KR100966508B1 - 전자 장치의 제조 방법 및 전자 장치 제조용 잉크 - Google Patents

전자 장치의 제조 방법 및 전자 장치 제조용 잉크 Download PDF

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Publication number
KR100966508B1
KR100966508B1 KR1020057004711A KR20057004711A KR100966508B1 KR 100966508 B1 KR100966508 B1 KR 100966508B1 KR 1020057004711 A KR1020057004711 A KR 1020057004711A KR 20057004711 A KR20057004711 A KR 20057004711A KR 100966508 B1 KR100966508 B1 KR 100966508B1
Authority
KR
South Korea
Prior art keywords
parts
ink
acrylate
component
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020057004711A
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English (en)
Korean (ko)
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KR20050057463A (ko
Inventor
알랜 존 호퍼
마크 로버트 제임스
Original Assignee
후지필름 이미징 컬러런츠 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of KR20050057463A publication Critical patent/KR20050057463A/ko
Application granted granted Critical
Publication of KR100966508B1 publication Critical patent/KR100966508B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/36—Inkjet printing inks based on non-aqueous solvents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Iron Core Of Rotating Electric Machines (AREA)
  • Glass Compositions (AREA)
KR1020057004711A 2002-09-20 2003-08-22 전자 장치의 제조 방법 및 전자 장치 제조용 잉크 Expired - Fee Related KR100966508B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0221892.3 2002-09-20
GBGB0221892.3A GB0221892D0 (en) 2002-09-20 2002-09-20 Process

Publications (2)

Publication Number Publication Date
KR20050057463A KR20050057463A (ko) 2005-06-16
KR100966508B1 true KR100966508B1 (ko) 2010-06-29

Family

ID=9944478

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057004711A Expired - Fee Related KR100966508B1 (ko) 2002-09-20 2003-08-22 전자 장치의 제조 방법 및 전자 장치 제조용 잉크

Country Status (11)

Country Link
US (1) US7427360B2 (https=)
EP (1) EP1543083B1 (https=)
JP (1) JP2005539391A (https=)
KR (1) KR100966508B1 (https=)
CN (1) CN1694934A (https=)
AT (1) ATE335796T1 (https=)
AU (1) AU2003260741A1 (https=)
DE (1) DE60307485T2 (https=)
GB (1) GB0221892D0 (https=)
TW (1) TWI340754B (https=)
WO (1) WO2004026977A1 (https=)

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ATE412714T1 (de) * 2003-05-30 2008-11-15 Fujifilm Imaging Colorants Ltd Verfahren zum ätzen einer metall- oder metalllegierung oberfläche
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US7208830B2 (en) * 2004-06-30 2007-04-24 Intel Corporation Interconnect shunt used for current distribution and reliability redundancy
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JP5430051B2 (ja) 2005-12-28 2014-02-26 富士フイルム株式会社 インク組成物、インクジェット記録方法、平版印刷版の製造方法、及び平版印刷版
ATE479553T1 (de) 2006-01-19 2010-09-15 Ikonics Corp Digitale verfahren zur formtexturierung
DE102006022722B4 (de) 2006-05-12 2010-06-17 Hueck Engraving Gmbh & Co. Kg Verfahren und Vorrichtung zur Oberflächenstrukturierung eines Pressbleches oder eines Endlosbandes
US7803420B2 (en) 2006-12-01 2010-09-28 Applied Materials, Inc. Methods and apparatus for inkjetting spacers in a flat panel display
GB0719464D0 (en) 2007-10-04 2007-11-14 Sun Chemical Bv An ink jet and a method of ink jet printing
US8425790B2 (en) 2008-03-27 2013-04-23 Nisshin Steel Co., Ltd. Ink-jet ink composition for etching resist
JP5518311B2 (ja) * 2008-08-26 2014-06-11 日新製鋼株式会社 エッチングレジスト用インクジェットインキ組成物
JP4335955B1 (ja) * 2008-05-16 2009-09-30 日立マクセル株式会社 エネルギー線硬化型インク組成物
EP2182786B1 (en) 2008-11-04 2011-07-13 Rohm and Haas Electronic Materials LLC Improved hot melt compositions
CN101481616B (zh) * 2009-02-05 2013-07-10 广州市和携化工科技有限公司 金属及金属氧化物蚀刻油墨及其制备方法与应用
US8628679B2 (en) * 2010-01-20 2014-01-14 Phoenix Inks And Coatings, Llc High-definition demetalization process
JP5747312B2 (ja) * 2011-02-24 2015-07-15 コニカミノルタ株式会社 活性光線硬化型インクジェットインク及び画像形成方法
JP5795200B2 (ja) * 2011-06-17 2015-10-14 株式会社フジキン 電気化学素子の製造方法及び電気化学素子の製造装置
BE1020757A3 (fr) * 2012-06-19 2014-04-01 Agc Glass Europe Methode de fabrication d'une feuille de verre depolie selectivement.
CN103517566A (zh) * 2012-06-28 2014-01-15 昆山联滔电子有限公司 非导电载体上的导体轨道的制造方法
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EP2915856B1 (en) * 2014-03-03 2019-10-16 Agfa-Gevaert Etch-resistant inkjet inks for manufacturing conductive patterns
CN104494310B (zh) * 2014-09-16 2017-04-12 苏州锐发打印技术有限公司 用于太阳能电池网格导线制作的3d打印系统及控制方法
EP3000853B1 (en) * 2014-09-29 2020-04-08 Agfa-Gevaert Etch-resistant inkjet inks for manufacturing conductive patterns
RU2696454C1 (ru) * 2015-07-06 2019-08-01 Блюстар Силикон Франс Сас Самоклеящееся многослойное изделие и способ его производства
EP3210946B1 (en) * 2016-02-29 2020-07-08 Agfa-Gevaert Method of manufacturing an etched glass article
CN105733361B (zh) * 2016-04-29 2019-05-03 珠海天威新材料股份有限公司 一种抗蚀刻喷墨墨水及其应用
EP3296368B1 (en) 2016-09-14 2020-11-11 Agfa-Gevaert Etch-resistant inkjet inks for manufacturing printed circuit boards
KR102670926B1 (ko) * 2017-10-17 2024-05-29 카티바, 인크. 디스플레이 장치를 위한 높은 양자점 농도를 갖는 잉크 조성물
EP3533844B1 (en) 2018-03-02 2022-09-28 Agfa-Gevaert Nv Inkjet inks for manufacturing printed circuit boards
CN112135883A (zh) * 2018-03-02 2020-12-25 爱克发-格法特公司 用于制造印刷电路板的喷墨油墨
WO2019190585A1 (en) * 2018-03-27 2019-10-03 Sun Chemical Corporation Uv-curable compositions comprising cleavage type photoinitiators
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US11596070B2 (en) 2019-02-14 2023-02-28 Orbotech Ltd. Apparatus for use in preparing a printed circuit board and photosensitive ink for in an ink jet printer
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US4416974A (en) * 1979-12-05 1983-11-22 Hercules Incorporated Radiation curable ceramic pigment composition
US5439982A (en) * 1993-06-23 1995-08-08 Union Carbide Chemical & Plastic Technology Corporation Reactive polymers having pendant flexible side chains prepared from ethylenically unsaturated carbodiimides

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US4416974A (en) * 1979-12-05 1983-11-22 Hercules Incorporated Radiation curable ceramic pigment composition
US5439982A (en) * 1993-06-23 1995-08-08 Union Carbide Chemical & Plastic Technology Corporation Reactive polymers having pendant flexible side chains prepared from ethylenically unsaturated carbodiimides

Also Published As

Publication number Publication date
KR20050057463A (ko) 2005-06-16
ATE335796T1 (de) 2006-09-15
DE60307485D1 (de) 2006-09-21
EP1543083A1 (en) 2005-06-22
DE60307485T2 (de) 2007-04-12
WO2004026977A1 (en) 2004-04-01
US7427360B2 (en) 2008-09-23
US20060154033A1 (en) 2006-07-13
GB0221892D0 (en) 2002-10-30
AU2003260741A1 (en) 2004-04-08
TWI340754B (en) 2011-04-21
JP2005539391A (ja) 2005-12-22
EP1543083B1 (en) 2006-08-09
CN1694934A (zh) 2005-11-09
TW200422356A (en) 2004-11-01

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