CN1697149A - 集成电路封装方法 - Google Patents

集成电路封装方法 Download PDF

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CN1697149A
CN1697149A CN 200410044205 CN200410044205A CN1697149A CN 1697149 A CN1697149 A CN 1697149A CN 200410044205 CN200410044205 CN 200410044205 CN 200410044205 A CN200410044205 A CN 200410044205A CN 1697149 A CN1697149 A CN 1697149A
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连世雄
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HONGLIAN INT TECH Co Ltd
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Abstract

本发明公开了一种集成电路封装方法，该方法依序包括晶圆研磨、晶圆贴片、晶圆切割、晶粒上片、焊接工艺步骤，使复数晶粒分别固定于导线架的各导线架单元上，该导线架单元具有复数排列状引指，并具有金属线连接于晶粒的电性接点与导线架单元的各引指间，其特征在于：后续封装作业包括以下步骤：(a)、选定晶粒实施有金属线构成可对外电性连接的部位，使用熔融呈适当黏度的液态封胶材料直接进行点胶，藉此密封金属线的电性连接部位；(b)、再将点置完成的封胶材料施以适温烘烤，进一步使该封胶材料固化成封胶体；(c)、最后利用刀具冲切方式，将各导线架单元的引指外端多余的材料切除，并藉此分离成为结构中包括有晶粒、导线架单元、复数引指、金属线及封胶体的集成电路，该方法程序简易、快速、成本低，易于控制集成电路的质量，而且适于大批量生产。

Description

集成电路封装方法
技术领域
本发明涉及一种集成电路封装方法，特别涉及一种晶粒与导线架组合并焊接导线之后，特别进行点胶、烘烤及切单方法制程的集成电路封装方法。
背景技术
习知的集成电路结构如图1所示，是令一经过切割的晶粒10黏固于一导线架单元20上，其中该导线架单元20具有复数排列状引指201，可提供晶粒10与引指201的选定面焊接有导线30，以各引指201作为晶粒10的对外导电性元件；因该导线30相当精密，为免受到外力损坏，习知制程上会通过封装方法加以密封，即利用模具等设备包覆于晶粒10及导线架单元20周围，藉此于模具中灌入绝缘性材料，以构成晶粒10及导线架单元20周围有一封胶体40；藉此，如图2所示，再经过切割方式将封装完成的集成电路切取，以提供相关业者使用。
但是，习见的封装方法必须配合移转模压模(Transfer Mold)模具进行，因此必须准备多种及各式尺寸、形态的模具，从而让集成电路的封装成本无法降低，而且增加许多模具在质量管理上的麻烦；其次，因模具包覆于晶粒10及导线架单元20周围时，各引指201间的缝隙并未实施阻挡，因此，在高压罐入封胶材料后，其封胶材料往往会溢流到导线架单元20以外，造成封装产品上的瑕疵；如欲使用阻挡元件防止封胶材料在各引指201间溢流，又受限于导线架单元20的各引指201相当细密，不仅实施技术困难、徒增制程上的麻烦，而且容易发生碰坏引指201等情况。另外，习见集成电路是封装后采用切割方式撷取出集成电路(排除导线架其它废料)，因此，只能逐一进行切割动作，如图2所示，而影响大量生产时的效率。
发明内容
本发明的目的是要解决上述习见的封装方法必须配合多种及各式尺寸、形态的移转模压模模具进行，从而导致封装成本高以及生产效率低的问题，而提供一种可克服上述缺点的集成电路封装方法。
本发明之方法依序包括：晶圆研磨、晶圆贴片、晶圆切割、晶粒上片、焊接工艺步骤，使复数晶粒分别固定于导线架的各导线架单元上，该导线架单元具有复数排列状引指，并具有金属线连接于晶粒的电性接点与导线架单元的各引指间，以提供后续封装作业，其特征在于：后续封装作业包括以下步骤：
(a)、选定晶粒实施有金属线构成可对外电性连接的部位，使用熔融呈适当黏度的液态封胶材料直接进行点胶，藉此密封金属线的电性连接部位；
(b)、再将点置完成的封胶材料施以适温烘烤，进一步使该封胶材料固化成封胶体；
(c)、最后利用刀具冲切方式，将各导线架单元的引指外端多余的材料切除，并藉此分离成为结构中包括有晶粒、导线架单元、复数引指、金属线及封胶体的集成电路。该方法程序简易、快速、成本低，易于控制集成电路的质量，而且适于大批量生产。
所述的后续封装作业包括晶粒一面实施有金属线而构成可对外电性连接的部位，预先覆盖有一板片，该板片在对应金属线的电性连接部位设有一开孔，藉此将封胶材料置于板片上面，通过刮刀推移封胶材料而填满开孔，藉此使封胶材料密封金属线的电性连接的部位。
附图说明
图1为习见集成电路组成结构的剖视示意图。
图2为习见集成电路与导线架其它部位切割分离的示意图。
图3为本发明的封装流程示意图。
图4为本发明晶圆贴片制造方法示意图。
图5为本发明导线架及导线架单元结构的示意图。
图6为本发明焊线制造方法示意图。
图7为本发明点胶制造方法示意图。
图8为本发明切单制造方法示意图。
图9为本发明之集成电路组成结构的剖视示意图。
图10为本发明之集成电路组成结构的底视示意图。
图11为本发明涂布封胶材料的实施示意图。
具体实施方式
请参阅图3所示，本发明之方法包括下列步骤：
(A)、晶圆研磨：是将切割形成圆片状的晶圆10进行背面研磨加工，使其厚度控制在产品规格尺寸，该项晶圆10背面研磨加工，是视实际需求而定，也可不需进行晶圆研磨；
(B)、晶圆贴片：如图4所示，是将上述研磨或不需研磨的晶圆10，通过黏着物2(例如胶带等)暂固定于金属框3上，以供后续制程作业使用；
(C)、晶圆切割：应用冲头模具(例如钻石刀)切割晶圆10，使其形成有复数独立单元而暂时黏固于金属框或圈3上的晶粒1；
(D)、晶粒上片：将切割完成的晶粒1通过吸取设备，分别移置于导线架4的各导线架单元41上，并藉以黏着物2(例如胶带或黏胶)使晶粒1与导线架单元41黏固，其中，该导线架4及导线架单元41结构，请参阅图5所示，是以板片(如铜片)于表面连续冲压出复数导线架单元41，各导线架单元41具有暂未切割分离的复数排列状引指411，以该引指411作为晶粒1的对外导电性元件；
(E)、焊线：如图6所示，是以金属线5(例如金线)运用机器而分别焊接晶粒1的电性接点及引指411内侧端选定处之间，以达成晶粒1可藉引指411对外电性连接功能；
(F)、点胶：如图7所示，其是选定晶粒1实施有金属线5构成可对外电性连接的部位，使用熔融成为液态的封胶材料6(绝缘性材料)直接进行连续点胶，藉此密封金属线5的电性连接部位；
(G)、烘烤：将上述点置完成的封胶材料6施以适温烘烤，进一步使该封胶材料6固化成封胶体6’，以该封胶体6’密封金属线5的电性连接部位，如图9、图10所示，而各导线架单元41的引指411外端是呈外露状态；
(H)、切单：如图8所示，藉上述已封装完成的制程，可进一步利用刀具冲切方式，将各导线架单元41的引指411外端多余的材料切除，并藉此分离成为结构中包括有晶粒1、导线架单元41、复数引指411、金属线5及封胶体6’的集成电路，可供特定电子产品使用。
利用本发明所组成的集成电路结构，如图9、图10所示，是在上面设有一特定功能性的晶粒1(晶片)，其底部设有包括复数排列状引指411所构成的导线架单元41，在晶粒1与各引指411间分别设有金属线5构成电性连接，而且该金属线5的电性连接部位具有封胶体6’构成密封，以预留各引指411外侧端及底面作为与电路板连接的部位，即为可焊接应用于各种电子产品中的集成电路。
但是，利用本发明“点胶”(F)制程方法的实施，因其是将熔融成适当黏度的液态封胶材料6，直接点设密封住金属线5的电性连接部位，并经过适温烘烤固化成封胶体6’，因此，即可使封胶体6’具有保护金属线5电性连接部位的作用；而且藉此项制程实施，可节省使用习知的模具设备，故可达到制造程序简易、快速、成本降低、易于控制集成电路质量，而且适于大批量生产的目的。
另外，因本发明在“切单”(H)制程时，是采用刀具冲切方式切取出独立单元的集成电路，并排除导线架4多余的材料，故可藉此利用冲头模具，一次切取下多数个集成电路，以改善习知逐一切割的制造方法，更进一步加速集成电路产品的制成，而适于大批量生产。
再者，本发明“点胶”(F)制程方法的实施，也可采用“涂布”方式实现，请参阅图11所示，其是于晶粒1一面实施有金属线5构成可对外电性连接的部位(面)，预先覆盖有一板片7，该板片7在对应金属线5的电性连接部位设有至少一开孔71，藉此将封胶材料6置于板片7上面，通过刮刀72推移封胶材料6而填满开孔71，藉此使封胶材料6密封金属线5的电性连接的部位，并于取下板片7后，经过“烘烤”(G)制程方法的实施，也可构成封胶体6’密封金属线5电性连接部位的结构，以进行后续的“切单”(H)等制程，以制作出独立单元的集成电路；因为此项采用板片7配合刮刀72进行“涂布”的制造方法，也无需使用习见的移转模压模(Transfer Mold)模具，故可实现相同于上述制造程序简易、快速、成本降低、易于控制集成电路质量，而且适于大批量生产的目的。

Claims (2)

1、一种集成电路封装方法，该方法依序包括：晶圆研磨、晶圆贴片、晶圆切割、晶粒上片、焊接工艺步骤，使复数晶粒分别固定于导线架的各导线架单元上，该导线架单元具有复数排列状引指，并具有金属线连接于晶粒的电性接点与导线架单元的各引指间，其特征在于：后续封装作业包括以下步骤：
(a)、选定晶粒实施有金属线构成可对外电性连接的部位，使用熔融呈适当黏度的液态封胶材料直接进行点胶，藉此密封金属线的电性连接部位；
(b)、再将点置完成的封胶材料施以适温烘烤，进一步使该封胶材料固化成封胶体；
(c)、最后利用刀具冲切方式，将各导线架单元的引指外端多余的材料切除，并藉此分离成为结构中包括有晶粒、导线架单元、复数引指、金属线及封胶体的集成电路。
2、根据权利要求1所述的一种集成电路封装方法，其特征在于：所述的后续封装作业还包括，在晶粒一面实施有金属线而构成可对外电性连接的部位，预先覆盖有一板片，该板片在对应金属线的电性连接部位设有一开孔，藉此将封胶材料置于板片上面，通过刮刀推移封胶材料而填满开孔，藉此使封胶材料密封金属线的电性连接的部位。
CN 200410044205 2004-05-12 2004-05-12 集成电路封装方法 Pending CN1697149A (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102157390A (zh) * 2011-01-25 2011-08-17 日月光半导体（昆山）有限公司 自动去除半导体封装不良品的机台及方法
CN113314426A (zh) * 2021-05-26 2021-08-27 广东国峰半导体有限公司 一种半导体封装工艺

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102157390A (zh) * 2011-01-25 2011-08-17 日月光半导体（昆山）有限公司 自动去除半导体封装不良品的机台及方法
CN102157390B (zh) * 2011-01-25 2013-03-27 日月光半导体（昆山）有限公司 自动去除半导体封装不良品的机台及方法
CN113314426A (zh) * 2021-05-26 2021-08-27 广东国峰半导体有限公司 一种半导体封装工艺

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