JPS63195683A - Relief-shaped transfer device - Google Patents

Abstract

PURPOSE:To easily peel a substrate without causing substrate deformation nor stress concentration in resin by using a vacuum sucking tool. CONSTITUTION:When transfer is performed, a stamper 100 is fixed on a base 11, the substrate 101 whose surface is coated with a resin 103 is supported on a holder 12 and positioned at a transfer position, and the resin 103 is cured by a resin curing means. Then the substrate 101 is sucked by the vacuum sucking tool 13 over the entire surface and the substrate 101 is moved to a stand-by position in the state and separated from the stamper 100. Consequently, the substrate 101 can be peeled without being deformed, and no stress concentration is caused, so that accurate transfer having no defect enabled.

Description

[Detailed Description of the Invention] [Summary] The present invention is aimed at making it possible to easily and accurately transfer the relief shape on the surface of a stamper onto a substrate such as a disk. This objective is achieved by peeling off the substrate from the stamper using a vacuum suction tool.

[Industrial application field]

The present invention relates to a relief shape transfer device used to transfer a relief shape on the surface of a stamper to a substrate such as a disk.

When manufacturing hologram disks, etc., a method is generally adopted in which a stamper with a relief of a predetermined shape formed on the surface is used as a mask, and the shape of this relief is transferred to a layer of 2P resin or the like on the surface of a substrate such as acrylic resin. has been done. It is desired that a transfer device that performs this transfer be capable of performing accurate transfer without damaging the substrate.

[Conventional technology]

FIG. 2 is an explanatory diagram of a procedure for transferring a relief shape using a conventional device. In the figure, 1 is a stamper, and 2 is an acrylic resin substrate (disc). The stamper 1 includes a relief 3 having a predetermined shape on its surface.

When transferring, 2P is placed on the surface of the substrate 2 (lower surface in Fig. 2).
The resin 4 is applied to a predetermined thickness, and the substrate 2 is placed over the stamper 1 and pressed so that the 2P resin 4 comes into close contact with the relief 3. In this state, ultraviolet rays are irradiated from above the substrate 2 as shown by the arrow to harden the 2P resin 4. When the substrate 2 is peeled off after curing is completed, a disk in which the shape of the relief 3 is transferred to the 2P resin layer can be obtained.

[Problem that the invention seeks to solve]

In the case of such a conventional method, it is possible to transfer the relief 3A having the shape shown in FIG. When trying to transcribe the following various problems occurred.

(1) When peeling off the substrate 2, a knife 5 is inserted into one end of the substrate 2 as shown in the figure, and then the substrate 2 is peeled off, so bending stress is applied to the substrate 2, causing deformation.

(2) A concentrated load is applied to the part where the knife 5 is inserted, and 2
P resin is easily destroyed.

(3) The work is troublesome.

[Means for solving problems]

The present invention provides a relief shape transfer device that can solve the above-mentioned problems, and as a means for that purpose, the present invention includes a base, a holder, a resin curing means, and a vacuum suction tool. The configuration is adopted.

The base is for fixing a stamper having a relief formed on its surface.

The holder is for supporting a transfer substrate whose surface is coated with resin, and there is a transfer position where the resin of the supported substrate is in close contact with the surface of the stamper fixed to the base, and a position where the resin is retracted from this position. It is supported by a base so as to be movable between the retracted position and the retracted position.

The resin curing means is for curing the resin on the substrate at the transfer position, and when a 2P resin is used as the resin, the resin is irradiated with ultraviolet rays. In this case, the substrate is made transparent and ultraviolet rays are irradiated from above.

The vacuum suction tool has a shape that can completely suction the substrate supported by the holder, and is detachably attached to the holder.

[Effect]

When transferring, fix the stamper to the base and
A substrate whose surface is coated with resin is supported by a holder, the substrate is positioned at a transfer position, and the resin is cured by a resin curing means. When the resin hardening is completed, the entire surface of the substrate is suctioned with a vacuum suction tool, and in this state, the substrate is moved to the retracted position and peeled off from the stamper. In this case, since the entire surface of the substrate is suctioned, it can be peeled off without deforming the substrate, and stress concentration does not occur in the resin, so accurate transfer without defects is achieved.

〔Example〕

The invention will now be described in detail with reference to FIG.

FIG. 1 is a front view showing the structure of a relief shape transfer device according to the present invention. In the figure, 11 is a base, 12 is a holder, and 13 is an octopus sucker-like vacuum suction tool.

Further, 100 is a stamper used as a transfer mask, and 101 is an acrylic resin substrate on which the shape of the relief 102 on the surface of the stamper 100 is to be transferred.

The base 11 is for fixing the stamper 100.

The holder 12 is for supporting the substrate 101, and is supported by the base 11 via a support shaft 14, and has two positions: a transfer position shown in FIG. It is possible to rotate between.

The vacuum suction tool 13 is a substrate 101 supported by the holder 12.
The end portion opposite to the suction side is connected to a vacuum source (not shown). This vacuum suction tool 13 can be attached to and detached from the holder 12.

When transferring onto the substrate 101, as shown in FIG.
The stamper 100 is fixed on the base 11, and the surface is coated with 2P resin (
The substrate 101 coated with the resin 103 is supported by the holder 12, and the holder 12 is positioned at the transfer position. In this state, the 2P resin is in close contact with the surface of the stamper 100 (the surface on which the relief 102 is formed).

At this stage, the vacuum suction tool has been removed.

Next, ultraviolet rays are irradiated from above the substrate 101 using an unillustrated ultraviolet irradiation means (resin curing means) to cure the 2P resin 10.
Cure 3.

Next, when the vacuum suction tool 13 is attached to the substrate 101 and a vacuum is drawn, the vacuum suction tool 13 suctions the entire surface of the substrate 101.

Thereafter, by lifting one end of the holder I2 (the left end in FIG. 1), the holder 12 is rotated to the retracted position and the substrate 101 is pulled away from the stamper 100 #I. in this case,
Since the substrate 101 is peeled off while being completely sucked by the vacuum suction tool 13, the reinforcing effect of this suction allows the substrate 101 to be peeled off without being deformed, and stress concentration is also prevented on the 2P resin 103. doesn't happen. Therefore, accurate transfer without defects is achieved. This peeling off can be performed, for example, by screwing a screw into one end of the holder 12 and rotating the screw to create a jacking effect.

In this way, in this example, the substrate 101 is peeled off by rotating the holder 12 clockwise in FIG. 1, so even in the case of the relief shape shown in FIG. Accurate transfer is possible by rotating the holder 12 in the direction of inclination of the relief and peeling it off.

〔Effect of the invention〕

As described above, according to the present invention, by using a vacuum suction tool, the substrate can be easily peeled off without causing deformation of the substrate or stress concentration of the resin, and accurate transfer is possible. . In addition, since the holder is positioned at the transfer position and the substrate is set on the stamper,
Uniform transfer can be achieved by keeping the thickness of the resin layer constant.

[Brief explanation of the drawing]

FIG. 1 is a front view showing the structure of a relief shape transfer device according to an embodiment of the present invention, FIG. 2 is an explanatory diagram of relief shape transfer procedures using a conventional device, and FIGS. 3(a) and (b) are various types of stampers. This is a cross-sectional view showing a relief shape. In the figure, 11 is a base, 12 is a holder, 13 is a vacuum suction tool, 100 is a stamper, 101 is a substrate, 102 is a relief, and 103 is a 2P resin (resin).

Claims (1)

[Claims] A stamper (10) having a relief (102) formed on its surface.
A base (11) for fixing the resin (1) and a resin (11) on the surface.
03) is coated with a transfer substrate (101),
a holder (12) supported by the base so as to be movable between a transfer position where the resin is in close contact with the surface of the stamper fixed to the base and a retreat position where the resin is evacuated from the position;
), a resin curing means for curing the resin on the substrate at the transfer position, and a vacuum suction tool (13) having a shape capable of sucking the entire surface of the substrate supported by the holder and detachably attached to the holder. ) A relief shape transfer device characterized by: