CN1750026A - 双界面ic卡 - Google Patents

双界面ic卡 Download PDF

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Publication number
CN1750026A
CN1750026A CNA2005101028895A CN200510102889A CN1750026A CN 1750026 A CN1750026 A CN 1750026A CN A2005101028895 A CNA2005101028895 A CN A2005101028895A CN 200510102889 A CN200510102889 A CN 200510102889A CN 1750026 A CN1750026 A CN 1750026A
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chip module
antenna
interface
double
flexure strip
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CN100458837C (zh
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李镕培
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Y B L CO
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

本发明涉及一种双界面IC卡,包括顶层、底层、顶层和底层之间的天线嵌入层,并且IC芯片模块嵌入到IC芯片模块嵌入孔。天线嵌入层的一侧具有矩形的凹槽,弹性片嵌入到该凹槽的两侧。IC芯片模块通过将粘合剂涂抹到天线嵌入层而插入,或使用粘接带而插入。这样,IC芯片模块容易安装并且不会脱落,从而具有良好的连接性,且持久耐用。

Description

双界面IC卡
技术领域
本发明涉及一种双界面IC卡,并且更加特别地,所述双界面卡包括顶层、底层、所述两层之间的天线嵌入层、以及嵌入IC芯片模块嵌入孔中的IC芯片模块,并且所述天线嵌入层在其一侧具有矩形凹槽,弹性片即插入到该矩形槽的两侧。通过在天线嵌入层上涂抹粘合剂或者采用含有热活化薄膜的热熔带而嵌入IC芯片模块。这样,IC芯片可容易地安装,并且不容易脱落,从而具有良好的连接性并可长时间使用。
背景技术
IC芯片模块嵌入到天线的触点,该天线位于顶层和底层之间形成的天线嵌入层中。通常地,通过将含银的导电粘合剂涂抹到触点而使得IC芯片模块嵌入到触点。该含银的导电粘合剂用于在长时间使用后保持导电率。然而,由于粘合力的迅速下降,IC芯片模块非常容易脱落,从而造成了很差的连接性。这样,需要重新更换新的双界面IC卡,因此很不经济。为了解决上述问题,提出了一种用于将IC芯片模块焊接在天线的触点的方法。该方法仍然存在很多问题,也即,IC芯片模块在焊接时容易熔化,且该操作很难进行,另外由于焊接还可能导致环境污染等问题。
发明内容
因此为解决上述问题而提出了本发明。本发明的一个目的在于提供一种双界面IC卡,其可容易地连接IC芯片模块,并且由于本发明将导电弹性复合金属片嵌入到位于IC卡内部的天线的两端,并且将IC芯片粘接到所述金属片,从而可解决IC芯片模块易脱落的连接较差问题,并且即使在长时间使用之后也不会发生该问题。
根据本发明的双界面IC卡包括形成于顶层和底层之间的天线、以及与所述天线的两端相结合的IC芯片模块的连接端子。所述IC芯片模块连接端子通过弹性片与所述天线的触点电连接。根据本发明的双界面IC卡还包括:形成于所述顶层和所述天线之间的天线嵌入层;形成于所述天线嵌入层中用于嵌入所述弹性片的凹槽;以及形成在所述顶层中用于嵌入IC芯片模块的IC芯片模块嵌入孔。如果所述弹性片嵌入到所述凹槽中,并且所述IC芯片模块嵌入到所述IC芯片模块嵌入孔中,则所述弹性片的一端与所述天线的触点相接触,而所述弹性片的另一端与所述IC芯片模块连接端子相接触。当将IC芯片模块嵌入到双界面IC卡时,导电弹性复合金属片被嵌入到天线两侧的触点,并且IC芯片模块与具有凹槽的天线嵌入层通过采用粘合剂或含有热活化薄膜的热熔带而相互结合。因此,根据本发明的双界面IC卡在天线的触点与IC芯片模块之间可获得良好的连接性,即使其使用很长时间,也不会发生掉落,并且IC芯片模块很容易连接。
附图说明
以下结合附图对本发明的其他目的进行详细地描述。
图1是根据本发明的双界面IC卡的分解状态的立体图;
图2是根据本发明的双界面IC卡的组装状态的立体图;以及
图3是根据本发明的双界面IC卡的剖面图。
具体实施方式
参照图1-图3所示,根据本发明的双界面IC卡1包括形成在顶层10和底层20之间的天线30、以及与所述天线30的两端均结合的IC芯片模块80的连接端子。所述IC芯片模块80的连接端子通过弹性片60与所述天线30的触点50电连接。根据本发明的双界面IC卡还包括形成于所述顶层10和所述天线30之间的天线嵌入层40;形成在所述天线嵌入层40,用于嵌入所述弹性片60的凹槽41;以及形成在所述顶层10的,用于嵌入IC芯片模块80的IC芯片模块嵌入孔11。如果所述弹性片60插入到所述凹槽41,并且IC芯片模块80嵌入到所述IC芯片模块嵌入孔11中,则所述弹性片60的一端接触所述天线30的触点,而所述弹性片60的另一端接触所述IC芯片模块80的连接端子。
在根据本发明的双界面IC卡中,在卡的顶层10和底层20之间形成有天线30和天线嵌入层40。顶层10具有IC芯片模块嵌入孔11,并且天线嵌入层40具有凹槽41。凹槽41的周长由天线嵌入层40决定。在凹槽41中形成去除天线嵌入层40而形成的孔。与所述天线30的触点50电连接的弹性片60通过导电合金金属制成,并且当与IC芯片模块80结合时,弹性片安装在凹槽41的触点50上。弹性片60的一端与所述天线30的触点50接触,而所述弹性片60的另一端与IC芯片模块80的接触端子接触,因此实现电连接。弹性片60可制成圆形、三角形、或矩形。通过采用粘合剂或粘接带将IC芯片模块80固定到形成于所述凹槽41周围的天线嵌入层40,IC芯片模块80完全连接到双界面IC卡1上。
如上所述,根据本发明的双界面IC卡容易制造,并且天线30可与IC芯片模块80安全连接,并且可与IC芯片模块牢固粘接而不会脱落。这样,根据本发明的双界面IC卡可使用较长时间而不需更换新卡,非常经济。
以上所述仅为本发明的优选实施例而已,并不用于限制本发明,对于本领域的技术人员来说,本发明可以有各种更改和变化。凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包括在本发明的保护范围之内。

Claims (5)

1.一种双界面IC卡,包括:顶层、底层、形成于所述顶层和所述底层之间的天线、双界面卡的IC芯片模块、以及弹性片,所述弹性片将所述IC芯片模块的连接端子与所述天线的触点电连接。
2.根据权利要求1所述的双界面IC卡,还包括:形成于所述顶层和所述天线之间的天线嵌入层;形成在所述天线嵌入层,用于嵌入所述弹性片的凹槽;以及形成于所述顶层,用于插入所述IC芯片模块的IC芯片模块嵌入孔,从而,当所述弹性片插入到所述凹槽中,并且所述IC芯片模块嵌入到所述IC芯片模块嵌入孔中时,所述弹性片的一端连接所述天线的一个触点,并且所述弹性片的另一端连接所述IC芯片模块的连接端子。
3.根据权利要求1所述的双界面IC卡,其中,所述弹性片是复合金属片。
4.根据权利要求2所述的双界面IC卡,其中,所述形成于所述天线嵌入层的凹槽的周长由所述天线嵌入层决定,并且,在所述凹槽形成去除所述天线嵌入层而形成的孔。
5.根据权利要求4所述的双界面IC卡,其中,通过使用粘合剂,所述IC芯片模块被粘接到所述凹槽周围形成的所述天线嵌入层。
CNB2005101028895A 2004-09-15 2005-09-14 双界面ic卡 Expired - Fee Related CN100458837C (zh)

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CN102236819A (zh) * 2010-04-27 2011-11-09 北京意诚信通智能卡股份有限公司 简化双界面ic卡生产流程的天线改进结构
CN103649970A (zh) * 2011-05-17 2014-03-19 格马尔托股份有限公司 具有优化无源谐振电路的射频应答器设备
CN103649970B (zh) * 2011-05-17 2018-06-01 格马尔托股份有限公司 具有优化无源谐振电路的射频应答器设备
CN103034897B (zh) * 2011-10-04 2017-11-14 斯迈达Ip有限公司 芯片卡和用于制造芯片卡的方法
CN102426659A (zh) * 2011-11-03 2012-04-25 北京德鑫泉物联网科技股份有限公司 同时具有两种读写模式基体的智能卡及其生产方法
WO2013063870A1 (zh) * 2011-11-03 2013-05-10 北京德鑫泉物联网科技股份有限公司 同时具有两种读写模式基体的智能卡及其生产方法
CN102426659B (zh) * 2011-11-03 2014-12-10 北京德鑫泉物联网科技股份有限公司 同时具有两种读写模式基体的智能卡及其生产方法
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CN102496582B (zh) * 2011-11-23 2014-03-05 佛山市顺德区德芯智能科技有限公司 一种双界面ic卡的制作方法
CN104978596A (zh) * 2014-04-03 2015-10-14 英飞凌科技股份有限公司 芯片卡衬底和形成芯片卡衬底的方法
CN104978596B (zh) * 2014-04-03 2018-08-03 英飞凌科技股份有限公司 芯片卡衬底和形成芯片卡衬底的方法

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CN100458837C (zh) 2009-02-04

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