JP2021130112A - Protective membrane formation device - Google Patents

Abstract

To provide a protective membrane formation device that can acquire a substrate formed with a protective membrane, even if it is a substrate without a hole in a formation region of the protective membrane.SOLUTION: A protective membrane formation device forms a protective membrane P constituted of an adhesive agent R by bonding a molding plate G to a substrate S while being interposed with the adhesive agent R between them. The protective membrane formation device includes: a stage 2 for placing the substrate S thereon; a substrate drive mechanism 3 for causing the stage 2 to advance or retreat relative to the molding plate G; and a detaching unit 4 for detaching the protective membrane P from the molding plate G by moving the substrate S in a direction of separating from the molding plate G.SELECTED DRAWING: Figure 3

Description

The present invention relates to a protective film forming apparatus for forming a protective film on a substrate.

An optical disk such as a DVD is provided with a recording layer formed by depositing a reflective film on a disk-shaped substrate having a hole in the center and a recording layer made of a translucent film provided on the recording layer. .. The following methods are known as methods for manufacturing such optical discs. That is, a recording surface is formed on one side of each of the two substrates. A reflective film is vapor-deposited on the recording surface of one substrate to form a recording layer, and a translucent film is vapor-deposited on the recording surface of the other substrate to form a recording layer.

Then, the recording layers of these two substrates are opposed to each other and bonded together with an adhesive. After the adhesive is cured, the other substrate is peeled off at the interface with the translucent film to transfer the recording layer made of the translucent film to the adhesive side.

For this peeling, a technique using a hole provided in the center of the substrate is used. That is, a technique is known in which compressed air is supplied from the central hole to separate the translucent film from the substrate (see, for example, Patent Document 1).

Japanese Patent No. 4020665

By the way, in a display panel of a mobile terminal typified by a smartphone, a protective film made of an adhesive such as an ultraviolet curable resin may be formed on the surface of a substrate such as a touch panel, which is a component of the display panel. Then, it is conceivable to apply the technique of Patent Document 1 to the formation of such a protective film. That is, protection made of an adhesive is formed by pressing the other substrate against the substrate coated with the adhesive to form a layer of the adhesive, then curing the adhesive and peeling the other substrate. Form a film.

In the case of a substrate having a hole in the center such as an optical disk, it can be peeled off by supplying compressed air to the hole in the center. However, the conventional technique cannot be applied to a substrate having no in-plane holes because there is no supply port for compressed air.

The present invention has been made to solve the above problems, and an object of the present invention is a substrate on which a protective film is formed even if the substrate is not provided with holes in the region where the protective film is formed. It is an object of the present invention to provide a protective film forming apparatus which can obtain.

The protective film forming apparatus of the present invention is a protective film forming apparatus for forming a protective film made of the adhesive by adhering a molding plate and a substrate with an adhesive interposed therebetween, and includes a stage on which the substrate is placed and the above. It is provided with a substrate driving mechanism for advancing and retreating the stage with respect to the molded plate, and a peeling unit for peeling the protective film from the molded plate by moving the substrate in a direction of pulling it away from the molded plate. It is characterized by.

The peeling unit includes a pressing member that presses the area where the adhesive has not been applied, which protrudes from the molded plate of the substrate, and a moving mechanism that moves the pressing member with respect to the molded plate in the direction of pulling the member apart. , May be provided.

In the substrate driving mechanism and the moving mechanism, the stage may support the substrate, and the pressing member may move the substrate along the pulling direction with respect to the molded plate while pressing the region. ..

The pressing member is a rod extending in a direction orthogonal to the stage, and the tip of the rod may be rounded or inclined.

The substrate has a rectangular shape, and the pressing member has a plurality of claws that press the region of the substrate, and the claws protrude from the molded plate of the substrate at intervals and are located along two opposite sides of the substrate. It may be provided.

The jig is provided with a jig that is placed on the stage and supports the molded plate and the substrate, and a jig regulating portion that regulates the movement of the jig on the stage by the substrate driving mechanism. , A base plate, a base on which the substrate provided on the base plate is placed, a molded plate support member provided opposite to the base plate and supporting the molded plate, and a base plate provided on the base plate. The substrate drive mechanism has an elastic member that supports the molded plate support member, the substrate driving mechanism advances the jig to the jig regulation portion, and the molded plate support member hits the jig regulation portion. You may make them touch.

The jig may be provided with a guide for regulating the expansion / contraction direction of the elastic member between the molded plate support member and the base plate.

According to the present invention, it is possible to obtain a protective film forming apparatus capable of obtaining a substrate on which a protective film is formed even if the substrate is not provided with holes in the protective film forming region.

It is a schematic view seen from the upper surface of the protective film forming apparatus which concerns on 1st Embodiment. It is a schematic cross-sectional view of the protective film forming apparatus seen from the arrow AA direction of FIG. It is a schematic cross-sectional view of the protective film forming apparatus seen from the arrow view BB direction of FIG. It is a schematic diagram which shows the molding process of the protective film in the protective film forming apparatus which concerns on 1st Embodiment. It is a schematic view seen from the upper surface of the protective film forming apparatus which concerns on 2nd Embodiment. It is a schematic cross-sectional view of the protective film forming apparatus seen from the arrow CC direction of FIG. It is a schematic cross-sectional view of the protective film forming apparatus seen from the arrow DD direction of FIG. It is a schematic diagram which shows the molding process of the protective film in the protective film forming apparatus which concerns on 2nd Embodiment. It is a schematic view seen from the upper surface of the jig used for the protective film forming apparatus which concerns on 3rd Embodiment. It is a schematic view seen from the upper surface of the protective film forming apparatus which concerns on 3rd Embodiment. It is a schematic cross-sectional view of the protective film forming apparatus seen from the arrow view EE direction of FIG. It is a schematic cross-sectional view of the protective film forming apparatus seen from the arrow view FF direction of FIG. It is a schematic diagram which shows the molding process of the protective film P in the protective film forming apparatus which concerns on 3rd Embodiment, and shows from the mounting of the jig to the bonding. It is a schematic diagram which shows the molding process of the protective film P in the protective film forming apparatus which concerns on 3rd Embodiment, and shows up to the formation of the protective film and the start of peeling thereof. It is a schematic diagram which shows the molding process of the protective film P in the protective film forming apparatus which concerns on 3rd Embodiment, and shows up to the formation of the protective film and the completion of peeling thereof. It is a schematic diagram of the protective film forming apparatus which concerns on another embodiment. It is a schematic diagram of the protective film forming apparatus which concerns on another embodiment. It is a schematic diagram of the protective film forming apparatus which concerns on another embodiment.

Hereinafter, the protective film forming apparatus according to the embodiment of the present invention will be described with reference to the drawings. It should be noted that the drawings are merely schematic views, and some members of the apparatus configuration may be described only in one of the drawings and may be omitted in the other drawings.

[First Embodiment]
(composition)
FIG. 1 is a schematic view of the protective film forming apparatus according to the first embodiment as viewed from above. FIG. 2 is a schematic cross-sectional view of the protective film forming apparatus seen from the direction of arrow AA in FIG. 1, and FIG. 3 is a schematic cross-sectional view of the protective film forming apparatus seen from the direction of arrow BB in FIG. be.

The protective film forming apparatus according to the present embodiment is an apparatus for forming a protective film P made of an adhesive R by adhering a molding plate G and a substrate S with an adhesive R interposed therebetween. The molding plate G is a plate-like body for molding the protective film P, and here, it is a rectangular glass plate having translucency, and more specifically, a transparent and rectangular glass plate in a plan view. Is. The lower surface of the molding plate G for forming the adhesive R is formed flat, and the lower surface is arranged so as to be parallel to the horizontal plane.

The substrate S is a rectangular object that forms the protective film P, and is, for example, a touch panel or a cover panel thereof. Such a substrate S is generally configured to be incorporated in a flat-panel display device represented by a liquid crystal display or an organic EL display, that is, a so-called flat panel display. The substrate S corresponds to a display panel, a backlight, a light guide plate for a backlight, and the like, in addition to the above-mentioned touch panel and cover panel.

Such a substrate S is incorporated into the housing individually or in a state of being laminated in advance. For example, a protective cover configured as a composite panel in which a touch panel is laminated may be used. As described above, there are various forms of the substrate S, and the substrate S constituting the display device is referred to as a display device member.

In the present embodiment, the substrate S will be described as a member constituting the display device, but the present invention is not limited to this, and can be applied to any substrate on which a protective film needs to be formed. Is.

As shown in FIG. 1, the substrate S is provided with a coated region S1 to which the adhesive R is applied and an uncoated region S2 to which the adhesive R is not applied. The coated region S1 is provided in the central portion of the substrate S, and the uncoated region S2 is provided around the uncoated region S2. The uncoated region S2 may be provided at a portion that protrudes when the substrate S is overlapped with the molded plate G, even if it is not the entire circumference of the coated region S1. Here, the uncoated areas S2 are provided at at least two locations along two opposite sides. The region on the substrate S is divided into a film-formed region and a non-film-formed region by the formation of the protective film P. When the protective film P is formed, the adhesive R is expanded by bonding the molded plate G and the substrate S, so that the film-formed region is larger than the coated region S1 and the uncoated region is the uncoated region. Although it is smaller than S2, in the present embodiment, it will be described as having no effect on the formation and peeling of the protective film P.

Specifically, the substrate S can be a so-called mother glass for collectively creating a plurality of touch panels, cover panels, and the like. The substrate S is finally individualized for each product substrate such as a touch panel or a cover panel, but in consideration of convenience in the production process until the substrate S is individualized, the outer peripheral portion is a margin that is not used as a product. The margin portion is an uncoated region S2 and a film unformed region.

The adhesive R is a resin, and here, it is an ultraviolet irradiation curable resin. The adhesive R may be a material of the protective film P and may be in a state of being bonded to the substrate S after curing, and must have a function of bonding the substrate S to another object before curing. No.

The protective film forming apparatus attaches the substrate S coated with the adhesive R to the molded plate G to form the protective film P on the substrate S. Specifically, the protective film forming apparatus includes a vacuum chamber 1, a stage 2, a substrate driving mechanism 3, and a peeling unit 4. In this specification, the directions and positional relationships may be referred to as "upper" and "lower", but "upper" and "lower" refer to the positional relationship in the protective film forming apparatus. It does not refer to the positional relationship or direction when the protective film forming device is installed.

As shown in FIG. 2, the vacuum chamber 1 has a box-shaped main body portion 11 having an opening on one surface, and a lid portion 12 that closes the opening. An exhaust device (not shown) is provided in the vacuum chamber 1, and a vacuum state is formed inside the exhaust device. The lid portion 12 is provided so as to be airtight and openable / closable in the vacuum chamber 1, and has an annular block 121, a quartz glass 122, and a quartz glass fixing member 123.

The annular block 121 is provided so that its outer edge rests on the opening edge of the main body 11, and is detachably fixed to the main body 11. When the device is in operation, the annular block 121 is fixed to the main body 11 with the opening edge of the main body 11 located between the outer peripheral edge and the inner peripheral edge thereof. The quartz glass fixing member 123 is an annular block body, and an annular step is provided around the central hole thereof, and the quartz glass 122 is fixed by being supported by the step.

The molded plate fixing member 124 is fixed to the lid portion 12. The molded plate fixing member 124 is a member for fixing the molded plate G in the vacuum chamber 1, is composed of a pair of members separated by a predetermined interval as shown in FIGS. 1 and 2, and is provided on the quartz glass fixing member 123. ing. The molded plate G is fixed in the vacuum chamber 1 by the molded plate fixing member 124 in a state of being in surface contact with the quartz glass 122. However, the molded plate G may be fixed in the vacuum chamber 1 and may not necessarily be in contact with the quartz glass 122. The molded plate fixing member 124 fixes the molded plate G by supporting two opposing sides of the molded plate G protruding from the substrate S. At this time, the lower surface of the molding plate G is a flat surface on which the adhesive R is molded.

The quartz glass 122 is exposed to the outside of the vacuum chamber 1 through the central hole of the annular block 121. An ultraviolet irradiation device 10 is provided at a position facing above the quartz glass 122, and irradiates the inside of the vacuum chamber 1 via the quartz glass 122 and the molded plate G.

The stage 2 is a member on which the substrate S is placed, and is provided in the vacuum chamber 1. The stage 2 is a flat plate that is the same size as or slightly larger than the substrate S, and supports the entire substrate S. Here, the stage 2 is a flat plate having the same size as the substrate S. As shown in FIG. 1, the substrate S is placed on the stage 2 so that two opposite sides protrude from the molding plate G when viewed in a plan view. This protruding region does not overlap with the molded plate fixing member 124 in the vertical direction.

The substrate drive mechanism 3 is connected to the stage 2 and advances and retreats the stage 2 with respect to the molding plate G. The advancing / retreating direction is a vertical direction orthogonal to the molded plate G. The substrate drive mechanism 3 is composed of a rod 31 which is airtightly inserted into the vacuum chamber 1 and one end of which is connected to the stage 2, and a drive source 32 which is connected to the other end of the rod 31 and advances and retreats the rod 31. As the drive source 32, for example, an air cylinder can be used.

The peeling unit 4 has a rod 41 extending perpendicularly to the lower surface of the molded plate G, and a moving mechanism 42 for moving the rod 41 along the direction of pulling the rod 41 away from the molded plate G or the molded plate fixing member 124. In the present embodiment, the rod 41 is columnar and extends in a direction orthogonal to the mounting surface of the substrate S of the stage 2, and when the substrate S is mounted on the stage 2, the rod 41 is mounted on the stage 2. It extends in a direction orthogonal to the substrate S. That is, as shown in FIG. 1, the rod 41 is a pressing member that presses the protruding region of the substrate S from the molded plate G. Here, it is assumed that the protruding region of the substrate S from the molded plate G and the uncoated region S2 coincide with each other. A plurality of rods 41 are provided on the uncoated region S2 at equal intervals along two opposite sides (hereinafter, also referred to as protruding sides) protruding from the molded plate G (here, three rods on each protruding side, for a total of 6). Book) is provided. Therefore, the rod 41 does not physically interfere with the molded plate fixing member 124 provided along the two sides orthogonal to the protruding side.

The three rods 41 along one protruding side and the three rods 41 along the other protruding side are each connected by a connecting portion 43. The connecting portion 43 is, for example, a long plate or a long block extending in the alignment direction of the rods 41. When the molded plate G and the substrate S are bonded, the rod 41 retracts to a retracted position above the lower surface of the molded plate G, descends after bonding, and comes into contact with the uncoated region S2 of the substrate S. The moving mechanism 42 uses an air cylinder as a drive source to move the rod 41 up and down via the connecting portion 43. As the moving mechanism 42, a ball screw mechanism driven by a motor can be used instead of the air cylinder.

(Action)
The operation of the protective film forming apparatus according to the present embodiment will be described with reference to FIG. FIG. 4 is a schematic view showing a molding process of the protective film P. It is assumed that the molded plate G is previously fixed to the lid portion 12 in the vacuum chamber 1 by the molded plate fixing member 124, and the inside is in a vacuum state by the exhaust device. Further, the loading and unloading of the substrate S into the vacuum chamber 1 and the loading and unloading on the stage 2 shall be automatically performed using a load lock chamber and a transporting means (not shown).

First, as shown in FIG. 4A, the substrate S is placed on the stage 2 with the adhesive R applied. At this time, the substrate S faces the molded plate G, and as shown in FIG. 1, the uncoated region S2 protrudes from the molded plate G.

Next, as shown in FIG. 4B, the substrate driving mechanism 3 raises the stage 2, and the substrate S and the molded plate G are bonded to each other via the adhesive R. That is, as the stage 2 rises, the adhesive R comes into contact with the molded plate G and is spread on the substrate S. When the stage 2 rises to a preset height, the stage 2 is stopped, and in that state, the adhesive R is irradiated with ultraviolet rays by the ultraviolet irradiation device 10 (see FIG. 4C). Ultraviolet rays pass through the quartz glass 122 and the molded plate G via the annular block 121 and reach the adhesive R. As a result, the adhesive R is cured, and a protective film P made of the adhesive R is formed between the molded plate G and the substrate S. Here, the preset height is, for example, a height at which the adhesive R spread by pressing against the molded plate G spreads over the entire film forming region.

At the time of this bonding, the rod 41 is retracted to the retracted position. After the irradiation of ultraviolet rays is stopped, the rod 41 is lowered by the moving mechanism 42, and the tip of the rod 41 comes into contact with the uncoated region S2 of the substrate S. At that time, since the stage 2 supports the substrate S, as shown in FIG. 4D, the protruding portion of the substrate S from the molding plate G is sandwiched between the tip of the rod 41 and the stage 2. .. The rod 41 and the stage 2 descend at the same descending speed while the protruding portion is sandwiched. In other words, in the substrate drive mechanism 3 and the moving mechanism 42, the stage 2 supports the substrate S, and the rod 41 holds the uncoated region S2 while moving the substrate S away from the molding plate G (in this case, downward). Move. In the present embodiment, since an air cylinder is used as the moving mechanism 42, if the rod 41 is pressed against the substrate S with a predetermined force, the rod 41 is lowered at the same speed as the stage 2 only by lowering the stage 2. be able to.

At this time, since the adhesive R has already been cured, the protective film P is adhered to the substrate S and also to the molded plate G. Therefore, the protective film P is prevented from peeling off from the molded plate G, but as shown in FIG. 4 (e), the end portion of the substrate S is pushed down by the rod 41, so that the substrate S is warped and protected from the molded plate G. The film P is peeled off in order from the end. That is, since the protective film P is adhered to the molded plate G in the central portion of the substrate S, it tries to stay in place, but since the end of the substrate S is pushed down by the rod 41, the protective film facing the protruding side A force in the direction of peeling from the molded plate G acts intensively on the end portion of P. As a result, the protective film P is peeled from the molded plate G from its end. In this way, since the rod 41 is pushed down while the substrate S is supported by the stage 2, the peeling can be started at the same time as the stage 2 is lowered.

Further, continuously, the rod 41 and the stage 2 lower the substrate S to gradually peel off the protective film P from the edge of the substrate S toward the central portion, and finally the entire protective film P is formed by the molded plate G. (Fig. 4 (f)). Since the lower surface of the molded plate G is flat, the surface of the formed protective film P is flat. As described above, the substrate S having the protective film P formed on the surface can be obtained. After the protective film P is peeled off, the rod 41 is raised to a predetermined position.

(effect)
The protective film forming apparatus of the present embodiment is a protective film forming apparatus that forms a protective film P made of an adhesive R by adhering a molding plate G and a substrate S with an adhesive R interposed therebetween. The protective film P is peeled off from the molded plate G by moving the stage 2 on which the stage 2 is placed, the substrate driving mechanism 3 for advancing and retreating the stage 2 with respect to the molded plate G, and the substrate S in the direction of pulling away from the molded plate G. It is provided with a unit 4.

As a result, even when the molded plate G and the substrate S having no holes in the surface are bonded to each other via the adhesive R, the protective film P is molded and then the protective film P is peeled off from the molded plate G. It is possible to obtain a substrate S having a protective film P formed on its surface.

The peeling unit 4 includes a pressing member that presses the region protruding from the molded plate G of the substrate S, and a moving mechanism 42 that moves the pressing member along the direction of pulling the pressing member away from the molded plate G. The rod 41 extends in a direction orthogonal to the stage 2.

As a result, the protruding region of the substrate S from the molded plate G can be first warped so that the molded plate G can be gradually peeled from the edge of the protective film P, and the protective film P can be easily peeled off. As a result, it is possible to prevent the protective film P from remaining on the molded plate G.

In the substrate driving mechanism 3 and the moving mechanism 42, the stage 2 supports the substrate S, and the rod 41 moves the substrate S along the direction of pulling it away from the molded plate G while pressing the uncoated region S2. As a result, even if the uncoated region S2 of the substrate S moves in the direction of being separated and the substrate S warps, the uncoated region S2 at the end of the substrate S is sandwiched between the rod 41 and the stage 2, so that the stage It is possible to prevent the displacement of the substrate S on the 2. As a result, for example, when the substrate S is carried out after the protective film P is peeled off, it is possible to prevent problems such as interference with other components due to misalignment.

The substrate S has a rectangular shape, and a plurality of rods 41 are provided along two opposite sides protruding from the molded plate G of the substrate S.

As a result, the protective film P can be peeled off cleanly by peeling the protective film P not from one point but from the opposite sides. In other words, it is possible to prevent the protective film P from remaining on the molded plate G. Further, since the amount of movement of the stage 2 and the rod 41 is smaller than that of peeling from one point or one side, the size of the device can be reduced. As a modification, the plurality of rods 41 provided along the protruding side may have different lengths. For example, if the middle rod 41 is made shorter than the outside among the three rods 41 on one side, when the rod 41 is lowered by the moving mechanism 42, the outer rod 41 comes into contact with the uncoated region S2 of the substrate S. Therefore, the warp of the substrate S can be adjusted.

[Second Embodiment]
(composition)
The protective film forming apparatus according to the second embodiment will be described with reference to FIGS. 5 to 8. The second embodiment has the same basic configuration as the first embodiment. Therefore, only the points different from those of the first embodiment will be described, and the same parts as those of the first embodiment are designated by the same reference numerals and detailed description thereof will be omitted.

FIG. 5 is a schematic view of the protective film forming apparatus according to the second embodiment as viewed from above. FIG. 6 is a schematic cross-sectional view of the protective film forming apparatus seen from the direction of arrow CC in FIG. FIG. 7 is a schematic cross-sectional view of the protective film forming apparatus seen from the direction of arrow DD in FIG.

As shown in FIG. 5, the pressing member of the present embodiment is a plate-shaped body 44 having a claw 44a for pressing the uncoated region S2 of the substrate S, and has an E-shape in a plan view. Claws 44a form each leg portion of the E-shape, and three claws 44a are connected by a long plate portion. However, the number of claws 44a is not particularly limited, and at least one or more claws may be provided.

Here, two plate-shaped bodies 44 are provided as pressing members so that the claws 44a face each other and are orthogonal to the extending direction of the molded plate fixing member 124 between the molded plate fixing members 124 when viewed in a plan view. , Does not physically interfere with the molded plate fixing member 124. In other words, when viewed in a plan view, the plate-like bodies 44 are arranged to face each other so that the claws 44a extend toward two sides that are not supported by the molding plate fixing member 124 of the molding plate G.

As shown in FIG. 6, the plate-shaped body 44 is located slightly below the molded plate fixing member 124, and is positioned beside the molded plate G when the molded plate G is arranged on the molded plate fixing member 124. do. That is, the height at which the plate-shaped body 44 is arranged is a height at which the molded plate G bridged to the molded plate fixing member 124 and the substrate S do not interfere with each other, more specifically, the height of the molded plate G. It is retracted to a retracted position higher than the bottom surface. In the present embodiment, the portion of the claw 44a is thinner than the connecting portion 43, and the thin portion of the claw 44a is located on the protruding region of the substrate S from the molded plate G. It is not necessary to reduce the thickness of the plate-shaped body 44 only at the portion of the claw 44a, and the thickness may be uniform.

The claw 44a faces the uncoated region S2 protruding from the molded plate G of the substrate S. As shown in FIG. 7, the plate-shaped body 44 is provided with two rod-shaped bodies 45 extending upward so as to be orthogonal to the plate-shaped body 44. These rod-shaped bodies 45 are connected by a connecting portion 43, and the rod-shaped body 45 is connected to the moving mechanism 42 via the connecting portion 43. That is, when the rod-shaped body 45 moves the plate-shaped body 44 in the direction of pulling the plate-shaped body 44 away from the molded plate G by using the moving mechanism 42 as a drive source, the claws 44a are lowered and are not attached to the substrate S bonded to the molded plate G. Contact in the coating area S2.

(Action)
The operation of the protective film forming apparatus according to the present embodiment will be described with reference to FIG. FIG. 8 is a schematic view showing a molding process of the protective film P. Note that FIGS. 8 (a) to 8 (c) have the same operations as those in FIGS. 4 (a) to 4 (c), and thus the description thereof will be omitted.

When the molded plate G and the substrate S are bonded together, the plate-shaped body 44 is retracted to the retracted position. After the irradiation of ultraviolet rays is stopped, the rod-shaped body 45 is lowered by the moving mechanism 42, and the lower surface of the claw 44a comes into contact with the uncoated region S2 of the substrate S. At that time, since the stage 2 supports the substrate S, as shown in FIG. 8D, the protruding portion of the substrate S from the molding plate G is sandwiched between the stage 2 and the stage 2. With the protruding portion sandwiched between the plate-shaped body 44 and the stage 2, the plate-shaped body 44 and the stage 2 descend at the same descending speed.

At this time, since the adhesive R has already been cured, the protective film P is adhered to the molded plate G together with the substrate S. Although the protective film P is not peeled off from the molded plate G, as shown in FIG. 8 (e), when the end portion of the substrate S is pushed down by the claw 44a, the substrate S is warped and the protective film is warped from the molded plate G. P peels off in order from the end. At this time, while the rod-shaped body 45 descends, the claw 44a away from the rod-shaped body 45 receives a drag force from the uncoated region S2 of the substrate S, so that the plate-shaped body 44 itself bends and the end portion of the substrate S is formed. Since it can be pressed only by the corners (sides) of the uncoated region S2, the uncoated region S2 is likely to warp, and the protective film P can be easily peeled off. Further, as compared with the first embodiment, since one side of the uncoated region S2 is pushed down as a whole, damage and scratches on the substrate S can be suppressed as compared with pushing down locally. Further, when the claw 44a and the stage 2 continuously lower the substrate S, the peeling spreads to the central portion of the protective film P, and the entire protective film P is peeled from the molded plate G (FIG. 8 (f)). Since the molded plate G is flat, the surface of the formed protective film P is flat. As described above, the substrate S having the protective film P formed on the surface can be obtained. After the protective film P is peeled off, the plate-shaped body 44 is raised to the retracted position.

(effect)
In the present embodiment, the pressing member is a plate-shaped body 44 having a claw 44a that presses the uncoated region S2 of the substrate S. Further, the substrate S has a rectangular shape, and a plurality of claws 44a are provided at intervals, and the plate-shaped body 44 is provided so that the claws 44a protrude from the molded plate G of the substrate S and are provided along two opposite sides. I made it.

As a result, the protective film P can be peeled off cleanly by peeling the protective film P not from one point but from the opposite sides. In other words, it is possible to prevent the protective film P from remaining on the molded plate G.

[Third Embodiment]
(composition)
The protective film forming apparatus according to the third embodiment will be described with reference to FIGS. 9 to 13. The third embodiment has the same basic configuration as the second embodiment. Therefore, only the points different from those of the second embodiment will be described, and the same parts as those of the second embodiment are designated by the same reference numerals and detailed description thereof will be omitted.

In the second embodiment, the molding plate G is previously fixed in the vacuum chamber 1 by the molding plate fixing member 124, but in the present embodiment, both the molding plate G and the substrate S are placed in the vacuum chamber 1 by the jig 5. It will be carried in. In this embodiment, the molded plate fixing member 124 is not provided.

FIG. 9 is a schematic view of the jig 5 used in the protective film forming apparatus according to the third embodiment as viewed from the upper surface. FIG. 10 is a schematic view of the protective film forming apparatus according to the third embodiment as viewed from above. FIG. 11 is a schematic cross-sectional view of the protective film forming apparatus seen from the direction of arrow EE in FIG. FIG. 12 is a schematic cross-sectional view of the protective film forming apparatus seen from the direction of arrow FF in FIG.

The jig 5 is a unit that carries in and out a substrate S, which is a molding target of the protective film P, and a molding plate G, which forms the protective film P, into the vacuum chamber 1 as a set, and is molded with the substrate S. It is used for laminating plates G. The jig 5 is provided in the protective film forming apparatus of the present embodiment.

As a specific configuration, as shown in FIGS. 9 to 12, the jig 5 includes a base plate 51, a base 52, a molded plate support member 53, a spring 54, and a guide 55.

The base plate 51 is a rectangular flat plate and serves as a base for the jig 5. The base 52 is, for example, a rectangular parallelepiped block body, which is provided on the base plate 51, and the upper surface thereof is a mounting surface on which the substrate S is placed.

The molded plate support member 53 is provided so as to face the base plate 51, and supports the molded plate G so as to be able to move up and down with respect to the base plate 51. Specifically, the molded plate support member 53 is composed of a pair of long plate-shaped bodies 53a and 53b, and is provided with a step on which one side portion of the molded plate G, specifically, the short side portion is placed. There is. The molded plate support member 53 is provided so that the elongated plates 53a and 53b are parallel to each other and face the base plate 51, and the short side of the molded plate G is supported by the stepped portion.

The spring 54 is an elastic member provided on the base plate 51 and supporting the molded plate support member 53. Specifically, one end of the spring 54 is fixed to the base plate 51, and the other end is fixed to the lower surface of the molded plate support member 53. A plurality of springs 54 are provided, and here, two springs are provided for each of the elongated plate-shaped bodies 53a and 53b. The spring 54 is a compression spring that urges the molded plate support member 53 and the base plate 51, and expands and contracts in the vertical direction. The spring 54 has an elastic force larger than the adhesive force of the protective film P to the molded plate G. That is, the repulsive force generated by the elastic force of the compressed spring, that is, the force for peeling the protective film P from the molded plate G is larger than the force required for peeling the protective film P from the molded plate G. A spring 54 is used.

The guide 55 is provided between the molded plate support member 53 and the base plate 51 at right angles to the guide 55, and regulates the expansion / contraction direction of the spring 54. For example, the guide 55 has a multi-cylinder structure and can be expanded and contracted in the vertical direction by expanding and contracting the spring 54.

Further, the protective film forming device of the present embodiment includes, in addition to the jig 5, a jig regulating unit that regulates the movement of the jig 5 on the stage 2 by the substrate driving mechanism 3. The jig regulating unit regulates the ascending movement of the molding plate G and the molding plate support member 53 when the stage 2 on which the jig 5 is placed rises. Here, the jig regulating portion is the quartz glass fixing member 123 and the quartz glass 122 fixed in the vacuum chamber 1.

(Action)
The operation of the protective film forming apparatus of the present embodiment will be described with reference to FIGS. 13 to 15. 13 to 15 are schematic views showing a molding process of the protective film P in the protective film forming apparatus according to the present embodiment. The figure on the left side in FIGS. 13 to 15 shows a schematic view of the protective film forming apparatus seen from the direction E of FIG. 10, and the figure on the right side in FIGS. 13 to 15 shows the protective film seen from the direction F of FIG. The schematic diagram of the forming apparatus is shown.

It is assumed that the molding plate G is supported by the molding plate supporting member 53 and the substrate S coated with the adhesive R on the surface is placed on the base 52 in the jig 5 in advance by the work of the worker. do. That is, the substrate S faces the molded plate G, and the uncoated region S2 protrudes from the molded plate G when viewed in a plan view. Further, the loading and unloading of the jig 5 into the vacuum chamber 1 and the loading and unloading of the jig 5 on the stage 2 shall be automatically performed using a load lock chamber and a transporting means (not shown).

First, the jig 5 is carried into the vacuum chamber 1 through the opening of the main body 11, and the jig 5 is placed on the stage 2 with the base plate 51 facing down, as shown in FIG. 13 (a). Therefore, the molded plate G is on the upper side and the substrate S is on the lower side. At this time, the spring 54 is contracted because a load is applied by the molded plate support member 53 and the molded plate G, and has a length shorter than the natural length (hereinafter, referred to as a specified length). The plate-shaped body 44 is on standby at the retracted position as in the second embodiment.

After the jig 5 is placed on the stage 2, the jig 5 is raised by the substrate drive mechanism 3. In this ascending process, as shown in FIG. 13B, the molded plate supporting member 53 comes into contact with the quartz glass fixing member 123, and the molded plate G reaches the quartz glass 122. That is, the molded plate G comes into surface contact with the quartz glass 122. Further, when the base plate 51 is raised by the substrate drive mechanism 3, the rise of the molded plate support member 53 is regulated by the quartz glass fixing member 123, so that the spring 54 contracts as shown in FIG. 13 (c). , The adhesive R on the substrate S comes into contact with the molded plate G, and eventually the substrate S and the molded plate G are bonded together.

After the molded plate G and the substrate S are bonded together in this way, the protective film P in which the adhesive R is cured is formed by irradiating with ultraviolet rays by the ultraviolet irradiation device 10 (FIG. 14 (d)).

After the protective film P is formed, the moving mechanism 42 lowers the plate-shaped body 44 via the rod-shaped body 45, and the claws 44a come into contact with the uncoated region S2 of the substrate S (FIG. 14 (e)). As a result, the end of the substrate S is sandwiched between the claw 44a and the base 52. In this state, when the substrate S is lowered by the moving mechanism 42 and the substrate driving mechanism 3, the end of the substrate S is pushed down by the claws 44a as in the second embodiment, while the protective film P adheres to the molded plate G. Therefore, as shown in FIG. 14 (f), the uncoated region S2 of the substrate S is warped, and the end of the protective film P is peeled off from the molded plate G. Further, by lowering the substrate S, the protective film P is completely peeled off from the molded plate G (FIG. 15 (g)). The length of the spring 54 at this time is not more than the specified length. After the protective film P is peeled off from the molded plate G, it is not necessary to push it down by the claw 44a. Therefore, the moving mechanism 42 stops the lowering of the plate-shaped body 44 and raises it to the retracted position.

When the base plate 51 is lowered by the substrate drive mechanism 3 even after the protective film P is peeled off, the spring 54 is restored to the specified length (FIG. 15 (h)), and when the base plate 51 is further lowered, the molded plate G is released. Separate from the quartz glass 122 (FIG. 15 (i)). After lowering the jig 5 to the same height as the specified FIG. 13 (a), the jig 5 is carried out of the vacuum chamber 1.

In the protective film forming method as described above, a worker may carry out the loading, unloading, and mounting work of the jig 5 on the stage 2. When it is done by a worker, it is returned to atmospheric pressure or evacuated each time.

After the jig 5 is carried out, the substrate S is replaced every time the protective film P is formed, but the molded plate G may be reused or replaced. For example, the used molded plate G may be used again as one set together with another substrate S, or the used molded plate G may be replaced to make a new molded plate G and the substrate S into one set. A jig 5 may be used. Further, if a part of the protective film P remains peeled off on the molded plate G after the protective film P is formed, it may be cleaned and reused. The replacement frequency and cleaning frequency of the molded plate G can be changed as appropriate.

(effect)
The protective film forming apparatus of the present embodiment is mounted on the stage 2, and the jig 5 that supports the molding plate G and the substrate S, the quartz glass fixing member 123 that restricts the movement of the jig 5 on the stage 2, and quartz. A glass 122 is provided. The jig 5 is provided so as to face the base plate 51, the base 52 on which the substrate S provided on the base plate 51 is placed, and the base plate 51, and supports the molded plate G. The substrate drive mechanism 3 includes a 53 and a spring 54 provided on the base plate 51 to support the molded plate support member 53, and the substrate drive mechanism 3 advances the jig 5 with respect to the quartz glass 122 to move the molded plate support member 53. It was brought into contact with the quartz glass fixing member 123.

As a result, even if the molded plate G is not fixed in advance in the vacuum chamber 1, when the substrate S is pressed against the molded plate G via the adhesive R, the molded plate G is the quartz glass 122 and the quartz glass fixing member. Since the adhesive R is in contact with the 123 and fixed, the adhesive R can be formed and the protective film P can be formed satisfactorily. Further, since the jig 5 can carry in and out the vacuum chamber 1 by pairing the molded plate G and the substrate S, the replacement frequency of the molded plate G can be changed without lowering the operating rate of the apparatus. Can be done. That is, in the case where the molded plate G is fixed in advance in the vacuum chamber 1, if the molded plate G needs to be cleaned due to the remaining protective film P, the entire apparatus is stopped to clean the molded plate G. , It is necessary to replace with a new molded plate G, but by using the jig 5, the molded plate G can be replaced without stopping the apparatus, and the productivity can be improved.

The jig 5 is provided with a guide 55 that regulates the expansion / contraction direction of the spring 54 between the molded plate support member 53 and the base plate 51. As a result, the substrate S and the molded plate G can be bonded in parallel to form a protective film P having a uniform film thickness, and the elastic member expands and contracts in an unintended direction, which causes unnecessary stress on the protective film P. Can be prevented from being added.

Further, the spring 54 has an elastic force larger than the adhesive force of the protective film P to the molded plate G. Therefore, when the stage 2 is lowered after the adhesive R is cured, the elastic force of the spring 54 is sufficient as long as the end portion of the substrate S is sandwiched between the stage 2 and the pressing member (claw 44a). The protective film P can be peeled off from the molded plate G by (repulsive force). As a result, even when the jig 5 is used, the protective film P can be formed with a simple configuration without complicating the configuration of the apparatus.

[4. Other embodiments]
The present invention is not limited to the first to third embodiments, but also includes other embodiments shown below. The present invention also includes a form in which all or any of the first to third embodiments and the following other embodiments are combined. Furthermore, various omissions, replacements, and changes can be made to these embodiments without departing from the scope of the invention, and modifications thereof are also included in the present invention.

(1) In the first to third embodiments, the protective film P is peeled from the molded plate G by the peeling unit 4 that presses the substrate S from the upper side on the molded plate G side. An electrostatic chuck or the like may be provided, and the substrate S may be pulled down by the substrate drive mechanism 3 to peel off the protective film P from the molded plate G while the substrate S is held from the lower side opposite to the molded plate G.

(2) In the first embodiment, the tip of the rod 41 that presses the substrate S is flat, but the tip of the rod 41 may be rounded as shown in FIG. 16A, or FIG. It may be tilted as in (b). The tip of the rod 41 is inclined so as to be elongated so as to descend from the inner direction to the outer direction of the substrate S. Since the tip of the rod 41 is rounded or inclined in this way, the contact surface between the substrate S and the rod 41 becomes small, and the rod 41 hinders the deformation of the substrate S in the warping direction. Can be prevented. In this way, since the substrate S is easily warped, the protective film P can be peeled off with a small load, and the stress load applied to the substrate S can be reduced. As for the claw 44a, the surface that comes into contact with the substrate S may be an inclined surface that rises toward the tip end, or may be a concave or convex arc surface.

(3) In the first to third embodiments, the pressing member for pressing the end of the substrate S is a rod 41 or a plate-shaped body 44 (claw 44a), which is provided separately from the stage 2, but is integrated with the stage 2. It may be provided as a target. For example, as shown in FIG. 17, the hook 21 may be provided on the stage 2. The hook 21 has, for example, a C shape, one end of which is rotatably connected to the stage 2, and the other end of the hook 21 presses the end of the substrate S from above. The protective film P can be peeled from the molded plate G by lowering the substrate S by the substrate driving mechanism 3 while pressing the end of the substrate S from above.

Further, as shown in FIG. 18, the protective film P is formed by fixing the substrate S to the stage 2 with the substrate S sandwiched from both side surfaces of the substrate S by hooks 21 and lowering the substrate S by the substrate drive mechanism 3. It may be peeled off from the plate G.

(4) In the first to third embodiments, the molded plate G may be subjected to a treatment on the surface in contact with the adhesive R so that the adhesive force with the protective film P is weaker than that with the substrate S. good. Examples of such treatment include a fluorine coating agent and a Teflon coating. By performing such a treatment, the effect of preventing the protective film P from remaining peeled can be expected. Further, in order to peel off the protective film P from the molded plate G, when the substrate S is made of a resin such as polycarbonate, the adhesive R may enter the gaps of minute irregularities on both sides of the resin, or the adhesive may be used. Since the solvent contained in R dissolves the resin surface and a relatively strong bonding force can be obtained, it is sufficient to use glass or the like having a high surface flatness and not being dissolved in the solvent as the molded plate G. It can be peeled off.

(5) In the first to third embodiments, the resin forming the protective film P is an ultraviolet curable resin, but it may be a thermosetting resin, a radiation curable resin, or a resin that is dried and cured. In these cases, the molded plate G and the quartz glass 122 do not necessarily have to have translucency.

(6) In the second to third embodiments, the E-shaped plate-shaped body 44 is used as the pressing member, but the pressing member has a shape if there is a portion that presses the protruding region of the substrate S from the molded plate G. Is not particularly limited, and may have a rectangular shape. In this case, one side of the rectangle can be a portion that presses the end of the substrate S.

(7) In the first embodiment, the moving mechanism 42 integrally moves the three rods 41 up and down for each protruding side of the rods 41, but even if each rod 41 is individually moved up and down. good. In this case, the timing for lowering the rod 41 may be individually set in order to peel off the protective film P. As an example of changing the timing, only the rod 41 located at the end of the protruding side is first brought into contact with the substrate S, and in this state, the stage 2 is lowered by a predetermined amount together with the rod 41 to temporarily stop, and then the center The rod 41 is brought into contact with the substrate S and pushed down until it is sandwiched between the rod 41 and the stage 2. After that, the descent of the stage 2 and the descent of all the rods 41 may be restarted. In this case, since the protective film P (coating region S1) tends to be peeled off from the four corners, it is easier to peel off than peeling off from one side of the protective film P. In other words, the peeling force is proportional to the peeling width, so peeling from one side requires peeling force for that one side from the beginning, but peeling from the corners (four corners) is easy to peel because the sides are short at the beginning. Benefits are obtained.

1 Vacuum chamber
10 Ultraviolet irradiation device
11 Main body
12 Closure
121 Ring block
122 Quartz glass
123 Quartz glass fixing member
124 Molded plate fixing member
2 stages
21 hook
3 Board drive mechanism
31 rod
32 drive source
4 Peeling unit
41 rod
42 movement mechanism
43 Connection part
44 plate-like body
44a nails
45 rod-shaped body
5 Jig
51 Base plate
52 base
53 Molded plate support member
54 spring
55 guide
G molded plate
S board
S1 coating area
S2 uncoated area
P protective film

Claims (8)

It is a protective film forming apparatus that forms a protective film made of the adhesive by adhering a molded plate and a substrate with an adhesive interposed therebetween.
The stage on which the board is placed and
A substrate drive mechanism for advancing and retreating the stage with respect to the molded plate,
A peeling unit that peels the protective film from the molded plate by moving the substrate in a direction that separates it from the molded plate.
To have
A protective film forming device characterized by. The peeling unit is
A pressing member that presses the region of the substrate protruding from the molded plate, and a pressing member.
A moving mechanism that moves the pressing member along the pulling direction with respect to the molded plate, and
To have
The protective film forming apparatus according to claim 1. In the substrate driving mechanism and the moving mechanism, the stage supports the substrate, and the pressing member moves the substrate along the pulling direction with respect to the molded plate while pressing the region.
The protective film forming apparatus according to claim 2. The holding member is a rod extending in a direction orthogonal to the stage.
The tip of the rod should be rounded or slanted,
The protective film forming apparatus according to claim 2 or 3. The substrate has a rectangular shape and has a rectangular shape.
The pressing member has a plurality of claws for pressing the region of the substrate, and the claws are provided along two opposite sides of the substrate so as to protrude from the molded plate at intervals.
The protective film forming apparatus according to claim 2 or 3. A jig that is placed on the stage and supports the molded plate and the substrate,
A jig regulation unit that regulates the movement of the jig on the stage by the substrate drive mechanism, and
With
The jig is
With the base plate
A base on which the substrate provided on the base plate is placed, and
A molded plate support member provided facing the base plate and supporting the molded plate,
An elastic member provided on the base plate and supporting the molded plate support member, and
With
In the substrate drive mechanism, the jig is advanced to the jig regulation portion, and the molded plate support member is brought into contact with the jig regulation portion.
The protective film forming apparatus according to claim 2 or 5. The elastic member has an elastic force larger than the adhesive force of the protective film to the molded plate.
The protective film forming apparatus according to claim 6. The jig includes a guide that regulates the expansion / contraction direction of the elastic member between the molded plate support member and the base plate.
The protective film forming apparatus according to claim 6 or 7.

Images