CN1696775A - 具有外部端子的lcd器件 - Google Patents
具有外部端子的lcd器件 Download PDFInfo
- Publication number
- CN1696775A CN1696775A CN200510068807.XA CN200510068807A CN1696775A CN 1696775 A CN1696775 A CN 1696775A CN 200510068807 A CN200510068807 A CN 200510068807A CN 1696775 A CN1696775 A CN 1696775A
- Authority
- CN
- China
- Prior art keywords
- lcd device
- insulator
- outside terminal
- conducting film
- island
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09481—Via in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09909—Special local insulating pattern, e.g. as dam around component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
Claims (12)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004-141168 | 2004-05-11 | ||
JP2004141168A JP4554983B2 (ja) | 2004-05-11 | 2004-05-11 | 液晶表示装置 |
JP2004141168 | 2004-05-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1696775A true CN1696775A (zh) | 2005-11-16 |
CN100426068C CN100426068C (zh) | 2008-10-15 |
Family
ID=35309060
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB200510068807XA Active CN100426068C (zh) | 2004-05-11 | 2005-05-11 | 具有外部端子的lcd器件 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7639338B2 (zh) |
JP (1) | JP4554983B2 (zh) |
CN (1) | CN100426068C (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101080137B (zh) * | 2006-05-25 | 2010-06-09 | Nec液晶技术株式会社 | 多层印刷电路板和液晶显示单元 |
CN106462290A (zh) * | 2014-05-28 | 2017-02-22 | 康宁公司 | 具有在盖板与框架之间的刚性界面的触摸屏组件 |
CN109037998A (zh) * | 2018-08-08 | 2018-12-18 | 武汉华星光电半导体显示技术有限公司 | 电连接组件及显示装置、电连接方法 |
CN109445209A (zh) * | 2018-10-24 | 2019-03-08 | 昆山国显光电有限公司 | 显示面板和显示装置 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100769435B1 (ko) * | 2005-11-30 | 2007-10-22 | 삼성에스디아이 주식회사 | 액정 표시 장치 |
KR101237115B1 (ko) | 2005-12-26 | 2013-02-25 | 엘지디스플레이 주식회사 | 발광 다이오드들을 포함하는 백라이트 패널 및 그 제조방법 |
JP4968665B2 (ja) * | 2006-04-18 | 2012-07-04 | Nltテクノロジー株式会社 | フラットディスプレイパネル及び接続構造 |
EP2398008A4 (en) | 2009-02-10 | 2012-09-19 | Sharp Kk | CONNECTION TERMINAL AND DISPLAY DEVICE WITH CONNECTION TERMINAL |
KR102586043B1 (ko) | 2018-04-10 | 2023-10-10 | 삼성디스플레이 주식회사 | 유기 발광 표시장치 및 그 제조방법 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62161187A (ja) * | 1986-01-10 | 1987-07-17 | セイコーエプソン株式会社 | 液晶表示装置 |
JPH05224227A (ja) * | 1992-02-13 | 1993-09-03 | Ricoh Co Ltd | 異方性導電膜 |
JPH06180460A (ja) | 1992-12-15 | 1994-06-28 | Seiko Epson Corp | 半導体チップ接続用基板構造 |
JPH10170897A (ja) * | 1996-12-09 | 1998-06-26 | Sony Corp | 画像表示装置 |
WO1998047044A1 (fr) * | 1997-04-11 | 1998-10-22 | Hitachi, Ltd. | Dispositif d'affichage a cristaux liquides |
JP3102392B2 (ja) * | 1997-10-28 | 2000-10-23 | 日本電気株式会社 | 半導体デバイスおよびその製造方法 |
JPH11281991A (ja) | 1998-03-27 | 1999-10-15 | Hitachi Ltd | 液晶表示装置 |
JP3025256B1 (ja) * | 1999-02-24 | 2000-03-27 | 松下電器産業株式会社 | 表示パネルへのtcpフィルムの実装方法 |
JP2001164210A (ja) * | 1999-12-13 | 2001-06-19 | Sumitomo Bakelite Co Ltd | 異方導電フィルム及びそれを用いた電子機器 |
JP2002116455A (ja) * | 2000-08-01 | 2002-04-19 | Kyodo Printing Co Ltd | 液晶表示装置、液晶表示装置の電極基材及び液晶表示装置の製造方法 |
KR100737896B1 (ko) * | 2001-02-07 | 2007-07-10 | 삼성전자주식회사 | 어레이 기판과, 액정표시장치 및 그 제조방법 |
KR100685946B1 (ko) * | 2001-03-02 | 2007-02-23 | 엘지.필립스 엘시디 주식회사 | 액정 디스플레이 패널 및 그 제조방법 |
JP3747828B2 (ja) * | 2001-09-21 | 2006-02-22 | セイコーエプソン株式会社 | 電気光学装置及びその製造方法 |
JP2003216065A (ja) * | 2002-01-24 | 2003-07-30 | Seiko Epson Corp | 電気光学装置及び電子機器 |
JP4007074B2 (ja) * | 2002-05-31 | 2007-11-14 | ソニー株式会社 | 表示装置の製造方法 |
JP2004043602A (ja) * | 2002-07-10 | 2004-02-12 | Bridgestone Corp | 異方性導電フィルム |
JP4408192B2 (ja) * | 2002-07-26 | 2010-02-03 | シャープ株式会社 | 液晶表示装置用基板及びそれを備えた液晶表示装置及びその製造方法 |
-
2004
- 2004-05-11 JP JP2004141168A patent/JP4554983B2/ja not_active Expired - Fee Related
-
2005
- 2005-05-09 US US11/124,803 patent/US7639338B2/en active Active
- 2005-05-11 CN CNB200510068807XA patent/CN100426068C/zh active Active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101080137B (zh) * | 2006-05-25 | 2010-06-09 | Nec液晶技术株式会社 | 多层印刷电路板和液晶显示单元 |
CN106462290A (zh) * | 2014-05-28 | 2017-02-22 | 康宁公司 | 具有在盖板与框架之间的刚性界面的触摸屏组件 |
CN109037998A (zh) * | 2018-08-08 | 2018-12-18 | 武汉华星光电半导体显示技术有限公司 | 电连接组件及显示装置、电连接方法 |
CN109445209A (zh) * | 2018-10-24 | 2019-03-08 | 昆山国显光电有限公司 | 显示面板和显示装置 |
Also Published As
Publication number | Publication date |
---|---|
US20050253992A1 (en) | 2005-11-17 |
CN100426068C (zh) | 2008-10-15 |
JP4554983B2 (ja) | 2010-09-29 |
JP2005321707A (ja) | 2005-11-17 |
US7639338B2 (en) | 2009-12-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: NEC LCD TECHNOLOGIES LTD. Free format text: FORMER NAME: NEC LCD TECH CORP. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Kanagawa Patentee after: NLT TECHNOLOGIES, Ltd. Address before: Kanagawa Patentee before: NEC LCD Technologies, Ltd. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20180726 Address after: 536000 the Guangxi Zhuang Autonomous Region Beihai Industrial Park Taiwan Road 10 1 Guangxi Hui Ke Technology Co., Ltd. three story factory floor Patentee after: BEIHAI HKC PHOTOELECTRIC TECHNOLOGY Co.,Ltd. Address before: 518100 Guangdong province Shenzhen District Longgang District Bantian Street cloth road long Rong building A-6C Patentee before: SHENZHEN LANSITENG SCIENCE & TECHNOLOGY CO.,LTD. Effective date of registration: 20180726 Address after: A-6C, Rong Xing Road, Longgang Road, Bantian District, Guangdong, Shenzhen Patentee after: SHENZHEN LANSITENG SCIENCE & TECHNOLOGY CO.,LTD. Address before: Kanagawa Patentee before: NLT TECHNOLOGIES, Ltd. |
|
TR01 | Transfer of patent right |