CN1738926A - 成膜装置用结构部件及其清洗方法 - Google Patents

成膜装置用结构部件及其清洗方法 Download PDF

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CN1738926A
CN1738926A CNA2004800023525A CN200480002352A CN1738926A CN 1738926 A CN1738926 A CN 1738926A CN A2004800023525 A CNA2004800023525 A CN A2004800023525A CN 200480002352 A CN200480002352 A CN 200480002352A CN 1738926 A CN1738926 A CN 1738926A
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base metals
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metallic diaphragm
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CN100476037C (zh
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平田招佑
矶田伸二
门肋丰
虫明克彦
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Abstract

本发明提供了一种成膜装置用结构部件以及该结构部件的清洗方法。所述装置具有能够用比以往更少的时间剥离去除形成在结构部件上的附着膜d，减轻由于清洗液s造成的构造上的损坏。通过溶射、蒸镀、溅镀、层压(laminating)等方法在母材金属(1)的表面形成在电化学性上比所述结构部件的母材(1)金属贱的金属膜层(2)。或采用上述溶射等方法，通过在金属膜层(2)的表面形成在电化学性上比上述母材金属(1)贵的第2金属膜层(3)，从而使金属膜层(2)在与母材金属(1)或第2金属膜层(3)之间形成局部电池，可使母材金属(1)自身不受清洗液的损伤，以极短的时间剥离堆积在母材金属(1)上的附着膜d。

Description

成膜装置用结构部件及其清洗方法
技术领域
本发明是一种使用成膜材料在衬底上形成各种薄膜的成膜装置用结构部件及其清洗方法。
在LSI(大规模集成电路)、太阳能电池、液晶显示器、等离子显示器等上使用的半导体部件，在其制造工序中使用成膜装置，通过将成膜材料进行蒸镀、溅镀、CVD、及其他方法，使衬底上形成薄膜。
上述成膜材料在薄膜形成时，还在成膜装置内的衬底掩模等防附着板及晶片的支撑框等的结构部件外表面也形成附着膜。
上述附着膜因在成膜装置内更换衬底时，反复进行成膜处理而堆积很厚，在某种情况下，其堆积膜的破损，成为诱发尘埃的原因，尘埃附着在正在成膜的衬底上，将有可能损害膜的目标特性，使所制造的半导体制品的成品率降低。
因此，如日本专利特开平3-87357号公报中所示，对上述结构部件的表面实施切削加工、压花加工(emboss)等机械加工处理或喷砂(blast)处理等，在使其形成一种很厚的附着膜也难以破坏、剥离脱落的构造上下工夫。
如果在成膜装置上使用经上述处理过的结构部件，令人满意的是在于薄膜形成时的附着膜难以破坏、剥离脱落这一点上。
但是，当需要除去附着膜反复使用结构部件时，则由于最初的附着膜不易破坏剥离脱落的特殊构造，而存在着用机械难以清除表面附着膜的问题。
另外，通过采用清洗液将附着膜溶解的化学除膜方法，需要将上述堆积了附着膜的结构部件浸在清洗液中达2天之久，而由于附着膜的种类和清洗液的种类的不同，出现过结构部件比附着膜更易溶解的现象。
因此，现有技术中，如在日本专利特开平11-124661号公报披露的那样，为了抑制结构部件自体的溶解并去除其表面附着膜，提供一种在上述结构部件的母材(例如：铝或铝合金)的表面，形成由比母材金属更易溶解于无机酸清洗液的金属(例如：铜或铜合金)构成的底层易溶性金属膜，进一步在其上形成多孔性金属膜的结构部件。
当该结构部件上堆积了附着膜时，清洗液从结构部件的端部及堆积膜的表面缺陷部，经由上述多孔性金属膜到达底层易溶液性金属膜，该底层金属膜最先溶解，能够以比原来更短的时间使附着膜从结构部件上剥离。
但是，在上述原来的结构部件中，从清洗液经由上述多孔性金属膜溶解底层金属膜，到附着膜从结构部件剥离附着膜为止，需要5～15小时，虽说比原来的浸泡时间缩短了，但是，仍然不得不将结构部件长时间浸泡在清洗液中，恐怕会造成母材金属不小的损坏。
同时，上述底层易溶性金属膜材料的选择方法也成为母材金属受到损坏的原因。
即，作为上述底层易溶性金属膜材料，虽然选择了比母材金属容易溶解于无机酸清洗液的金属，例如，铜或铜合金等，但当母材金属为铝或铝合金时，在根据自然电位测定的数据中，由于铜或铜合金是比铝或铝合金活性还差的贵金属，因此，由于其电位差，若长时间浸泡在清洗液中，就会在作为母材金属的铝或铝合金与作为底层易溶性金属膜的铜或铜合金之间形成局部电池，有加快母材金属溶解的危险。
因此，鉴于上述技术问题，本发明的目的在于提供一种零部件和清洗方法。此种零部件和清洗方法具有能够用比现有技术更短的时间剥离去除在上述结构部件形成的附着膜，减轻由于清洗液给母材金属造成的侵蚀和损坏。
发明内容
为解决上述技术缺陷，本发明涉及的成膜装置用结构部件，其系在衬底上形成薄膜的成膜装置的结构部件，其特征在于：通过溶射、蒸镀、溅镀、层压等方法在母材金属的表面形成在电化学上比上述结构部件母材金属贱的金属膜层。
把如此处理的结构部件浸于清洗液后，由于母材金属与上述金属膜层的自然电位差，在两者之间形成局部电池，局部电流从母材金属流到金属膜层。
一方面，在清洗液中附加的金属膜层先溶解，变成金属离子，滞留在清洗液中。
通常，当在两种金属间形成局部电池时，两者中的自然电位的电位差大的贱金属溶解速度会加快。
因此，在选择上述金属膜层的材料时，最好考虑与母材金属或附着膜之间的上述电位差后恰当选择。
进而，通过采用溶射、蒸镀、溅镀、层压等方法在母材金属的表面形成在电化学性上比上述母材金属贵的第2金属膜层；在底层金属膜层中，与第2金属膜层之间也形成局部电池，这样，溶解反应从与母材金属侧的界面及与第2金属膜层的界面双方同时进行。
此时，由于第2金属膜层与底层的金属膜层之间的电位差变得比母材金属与底层的金属膜层之间的电位差还大，因而在与第2金属膜层的界面附近形成更剧烈的溶解。
然而，由于附着膜的种类不同，有时附着膜的电位比母材金属的电位还高(比如：附着膜是钼，母材金属为铝或铝合金时)。另外，当设置了上述第2金属膜层时，由于第2金属膜层比母材金属的电位还高，所以，在这种情况下，由于母材金属相对变为贱金属，母材金属的电位变得比附着膜或第2金属膜层的电位还低，因而有母材金属被清洗液溶解的危险。
所以，若在这样的情况下，向母材金属施加正电场，使之钝化，以使母材金属转变为相对于附着膜或第2金属膜层的贵金属，从而阻止母材金属溶解。
附图说明
图1为根据本发明的结构部件局部放大截面图；(a)是使母材金属的表面形成金属膜层后，浸泡在清洗液中的截面图。(b)是使金属膜层的表面形成第2金属膜层，并浸泡在清洗液中的截面图、(c)是说明向母材金属施加正电场，并除去附着膜的清洗方法的示意图。
具体实施方式
图1(a)是使母材金属1的表面形成了金属膜层2的成膜装置用结构部件的放大截面图。由母材金属1构成的结构部件，例如，有成膜装置内的衬底掩模等防附粘着板及晶片的支撑框等。
若在成膜装置内，使成膜材料在衬底上形成薄膜，则除衬底以外，上述结构部件上也将粘着上附着膜d。
该附着膜d将因在成膜装置内不断更新衬底，并反复进行成膜处理而堆积很厚，在某种情况下，其堆积层破损，成为诱发尘埃的原因。在成膜过程中衬底上附着尘埃，将有可能损害膜的目标特性。
要想去除该附着膜d，可以将母材金属1浸到清洗液s中，加以去除，但是，从开始将清洗液s浸透附着膜d到剥离为止，需要将母材金属1浸泡在清洗液s中相当长的时间(2日左右)，存在着母材金属1也被清洗液s损坏的危险。
进而，可以考虑在母材金属的表面形成底层易溶性金属膜，进一步通过在该底层易溶性金属膜的表面形成多孔性金属膜，缩短在清洗液s的浸泡时间。但是，即使在这种情况下，附着膜从母材金属1剥离也需要5～15小时，仍然不得不将结构部件长时间浸泡在清洗液s中，有造成母材金属1较大损坏的危险。
另外，选择上述底层易溶性金属膜的材料时，可选择比母材金属1更容易溶解于清洗液s的金属，例如：铜合金等。母材金属1为铝合金时，如表1所示，根据自然电位的测定数据，由于铝合金(在硫酸1mol/l液中-0.06)是贵金属，所以，若长时间浸在清洗液中，则因其电位差，而在铝合金和铜合金之间形成局部电池，存在促使母材金属氧化逐渐溶解的危险。
所谓贵金属，系指在表1中，位于基准金属上部的金属；所谓贱金属，系指在表1中，位于基准金属下部的金属，因此，某金属是贵金属还是贱金属，是相对于作为基准的金属而确定的。
本发明通过溶射、蒸镀、溅镀、层压等方法，在母材金属1的表面形成了相对于上述母材金属1的贱金属的金属膜层2，使得其在被浸于清洗液时，在母材金属1与金属膜层2之间形成局部电池，促进金属膜层2的溶解，能在短时间内(约45分)，使得附着膜与金属膜层2同时从母材金属被剥离。
即，由于母材金属1与金属膜层2之间的电位差，使两者之间形成局部电池，局部电流从母材金属1流向金属膜层2。
另一方面，在清洗液S中，金属膜层2先溶解后，变为金属离子滞留在清洗液S中。
例如，对金属膜层2使用Al-5％In(自然电位，在硫酸1mol/l液体中为-1.17)。当母材金属1是AI合金时(JIS A5052的自然电位，在在硫酸1mol/l液体中为-0.17)，若将堆积了99.99％AL(4N-Al)(自然电位，在硫酸1mol/l液体中为-0.86)的附着膜d的部件，侵在硫酸液中，则在母材金属1与金属膜层2之间形成局部电池。金属膜层2被离子化后溶解在硫酸液中。
另外，在选择金属膜层2时，可以根据在清洗液S中的自然电位E(Vvs.SCE)，恰当选择容易与母材金属1构成局部电池的金属或合金。
参照图1(b)，3是通过溶射、蒸镀、溅镀、叠层等方法，在上述金属膜层2的表面形成含有相对于母材金属1的贵金属的第2金属膜层3。
在这种情况下，在清洗液S中，由于金属膜层2除了在与母材金属1之间形成局部电池外，在和第2金属膜层3之间，也形成局部电池。因此，溶解反应从与母材金属1侧的界面以及与第2金属膜层3的界面的双方进行，所以，与只有图1所示的金属膜层2的情况相比，能更快剥离掉附着膜d。
例如，在金属膜层2使用Al-5％In、在第2金属膜层3使用Al合金(JIS A2017的自然电位，在硫酸1mol/l液体中为-0.56)，母材金属1为Al合金(JIS A5052)时，若在其上堆积了99.99％AL(4N-Al)的附着膜d，则在硫酸液中，在母材金属1与金属膜层2之间，以及在第2金属膜层3与金属膜层2之间分别形成局部电池，金属膜层2被离子化，溶解在硫酸液中。
进而，此时，金属膜层2溶解，到附着膜d从母材金属1剥离为止大概需要15分钟。
参照图1(c)，4是电源，用于为使母材金属1具有阳极功能，而施加的正电场，电源4的负极侧被阴极5连接。
由于附着膜d的种类不同，有时其电位比母材金属1的还高，另外，当设有第2金属膜层3时，因为第2金属膜层3比母材金属1的电位还高，所以，在这种情况下，母材金属1为贱金属，母材金属1有在清洗液中被溶解的危险。
因此，在这样的情况下，可以通过电源4对母材金属1施加正电场，使之钝化，以使母材金属1转化为相对于附着膜或第2金属膜层的贵金属，从而阻止部件的溶解。
从上述说明可以明确，本发明通过在结构部件的母材金属的表面设置与母材金属形成局部电池的上述金属膜层，或在母材金属的表面设置与母材金属形成局部电池的上述第2金属膜层，而使母材金属自身不受清洗液的侵蚀，使在短时间内剥离在母材金属上堆积的附着膜成为可能，在促进结构部件的再生利用的同时，延长部件的寿命。
产业化可行性
如上所述，本发明涉及的成膜用结构部件及其清洗方法，以比现有技术更短的时间，剥离掉成膜装置用结构部件上的附着膜，使清洗液对母材金属的侵蚀得以减轻，另外，本发明涉及的结构部件以及清洗方法，可延长结构部件的使用寿命，对降低成膜装置的维护费以及节省能源做出贡献。本发明适用于衬底掩膜等的防附着板或晶片的支撑框等，通过蒸镀、溅镀、CVD、及其他方法由成膜材料在衬底上形成薄膜的成膜装置的结构部件及清洗方法。
【表1】
Figure A20048000235200111

Claims (4)

1.一种成膜装置用结构部件，为在衬底上形成薄膜的成膜装置的结构部件，其特征在于：通过溶射、蒸镀、溅镀、层压等方法在母材金属的表面形成了在电化学性上比所述结构部件的母材金属贱的金属膜层。
2.根据权利要求1所述的成膜装置用结构部件，其特征在于：通过溶射、蒸镀、溅镀、层压等方法在母材金属的表面形成了在电化学性上比所述结构部件的母材金属贵的金属膜层。
3.一种成膜装置用结构部件的清洗方法，其特征在于：在通过成膜装置形成了薄膜时，为了除去堆积在权利要求1或权利要求2所述的结构部件上的、由成膜材料构成的附着膜，而将该构成部件浸在清洗液中。
4.根据权利要求3所述的成膜装置用结构部件的清洗方法，其特征在于：向浸在清洗液中的所述结构部件的母材金属施加正电场。
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