CN1721897A - 制备挠性光学波导的方法 - Google Patents

制备挠性光学波导的方法 Download PDF

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CN1721897A
CN1721897A CN200510083356.7A CN200510083356A CN1721897A CN 1721897 A CN1721897 A CN 1721897A CN 200510083356 A CN200510083356 A CN 200510083356A CN 1721897 A CN1721897 A CN 1721897A
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optical waveguide
substrate
flexible optical
sensitive adhesive
adhesive layer
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CN100460904C (zh
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内藤龙介
宗和范
望月周
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Nitto Denko Corp
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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122Basic optical elements, e.g. light-guiding paths
    • G02B6/1221Basic optical elements, e.g. light-guiding paths made from organic materials
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/002Processes for applying liquids or other fluent materials the substrate being rotated
    • B05D1/005Spin coating
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • G02B1/045Light guides
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/25Preparing the ends of light guides for coupling, e.g. cutting
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12035Materials
    • G02B2006/12069Organic material
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12133Functions
    • G02B2006/1215Splitter
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12133Functions
    • G02B2006/12164Multiplexing; Demultiplexing

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Abstract

本发明提供一种制备挠性光学波导的方法,其包括以下步骤:将其上形成有光学波导的衬底浸入水中以减小光学波导与衬底之间的附着力,然后将光学波导从衬底上剥离;将被剥离的光学波导暂时粘接到含有发泡剂的压敏粘合剂层的表面;将被暂时粘接的光学波导切割成给定长度;在切割步骤之后,通过加热使含有发泡剂的压敏粘合剂层发泡,从而减小含有发泡剂的压敏粘合剂层和光学波导之间的附着力;以及将切割成给定长度的光学波导从发泡的粘合剂层上剥离。

Description

制备挠性光学波导的方法
技术领域
本发明涉及一种制备挠性光学波导(flexible optical waveguide)的方法,所述挠性光学波导广泛地应用在光通信、光学信息处理和其它一般光学领域中。
背景技术
光学波导安装在光学波导装置、集成光路(optical integral circuit)和光学线路板(optical wiring boards)中,并广泛地应用在光通信、光学信息处理和其它一般光学领域中。对于光学波导形成在例如硅或石英等衬底上的情况,光学波导由芯层(core layer)和一个或多个包层(cladding layer)构成,所述芯层透射光线,所述包层的折射率低于所述芯层的折射率。更具体地,这种光学波导的实例包括形成在衬底2上的具有三层结构的光学波导1,如图11所示。这种光学波导1包含形成在衬底2上的底包层(undercladding layer)11、形成在底包层11上的芯层12,以及包围(surround)所述芯层12的外包层(overcladding layer)13。
存在使用挠性形式的光学波导1的情况。在这些情况中,在衬底2上形成上述光学波导1,待在衬底2上将其切割成给定长度并从衬底2上剥离之后,使用该光学波导。
通常,使用同时具有优异的耐热性和光传输(light transmission)的氟化聚酰亚胺作为形成两个包层11和13的材料或者作为形成芯层12的材料。但是,这种构造中底包层11(氟化聚酰亚胺)对衬底2(例如硅晶片)的附着力大大降低。因此,存在的问题是,在切割过程中衬底2和底包层11之间发生分离且光学波导1移动,导致产生变形的切断面(cut surface)。当光学波导1具有形状变形的端面(end surface)的情况下,会引起光传输(light transmission)问题。
已经提出了一项用于增大光学波导的底包层与衬底之间的附着力以便于切割光学波导的技术(例如,见专利文献1)。该技术包括使用表面涂覆有气相沉积的铜的玻璃衬底作为衬底,并且使用粘合剂在该表面上形成光学波导。在该技术中,将光学波导切割成给定长度,而后将带有被切割的光学波导的玻璃衬底浸入稀盐酸中,以溶去玻璃衬底表面上的气相沉积的铜,并由此将光学波导从玻璃衬底上剥离。
专利文献1:JP 08-313747A(实施例1和2)
但是,专利文献1所公开的技术的缺点是剥离操作伴随有危险,原因是用于剥离的盐酸是强酸,可加工性差。
发明内容
本发明已经考虑了上述问题。
因此,本发明的目的是提供一种制备挠性光学波导的方法,在该方法中,当光学波导被牢固固定(tenaciously fixed)的同时,可以对光学波导进行切割,且可以安全地剥离所述光学波导。
由下面的描述,本发明的其它目的和效果是显而易见的。
本发明的上述目的是通过提供一种制备挠性光学波导的方法而实现的,所述方法包括以下步骤:
将其上形成有光学波导的衬底浸入水中以减小光学波导与衬底之间的附着力,然后将光学波导从衬底上剥离;
将被剥离的光学波导暂时粘接到含有发泡剂的压敏粘合剂层的表面;
将被暂时粘接的光学波导切割成给定长度;
在切割步骤之后,通过加热使含有发泡剂的压敏粘合剂层发泡,从而减小发泡的粘合剂层和光学波导之间的附着力;以及
将切割成给定长度的光学波导从发泡的粘合剂层上剥离。
在本发明中,术语光学波导表示一种薄膜层状产品,如上所述,其通常包括芯层和包层,所述芯层透射光线,所述包层的折射率低于所述芯层的折射率,且该包层包围所述芯层。
也就是说,在本发明的制备挠性光学波导的方法中,首先在衬底上形成光学波导,其形成方式使得可以用水将光学波导从衬底上剥离。这种形成可以通过迄今所应用的、使用普通材料(例如使用硅晶片等作为衬底材料,和使用氟化聚酰亚胺等作为底包层材料)的技术来实现。当使用这种技术形成光学波导时,如上所述,光学波导的底包层对衬底附着力相当差。由于这一原因,当把该结构体浸入水中时,底包层变得容易从衬底上剥离。剥离之后,然后将被剥离的光学波导粘接(暂时粘接)到含有发泡剂的压敏粘合剂层的表面,从而以增大的附着力将光学波导固定在含有发泡剂的压敏粘合剂层上。接着,将处于这种粘接状态的光学波导切割成给定长度。在该操作中,由于衬底与光学波导之间的附着力强,因此可以稳定地进行切割,并且得到的切断面具有光洁度(smooth finish)。然后,通过加热使含有发泡剂的压敏粘合剂层发泡。结果,发泡的粘合剂层和光学波导之间的接触面积减小,从而减小了附着力。因此,被切割成给定长度的光学波导变得容易从发泡的粘合剂层上剥离。
在本发明的制备挠性光学波导的方法中,用水将光学波导从衬底上剥离,然后将其暂时地粘接到含有发泡剂的压敏粘合剂层的表面,切割,接着在通过加热使粘合剂层发泡之后,将其从含有发泡剂的压敏粘合剂层上剥离。也就是说,由于剥离光学波导是使用水或者通过加热而进行的,因此可以安全地进行。而且,由于光学波导是在紧密地附着在含有发泡剂的压敏粘合剂层上的同时被切割的,所以可以在保持光学波导处于牢固固定状态的同时进行切割。结果,得到具有光洁度的切断面,且能够形成表现出令人满意的光传输的挠性光学波导。
附图说明
图1是本发明的制备挠性光学波导的方法的一个实施方案的示意图。
图2是制备挠性光学波导的方法的上述实施方案的示意图。
图3是制备挠性光学波导的方法的上述实施方案的示意图。
图4是制备挠性光学波导的方法的上述实施方案的示意图。
图5是制备挠性光学波导的方法的上述实施方案的示意图。
图6是制备挠性光学波导的方法的上述实施方案的示意图。
图7是制备光学波导的方法中的通用步骤的示意图。
图8是制备光学波导的方法中的通用步骤的示意图。
图9是制备光学波导的方法中的通用步骤的示意图。
图10是制备光学波导的方法中的通用步骤的示意图。
图11是沿图1中的线X-X的剖面图。
附图中使用的附图标记和符号分别表示以下组成部分:
1:光学波导,
2:衬底,
3:支承体(support),
4:含有发泡剂的压敏粘合剂层,
4′:发泡的粘合剂层,
11:底包层,
12:芯层,
12a:感光聚酰亚胺树脂前体层,
13:外包层,
C:切割面(cut plane),
M:光掩模,以及
L:紫外射线。
具体实施方式
下面参考附图详细解释本发明的实施方案。
图1-6示出本发明的制备挠性光学波导的方法的一个实施方案。在该制备挠性光学波导的方法中,首先通过迄今通用的方法在衬底2上形成光学波导1,如图1所示。然后,将得到的结构体(structure)浸入水中,从而将光学波导1从衬底2上剥离,如图2所示。之后,将被如此剥离的光学波导1粘接(暂时粘接)到压敏粘合剂层4的表面,所述压敏粘合剂层4含有发泡剂且已经形成在支承体3上,如图3所示。其后,切割处于粘接状态(暂时粘接状态)的光学波导1的两个端部,以得到给定的长度,如图4所示(在该图中,C表示切割面)。接着,加热含有发泡剂的压敏粘合剂层4,使其发泡,如图5所示。发泡的结果是,发泡的粘合剂层4′与光学波导1之间的附着力减小。因此,能够将被切割成给定长度的光学波导1从发泡的粘合剂层4′上剥离,如图6所示。由此,可以得到挠性光学波导1。
在该制备挠性光学波导的方法中,在切割过程中,被粘接到含有发泡剂的压敏粘合剂层4上的光学波导1处于与压敏粘合剂层4牢固固定的状态,因此,能够得到具有光洁度的切断面。结果,可以制备出具有令人满意的光传输的挠性光学波导1。而且,由于将光学波导1从衬底2上剥离是通过浸入水中进行的,且将光学波导1从含有发泡剂的压敏粘合剂层4上剥离是通过加热进行的,因此,可以在不使用危险的化学品或类似物的情况下安全地剥离光学波导1,而且其可加工性是良好的。
更具体地,如上所述,可以通过使用迄今仍在使用的普通材料在衬底2上形成光学波导1从而通过浸入水中将光学波导1从衬底2上剥离。即,硅晶片、涂覆有二氧化硅的硅晶片、蓝色平板玻璃、合成石英、聚酰亚胺树脂等中的任一种都可以用作形成衬底2的材料,具有优异的耐热性和光传输的氟化聚酰亚胺等可以用作形成光学波导1的底包层11的材料。当使用这些材料形成光学波导的底包层11和形成衬底2时,底包层11和衬底2之间的附着力相当弱,可以使用水容易地将两者彼此分离。
例如,含有发泡剂的压敏粘合剂层4包含含有压敏粘合剂和结合在压敏粘合剂中的发泡剂的材料。所述层4可以形成在支承体3例如支承台、支承板或支承片的表面上。
对压敏粘合剂没有具体限制,可以使用已知的粘合剂例如橡胶类粘合剂或者丙烯酸系粘合剂。所述压敏粘合剂的实例例如包括含有以下组分的压敏粘合剂:重均分子量为5,000-3,000,000的基础聚合物(base polymer),其选自橡胶状聚合物(例如天然橡胶和各种合成橡胶;丙烯酸的烷基酯、甲基丙烯酸的烷基酯等的聚合物;丙烯酸(酯)类聚合物,其是约50-99.5重量%的丙烯酸的烷基酯、甲基丙烯酸的烷基酯等与约50-0.5重量%的可与其共聚的一种或多种其它不饱和共聚单体的共聚物等);以及根据需要加入基础聚合物中的交联剂(例如聚异氰酸酯化合物或者三聚氰胺-烷基醚化合物)。在加入交联剂的情况下,其用量通常为约0.1-10重量份/100重量份基础聚合物。
对发泡剂没有具体限制,可以使用已知的发泡剂。所述发泡剂的实例包括:由碳酸铵、碳酸氢铵、碳酸氢钠、硝酸铵、硼氢化钠和叠氮化物所代表的无机发泡剂,以及由下述化合物所代表的有机发泡剂:偶氮化合物例如偶氮二异丁腈、偶氮二甲酰胺、偶氮二羧酸钡;肼化合物,例如甲苯磺酰肼、二苯砜3,3′-二磺酰肼、4,4′-氧双(苯磺酰肼)和烯丙基二(磺酰肼);氨基脲化合物,例如对亚甲代苯基磺酰氨基脲(p-toluylenesulfonylsemicarbazide)和4,4′-氧双(苯磺酰氨基脲);三唑化合物,例如5-吗啉基(morpholyl)-1,2,3,4-噻三唑;以及N-亚硝基化合物,例如N,N′-二亚硝基五亚甲基四胺和N,N′-二甲基-N,N′-二亚硝基对苯二甲酰胺。从在压敏粘合剂中的可分散性等角度看,优选使用微胶囊化的发泡剂。所述微胶囊化发泡剂的实例包括商业产品例如Microsphere(F-30、F-50和F-70,均由MatsumotoYushi-Seiyaku Co.,Ltd.生产)。待加入的发泡剂的量通常为5-300重量份/100重量份基础聚合物。但是,由于发泡性会随所使用的发泡剂的种类和加热条件等发生相当大的变化,所以发泡剂的用量不限于此范围,并可以合适地确定。发泡剂的加入量使得含有发泡剂的压敏粘合剂层4的体积经发泡增大至少2倍通常是优选的。配制该系统使得通过在100-150℃时加热约30秒-1分钟来完成发泡处理也是优选的。
对于将要在其上形成含有发泡剂的压敏粘合剂层4的支承体3例如支承片也没有具体限制。当在各种支承材料中使用支承片作为支承体3时,从强度等角度看,该支承片优选是相对硬质的且具有自支承性能的膜,例如聚酯膜或聚丙烯膜。其厚度优选10-500μm。
下面更详细地解释本发明的制备挠性光学波导的方法。
首先,通过迄今仍在使用的方法在衬底2上形成光学波导1。具体地,如图7所示,将聚酰亚胺树脂前体溶液(聚(酰胺酸)溶液)涂覆在衬底2上,基于干基准,厚度优选为1-30μm,特别优选为5-15μm,并干燥以形成含有聚酰亚胺树脂前体组合物的树脂层。可以使用普通的成膜技术例如旋涂或者流延进行涂覆。然后,在惰性气氛中加热该树脂层从而完成树脂层中残留溶剂的去除并且使聚酰亚胺树脂前体酰亚胺化。这样,就在衬底2上形成由聚酰亚胺树脂制成的底包层11。
然后,如图8所示,将感光聚酰亚胺树脂前体溶液(感光聚(酰胺酸)清漆)涂覆在底包层11上,基于干基准,厚度优选为2-30μm,特别优选为6-10μm,所述溶液含有能够提供折射率大于底包层11的折射率的层的材料。预干燥该涂层,以形成感光聚酰亚胺树脂前体层12a,其稍后变成芯层12。然后,将光掩模M放置在感光聚酰亚胺树脂前体层12a上以得到所需图案,并且从光掩模M的上方施加紫外线L,如图9所示。在本发明中,当用紫外线L进行辐射的曝光量为5-50mJ/cm2时,获得足够的分辨率(resolution)。此后,进行曝光后热处理,称为曝光后烘焙(post-exposure bake,PEB),从而完成光反应,并使用显影液显影(湿处理技术)。通常对通过显影得到的所需图案进行热处理,以使图案酰亚胺化。该处理通常在300-400℃的温度下进行,以进行溶剂的去除并在真空或者氮气氛中进行固化反应(固化)。通过这样进行的酰亚胺化,形成含有聚酰亚胺树脂的带图案芯层12,如图10所示。
对于显影中使用的显影液没有具体限制。例如,可以使用醇的碱性水溶液。更具体地,从令人满意的分辨率和容易调节显影速率的角度看,优选使用氢氧化四甲铵和乙醇的混合水溶液。在该混合水溶液中,优选调节氢氧化四甲铵与乙醇的比例使其分别为2-10重量%和40-50重量%。
然后,在芯层12上涂覆聚酰亚胺树脂前体溶液,该溶液含有能够提供折射率低于芯层12的折射率的层的成层材料,该溶液的涂覆量为使得基于干基准的最大膜厚度优选为1-30μm,特别优选为5-15μm,然后干燥以形成含有聚酰亚胺树脂前体组合物的树脂层,如图11所示。然后如底包层11的情况那样在惰性气氛中加热该树脂层,从而完成树脂层中残留溶剂的去除,并且使聚酰亚胺树脂前体酰亚胺化。由此,形成含有聚酰亚胺树脂的外包层13以包围芯层12,从而在衬底2上形成光学波导1,如图所示。上述过程是以外包层13的形成而结束的,这是迄今通用的光学波导生产方法所共有的。顺便地,图11是沿图1中的线X-X的剖视图。
本发明的特征在于后续步骤。即,将其上以上述方式形成有光学波导1的衬底2(见图1)浸入水中,从而减小光学波导1和衬底2之间的附着力。当带有光学波导1的衬底2还处于水中时或者在将其从水中取出之后立即,将光学波导1从衬底2上剥离,如图2所示。剥离之后,通过干燥等除去光学波导1表面上存在的水。
另一方面,将含有发泡剂的压敏粘合剂涂覆在支承体3的表面,以形成含有发泡剂的压敏粘合剂层4,如图3所示。从切割过程中附着力的提高和稳定性的角度看,调节其厚度为优选10-300μm,特别优选25-200μm。
将光学波导1压向并粘接(暂时粘接)到含有发泡剂的压敏粘合剂层4的表面上。在这样固定光学波导1之后,将处于这种暂时粘接状态的光学波导1切割成给定长度,如图4所示(在该图中,C表示切割面)。对于这种切割所使用的切割装置没有具体限制,其实例包括切割锯(dicing saw)。
然后,加热所得到的结构体,该结构体中的光学波导1已经被切割。这种加热使含有发泡剂的压敏粘合剂层4发泡,如图5所示。结果,发泡的粘合剂层4′与光学波导1之间的接触面积减小,因而发泡的粘合剂层4′与光学波导1之间的附着力减小。因此,光学波导1变得容易从发泡的粘合剂层4′上剥离,如图6所示。剥离光学波导1以提供挠性光学波导1。对于加热装置没有具体限制,其实例包括干燥炉和热板。如上所述,优选在100-150℃时加热约30秒-1分钟。
这样得到的挠性光学波导1的实例包括直线光学波导(straight opticalwaveguides)、弯曲光学波导(bend optical waveguides)、交叉光学波导(crossingoptical waveguides)、Y型分支光学波导(Y-branched optical waveguides)、平板光学波导(slab optical waveguides)、Mach-Zehnder型光学波导(Mach-Zehnder type optical waveguides)、AWG(alley wave guide)型光学波导、栅状光学波导(grating optical waveguides)和光学波导透镜。使用这些光学波导的光学元件的实例包括波长滤波器、光开关、光学分支单元、光多路传输器(optical multiplexer)、光多路传输器/多路输出选择器、光学放大器、波长调制器、波分复用器(wavelength division multiplexes)、光分路器、定向耦合器,以及其内混合集成有激光二极管或者光电二极管的光传输模块。
参考下面的实施例更加详细地解释本发明,但是不应认为本发明受其限制。
实施例
聚(酰胺酸)溶液
在安装有搅拌器的500ml可分离烧瓶中,将26.66g(0.06mol)酸二酐的2,2-双(3,4-二羧苯基)六氟丙烷二酐(6FDA)和18.54g(0.058mol)的2,2′-双(三氟甲基)联苯胺(BTFB)溶解于182.85g(2.10mol)有机溶剂的N,N-二甲基乙酰胺(DMAc)中。然后,在室温(25℃)下搅拌得到的溶液达10小时,从而得到聚(酰胺酸)溶液(聚酰亚胺树脂前体溶液)。
然后,通过旋涂法将聚(酰胺酸)溶液涂覆在525μm厚的硅晶片衬底上,涂覆量使得热处理后的厚度为15μm。在90℃干燥被涂覆的溶液,从而形成含有聚酰亚胺树脂前体组合物的树脂层。接着,在真空中于385℃加热该树脂层,以完成树脂膜中残留溶剂的去除并使聚酰亚胺树脂前体酰亚胺化。由此,在硅晶片衬底上形成厚度为15μm的底包层(折射率为1.51)。
然后,为了在底包层上形成芯层,通过以下方式制备感光聚酰亚胺树脂前体溶液,作为形成芯层的材料。将作为光敏剂的1-乙基-3,5-二甲氧羰基-4-(2-硝基苯基)-1,4-二氢吡啶加入上述聚(酰胺酸)溶液中,加入量为基于聚(酰胺酸)溶液固体组分的2重量%。进一步向其中加入重均分子量为500的聚乙二醇二甲醚作为溶解控制剂,加入量为基于聚(酰胺酸)溶液固体组分的30重量%。由此,得到感光聚酰亚胺树脂前体组合物作为溶液(感光聚酰亚胺树脂前体溶液)。
然后,以与形成底包层相同的方式,将感光聚酰亚胺树脂前体溶液涂覆在底包层上并在90℃干燥,以形成含有感光聚酰亚胺树脂前体组合物的感光聚酰亚胺树脂前体层。将给定光掩模(线宽6μm×长度50mm×间隔0.2mm)放置在该感光聚酰亚胺树脂前体层上,使用紫外线以30mJ/cm2的量从光掩模上方进行曝光。而且,在170℃时进行曝光后热处理10分钟。
然后使用含有2-10%的氢氧化四甲铵和40-50%的乙醇的水溶液作为显影液在35℃时使该层显影,并溶解掉未曝光的区域。接着,用水冲洗该层,以形成具有负像的图案。在真空中于330℃加热该图案以完成聚酰亚胺树脂前体的酰亚胺化。由此,形成具有给定图案的芯层(折射率为1.52)。所形成的芯层具有6μm×6μm的截面尺寸。
接着,以与形成底包层相同的方式,使用上述聚(酰胺酸)溶液(聚酰亚胺树脂前体溶液)作为形成芯层上的外包层的材料。即,通过旋涂法涂覆聚(酰胺酸)溶液,涂覆量使得热处理后的厚度为15μm,并在90℃时干燥以形成含有聚酰亚胺树脂前体组合物的树脂膜。接着,在真空中于330℃时加热该树脂膜,以完成树脂膜中残留溶剂的去除并使聚酰亚胺树脂前体酰亚胺化。结果,形成最大厚度为20μm的外包层(折射率为1.51)以包围芯层。由此,在硅晶片衬底上形成由聚酰亚胺树脂制成的光学波导。
将其上形成有光学波导的硅晶片衬底浸入25℃的水中达5分钟,在水中将光学波导从衬底上剥离。然后,从水中取出光学波导并在25℃的气氛中自然干燥。
含有发泡剂的压敏粘合剂
将100重量份由100重量份丙烯酸丁酯和2重量份丙烯酸形成的共聚物(重均分子量约为800,000)与2重量份聚异氰酸酯交联剂和30重量份Microsphere(F-30,由Matsumoto Yushi-Seiyaku Co.,Ltd.生产)一起溶解在甲苯中。通过搅拌使得到的混合物均匀,以制备含有发泡剂的压敏粘合剂。
然后,将含有发泡剂的压敏粘合剂涂覆在厚度为100μm的聚酯膜的一面上,然后使其在25℃的气氛中自然干燥,以形成厚度为30μm的含有发泡剂的压敏粘合剂层。
将光学波导压向并暂时粘接到含有发泡剂的压敏粘合剂层的表面。使用切割锯切割处于这种暂时粘接状态的光学波导的两个端部,以得到40mm的光学波导长度。切割的深度使切割锯达到含有发泡剂的压敏粘合剂层。
然后,使用120℃的热板加热所得到的结构体30秒,在该结构中光学波导已被如上切割。结果形成含有发泡剂的压敏粘合剂层。而后,从加热器中取出该结构体,使用镊子夹住两个端部已经被切割的光学波导并从发泡的粘合剂层上剥离。该剥离是容易的。
使用截断法(cutback method)在1.55μm波长处检测如此得到的挠性光学波导的光传播损失。结果发现,所述光学波导具有0.5dB/cm的光传播损失,这是非常小的值。也就是说,该实施例能够形成具有令人满意的光传输的挠性光学波导。
尽管已经参考本发明的具体实施方案对本发明进行了详细描述,但是对于本领域的普通技术人员来说,很明显,在不偏离本发明的实质和范围的情况下可以对本发明进行各种变化和改进。
本申请是基于2004年7月12日提交的日本专利申请No.2004-204916,在此引入其内容作为参考。

Claims (12)

1.一种制备挠性光学波导的方法,其包括以下步骤:
将其上形成有光学波导的衬底浸入水中以减小光学波导与衬底之间的附着力,然后将光学波导从衬底上剥离;
将被剥离的光学波导暂时粘接到含有发泡剂的压敏粘合剂层的表面;
将被暂时粘接的光学波导切割成给定长度;
在切割步骤之后,通过加热使含有发泡剂的压敏粘合剂层发泡,从而减小含有发泡剂的压敏粘合剂层和光学波导之间的附着力;以及
将切割成给定长度的光学波导从发泡的粘合剂层上剥离。
2.权利要求1的制备挠性光学波导的方法,其中所述衬底包含选自硅晶片、涂覆有二氧化硅的硅晶片、蓝色平板玻璃、合成石英和聚酰亚胺树脂中的至少一种。
3.权利要求1的制备挠性光学波导的方法,其中所述形成在衬底上的光学波导至少包含:
布置在所述衬底上的底包层;以及
布置在所述底包层上的带图案芯层。
4.权利要求3的制备挠性光学波导的方法,其中所述底包层含有氟化聚酰亚胺。
5.权利要求3的制备挠性光学波导的方法,其中所述带图案芯层含有折射率大于所述底包层的折射率的聚酰亚胺。
6.权利要求3的制备挠性光学波导的方法,其中所述光学波导还包含包围所述带图案芯层布置的外包层。
7.权利要求6的制备挠性光学波导的方法,其中所述外包层含有折射率小于所述带图案芯层的折射率的聚酰亚胺。
8.权利要求1的制备挠性光学波导的方法,其中压敏粘合剂层中所含的发泡剂是微胶囊化的。
9.权利要求1的制备挠性光学波导的方法,其中为使所述含有发泡剂的压敏粘合剂层发泡而进行的加热在100℃-150℃时持续约30秒-1分钟。
10.权利要求1的制备挠性光学波导的方法,其中所述含有发泡剂的压敏粘合剂层由支承体支承。
11.权利要求10的制备挠性光学波导的方法,其中所述支承体包括聚酯或聚丙烯。
12.权利要求10的制备挠性光学波导的方法,其中所述支承体具有10-500μm的厚度。
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CN103627336A (zh) * 2013-05-14 2014-03-12 苏州邦立达新材料有限公司 一种压敏胶带及其制备方法

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