AU2003273208A1 - An apparatus and method for filling a ball grid array template - Google Patents

An apparatus and method for filling a ball grid array template

Info

Publication number
AU2003273208A1
AU2003273208A1 AU2003273208A AU2003273208A AU2003273208A1 AU 2003273208 A1 AU2003273208 A1 AU 2003273208A1 AU 2003273208 A AU2003273208 A AU 2003273208A AU 2003273208 A AU2003273208 A AU 2003273208A AU 2003273208 A1 AU2003273208 A1 AU 2003273208A1
Authority
AU
Australia
Prior art keywords
filling
grid array
ball grid
array template
template
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003273208A
Other languages
English (en)
Inventor
Ee Teoh Lim
Boon Chew Ng
Wing Wah Tam
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aurigin Technology Pte Ltd
Original Assignee
Aurigin Technology Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aurigin Technology Pte Ltd filed Critical Aurigin Technology Pte Ltd
Publication of AU2003273208A1 publication Critical patent/AU2003273208A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
AU2003273208A 2002-10-14 2003-10-13 An apparatus and method for filling a ball grid array template Abandoned AU2003273208A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SG0206254-5 2002-10-14
SG200206254 2002-10-14
PCT/SG2003/000246 WO2004035253A1 (en) 2002-10-14 2003-10-13 An apparatus and method for filling a ball grid array template

Publications (1)

Publication Number Publication Date
AU2003273208A1 true AU2003273208A1 (en) 2004-05-04

Family

ID=32105814

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003273208A Abandoned AU2003273208A1 (en) 2002-10-14 2003-10-13 An apparatus and method for filling a ball grid array template

Country Status (6)

Country Link
US (1) US7458499B2 (enExample)
JP (1) JP4528626B2 (enExample)
CN (1) CN1703295A (enExample)
AU (1) AU2003273208A1 (enExample)
TW (1) TWI272708B (enExample)
WO (1) WO2004035253A1 (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4576424B2 (ja) * 2005-03-30 2010-11-10 富士通株式会社 ボール捕捉装置、半田ボール配置装置、ボール捕捉方法、および半田ボール配置方法
SG194412A1 (en) * 2006-11-22 2013-11-29 Rokko Ventures Pte Ltd An improved ball mounting apparatus and method
CN101276759B (zh) * 2007-03-26 2012-10-10 矽品精密工业股份有限公司 焊球植球设备及其撷取装置
US20080308612A1 (en) * 2007-06-15 2008-12-18 Best Inc. Manual method for reballing using a solder preform
US7802901B2 (en) * 2007-09-25 2010-09-28 Cree, Inc. LED multi-chip lighting units and related methods
JP5056491B2 (ja) * 2007-11-02 2012-10-24 イビデン株式会社 半田ボール搭載装置
WO2009102281A1 (en) * 2008-02-14 2009-08-20 Aurigin Technology Pte Ltd Apparatus and method for solder ball filing
US7780063B2 (en) * 2008-05-15 2010-08-24 International Business Machines Corporation Techniques for arranging solder balls and forming bumps
SG157985A1 (en) * 2008-06-24 2010-01-29 Rokko Ventures Pte Ltd Method and apparatus for solder ball placement
CN102122606B (zh) * 2010-11-16 2012-07-18 上海微松工业自动化有限公司 一种晶圆级封装微球自动收集及供球循环设备
US8813350B2 (en) * 2011-06-03 2014-08-26 Seagate Technology Llc Solder ball pattern forming
CN102956513A (zh) * 2011-08-18 2013-03-06 深南电路有限公司 一种球栅阵列器件的植球方法、系统及其夹具
TWI469295B (zh) * 2012-11-21 2015-01-11 All Ring Tech Co Ltd A Method and Device for Filling Ball Grid Array Fixture
TWI476884B (zh) * 2012-11-21 2015-03-11 All Ring Tech Co Ltd A Method and Device for Filling Ball Grid Array Fixture
US8955735B2 (en) * 2013-05-17 2015-02-17 Zen Voce Corporation Method for enhancing the yield rate of ball implanting of a substrate of an integrated circuit
CN103418875A (zh) * 2013-08-20 2013-12-04 歌尔声学股份有限公司 自动植入锡球装置
US9120170B2 (en) * 2013-11-01 2015-09-01 Zen Voce Corporation Apparatus and method for placing and mounting solder balls on an integrated circuit substrate
CN104485300B (zh) * 2014-12-10 2017-11-24 华进半导体封装先导技术研发中心有限公司 磁性非对称型柱或核球的植球治具及植球方法
CN105855659B (zh) * 2016-06-27 2017-12-19 上海嘉强自动化技术有限公司 一种微型锡球焊接的送料装置
SG10201701738VA (en) * 2017-03-03 2018-10-30 Aurigin Tech Pte Ltd Apparatus And Method For Filling A Ball Grid Array
CN109300815A (zh) * 2018-10-12 2019-02-01 济南晶恒电子有限责任公司 圆柱形无脚器件引线自动装填机
CN109436848B (zh) * 2018-10-30 2020-09-29 立讯精密工业（滁州）有限公司 一种锡球送料机构
US11247285B1 (en) * 2020-04-03 2022-02-15 Seagate Technology Llc Fluidization of agglomerated solder microspheres
CN116917074A (zh) * 2021-03-24 2023-10-20 株式会社富士 焊球供给装置及焊球供给方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5551216A (en) * 1994-09-14 1996-09-03 Vanguard Automation, Inc. Method and apparatus for filling a ball grid array
JP2792596B2 (ja) * 1994-11-07 1998-09-03 キヤノン電子株式会社 はんだチップの実装方法及び実装装置及び供給装置及び整列装置及び吸着ヘッド及び回路基板
US5762258A (en) * 1996-07-23 1998-06-09 International Business Machines Corporation Method of making an electronic package having spacer elements
US6604673B1 (en) 1999-03-17 2003-08-12 Novatec Sa Filling device and method for filling balls in the apertures of a ball-receiving element
US6276598B1 (en) 1999-07-13 2001-08-21 Asm Assembly Automation Ltd. Method and apparatus for ball placement
JP3552610B2 (ja) 1999-10-22 2004-08-11 松下電器産業株式会社 導電性ボールの移載装置および移載方法並びに導電性ボールの供給装置および供給方法
JP3619410B2 (ja) * 1999-11-18 2005-02-09 株式会社ルネサステクノロジ バンプ形成方法およびそのシステム
JP4233190B2 (ja) 1999-11-30 2009-03-04 日立ビアメカニクス株式会社 はんだボールの搭載方法およびその装置
US6766938B2 (en) 2002-01-08 2004-07-27 Asm Assembly Automation Ltd. Apparatus and method of placing solder balls onto a substrate

Also Published As

Publication number Publication date
TWI272708B (en) 2007-02-01
JP4528626B2 (ja) 2010-08-18
WO2004035253A1 (en) 2004-04-29
JP2006503437A (ja) 2006-01-26
TW200406051A (en) 2004-04-16
US20060169743A1 (en) 2006-08-03
CN1703295A (zh) 2005-11-30
US7458499B2 (en) 2008-12-02

Similar Documents

Publication Publication Date Title
AU2003273208A1 (en) An apparatus and method for filling a ball grid array template
GB0215582D0 (en) A method and apparatus for gain calibration
AU2002229921A1 (en) Method and apparatus for generating a physical exercise program
AU2003297484A1 (en) Apparatus and method for making a forming structure
AU2003277095A1 (en) A method and apparatus for providing an instant win program
AU2003201433A1 (en) Method and apparatus for integrating a wide keyboard in a small device
AU2003258110A8 (en) A system and method for playing black jack
AU2003297970A1 (en) Method and apparatus for creating a report
AU2003234547A1 (en) Method and apparatus for reducing transmission-link errors
ZA200607005B (en) A method and apparatus for orienting spherical cells
EP1649627A4 (en) PROCESS AND DEVICE FOR PLAN PRODUCTION
IL154677A0 (en) A method and apparatus for manipulating an individual cell
AU2003286877A8 (en) Method and apparatus for data acquisition
EP1530546A4 (en) METHOD AND DEVICE FOR MOVING A MASS
AU2003232507A1 (en) Device and method for generating a random number
AU6512499A (en) Apparatus and method for filling a ball grid array
AU2003280322A1 (en) An apparatus and a method for urological measurements
IL166215A0 (en) Method and device for producing a stamp
AU2003239323A1 (en) Method and apparatus for enabling a quick repeat feature
AU1584101A (en) Method and apparatus for assembling ball grid array and chip scale array
AU2003223682A1 (en) Method and apparatus for selecting devices on a data bus
AU2002254162A1 (en) Apparatus and method for labeling rows and columns in an irregular array
GB0317109D0 (en) Method and apparatus for simplifying a circuit model
AU2003205248A1 (en) Method and apparatus for a nack-protocol
AU2003297911A1 (en) Apparatus and method for identifying biomarkers using a computer model

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase