JP4471593B2 - Organic film substrate pasting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate pasting technique of an organic film for forming a film-like organic film on a substrate, and in particular, an organic for forming a substrate that can be processed by forming an organic film on the substrate. The present invention relates to a technique for attaching a film to a substrate, and a technique for attaching an organic film to a substrate that can further produce an optical element on the organic film.
[0002]
[Prior art]
Conventionally, organic materials have been used in a wide variety of applications, and as general optical system parts, they are also used in lenses, wavelength plates, hologram elements, etc., especially optical parts for optical disks. As such, the utility value is high. Hereinafter, conventional examples of optical elements using organic materials will be shown.
[0003]
As a conventional example using an organic material for a hologram element, there is one disclosed in Japanese Patent Laid-Open No. 2000-75130 (Patent Document 1). In this conventional example, since the stretched organic film (about 100 μm) is used, it is necessary to adhere the organic film to the substrate material once using an adhesive or the like.
[0004]
As for the method of attaching the organic film on the substrate, there has been no effective method so far, and there is a strong demand for development. Here, as a conventional technique to be referred to, two patent documents disclosing a method of bonding two disks, Japanese Patent Laid-Open No. 2000-268416 (Patent Document 2), Japanese Patent Laid-Open No. 10-334521 (Patent Document 3). There is.
[0005]
[Patent Document 1]
JP 2000-75130 A (Patent Document 1)
[Patent Document 2]
JP 2000-268416 A (Patent Document 2)
[Patent Document 3]
JP-A-10-334521 (Patent Document 3)
[0006]
[Problems to be solved by the invention]
When the organic material formed on the substrate is processed using a photolithography process or a dry etching process, the surface properties (surface unevenness accuracy and surface uniformity) of the adhered organic film are required. For this reason, a sticking method excellent in surface property is indispensable for an element using an organic material accompanied by processing such as a hologram element.
[0007]
In that case, it is also important to attach the organic film to a predetermined position of the substrate material with high accuracy. However, Patent Document 1 does not disclose anything to improve the surface property and the positional accuracy as described above.
[0008]
The bonding methods disclosed in Patent Documents 2 and 3 improve the uniformity of the adhesive layer and the protrusion of the periphery by irradiating ultraviolet rays while rotating when two disks are bonded with an ultraviolet curable adhesive. However, this method cannot be used as it is when an organic film is formed on a substrate.
[0009]
The reason for this is that when using photolithography and dry etching processes, it is necessary to improve the centering accuracy (position accuracy) and surface properties (surface unevenness accuracy, uniformity), but the surface organic film is placed on the substrate. In the case of forming in the same manner, since the hole cannot be made in the center of the substrate as in the optical disk laminating method disclosed in Patent Documents 2 and 3, the centering (position accuracy) cannot be obtained, and the pasting Is an organic material in the form of a film, so that unevenness occurs on the surface, resulting in problems that the uniformity of the adhesive layer is deteriorated and that the surface unevenness accuracy cannot be formed.
[0010]
In view of the above problems, the present invention provides a substrate pasting technique for an organic film for forming a film-like organic material on a substrate. In particular, the surface properties (surface irregularity accuracy, uniformity after the organic film is stuck to the substrate). It is an object of the present invention to provide a method for attaching a substrate of an organic film capable of improving the position accuracy and improving the positional accuracy.
[0011]
In more detail,
a) In the invention according to claim 1 or 2 , the object is to improve the surface properties after the organic film is attached to the substrate;
b) In the inventions according to claims 3 to 5 , the object is to improve the surface property of the organic film after pasting the substrate by preventing bubble entrainment that occurs when the organic film is stuck to the substrate.
[0012]
[Means for Solving the Problems]
In order to achieve the above object, the present invention has the following configuration.
The features of the structure for each claim will be described below.
[0013]
a) The invention according to claim 1 is a method of attaching an organic film to a substrate material by attaching a film-like organic material onto the substrate material, the step of fixing the film-like organic material on a fixed stage; The method includes a step of spin-coating an adhesive on the organic material, a step of fixing a substrate to a surface coated with the adhesive, and a step of curing the adhesive.
[0014]
Further, the step of fixing the film-like organic material on the fixed stage is a step of adsorbing and fixing the film-like organic material on the fixed stage using a vacuum suction means.
[0016]
Further, the vacuum suction means is constituted by a porous material provided in a portion of the fixed stage in contact with the organic film.
[0017]
b ) The invention described in claim 2 is the organic film substrate sticking method according to claim 1, wherein the porous material is an organic material.
[0018]
c ) The invention according to claim 3 is the method for attaching a substrate to an organic film according to claim 1 or 2 , wherein the step of fixing the substrate to the surface to which the adhesive has been applied is a part of the peripheral portion of the film-like organic material. It includes a step of bringing the substrate into contact with the adhesive at a location and a step of gradually widening the contact surface between the two.
[0019]
d ) The invention according to claim 4 is the method for attaching a substrate to an organic film according to claim 1 or 2 , wherein the step of fixing the substrate to the surface to which the adhesive is applied is a substrate near the center of the film-like organic material. And a step of bringing the adhesive into contact with each other, and then a step of gradually widening the contact surface between the two.
[0020]
e ) The invention according to claim 5 is the method for attaching the organic film to the substrate according to claim 4 , wherein the step of bringing the substrate into contact with the adhesive in the vicinity of the center of the film-like organic material contacts the vicinity of the center of the substrate. The method includes a step of applying pressure in the form of dots from the surface opposite to the surface.
[0022]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
(First Example)
A first embodiment of the organic film substrate sticking method according to the present invention will be described in detail with reference to FIG.
[0023]
First, as shown in FIG. 1A, an organic film 12 (an organic film having a thickness of 100 μm, hereinafter referred to as an organic film or an organic film) is fixed on a fixing stage 11, and an epoxy is used on its upper surface by using a dispenser 15. A system ultraviolet curable resin (hereinafter also referred to as an adhesive or an adhesive layer) 13 is applied, and the fixed stage 11 is rotated by rotating a rotating shaft (not shown) connected to the fixed stage 11. The rotating shaft is inside the bearing cylinder T11 in the figure, and is rotationally driven and controlled by a motor (not shown). In this embodiment, the resin is rotated at about 500 rpm and 600 cp resin is used, and the film thickness is about 50 μm.
[0024]
The size of the fixed stage 11 is a circle having a diameter of 90 mm, and the organic film 12 is also a circle having a diameter of 90 mm. On the contact surface of the fixed stage 11 with the organic film 2, a suction groove having a width of 0.5 mm is formed in a portion 1 mm inside from the outer periphery, and thereby the organic film 12 is fixed to the fixed stage 11.
[0025]
FIG. 2 is a diagram illustrating a state in which the vacuum suction groove 111 is provided in the fixed stage 11. The vacuum suction groove 111 is connected to the vacuum pump through a pipe disposed inside the bearing cylinder T11.
[0026]
Next, as shown in FIG. 1 (b), the substrate 14 (diameter 100 mm, BK7 substrate: thickness 1 mm) is tilted, and is first brought into contact with the adhesive layer (ultraviolet curable resin 13) from a part of the circular outer periphery, and gradually comes into contact. Is mounted on the organic film 12.
[0027]
In this embodiment, the substrate 14 is adsorbed and mounted on the adhesive layer 13 using the substrate fixing stage 16 that vacuum adsorbs the substrate. At this time, the substrate fixing stage 16 is tilted by the holder T16, the substrate 14 is brought into contact with the adhesive layer (ultraviolet curable resin) 13 from a part of the circular outer periphery, and the contact surface is gradually expanded so that the contact surface is gradually widened. A substrate 14 is mounted on 12. These controls can also be performed by program control by a computer (not shown). At this time, it is necessary to suppress the spread speed of the contact area between the adhesive and the substrate as much as possible so that bubbles do not enter the adhesive layer 13 (about 1 mm / sec).
[0028]
Through the process shown in FIG. 1B, the substrate is mounted in the shape shown in FIG. 1C. In this state, as shown in FIG. More ultraviolet rays 17 are irradiated. When the irradiation condition is about 20 mW / cm 2 and 9000 mJ is irradiated, the ultraviolet curable resin is completely cured, and the adhesion between the substrate 14 and the organic film 12 is completed.
[0029]
Here, the substrate 14 on which the organic film 12 is attached is completed by removing the vacuum suction of the fixed stage 11.
[0030]
As described above, in the first embodiment, the organic film 12 is fixed to the fixed stage 11, the adhesive 13 is spin-coated on the organic film 12, the substrate 14 is fixed to the upper portion thereof, and the adhesive 13 is applied. The organic film 12 is formed on the substrate 14 by being cured . As a result, it is possible to form a substrate on which an organic film is pasted, such as an optical disc, which does not have a positional shift even if there is no hole in the center.
[0031]
Further, the method of fixing the organic film 12 to the fixed stage 11 uses vacuum suction, and employs a method of vacuum suction around the suction. Thereby, the surface property with favorable flatness can be ensured .
[0032]
Here, an outline of securing the surface property will be described.
In this embodiment, since the periphery of the film is held by vacuum suction, no tensile force or the like is applied to the central portion.
[0033]
Usually, when the adhesive is cured with a tensile force applied to the surface of the film material, a concave portion having a depth of several μm called a dimple is generated. However, by adhering only the peripheral portion as in this embodiment, a good surface free from dimples can be secured.
[0034]
Also, in this example, by mounting the substrate gradually expanding the contact surface so as not to entrain air bubbles from a part of the peripheral part, no air bubbles are generated and good flatness after pasting is ensured. Can
[0035]
(Second embodiment)
Next, the organic film sticking method of a 2nd Example is demonstrated using FIG.
First, as in the first embodiment, as shown in FIG. 3A, an organic film 22 (an organic film having a thickness of 100 μm) is fixed on a fixing stage 21, and an epoxy system is used on its upper surface by using a dispenser 25. The ultraviolet curable resin 23 is applied, and the fixed stage 21 is rotated by rotating a rotating shaft (not shown) connected to the fixed stage 21. The rotating shaft is inside the bearing cylinder T21 in the figure, and is rotationally driven and controlled by a motor (not shown). In this embodiment, the resin is rotated at about 500 rpm and 600 cp resin is used, and the film thickness is about 50 μm.
[0036]
The size of the fixed stage is a circle with a diameter of 90 mm, and the organic film is also a circle with a diameter of 90 mm. A porous material 212 made of an organic material is formed on the contact surface of the fixed stage 21 with the organic film 22, and the organic film 22 is fixed to the fixed stage 21 through the porous material 212 by vacuum adsorption.
[0037]
FIG. 4 is a diagram showing a state in which a vacuum suction hole 211 is provided in the fixed stage 21 and a porous material 212 made of an organic material is provided thereon. The vacuum suction groove 211 is connected to the vacuum pump through a pipe disposed inside the bearing cylinder T21.
[0038]
Next, as shown in FIG. 3 (b), the substrate 24 (diameter 100mm BK7 substrate: thickness 1mm) is formed in a convex shape with respect to the bonding surface so that the center is pushed out by the external force from the opposite side of the bonding surface. The substrate 24 is mounted on the organic film 22 so as to contact the adhesive layer from the center of the circle.
[0039]
In this embodiment, the substrate 24 is adsorbed and mounted on the adhesive layer using the substrate fixing stage 26 that vacuum adsorbs the substrate. At this time, a pressurizing needle 28 capable of controlling the projection amount is provided at the center of the substrate fixing stage 26, and by controlling the projection amount of the pressurizing needle 28 and the vertical control of the holder T 26 of the substrate fixing stage 26. Then, the substrate 24 is gradually brought into contact with the adhesive layer 23 from the center of the circle. These controls can also be performed by program control by a computer (not shown).
[0040]
At this time, it is necessary to mount the adhesive layer 23 while suppressing the spreading speed of the contact area between the adhesive layer 23 and the substrate 24 as much as possible so that bubbles do not enter the adhesive layer 23 (about 1 mm / sec).
[0041]
Through the process shown in FIG. 3B, the substrate 24 is mounted in a shape as shown in FIG. 3C. In this state, as shown in FIG. Irradiate ultraviolet rays 27 from the surface. When the irradiation condition is about 20 mW / cm 2 and 9000 mJ light is irradiated, the ultraviolet curable resin 23 is completely cured and the adhesion between the substrate 24 and the organic film 22 is completed. Here, by removing the vacuum suction of the fixed stage 21, the substrate 24 to which the organic film 22 is attached is completed.
[0042]
As described above, in the second embodiment, the organic film 22 is fixed to the fixed stage 1, the adhesive (ultraviolet curable resin) is spin-coated, the substrate 24 is fixed to the upper portion, and the adhesive is cured. Thus, the organic film 22 is formed on the substrate 24 . As a result, it is possible to form a substrate with no positional deviation even if there is no hole or the like in the center like an optical disk.
[0043]
Moreover, the method of fixing the organic film 22 to the fixed stage 21 uses vacuum adsorption, and employs a method of fixing the adsorption via an organic porous material. Thereby, the surface property with favorable flatness can be ensured .
[0044]
Here, an outline of securing the surface property will be described.
In this embodiment, the entire organic film is uniformly vacuum-adsorbed with a porous material. Further, the portion corresponding to the suction hole becomes a small region (1 mm or less), and the fixing force to the organic film works at a fine pitch.
[0045]
Usually, when the adhesive is cured in a state where a tensile force is applied to the surface of the film material, a concave portion having a depth of several μm called a dimple is generated. However, by applying a uniform fixing force and bonding as in this embodiment, a good surface free from dimples can be secured.
[0046]
Also, in this embodiment, the substrate mounting is gradually brought into contact from the center toward the peripheral part so as not to entrain the bubbles, thereby preventing the generation of bubbles and ensuring good flatness after pasting. Can
[0047]
Moreover, the board | substrate which affixed the organic film with favorable position accuracy and flatness can be produced in the 1st Example and 2nd Example which were mentioned above by using the apparatus which implement | achieves the operation | movement shown above.
[0048]
【The invention's effect】
The effects of the present invention will be described below for each claim.
a) According to the first aspect of the invention, the step of fixing the film-like organic material on the fixing stage, the step of spin-coating the adhesive on the film-like organic material, and the surface on which the adhesive is applied The position accuracy depends on the installation accuracy of the substrate, and the control of the film thickness of the adhesive layer also depends on the number of rotations of the coating. A substrate to which an organic film is attached with good flatness can be formed.
[0049]
In addition, since vacuum adsorption is used, not only can the organic film material be accurately fixed to the fixed stage, but also the flatness can be determined so as to follow the flatness of the fixed stage. An attached substrate can be formed.
[0051]
In addition, by using vacuum adsorption and the portion of the fixing stage in contact with the organic film being a porous material, not only can the organic film material be accurately fixed to the fixing stage, but also by relatively small irregularities. A relatively large deterioration in flatness due to the suction holes of the fixed stage can be prevented. Furthermore, since generation | occurrence | production of the big dent etc. of the film surface by shrinkage | contraction etc. of an adhesive material can also be suppressed, the board | substrate with which the organic film was stuck with favorable flatness can be formed.
[0052]
b ) According to the invention described in claim 2 , since a porous material made of an organic material is used, the replacement frequency can be increased, and quality deterioration due to clogging of the porous material due to dust or adhesive can be prevented. Will be able to.
[0053]
c ) According to the invention described in claim 3, since the contact surface is gradually widened from a part of the peripheral part to the whole, it is possible to prevent entrainment of bubbles when spreading at the time of adhesion. For this reason, there is no influence of surface irregularities due to bubbles, and a substrate with an organic film attached with good flatness can be formed.
[0054]
d ) According to the invention described in claim 4 , since the contact surface is gradually expanded from the central portion to the peripheral portion, it is possible to prevent entrainment of bubbles when spreading at the time of adhesion. For this reason, there is no influence of surface irregularities due to bubbles, and a substrate with an organic film attached with good flatness can be formed.
[0055]
e ) According to the invention described in claim 5 , pressure is applied in the form of dots from the opposite side of the contact surface in the vicinity of the center of the substrate so that the contact surface is gradually widened from the center portion. Can be prevented. For this reason, there is no influence of surface irregularities due to bubbles, and a substrate with an organic film attached with good flatness can be formed.
[Brief description of the drawings]
FIG. 1 is a diagram for explaining a first embodiment of a method for attaching a substrate of an organic film according to the present invention.
FIG. 2 is a diagram for explaining a configuration example of a fixed stage used in the first embodiment of the organic film substrate pasting method according to the present invention.
FIG. 3 is a view for explaining a first embodiment of an organic film substrate pasting method according to the present invention.
FIG. 4 is a view for explaining a configuration example of a fixing stage and a porous material used in a second embodiment of the method for attaching an organic film to a substrate according to the present invention.
[Explanation of symbols]
11, 21: Fixed stages 111, 161, 261: Vacuum suction grooves 12, 22: Organic film (organic film)
13, 23: UV curable resin (adhesive or adhesive layer)
14, 24: Substrate 15, 25: Dispenser 16, 26: Substrate fixing stage 17, 27: Ultraviolet light 211: Vacuum suction hole 212: Porous material (organic material)
28: Pressurizing needles T11, T21: Bearing cylinder T16, T26: Holder

Claims (5)

An organic film substrate pasting method for pasting a film-like organic material on a substrate material,
A step of fixing a film-like organic material on a fixing stage, a step of spin-coating an adhesive on the film-like organic material, a step of fixing a substrate on the surface coated with the adhesive, and the bonding A step of curing the agent,
And the step of fixing the film-like organic material on the fixed stage is a step of adsorbing and fixing the film-like organic material on the fixed stage using a vacuum suction means,
The vacuum suction means is composed of a porous material provided in a portion of the fixed stage that is in contact with the organic film, and an organic film substrate for attaching a film-like organic material on the substrate Pasting method. In the organic film board | substrate sticking method of Claim 1,
A method for attaching a substrate to an organic film, wherein the porous material is an organic material. The organic film substrate pasting method according to claim 1 or 2,
The step of fixing the substrate to the surface to which the adhesive has been applied includes the step of bringing the substrate and the adhesive into contact with each other at one location around the film-like organic material, and then gradually increasing the contact surface between the two. A method for attaching a substrate to an organic film, comprising the step of: The organic film substrate pasting method according to claim 1 or 2,
The step of fixing the substrate to the surface coated with the adhesive includes the step of bringing the substrate and the adhesive into contact with each other in the vicinity of the center of the film-like organic material, and then gradually widening the contact surface between the two. A method for attaching a substrate to an organic film, comprising: In the method for affixing a substrate of an organic film according to claim 4,
The step of bringing the substrate and the adhesive into contact with each other in the vicinity of the center of the film-like organic material includes a step of applying pressure in the form of dots from the surface opposite to the contact surface near the center of the substrate. To paste the organic film to the substrate.

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