CN1703295A - 一种用于填充球栅极阵列模板的设备和方法 - Google Patents

一种用于填充球栅极阵列模板的设备和方法 Download PDF

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Publication number
CN1703295A
CN1703295A CNA2003801012631A CN200380101263A CN1703295A CN 1703295 A CN1703295 A CN 1703295A CN A2003801012631 A CNA2003801012631 A CN A2003801012631A CN 200380101263 A CN200380101263 A CN 200380101263A CN 1703295 A CN1703295 A CN 1703295A
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CN
China
Prior art keywords
ball
substrate
template
grid array
hopper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2003801012631A
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English (en)
Chinese (zh)
Inventor
黄文洲
谭永桦
林贻潮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AOLIGEN TECHNOLOGY Co Ltd
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AOLIGEN TECHNOLOGY Co Ltd
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Filing date
Publication date
Application filed by AOLIGEN TECHNOLOGY Co Ltd filed Critical AOLIGEN TECHNOLOGY Co Ltd
Publication of CN1703295A publication Critical patent/CN1703295A/zh
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CNA2003801012631A 2002-10-14 2003-10-13 一种用于填充球栅极阵列模板的设备和方法 Pending CN1703295A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG02062545 2002-10-14
SG200206254 2002-10-14

Publications (1)

Publication Number Publication Date
CN1703295A true CN1703295A (zh) 2005-11-30

Family

ID=32105814

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2003801012631A Pending CN1703295A (zh) 2002-10-14 2003-10-13 一种用于填充球栅极阵列模板的设备和方法

Country Status (6)

Country Link
US (1) US7458499B2 (enExample)
JP (1) JP4528626B2 (enExample)
CN (1) CN1703295A (enExample)
AU (1) AU2003273208A1 (enExample)
TW (1) TWI272708B (enExample)
WO (1) WO2004035253A1 (enExample)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101276759A (zh) * 2007-03-26 2008-10-01 矽品精密工业股份有限公司 焊球植球设备及其撷取装置
CN102105254A (zh) * 2008-06-24 2011-06-22 洛科企业有限公司 用于布置焊球的方法和设备
CN102122606A (zh) * 2010-11-16 2011-07-13 上海微松工业自动化有限公司 一种晶圆级封装微球自动收集及供球循环设备
CN102956513A (zh) * 2011-08-18 2013-03-06 深南电路有限公司 一种球栅阵列器件的植球方法、系统及其夹具
CN101743480B (zh) * 2006-11-22 2013-03-27 洛科企业有限公司 改进的球植入装置和方法
CN103418875A (zh) * 2013-08-20 2013-12-04 歌尔声学股份有限公司 自动植入锡球装置
CN105855659A (zh) * 2016-06-27 2016-08-17 上海嘉强自动化技术有限公司 一种微型锡球焊接的送料装置
CN109300815A (zh) * 2018-10-12 2019-02-01 济南晶恒电子有限责任公司 圆柱形无脚器件引线自动装填机
CN109436848A (zh) * 2018-10-30 2019-03-08 立讯精密工业（滁州）有限公司 一种锡球送料机构
CN110023020A (zh) * 2017-03-03 2019-07-16 奥利进科技有限公司 用于填充球栅阵列的设备和方法
CN116917074A (zh) * 2021-03-24 2023-10-20 株式会社富士 焊球供给装置及焊球供给方法

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JP4576424B2 (ja) * 2005-03-30 2010-11-10 富士通株式会社 ボール捕捉装置、半田ボール配置装置、ボール捕捉方法、および半田ボール配置方法
US20080308612A1 (en) * 2007-06-15 2008-12-18 Best Inc. Manual method for reballing using a solder preform
US7802901B2 (en) * 2007-09-25 2010-09-28 Cree, Inc. LED multi-chip lighting units and related methods
JP5056491B2 (ja) * 2007-11-02 2012-10-24 イビデン株式会社 半田ボール搭載装置
WO2009102281A1 (en) * 2008-02-14 2009-08-20 Aurigin Technology Pte Ltd Apparatus and method for solder ball filing
US7780063B2 (en) * 2008-05-15 2010-08-24 International Business Machines Corporation Techniques for arranging solder balls and forming bumps
US8813350B2 (en) * 2011-06-03 2014-08-26 Seagate Technology Llc Solder ball pattern forming
TWI469295B (zh) * 2012-11-21 2015-01-11 All Ring Tech Co Ltd A Method and Device for Filling Ball Grid Array Fixture
TWI476884B (zh) * 2012-11-21 2015-03-11 All Ring Tech Co Ltd A Method and Device for Filling Ball Grid Array Fixture
US8955735B2 (en) * 2013-05-17 2015-02-17 Zen Voce Corporation Method for enhancing the yield rate of ball implanting of a substrate of an integrated circuit
US9120170B2 (en) * 2013-11-01 2015-09-01 Zen Voce Corporation Apparatus and method for placing and mounting solder balls on an integrated circuit substrate
CN104485300B (zh) * 2014-12-10 2017-11-24 华进半导体封装先导技术研发中心有限公司 磁性非对称型柱或核球的植球治具及植球方法
US11247285B1 (en) * 2020-04-03 2022-02-15 Seagate Technology Llc Fluidization of agglomerated solder microspheres

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US5551216A (en) * 1994-09-14 1996-09-03 Vanguard Automation, Inc. Method and apparatus for filling a ball grid array
JP2792596B2 (ja) * 1994-11-07 1998-09-03 キヤノン電子株式会社 はんだチップの実装方法及び実装装置及び供給装置及び整列装置及び吸着ヘッド及び回路基板
US5762258A (en) * 1996-07-23 1998-06-09 International Business Machines Corporation Method of making an electronic package having spacer elements
US6604673B1 (en) 1999-03-17 2003-08-12 Novatec Sa Filling device and method for filling balls in the apertures of a ball-receiving element
US6276598B1 (en) 1999-07-13 2001-08-21 Asm Assembly Automation Ltd. Method and apparatus for ball placement
JP3552610B2 (ja) 1999-10-22 2004-08-11 松下電器産業株式会社 導電性ボールの移載装置および移載方法並びに導電性ボールの供給装置および供給方法
JP3619410B2 (ja) * 1999-11-18 2005-02-09 株式会社ルネサステクノロジ バンプ形成方法およびそのシステム
JP4233190B2 (ja) 1999-11-30 2009-03-04 日立ビアメカニクス株式会社 はんだボールの搭載方法およびその装置
US6766938B2 (en) 2002-01-08 2004-07-27 Asm Assembly Automation Ltd. Apparatus and method of placing solder balls onto a substrate

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101743480B (zh) * 2006-11-22 2013-03-27 洛科企业有限公司 改进的球植入装置和方法
CN101276759A (zh) * 2007-03-26 2008-10-01 矽品精密工业股份有限公司 焊球植球设备及其撷取装置
CN101276759B (zh) * 2007-03-26 2012-10-10 矽品精密工业股份有限公司 焊球植球设备及其撷取装置
CN102105254A (zh) * 2008-06-24 2011-06-22 洛科企业有限公司 用于布置焊球的方法和设备
CN102122606A (zh) * 2010-11-16 2011-07-13 上海微松工业自动化有限公司 一种晶圆级封装微球自动收集及供球循环设备
CN102122606B (zh) * 2010-11-16 2012-07-18 上海微松工业自动化有限公司 一种晶圆级封装微球自动收集及供球循环设备
CN102956513A (zh) * 2011-08-18 2013-03-06 深南电路有限公司 一种球栅阵列器件的植球方法、系统及其夹具
CN103418875A (zh) * 2013-08-20 2013-12-04 歌尔声学股份有限公司 自动植入锡球装置
CN105855659A (zh) * 2016-06-27 2016-08-17 上海嘉强自动化技术有限公司 一种微型锡球焊接的送料装置
CN105855659B (zh) * 2016-06-27 2017-12-19 上海嘉强自动化技术有限公司 一种微型锡球焊接的送料装置
CN110023020A (zh) * 2017-03-03 2019-07-16 奥利进科技有限公司 用于填充球栅阵列的设备和方法
CN110023020B (zh) * 2017-03-03 2021-08-31 奥利进科技有限公司 用于填充球栅阵列的设备和方法
CN109300815A (zh) * 2018-10-12 2019-02-01 济南晶恒电子有限责任公司 圆柱形无脚器件引线自动装填机
CN109436848A (zh) * 2018-10-30 2019-03-08 立讯精密工业（滁州）有限公司 一种锡球送料机构
CN109436848B (zh) * 2018-10-30 2020-09-29 立讯精密工业（滁州）有限公司 一种锡球送料机构
CN116917074A (zh) * 2021-03-24 2023-10-20 株式会社富士 焊球供给装置及焊球供给方法

Also Published As

Publication number Publication date
TWI272708B (en) 2007-02-01
JP4528626B2 (ja) 2010-08-18
WO2004035253A1 (en) 2004-04-29
JP2006503437A (ja) 2006-01-26
AU2003273208A1 (en) 2004-05-04
TW200406051A (en) 2004-04-16
US20060169743A1 (en) 2006-08-03
US7458499B2 (en) 2008-12-02

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Open date: 20051130