WO2013063870A1 - 同时具有两种读写模式基体的智能卡及其生产方法 - Google Patents

同时具有两种读写模式基体的智能卡及其生产方法 Download PDF

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Publication number
WO2013063870A1
WO2013063870A1 PCT/CN2012/070084 CN2012070084W WO2013063870A1 WO 2013063870 A1 WO2013063870 A1 WO 2013063870A1 CN 2012070084 W CN2012070084 W CN 2012070084W WO 2013063870 A1 WO2013063870 A1 WO 2013063870A1
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WO
WIPO (PCT)
Prior art keywords
antenna
layer
smart card
read
write mode
Prior art date
Application number
PCT/CN2012/070084
Other languages
English (en)
French (fr)
Inventor
张晓冬
Original Assignee
北京德鑫泉物联网科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 北京德鑫泉物联网科技股份有限公司 filed Critical 北京德鑫泉物联网科技股份有限公司
Priority to RU2014121803/08A priority Critical patent/RU2598580C2/ru
Priority to BR112014010791-2A priority patent/BR112014010791B1/pt
Priority to ES12845546T priority patent/ES2716279T3/es
Priority to PL12845546T priority patent/PL2775426T3/pl
Priority to EP12845546.6A priority patent/EP2775426B1/en
Priority to SI201231569T priority patent/SI2775426T1/sl
Priority to KR1020147014232A priority patent/KR101652357B1/ko
Priority to US14/355,398 priority patent/US9342779B2/en
Publication of WO2013063870A1 publication Critical patent/WO2013063870A1/zh
Priority to IN3535CHN2014 priority patent/IN2014CN03535A/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07716—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising means for customization, e.g. being arranged for personalization in batch
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component

Definitions

  • the invention belongs to the field of smart card manufacturing, and in particular relates to a smart card having two read/write mode bases and a production method thereof. Background technique
  • the DI (Dual Interface) card is an abbreviation for a smart card that has two read/write mode bases at the same time.
  • the DI card is made of PVC layer and chip, coil, and is based on a single chip, which integrates contact and non-contact interfaces.
  • the DI card has two operation interfaces, which can access the chip through the RF method through the contacts of the contact mode or the distance (10cm), and perform the same operation.
  • the two interfaces follow two different The standard, the contact interface conforms to ISO/IEC 7816; the contactless interface conforms to ISO/EC 14443. These two interfaces share the same microprocessor, operating system and EEPROM (Electrically Erasable Programmable Read Only Memory).
  • the DI card In addition to a microprocessor chip, the DI card also has an antenna coil connected to the micro-processing chip.
  • the electromagnetic field generated by the reader provides energy to realize energy supply and data transmission by radio frequency.
  • DI cards are two types, one of which includes the following steps:
  • an Inlay (chip circuit) layer is obtained; and the front layer including the front surface printing material and the protective film, the back layer printing material and the back layer of the protective film are accurately matched with the Inlay layer, and then Laminating and cutting the card to obtain a card base of a smart card having two read/write mode substrates; performing a milling slot at the chip module of the card base, and manually aligning the antenna on the card base obtained after one slot milling After the thread picking, pulling and trimming, etc., the card base is secondly slotted; at the same time, the two contacts of the chip module are tinned and flattened on another device, and finally placed on the packaging machine. The processed card base and chip are packaged.
  • the other category includes the following steps:
  • an Inlay (chip circuit) layer is obtained; and the front layer including the front surface printing material and the protective film, the back layer printing material and the back layer of the protective film are accurately matched with the Inlay layer, and then Laminating and cutting the card to obtain the card base of the smart card; performing a milling slot at the location of the chip module of the card base, and secondly milling the slot on the card base obtained after the slotting; The position of the groove is injected into the conductive adhesive, and the chip is placed in the corresponding contact point for curing; finally, the processed card base and the chip are gradually placed on the packaging machine for packaging.
  • the technical problem to be solved by the present invention is to provide a smart card having two types of read/write mode substrates and a production method thereof with high yield, good product quality, high yield, and high stability.
  • a smart card having two read/write mode bases comprising an antenna layer, an antenna disposed on the antenna layer, and a chip circuit layer, wherein: the antenna and the chip circuit layer are electrically powered by an elastic conductive device connection.
  • the smart card of the present invention has two read/write mode bases, wherein the wire ends of the antenna are electrically connected to the elastic conductive device, and the elastic conductive device is disposed at a region corresponding to a circuit contact point of the chip circuit layer, the elasticity One side of the conductive device is in electrical contact with the circuit contact point of the chip circuit layer.
  • the smart card of the present invention having two read/write mode substrates at the same time, wherein the elastic conductive device is a metal elastic conductive device.
  • the smart card of the present invention having two read/write mode substrates simultaneously, wherein the elastic conductive device is a non-metallic elastic conductive device.
  • the smart card of the present invention has two read/write mode bases, wherein the wire ends of the antenna are disposed in a single wire or a multi-wire reciprocating manner on a region of the antenna layer corresponding to a circuit contact point of the chip circuit layer.
  • a smart card having two read/write mode substrates, wherein the wire ends of the antennas are electrically connected to the other side of the elastic conductive device by soldering.
  • the smart card of the present invention having two read/write mode substrates simultaneously, wherein the wire ends of the antennas are in direct contact with the other side of the elastic conductive device for electrical connection.
  • the invention also provides a method for producing the above smart card having two read/write mode bases, which comprises the following steps:
  • the invention has a method for producing a smart card with two read/write mode bases.
  • the wire end of the antenna is formed into a contact pad by reciprocating winding, and the contact pad is located at a circuit contact point with the chip circuit layer. region.
  • the smart card having the two read/write mode bases and the production method thereof adopts the elastic conductive device to electrically connect the antenna and the chip circuit layer, and does not need manual operation such as tinning, thereby improving production efficiency and using special sensors.
  • the milling cutter is used for milling, which guarantees the product quality and high yield, and the prepared smart card has good stability.
  • 1 is a schematic structural view of a smart card having two read/write mode bases at the same time
  • FIG. 2 is a perspective view of a smart card having two read/write mode substrates at the same time
  • FIG. 3 is a cross-sectional view of a smart card having two read and write mode substrates simultaneously in accordance with the present invention.
  • Figure 4 is a partial enlarged view of Figure 3;
  • Figure 5 is a schematic structural view of the card base after the groove is processed
  • Figure 6 is a schematic structural view of the elastic conductive device
  • Fig. 7 is a structural schematic view showing the positional relationship of the chip, the elastic conductive device and the antenna.
  • Fig. 8 is a schematic view showing the linear structure of the antenna layer after embedding. detailed description
  • the smart card of the present invention has two read/write mode bases, including a base layer 1 and an antenna layer.
  • the antenna layer 2 is disposed in the base layer 1
  • the wire head of the antenna 3 reciprocates in a single line or multiple lines Winding is disposed on the antenna layer 2 and the chip circuit layer 4, the corresponding area of the circuit contact point
  • the base layer 1 has grooves B5, B6, two grooves B3 are respectively formed on the bottom surface of the groove B5, and the elastic conductive device 5 has two, respectively placed in the two grooves B3
  • the elastic conductive devices 5 are respectively disposed in the regions corresponding to the two circuit contact points of the chip circuit layer 4, the wire head 31 of the antenna 3 is electrically connected to one side of the elastic conductive device 5, and the chip circuit layer 4 is placed in the grooves B5, B6.
  • the other side of the elastic conductive device 5 is in electrical contact with the circuit contact point of the chip circuit layer 4.
  • the elastic conductive device 5 is a metal elastic conductive device such as a metal spring pressing piece, and may also be a non-metallic elastic conductive device such as conductive graphite.
  • the wire end 31 of the antenna 3 is electrically connected to the elastic conductive device by soldering or direct contact.
  • the smart card of the invention having two read-write mode bases and a production method thereof comprises the following steps:
  • the antenna 3 is embedded on the back or front side of the antenna layer 2, and the wire end of the antenna 3 is made into a contact pad by reciprocating winding, or the contact piece is fabricated by other methods, such as soldering a wire on the metal piece.
  • the contact pads or contact pads are placed on the antenna layer at positions corresponding to the two circuit contacts of the chip circuit layer 4, ie, the chip module, such as B1 and B2 (FIG. 7), in order to enable the antenna and the chip module to be electrically conductive.
  • the device is in good contact, and Figure 8 shows a reciprocating winding of the wire.
  • the pad layer, the printed layer and the protective layer are added to the upper and lower layers of the antenna layer 2 to form a base layer, thereby obtaining a bond-stabilized card base carrier, where the layers are
  • the thickness of the buried antenna layer 2 may be changed according to requirements. In this example, the thickness of the buried antenna layer 2 is about 0.15, and the upper layer is respectively added with a cushion layer, a printed layer, and a protective layer to achieve a certain strength, and finally the card base is 8 ⁇ The thickness can reach 0. 8mm or so.
  • the groove B5 has a depth equal to the thickness of the boundary of the chip circuit layer 4, and then a groove B6 is milled in the middle of the groove B5. Milling the position requires a milling cutter with a special sensor. During the process of milling the groove, it is detected in real time whether it is milled to the buried layer. When the wire is cut to the buried wire, it is stopped according to the preset program and the value is memorized. This method is used to ensure the precision of the milling groove, and finally the elastic conductive The position of the device placement 5 is slotted B3, the depth of which is determined by the memory value.
  • the elastic conductive device 5 is first placed in the recess B3, and then the chip circuit layer 4 is placed in the B5 and B6 with the position of the circuit contact point corresponding to the elastic conductive device 5, and finally thermally packaged. , Cold package shaping and smart card functional testing.
  • the smart card of the present invention having two read-write mode bases can be widely used in financial finance, social insurance, transportation, medical care, government administration, commodity retail, entertainment, school management and other fields.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

本发明公开了一种同时具有两种读写模式基体的智能卡，包括天线层、设在所述天线层上的天线和芯片电路层，所述天线和所述芯片电路层通过弹性导电装置进行电连接。本发明还提供了上述同时具有两种读写模式基体的智能卡的生产工艺，包括步骤：在天线层的背面或正面埋设天线；在天线层完成埋线后，在天线层上下各增加垫层、印刷层、保护层进行层压，得到卡基载体；对层压好的整版的卡基载体进行切卡，最终得到卡基，对得到的卡基进行铣槽；最后封装。本发明采用弹性导电装置将天线和所述芯片电路层进行电连接，无需点锡等手工操作，提高了生产效率，采用带有特殊传感器的铣刀进行铣槽，保证了产品质量，成品率高，制得的智能卡稳定性好。

Description

同时具有两种读写模式基体的智能卡及其生产方法
技术领域
本发明属于智能卡制造领域， 尤其涉及同时具有两种读写模式基体的智能卡及其生产方 法。 背景技术
DI (Dual Interface)卡是同时具有两种读写模式基体的智能卡的简称。 DI卡是 PVC层 和芯片、 线圈制成， 基于单芯片、 集接触式与非接触式接口为一体的卡。 DI卡有两个操作界 面， 既可以通过接触方式的触点， 也可以在相隔一定距离（10cm内）的情况下通过射频方式 来访问芯片， 执行相同的操作， 两个界面分别遵循两个不同的标准， 接触界面符合 ISO/IEC 7816； 非接触界面符合 ISO/EC 14443.这两个界面共享同一个微处理器、 操作系统和 EEPROM(电可擦可编程只读存储器)。
DI卡内除了一个微处理器芯片外还有一个与微处理芯片相连的天线线圈， 在使用非接触 界面时， 由读写器产生的电磁场提供能量， 通过射频方式实现能量供应和数据传输。
目前 DI卡的主要生产过程为两类， 一类包括如下步骤：
制作好天线与基材进行预层压后得到 Inlay (芯片电路）层； 将包括正面印刷料和保护膜 的正面层、背面层印刷料和保护膜的背面层与所述 Inlay层精准对应后进行层压和切卡，得到 同时具有两种读写模式基体的智能卡的卡基； 在所述卡基的芯片模块所在处进行一次铣槽， 在一次铣槽后得到的卡基上通过手工对天线进行挑线、 拉线和剪线头等处理， 之后对卡基进 行二次铣槽； 同时在另外设备上将芯片模块的两个触点上进行点锡并铣平处理， 最后在封装 机上逐步摆放处理后的卡基及芯片进行封装。
另一类包括如下步骤：
制作好天线与基材进行预层压后得到 Inlay (芯片电路）层； 将包括正面印刷料和保护膜 的正面层、背面层印刷料和保护膜的背面层与所述 Inlay层精准对应后进行层压和切卡，得到 智能卡的卡基； 在所述卡基的芯片模块所在处进行一次铣槽， 铣槽后得到的卡基上在芯片模 块接触点处二次铣槽； 在二次铣槽的位置注入导电胶， 并将芯片置入对应接触点进行固化； 最后在封装机上逐步摆放处理后的卡基及芯片进行封装。
在实现上述 DI卡生产的过程中， 发明人发现现有技术中至少存在如下问题： 有多个步骤 需要通过手工完成如点锡等， 每天的产量很低， 而且这些操作方法控制难度大， 即使是熟练 的工人也难保证产品质量， 废品率高， 通过此方法在锡和铜线的处理上可能损坏天线线头和 芯片模块， 使成卡的稳定性降低。 采用导电胶， 由于胶在固化过程中与外界空气接触， 并且 固化时间比较长， 因此导电胶的导电性受时间和环境影响比较大， 会造成导电性不稳定。 发明内容
本发明要解决的技术问题是提供一种产量高、 产品质量好、 成品率高、 稳定性高的同时 具有两种读写模式基体的智能卡及其生产方法。
为解决上述技术问题， 本发明采用如下技术方案：
一种同时具有两种读写模式基体的智能卡，包括天线层、设在所述天线层上的天线和芯片 电路层， 其特征在于： 所述天线和所述芯片电路层通过弹性导电装置进行电连接。
本发明的同时具有两种读写模式基体的智能卡， 其中所述天线的线头与弹性导电装置进 行电连接， 所述弹性导电装置设于与芯片电路层的电路接触点对应的区域， 所述弹性导电装 置的一面与芯片电路层的电路接触点接触电连接。
本发明的同时具有两种读写模式基体的智能卡， 其中所述弹性导电装置是金属弹性导电 装置。
本发明的同时具有两种读写模式基体的智能卡， 其中所述弹性导电装置是非金属弹性导 电装置。
本发明的同时具有两种读写模式基体的智能卡， 其中所述天线的线头以单线或多线往复 绕线的方式设置于天线层上与所述的芯片电路层的电路接触点对应的区域。
本发明的同时具有两种读写模式基体的智能卡， 其中所述天线的线头与弹性导电装置的 另一面采用焊接的方式进行电连接。
本发明的同时具有两种读写模式基体的智能卡， 其中所述天线的线头与弹性导电装置的 另一面直接接触进行电连接。
本发明的同时具有两种读写模式基体的智能卡， 其中所述天线层的厚度为 0. 13-0. 16mm。 本发明还提供了上述同时具有两种读写模式基体的智能卡的生产方法， 包括以下步骤：
( 1)埋线： 在天线层的背面或正面埋设天线， 并将天线的线头置于与芯片电路层的电路 接触点对应的区域；
( 2)层压： 在天线层完成埋线后， 在天线层上下各增加垫层、 印刷层、 保护层进行层压， 得到卡基载体；
( 3)切卡和铣槽： 对层压好的整版的卡基载体进行切卡， 最终得到卡基， 对得到的卡基 进行铣槽， 首先对放置芯片的位置铣槽， 先铣一个凹槽 B5， 该凹槽 B5的深度与芯片边界的 厚度相等， 然后再在凹槽 B5的中部铣一个凹槽 B6， 铣此位置采用带有特殊传感器的铣刀， 铣刀在铣槽的过程中， 实时检测是否铣到埋线层， 当铣到埋线的线头就立刻按照预先设定的 程序停止并且记忆此值， 最后再对弹性装置放置的位置铣槽 B3， 其凹槽 B3的深度由记忆值 确定；
( 4)封装： 先把弹性装置放置到凹槽 B3内并与天线的线头电连接，然后把芯片电路层以 电路接触点对应弹性装置的位置放入 B5和 B6内， 最后进行定形。
本发明同时具有两种读写模式基体的智能卡的生产方法， 其中步骤（1 )中， 将天线的线 头通过往复绕线做成一个接触盘， 接触盘位于与芯片电路层的电路接触点对应的区域。
本发明同时具有两种读写模式基体的智能卡及其生产方法采用弹性导电装置将天线和所 述芯片电路层进行电连接， 无需点锡等手工操作， 提高了生产效率， 釆用带有特殊传感器的 铣刀进行铣槽， 保证了产品质量， 成品率高， 制得的智能卡稳定性好。
按国际和国内的检测标准， 弯扭曲测试超出此标准 2-3倍， 高温高湿耐冲击实验超出标 准 0. 5-1倍。 其他各项均符合国际和国内标准。
下面结合附图对本发明的同时具有两种读写模式基体的智能卡及其生产方法作进一步说 明。 附图说明
图 1为本发明同时具有两种读写模式基体的智能卡的结构示意图;
图 2为本发明同时具有两种读写模式基体的智能卡的透视图；
图 3为本发明同时具有两种读写模式基体的智能卡的剖视图。
图 4为图 3的局部放大视图；
图 5为卡基加工完凹槽后的结构示意图；
图 6为放入弹性导电装置后的结构示意图；
图 7为芯片、 弹性导电装置及天线线形位置关系的结构示意图。
图 8为天线层埋线后的线形结构示意图。 具体实施方式
如图 1-4、 图 7所示， 本发明同时具有两种读写模式基体的智能卡， 包括基层 1、 天线层
2、 设在天线层 2上的天线 3和芯片电路层 4， 天线层 2的厚度为 0. 13-0. 16mm， 天线层 2设 置在基层 1内， 天线 3的线头以单线或多线往复绕线的方式设置于天线层 2上与芯片电路层 4的电路接触点对应的区域， 基层 1上开设凹槽 B5、 B6 , 凹槽 B5的底面上分别开设两个凹槽 B3 , 弹性导电装置 5具有两个， 分别置于两个凹槽 B3内， 弹性导电装置 5分别设于与芯片电 路层 4的两个电路接触点对应的区域，天线 3的线头 31与弹性导电装置 5的一面进行电连接， 芯片电路层 4置于凹槽 B5、 B6中， 弹性导电装置 5的另一面与芯片电路层 4的电路接触点接 触电连接。 弹性导电装置 5是金属弹性导电装置如金属弹簧压片， 也可以是非金属弹性导电 装置如导电石墨。天线 3的线头 31与弹性导电装置采用焊接的方式或直接接触方式进行电连 接。
本发明同时具有两种读写模式基体的智能卡及其生产方法包括以下步骤：
( 1)埋线:
如图 8所示， 在天线层 2的背面或正面埋设天线 3， 并将天线 3的线头通过往复绕线做 成一个接触盘， 或用其他方法制作接触片如在金属片上焊接一根电线， 将接触盘或接触片置 于天线层上与芯片电路层 4即芯片模块的两个电路接触点对应的位置如 B1和 B2 (图 7)， 这 是为了能够使天线与芯片模块可以通过弹性导电装置良好的接触， 图 8示出了线头的一种往 复绕线方式。
( 2)层压- 在天线层 2完成埋线后， 在天线层 2上下各增加垫层、 印刷层、 保护层形成基层进行层 压， 从而得到粘合稳定的卡基载体， 在这里各层的厚度可以根据要求不同而改变， 在此次实 例中埋线天线层 2的厚度大约 0. 15皿，上下分别添加垫层，印刷层，保护层来使其达到一定的 强度， 最终卡基的厚度能够达到 0. 8mm左右。
( 3)切卡和铣槽：
对层压好的整版的卡基载体进行切卡， 最终得到卡基， 对得到的卡基进行铣槽， 如图 5 所示， 首先对放置芯片电路层 4的位置铣槽， 先铣一个凹槽 B5， 该凹槽 B5的深度与芯片电 路层 4边界的厚度相等， 然后再在凹槽 B5的中部铣一个凹槽 B6， 铣此位置需要用带有特殊 传感器的铣刀， 铣刀在铣槽的过程中， 实时检测是否铣到埋线层， 当铣到埋线的线头就立刻 按照预先设定的程序停止并且记忆此值，用此方法保证铣槽的精度，最后再对弹性导电装置放 置 5的位置铣槽 B3， 其凹槽 B3的深度由记忆值确定。
( 4)封装：
如图 6、 7所示， 先把弹性导电装置 5放置到凹槽 B3内， 然后把芯片电路层 4以其电路 接触点对应弹性导电装置 5的位置放入 B5和 B6内， 最后进行热封装、 冷封装定形和智能卡 功能测试。
以上所述的实施例仅仅是对本发明的优选实施方式进行描述， 并非对本发明的范围进行 限定， 在不脱离本发明设计精神的前提下， 本领域普通技术人员对本发明的技术方案作出的 各种变形和改进， 均应落入本发明权利要求书确定的保护范围内。
工业实用性
本发明同时具有两种读写模式基体的智能卡可广泛地应用于金融财务、 社会保险、 交通 旅游、 医疗卫生、 政府行政、 商品零售、 休闲娱乐、 学校管理及其它领域。

Claims

权 利 要 求
1、 同时具有两种读写模式基体的智能卡， 包括天线层、设在所述天线层上的天线和芯片 电路层， 其特征在于： 所述天线和所述芯片电路层通过弹性导电装置进行电连接。
2、根据权利要求 1所述的同时具有两种读写模式基体的智能卡， 其特征在于： 所述天线 的线头与弹性导电装置进行电连接， 所述弹性导电装置设于与芯片电路层的电路接触点对应 的区域， 所述弹性导电装置的一面与芯片电路层的电路接触点接触电连接。
3、根据权利要求 2所述的同时具有两种读写模式基体的智能卡， 其特征在于： 所述弹性 导电装置是金属弹性导电装置。
4、根据权利要求 2所述的同时具有两种读写模式基体的智能卡， 其特征在于： 所述弹性 导电装置是非金属弹性导电装置。
5、根据权利要求 3或 4所述的同时具有两种读写模式基体的智能卡， 其特征在于： 所述 天线的线头以单线或多线往复绕线的方式设置于天线层上与所述的芯片电路层的电路接触点 对应的区域。
6、根据权利要求 5所述的同时具有两种读写模式基体的智能卡， 其特征在于： 所述天线 的线头与弹性导电装置的另一面采用焊接的方式进行电连接。
7、根据权利要求 5所述的同时具有两种读写模式基体的智能卡， 其特征在于： 所述天线 的线头与弹性导电装置的另一面直接接触进行电连接。
8、根据权利要求 6或 7所述的同时具有两种读写模式基体的智能卡，其特征在于所述天 线层的厚度为 0.13-0.16mm。
9、 根据权利要求 1-4、 6、 7任一项所述的同时具有两种读写模式基体的智能卡的生产方 法， 其特征在于包括以下步骤-
( 1 )埋线： 在天线层的背面或正面埋设天线， 并将天线的线头置于与芯片电路层的电路 接触点对应的区域；
(2)层压： 在天线层完成埋线后，在天线层上下各增加垫层、印刷层、保护层进行层压， 得到卡基载体；
(3 )切卡和铣槽： 对层压好的整版的卡基载体进行切卡， 最终得到卡基， 对得到的卡基 进行铣槽， 首先对放置芯片的位置铣槽， 先铣一个凹槽 B5， 该凹槽 B5的深度与芯片边界的 厚度相等，然后再在凹槽 B5的中部铣一个凹槽 B6，铣此位置需要用带有特殊传感器的铣刀， 铣刀在铣槽的过程中， 实时检测是否铣到埋线层， 当铣到埋线的线头就立刻按照预先设定的 程序停止并且记忆此值， 最后再对弹性装置放置的位置铣凹槽 B3， 凹槽 B3的深度由记忆值 确定；
(4)封装： 先把弹性装置放置到凹槽 B3内并与天线的线头电连接， 然后把芯片电路层 以电路接触点对应弹性装置的位置放入 B5和 B6内， 最后进行定形。
10、 根据权利要求 9所述的生产方法， 其特征在于： 步骤（1 ) 中， 将天线的线头通过往 复绕线做成一个接触盘， 接触盘位于与芯片电路层的电路接触点对应的区域。
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3015733A1 (fr) * 2013-12-23 2015-06-26 Oberthur Technologies Dispositif electronique, tel qu'une carte, comportant des moyens de contact agences en lacets et procede de fabrication d'un tel dispositif
WO2016001569A1 (fr) * 2014-07-01 2016-01-07 Oberthur Technologies Support d'antenne destine a etre integre dans un document electronique
CN112350129A (zh) * 2020-11-18 2021-02-09 广州展丰智能科技有限公司 一种非接触式智能卡绕线碰焊生产工艺及系统

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102945817A (zh) * 2012-11-21 2013-02-27 兰荣 一体式智能卡封装系统及封装方法
WO2014082401A1 (zh) * 2012-11-30 2014-06-05 Xue Yuan 双界面智能卡及其制造方法
FR3026530B1 (fr) * 2014-09-30 2017-12-22 Oberthur Technologies Document electronique a extremites d'antenne inclinees, support d'antenne pour un tel document electronique et procede de fabrication d'un tel document
CN104239946B (zh) * 2014-10-11 2018-01-26 上海东方磁卡工程有限公司 双界面智能卡及其制作方法
CN107127974A (zh) * 2016-04-29 2017-09-05 苏州海博智能系统有限公司 智能ic卡载带的焊接方法
CN106650900A (zh) * 2016-12-30 2017-05-10 郑州单点科技软件有限公司 一种双界面金属智能芯片卡
CN107085740A (zh) * 2017-05-11 2017-08-22 金邦达有限公司 一种具有金属光泽的智能卡及其制备方法
CN107478916A (zh) * 2017-08-29 2017-12-15 恒宝股份有限公司 天线测试装置、智能卡以及芯片
FR3073307B1 (fr) * 2017-11-08 2021-05-28 Oberthur Technologies Dispositif de securite tel qu'une carte a puce
FR3079645B1 (fr) * 2018-04-03 2021-09-24 Idemia France Document electronique dont une liaison electrique entre un port de puce et une plage externe de contact electrique est etablie via un inlay
CN111401503A (zh) * 2020-04-15 2020-07-10 河北博影云一科技有限公司 一种基于区块链的居民电子健康记录卡和医疗健康系统
JP2022179866A (ja) * 2021-05-24 2022-12-06 Tdk株式会社 アンテナ装置及びこれを備えるワイヤレス電力伝送デバイス

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1750026A (zh) * 2004-09-15 2006-03-22 株式会社Y.B.L 双界面ic卡
CN101350073A (zh) * 2008-08-20 2009-01-21 北京握奇数据系统有限公司 双界面智能卡的生产方法、双界面智能卡及其天线层
CN101527008A (zh) * 2009-04-24 2009-09-09 北京德鑫泉科技发展有限公司 射频识别装置及其制造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6036099A (en) * 1995-10-17 2000-03-14 Leighton; Keith Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom
JPH09156267A (ja) * 1995-12-06 1997-06-17 Watada Insatsu Kk プラスチックカード
US6161761A (en) * 1998-07-09 2000-12-19 Motorola, Inc. Card assembly having a loop antenna formed of a bare conductor and method for manufacturing the card assembly
JP2003044814A (ja) * 2001-07-31 2003-02-14 Toppan Forms Co Ltd コンビネーション型ｉｃカード及びその製造方法
DE10223509B4 (de) * 2002-05-27 2005-11-24 Mühlbauer Ag Vorrichtung zum definierten Materialabtrag sowie Verfahren zur Steuerung einer Vorrichtung
DE10257111B4 (de) * 2002-12-05 2005-12-22 Mühlbauer Ag Chipkarte und Verfahren zur Herstellung einer Chipkarte
RU2308756C2 (ru) * 2002-12-06 2007-10-20 ДжейТи КОРП Способ изготовления карт со встроенной микросхемой путем формования из нескольких слоев
US8322624B2 (en) * 2007-04-10 2012-12-04 Feinics Amatech Teoranta Smart card with switchable matching antenna
KR20090057328A (ko) * 2006-09-26 2009-06-04 알프스 덴키 가부시키가이샤 탄성 접촉자 및 이것을 이용한 금속단자 간의 접합방법
HK1109708A2 (en) * 2007-04-24 2008-06-13 On Track Innovations Ltd Interface card and apparatus and process for the formation thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1750026A (zh) * 2004-09-15 2006-03-22 株式会社Y.B.L 双界面ic卡
CN101350073A (zh) * 2008-08-20 2009-01-21 北京握奇数据系统有限公司 双界面智能卡的生产方法、双界面智能卡及其天线层
CN101527008A (zh) * 2009-04-24 2009-09-09 北京德鑫泉科技发展有限公司 射频识别装置及其制造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3015733A1 (fr) * 2013-12-23 2015-06-26 Oberthur Technologies Dispositif electronique, tel qu'une carte, comportant des moyens de contact agences en lacets et procede de fabrication d'un tel dispositif
WO2015097400A1 (fr) * 2013-12-23 2015-07-02 Oberthur Technologies Dispositif électronique, tel qu'une carte, comportant des moyens de contact agences en lacets et procédé de fabrication d'un tel dispositif
WO2016001569A1 (fr) * 2014-07-01 2016-01-07 Oberthur Technologies Support d'antenne destine a etre integre dans un document electronique
FR3023419A1 (fr) * 2014-07-01 2016-01-08 Oberthur Technologies Support d'antenne destine a etre integre dans un document electronique
US10320066B2 (en) 2014-07-01 2019-06-11 Idemia France Antenna carrier intended for being built into an electronic document
CN112350129A (zh) * 2020-11-18 2021-02-09 广州展丰智能科技有限公司 一种非接触式智能卡绕线碰焊生产工艺及系统
CN112350129B (zh) * 2020-11-18 2021-12-03 广州展丰智能科技有限公司 一种非接触式智能卡绕线碰焊生产工艺及系统

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