JPH0520251B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a substrate peeling device, and in particular to a stamper having a groove and an ultraviolet curing resin for adhering an ultraviolet curing resin for transferring a group of substrates such as an optical disk. The present invention relates to a substrate peeling device for peeling off a substrate to which it has been attached.

[Conventional technology]

Conventionally, this type of substrate peeling apparatus, as shown in FIG. 2, pours an ultraviolet curable resin 2 onto a stamper 3 having grooves on its surface, presses a substrate 1 on top of it, and spreads the ultraviolet curable resin 2 thinly. In this state, by irradiating ultraviolet rays through the substrate 1 and curing the ultraviolet curing resin 2, the grooves are transferred and at the same time the ultraviolet curing resin 2 is attached to the substrate 1, and then the stamper 3 is fixed to the upper surface of the base 4a. A cylindrical peeling ring 8 is attached to the outer periphery of the ring so that it can move up and down.
The outer peripheral edge of the substrate 1 was pushed up to separate the substrate 1 from the stamper 3.

[Problem that the invention seeks to solve]

The conventional substrate peeling apparatus described above simultaneously pushes up the outer periphery of the substrate over the entire circumference, so a very large force is required at the beginning and early stage of peeling, and the stress applied to the substrate is also large. Become. Therefore, when glass is used as the substrate, there is a problem that it may break, leading to a decrease in yield and safety.

SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate peeling device that can peel off a substrate with a small external force and also applies less stress to the substrate.

[Means for solving problems]

The substrate peeling device of the present invention includes a stamper having an information pattern formed on its surface to be transferred to the resin on the substrate;
The stamper is fixed on the upper surface and at least 3
a base having screw holes and guide holes provided in parallel in a direction perpendicular to the surface of the stamper; a feed screw fitted in each of the screw holes and movable by rotation; at least three peeling mechanisms including a slide pin penetrating through the guide hole and having one end peeling the substrate from the stamper by sliding in the guide hole by movement of the feed screw; and a rotation mechanism rotating the feed screw. Consists of.

[Effect]

According to the present invention, peeling is started by lifting one of the slide pins provided at at least three locations. Next, by raising the slide pin adjacent to that slide pin, the peeling is expanded. When there are three slide pins, first start peeling with any one slide pin, then raise the slide pin on the right (or on the left), and then raise the slide pin on the left (or on the right). to rise.

Even when a large number of slide pins are used, the peeling is expanded and the entire surface is peeled off by similarly raising the slide pins adjacent to each other on the left and right alternately.
Another method is to start peeling with one slide pin and then rotate clockwise (or counterclockwise).
The slide pins adjacent to each other may be raised sequentially.

By sequentially performing peeling in this manner, smooth peeling can be performed with a small force, and the stress acting on the substrate can be reduced to allow peeling to proceed.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIGS. 1a and 1b are a plan view and a sectional view taken along the line A-A' of an embodiment of the present invention, respectively.

As shown in FIGS. 1a and 1b, a stamper 3 has a groove formed thereon, which is an information pattern to be transferred to the ultraviolet curing resin 2 on a disk-shaped substrate 1, and an outer peripheral edge portion on which the stamper 3 is fixed. A base 4 having screw holes 41 and guide holes 42 provided in three locations in parallel in a direction perpendicular to the surface of the stamper 3.
A feed screw 6 is fitted into each screw hole 41 and can move up and down by rotation, and a feed screw 6 penetrates through each guide hole 42 and slides through the guide hole 42 in conjunction with the up and down movement of the feed screw 6, and the tip of the feed screw 6 touches the board 1. It includes three peeling mechanisms 9 including a slide pin 5 that pushes up and peels off the substrate 1 and the stamper 3, and a cuff 7 as a rotation mechanism fixed to one end of a feed screw 6.

The substrate 1 to which the ultraviolet curable resin 2 that has been cured by ultraviolet irradiation is pushed up by the slide pin 5 that moves upward in conjunction with the feed screw 6 that moves upward as the knob 7 rotates, is partially peeled off from the stamper 3. be done. Note that the tip of the slide pin 5 is connected to the substrate 1.
It is advisable to apply a plastic coat to prevent damage.

As shown in FIG. 1A, among the peeling mechanisms 9 provided at three locations around the peripheral edge of the base 4, the slide pin 5 of the central peeling mechanism 9 is used to push up the substrate 1 to begin peeling. Next, the slide pin 5 adjacent to the right (or left) is moved, followed by the slide pin 5 adjacent to the left (or right), and further returned to the center, thereby sequentially expanding the range of peeling and peeling.

By performing partial peeling in this way, the entire surface can be peeled off with a small force, and the stress applied to the substrate 1 can also be reduced.

In this embodiment, the feed screw 6 is rotated by the knob 7, but a lever may be attached so that peeling can be performed with even smaller force, or a drive mechanism using a combination of a gear mechanism and a motor may be used.

〔Effect of the invention〕

As described above, the present invention starts peeling from one point on the circumference and gradually expands over a wide range, thereby reducing the force required to initiate and progress peeling, and reducing the stress applied to the substrate during peeling. Since it can be made small, even if a glass plate is used as the substrate, crack lines will not occur and the yield and stability can be improved.

[Brief explanation of the drawing]

1A and 1B are a plan view and a sectional view taken along the line A-A' of an embodiment of the present invention, respectively, and FIG. 2 is a sectional view of an example of a conventional substrate peeling apparatus. 1... Substrate, 2... Ultraviolet curing resin, 3... Stamper, 4, 4a... Base, 5... Slide pin, 6... Feed screw, 7... That is, 8... Peeling ring, 9... Peeling mechanism, 41...Screw hole, 42
...Guide hole.

Claims (1)

[Claims] 1. A stamper having an information pattern formed on its surface to be transferred to the resin on the substrate, and screws that fix the stamper to the upper surface and are provided in at least three locations on the outer periphery in parallel in a direction perpendicular to the surface of the stamper. a base having a hole and a guide hole; a feed screw that is fitted into each of the threaded holes and movable by rotation; and one end that penetrates through each of the guide holes and slides through the guide hole as the feed screw moves. A substrate peeling apparatus characterized in that the substrate peeling apparatus includes at least three peeling mechanisms each including a slide pin that peels the substrate from the stamper and a rotation mechanism that rotates the feed screw.