CN1694934A - 制备电子装置的方法和油墨 - Google Patents

制备电子装置的方法和油墨 Download PDF

Info

Publication number
CN1694934A
CN1694934A CNA03825204XA CN03825204A CN1694934A CN 1694934 A CN1694934 A CN 1694934A CN A03825204X A CNA03825204X A CN A03825204XA CN 03825204 A CN03825204 A CN 03825204A CN 1694934 A CN1694934 A CN 1694934A
Authority
CN
China
Prior art keywords
ink
parts
etch
monomers
acrylate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA03825204XA
Other languages
English (en)
Chinese (zh)
Inventor
A·J·霍珀
M·R·詹姆斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avecia Ltd
Original Assignee
Avecia Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avecia Ltd filed Critical Avecia Ltd
Publication of CN1694934A publication Critical patent/CN1694934A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/36—Inkjet printing inks based on non-aqueous solvents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Iron Core Of Rotating Electric Machines (AREA)
  • Glass Compositions (AREA)
CNA03825204XA 2002-09-20 2003-08-22 制备电子装置的方法和油墨 Pending CN1694934A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0221892.3 2002-09-20
GBGB0221892.3A GB0221892D0 (en) 2002-09-20 2002-09-20 Process

Publications (1)

Publication Number Publication Date
CN1694934A true CN1694934A (zh) 2005-11-09

Family

ID=9944478

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA03825204XA Pending CN1694934A (zh) 2002-09-20 2003-08-22 制备电子装置的方法和油墨

Country Status (11)

Country Link
US (1) US7427360B2 (https=)
EP (1) EP1543083B1 (https=)
JP (1) JP2005539391A (https=)
KR (1) KR100966508B1 (https=)
CN (1) CN1694934A (https=)
AT (1) ATE335796T1 (https=)
AU (1) AU2003260741A1 (https=)
DE (1) DE60307485T2 (https=)
GB (1) GB0221892D0 (https=)
TW (1) TWI340754B (https=)
WO (1) WO2004026977A1 (https=)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103517566A (zh) * 2012-06-28 2014-01-15 昆山联滔电子有限公司 非导电载体上的导体轨道的制造方法
CN103762049A (zh) * 2013-11-01 2014-04-30 成都顺康三森电子有限责任公司 半导体陶瓷化学镀镍镍电极外沿去除的方法
CN104494310A (zh) * 2014-09-16 2015-04-08 苏州锐发打印技术有限公司 用于太阳能电池网格导线制作的3d打印系统及控制方法
CN105733361A (zh) * 2016-04-29 2016-07-06 珠海保税区天然宝杰数码科技材料有限公司 一种抗蚀刻喷墨墨水及其应用
CN106062099A (zh) * 2014-03-03 2016-10-26 爱克发-格法特公司 用于制造导电图案的抗蚀刻喷墨油墨
CN107075283A (zh) * 2014-09-29 2017-08-18 爱克发-格法特公司 金属制品的数字制造
CN111512452A (zh) * 2017-10-17 2020-08-07 科迪华公司 用于显示装置的具有高量子点浓度的油墨组合物
CN112135883A (zh) * 2018-03-02 2020-12-25 爱克发-格法特公司 用于制造印刷电路板的喷墨油墨

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE412714T1 (de) * 2003-05-30 2008-11-15 Fujifilm Imaging Colorants Ltd Verfahren zum ätzen einer metall- oder metalllegierung oberfläche
ES2345985T3 (es) * 2003-08-25 2010-10-07 Dip Tech. Ltd. Tinta para superficies ceramicas.
US7208830B2 (en) * 2004-06-30 2007-04-24 Intel Corporation Interconnect shunt used for current distribution and reliability redundancy
FR2882491B1 (fr) * 2005-02-23 2009-04-24 Eads Space Transp Sas Soc Par Procede pour former des motifs electriquement conducteurs sur une surface non developpable d'un substrat isolant, et dispositif obtenu
JP5430051B2 (ja) 2005-12-28 2014-02-26 富士フイルム株式会社 インク組成物、インクジェット記録方法、平版印刷版の製造方法、及び平版印刷版
ATE479553T1 (de) 2006-01-19 2010-09-15 Ikonics Corp Digitale verfahren zur formtexturierung
DE102006022722B4 (de) 2006-05-12 2010-06-17 Hueck Engraving Gmbh & Co. Kg Verfahren und Vorrichtung zur Oberflächenstrukturierung eines Pressbleches oder eines Endlosbandes
US7803420B2 (en) 2006-12-01 2010-09-28 Applied Materials, Inc. Methods and apparatus for inkjetting spacers in a flat panel display
GB0719464D0 (en) 2007-10-04 2007-11-14 Sun Chemical Bv An ink jet and a method of ink jet printing
US8425790B2 (en) 2008-03-27 2013-04-23 Nisshin Steel Co., Ltd. Ink-jet ink composition for etching resist
JP5518311B2 (ja) * 2008-08-26 2014-06-11 日新製鋼株式会社 エッチングレジスト用インクジェットインキ組成物
JP4335955B1 (ja) * 2008-05-16 2009-09-30 日立マクセル株式会社 エネルギー線硬化型インク組成物
EP2182786B1 (en) 2008-11-04 2011-07-13 Rohm and Haas Electronic Materials LLC Improved hot melt compositions
CN101481616B (zh) * 2009-02-05 2013-07-10 广州市和携化工科技有限公司 金属及金属氧化物蚀刻油墨及其制备方法与应用
US8628679B2 (en) * 2010-01-20 2014-01-14 Phoenix Inks And Coatings, Llc High-definition demetalization process
JP5747312B2 (ja) * 2011-02-24 2015-07-15 コニカミノルタ株式会社 活性光線硬化型インクジェットインク及び画像形成方法
JP5795200B2 (ja) * 2011-06-17 2015-10-14 株式会社フジキン 電気化学素子の製造方法及び電気化学素子の製造装置
BE1020757A3 (fr) * 2012-06-19 2014-04-01 Agc Glass Europe Methode de fabrication d'une feuille de verre depolie selectivement.
ES2563441T3 (es) * 2012-08-27 2016-03-15 Agfa Graphics Nv Líquidos curables por radiación por radicales libres para destintar sustratos
US9453139B2 (en) 2013-08-20 2016-09-27 Rohm And Haas Electronic Materials Llc Hot melt compositions with improved etch resistance
RU2696454C1 (ru) * 2015-07-06 2019-08-01 Блюстар Силикон Франс Сас Самоклеящееся многослойное изделие и способ его производства
EP3210946B1 (en) * 2016-02-29 2020-07-08 Agfa-Gevaert Method of manufacturing an etched glass article
EP3296368B1 (en) 2016-09-14 2020-11-11 Agfa-Gevaert Etch-resistant inkjet inks for manufacturing printed circuit boards
EP3533844B1 (en) 2018-03-02 2022-09-28 Agfa-Gevaert Nv Inkjet inks for manufacturing printed circuit boards
WO2019190585A1 (en) * 2018-03-27 2019-10-03 Sun Chemical Corporation Uv-curable compositions comprising cleavage type photoinitiators
US20220010156A1 (en) * 2018-11-20 2022-01-13 Agfa-Gevaert Nv Radiation curable inkjet ink for manufacturing printed circuit boards
EP3656824A1 (en) 2018-11-26 2020-05-27 Agfa-Gevaert Nv Radiation curable inkjet for manufacturing printed circuit boards
WO2020109148A1 (en) 2018-11-26 2020-06-04 Agfa-Gevaert Nv Novel photoinitiators
EP3686252A1 (en) 2019-01-24 2020-07-29 Agfa-Gevaert Nv Radiation curable inkjet ink for manufacturing printed circuit boards
US11596070B2 (en) 2019-02-14 2023-02-28 Orbotech Ltd. Apparatus for use in preparing a printed circuit board and photosensitive ink for in an ink jet printer
EP3757174B1 (en) 2019-06-28 2022-04-20 Agfa-Gevaert Nv Radiation curable inkjet ink for alkaline etching or plating applications
EP3757175A1 (en) 2019-06-28 2020-12-30 Agfa-Gevaert Nv Radiation curable inkjet ink for alkaline etching or plating applications
CN114616294A (zh) 2019-11-07 2022-06-10 爱克发-格法特公司 用于制造印刷电路板的可辐射固化的喷墨油墨
EP3901226A1 (en) 2020-04-21 2021-10-27 Agfa-Gevaert Nv Method of manufacturing printed circuit boards
EP4032958B1 (en) 2021-01-25 2025-10-01 Agfa-Gevaert Nv Radiation curable inkjet inks
EP4190866A1 (en) 2021-12-02 2023-06-07 Agfa-Gevaert Nv Radiation curable inkjet inks
KR20250024086A (ko) 2022-07-19 2025-02-18 아그파-게바에르트 엔.브이. 인쇄 회로 기판의 제조를 위한 경화성 잉크젯 조성물
WO2024017926A1 (en) 2022-07-19 2024-01-25 Agfa-Gevaert Nv A curable inkjet composition for the manufacturing of printed circuit boards
JP2025524830A (ja) 2022-07-19 2025-08-01 アグフア－ゲヴエルト，ナームローゼ・フエンノートシヤツプ プリント回路基板製造用硬化性インクジェット組成物
WO2024017881A1 (en) 2022-07-19 2024-01-25 Agfa-Gevaert Nv A curable inkjet composition for the manufacturing of printed circuit boards
CN116239914A (zh) * 2022-09-09 2023-06-09 广东东溢新材料科技有限公司 一种水性白色油墨及其制备方法与应用
WO2025149599A1 (en) 2024-01-11 2025-07-17 Agfa-Gevaert Nv A curable inkjet composition for the manufacturing of printed circuit boards
EP4640772A1 (en) 2024-04-23 2025-10-29 Agfa-Gevaert Nv A curable inkjet composition for the manufacturing of printed circuit boards
WO2026014193A1 (ja) * 2024-07-12 2026-01-15 コニカミノルタ株式会社 活性エネルギー線硬化型インクジェットインク及びインクジェット記録方法
WO2026014192A1 (ja) * 2024-07-12 2026-01-15 コニカミノルタ株式会社 活性エネルギー線硬化型インクジェットインク及びインクジェット記録方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4270985A (en) * 1978-07-21 1981-06-02 Dynachem Corporation Screen printing of photopolymerizable inks
US4416974A (en) * 1979-12-05 1983-11-22 Hercules Incorporated Radiation curable ceramic pigment composition
JP2620954B2 (ja) * 1988-04-22 1997-06-18 日本合成化学工業株式会社 紫外線硬化型インキ
JPH01278585A (ja) 1988-04-30 1989-11-08 Somar Corp 紫外線硬化性レジストインキ
US5204383A (en) * 1990-03-28 1993-04-20 Kuraray Co., Ltd. Dental adhesives
GB9123070D0 (en) 1991-10-30 1991-12-18 Domino Printing Sciences Plc Ink
JPH0675374A (ja) * 1992-07-02 1994-03-18 Showa Denko Kk 光硬化性材料及び硬化方法
JPH06237063A (ja) * 1993-02-12 1994-08-23 Mitsubishi Rayon Co Ltd プリント配線板の製造方法
US5371148A (en) * 1993-06-23 1994-12-06 Union Carbide Chemicals & Plastics Technology Corporation Reactive polymers having pendant flexible side chains prepared from ethylenically unsaturated carbodiimides
JPH0766530A (ja) * 1993-08-26 1995-03-10 Olympus Optical Co Ltd パターン形成方法
JP3799069B2 (ja) * 1993-12-14 2006-07-19 キヤノン株式会社 エッチングレジスト性組成物、これを用いたパターン形成方法及び配線基板の製造方法
GB9725928D0 (en) 1997-12-05 1998-02-04 Xaar Plc Radiation curable ink jet ink compositions
GB9725929D0 (en) 1997-12-05 1998-02-04 Xaar Plc Radiation curable ink jet ink compositions
JPH11340129A (ja) * 1998-05-28 1999-12-10 Seiko Epson Corp パターン製造方法およびパターン製造装置
JP2001288387A (ja) * 2000-04-05 2001-10-16 Sony Chem Corp 電離放射線硬化型インクジェット用インク及びその印画物
JP2001324803A (ja) * 2000-05-15 2001-11-22 Mitsubishi Chemicals Corp 赤外光感受性エッチングまたは鍍金用レジスト
WO2002038688A2 (en) * 2000-11-09 2002-05-16 3M Innovative Properties Company Weather resistant, ink jettable, radiation curable, fluid compositions particularly suitable for outdoor applications
JP2002179967A (ja) * 2000-12-18 2002-06-26 Dainippon Ink & Chem Inc 紫外線硬化型ジェットインク組成物及びその製造方法
GB2371551B (en) 2001-01-29 2003-07-30 Sericol Ltd A printing ink

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103517566A (zh) * 2012-06-28 2014-01-15 昆山联滔电子有限公司 非导电载体上的导体轨道的制造方法
CN103762049A (zh) * 2013-11-01 2014-04-30 成都顺康三森电子有限责任公司 半导体陶瓷化学镀镍镍电极外沿去除的方法
CN106062099A (zh) * 2014-03-03 2016-10-26 爱克发-格法特公司 用于制造导电图案的抗蚀刻喷墨油墨
CN104494310A (zh) * 2014-09-16 2015-04-08 苏州锐发打印技术有限公司 用于太阳能电池网格导线制作的3d打印系统及控制方法
CN107075283A (zh) * 2014-09-29 2017-08-18 爱克发-格法特公司 金属制品的数字制造
CN105733361A (zh) * 2016-04-29 2016-07-06 珠海保税区天然宝杰数码科技材料有限公司 一种抗蚀刻喷墨墨水及其应用
CN111512452A (zh) * 2017-10-17 2020-08-07 科迪华公司 用于显示装置的具有高量子点浓度的油墨组合物
CN111512452B (zh) * 2017-10-17 2023-11-21 科迪华公司 用于显示装置的具有高量子点浓度的油墨组合物
CN112135883A (zh) * 2018-03-02 2020-12-25 爱克发-格法特公司 用于制造印刷电路板的喷墨油墨

Also Published As

Publication number Publication date
KR20050057463A (ko) 2005-06-16
ATE335796T1 (de) 2006-09-15
DE60307485D1 (de) 2006-09-21
EP1543083A1 (en) 2005-06-22
DE60307485T2 (de) 2007-04-12
WO2004026977A1 (en) 2004-04-01
US7427360B2 (en) 2008-09-23
US20060154033A1 (en) 2006-07-13
GB0221892D0 (en) 2002-10-30
AU2003260741A1 (en) 2004-04-08
TWI340754B (en) 2011-04-21
JP2005539391A (ja) 2005-12-22
KR100966508B1 (ko) 2010-06-29
EP1543083B1 (en) 2006-08-09
TW200422356A (en) 2004-11-01

Similar Documents

Publication Publication Date Title
CN1694934A (zh) 制备电子装置的方法和油墨
EP1543704B1 (en) Printing process and solder mask ink composition
JP4633727B2 (ja) 方法
KR101685469B1 (ko) 개선된 핫 멜트 조성물
EP0659039A2 (en) Ultraviolet-curing composition, pattern forming method making use of the same, printed-wiring board and its production
US20060019077A1 (en) Process
JP6663034B2 (ja) インクジェット樹脂組成物およびそれを使用するプリント配線板
JP4392350B2 (ja) メッキ法
WO2008156523A1 (en) Uv inkjet resist
US20150053643A1 (en) Hot melt compositions with improved etch resistance
JP2017179006A (ja) 活性エネルギー線硬化型インクジェットインキ組成物

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication