition, this embodiment will be described with reference to FIG.

The horizontal base 15 has a substantially L-shaped vertical base 1.
6 are erected. A mold base 18 is held so as to be vertically slidable via a linear guide 17 fixedly provided on a side surface of the vertical base 16. A mold 12 having a desired molding surface shape is vertically provided on the lower surface of the mold base 18. The mold base 18 is vertically moved by rotation of a motor 22 via a ball screw 19, a timing pulley 20 and a belt 21.

An annular structure 13 is rotatably screwed onto the outer periphery of the mold 12. A gear 1 is provided on the outer periphery of the annular structure 13.
3a is threaded so that the rotation of the motor 23 provided near the tip of the mold base 18 can be transmitted.
The annular structure 13 is a lead that can move up and down by 0.5 mm per revolution. In addition, the lower end surface of the annular structure 13 is formed in a tapered shape, and when the most projecting protrusion 13b thereof contacts the base material 11, it contacts the outside of the effective diameter of the base material 11 or the outside of the optical surface in a dot shape. It is configured like.

On the other hand, a holding table 24 for holding the base material 11 is placed directly below the die 12 on the upper surface of the horizontal base 15. An ultraviolet irradiation lamp 25 is installed directly below the holding table 24 below the horizontal base 15. Although not shown, the horizontal base 15
An optical path for allowing ultraviolet rays to reach the base material 11 is secured in the holding table 24. The holding table 24 has an edge, receives the base material 11 like a bell clamp, and holds the base material 11 by fitting the outer circumference thereof (see FIG. 4).

A molding process and a mold releasing process using the apparatus having the above structure will be described below. First, the molding process will be described. After centering the optical base material 11 on which the necessary amount of the ultraviolet curable resin 14 has been discharged by the holding table 24 (the description of the centering mechanism is omitted), the motor 22 is driven to move the mold 12 downward. . Then, when the distance between the mold 12 and the base material 11 reaches a desired resin thickness, the lowering of the mold 12 is stopped (see FIG. 5). Then, the lamp 25 is irradiated with ultraviolet rays to cure the resin layer 14 to form a molded product 26 (see FIG. 6).

Next, the mold release process of this embodiment will be described. First, the mold 12 is raised by about 1 mm in a state where the molded product 26 (the base material 11 and the cured resin layer 14) and the mold 12 are in close contact with each other (see FIG. 2). Next, when the motor 23 is rotated, the annular structure 13 is screwed onto the outer periphery of the die 12, so that the annular structure 13 descends while rotating via the gear 13a. Then, the distance between the most protruding portion 13b of the annular structure 13 and the base material 11 gradually becomes narrower.

When the rotation is further continued, the protrusion 13b contacts the base material 11, and concentrated load starts to be applied. When a concentrated load starts to be applied, stress concentrates on that portion, and the base material 11
Is deformed and peeled from the mold 12. At that moment, the distance between the base material 11 and the protruding portion 13b is widened by the amount of deformation of the base material 11, so that the portion that has been peeled off first does not receive an excessive force for peeling. Molded product 2 by the above continuous operation
The mold release between 6 and the mold 12 is completed.

According to this embodiment, when the molded product is released from the mold, it can be released without applying a force greater than that required for releasing the molded product, so that the molded product is free from deformation and damage. It will be possible to obtain.

In the present embodiment, the lower end surface of the annular structure 13 is tapered to form the protrusion 13b, but the present invention is not limited to this. For example, the lower end surface of the annular structure may be horizontal. Needless to say, the protrusion may be formed so that only a part thereof is protruded.

[0019]

[Embodiment 2] FIGS. 7 to 10 show an apparatus used in this embodiment. FIG. 7 is a right side view of FIG. 4, FIG. 8 is an end view taken along the line AA 'of FIG. 7, and FIGS. It is a right view which shows a mold release process. In the present embodiment, the same components as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

Two air cylinders 32 are fixed to the side surface of the mold base 18 with two screws sandwiching the axis of the mold 31. Members 33a and 33b are fixed to the lower ends of the air cylinders 32, respectively. The surfaces of the members 33a and 33b that face each other are formed in a substantially semicircular shape. The groove 3 is provided on the upper side circumference of the annular structure 34.
4a is formed, and the surfaces of the members 33a and 33b that face each other are fitted in the groove 34a. That is, the annular structure 34 is loosely fitted coaxially with the mold 31 and is held so as to be rotatable and vertically movable. The other structure including the rotating mechanism of the annular structure 34 and the molding process are the same as those in the first embodiment, and the description thereof will be omitted.

The mold release process of this embodiment will be described below. After the resin 14 is cured by ultraviolet irradiation, the mold 31 (with the molded product 26 in close contact) is raised by about 1 mm, the air cylinder 32 is operated, and the annular structure 34 is lowered.
It is applied to the base material 11 with a desired thrust obtained empirically by research and development or set by simulation or the like.

The thrust needs to be at least the force necessary for the molded product 26 to partially peel from the mold 31. The annular structure 34 is rotated while the force is applied. Then, the force required to release the close contact between the molded product 26 and the mold 31 is continuously applied to the entire circumference of the molded product 26. Then, peeling extends over the entire interface between the molded product 26 and the mold 31 and is released.

According to this embodiment, since a force greater than necessary is not applied to the molded product, it is possible to obtain a good product without any deformation or damage of the molded product.

[0024]

[Embodiment 3] FIG. 11 is a side view of essential parts showing an apparatus used in this embodiment. The same numbers are given to the respective components as in the first embodiment, and the description thereof will be omitted. The present embodiment is different from each of the above-described embodiments only in that the annular structure 13 is configured to hang on the chamfered portion of the base material 11, and other configurations and operations are the same, and therefore description thereof is omitted.

According to this embodiment, since a force higher than necessary is not applied to the molded product, it is possible to obtain a good product without any deformation or damage of the molded product. Further, since the concentrated load acts more effectively as a moment load, the force required for peeling can be suppressed to be smaller than that in each of the above embodiments.

[0026]

[Embodiment 4] FIGS. 12 and 13 show an apparatus used in this embodiment, FIG. 12 is a side view of a main portion, and FIG.
It is a B'line sectional drawing. In this embodiment, the same components as those in the second embodiment are designated by the same reference numerals and the description thereof will be omitted.
On the lower surface of the mold base 18, four air cylinders 41 are vertically provided along the outer periphery of the mold 31 at equal intervals.

After the resin is cured by the irradiation of ultraviolet rays, the mold 31 (in the state where the molded product is in close contact) is raised by about 1 mm, and the four air cylinders 41 are sequentially driven to closely contact the molded product and the mold 31. Apply the force necessary to release the to the outer periphery of the molded product. The driving order of the air cylinders 41 may be such that the air cylinders 41 are driven so as to go around the outer circumference of the mold 31, or the cylinders 41 facing each other may be driven alternately.

According to this embodiment, since it is possible to release the molded product from the mold 31 without applying a force greater than that required for releasing the molded product, a good product can be obtained without any deformation or damage of the molded product. Will be possible. Further, the device can be simplified.

[0029]

The effects of the inventions according to claims 1, 2, 3 and 4 are that it is possible to obtain a non-defective product without any deformation or damage of the molded product because an unnecessary force is not applied to the molded product. Become.

[Brief description of drawings]

FIG. 1 is a conceptual diagram showing the present invention.

FIG. 2 is a conceptual diagram showing the present invention.

FIG. 3 is a conceptual diagram showing the present invention.

FIG. 4 is a side view showing the first embodiment.

FIG. 5 is a partial side view showing the first embodiment.

FIG. 6 is a partial side view showing the first embodiment.

FIG. 7 is a right side view showing a second embodiment.

FIG. 8 is an end view taken along the line AA ′ of FIG.

FIG. 9 is a right side view showing the second embodiment.

FIG. 10 is a right side view showing the second embodiment.

FIG. 11 is a side view of essential parts showing a third embodiment.

FIG. 12 is a side view of essential parts showing a fourth embodiment.

13 is a sectional view taken along line BB ′ of FIG.

FIG. 14 is a cross-sectional view showing a conventional example.

[Explanation of symbols]

 1 Base Material 2 Mold 3 Annular Structure 4 Resin 5 Holding Base 6 Load Point

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Office reference number FI technical display area // B29L 11:00

Claims (4)

[Claims] 1. When releasing the molded composite optical element from the mold, a load point is added to the outer periphery of the composite optical element, and the mold is released while moving the load point. Method of releasing composite optical element. 2. The mold releasing method for a composite optical element according to claim 1, wherein the movement of the load point is made around the periphery of the composite optical element. 3. A mold releasing apparatus for releasing a molded composite optical element from a mold, wherein the mold releasing apparatus has a protrusion and rotates coaxially with the optical axis of the composite optical element, and in the optical axis direction. A mold releasing apparatus for a composite optical element, comprising a moving annular structure. 4. A mold releasing device for releasing a molded composite optical element from a mold, wherein a plurality of air cylinders are arranged at equal intervals along the outer periphery of the mold. Mold release device for optical elements.