JP2005539391A - 電子装置を製造する方法及びインク - Google Patents
電子装置を製造する方法及びインク Download PDFInfo
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- JP2005539391A JP2005539391A JP2004537257A JP2004537257A JP2005539391A JP 2005539391 A JP2005539391 A JP 2005539391A JP 2004537257 A JP2004537257 A JP 2004537257A JP 2004537257 A JP2004537257 A JP 2004537257A JP 2005539391 A JP2005539391 A JP 2005539391A
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- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 239000000178 monomer Substances 0.000 claims abstract description 61
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 52
- 230000002378 acidificating effect Effects 0.000 claims abstract description 32
- 229910052751 metal Inorganic materials 0.000 claims abstract description 27
- 239000002184 metal Substances 0.000 claims abstract description 27
- 239000003999 initiator Substances 0.000 claims abstract description 24
- 229920000642 polymer Polymers 0.000 claims abstract description 18
- 230000005855 radiation Effects 0.000 claims abstract description 18
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 16
- 239000000956 alloy Substances 0.000 claims abstract description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000003086 colorant Substances 0.000 claims abstract description 12
- 238000007641 inkjet printing Methods 0.000 claims abstract description 12
- 239000004094 surface-active agent Substances 0.000 claims abstract description 12
- 239000002245 particle Substances 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 238000003486 chemical etching Methods 0.000 claims abstract description 8
- 125000000524 functional group Chemical group 0.000 claims abstract description 7
- 239000003513 alkali Substances 0.000 claims abstract description 6
- 239000000203 mixture Substances 0.000 claims description 24
- 239000002253 acid Substances 0.000 claims description 20
- 238000005530 etching Methods 0.000 claims description 19
- 239000003960 organic solvent Substances 0.000 claims description 9
- 150000002739 metals Chemical class 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 4
- 125000002843 carboxylic acid group Chemical group 0.000 claims description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 3
- JKFSTSLUNHRNNX-UHFFFAOYSA-N 1-o-ethyl 2-o-(2-methylprop-2-enoyl) benzene-1,2-dicarboxylate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OC(=O)C(C)=C JKFSTSLUNHRNNX-UHFFFAOYSA-N 0.000 claims 1
- 239000000976 ink Substances 0.000 description 76
- 229920002120 photoresistant polymer Polymers 0.000 description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
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- 239000010949 copper Substances 0.000 description 14
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- 239000000126 substance Substances 0.000 description 8
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- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 5
- 150000004056 anthraquinones Chemical class 0.000 description 5
- 239000000463 material Substances 0.000 description 5
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- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
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- 125000000217 alkyl group Chemical group 0.000 description 4
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- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 244000028419 Styrax benzoin Species 0.000 description 3
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- 125000000751 azo group Chemical group [*]N=N[*] 0.000 description 3
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- 239000001055 blue pigment Substances 0.000 description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 3
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- 235000019382 gum benzoic Nutrition 0.000 description 3
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 3
- 239000003607 modifier Substances 0.000 description 3
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- 238000003756 stirring Methods 0.000 description 3
- 239000011135 tin Substances 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- FRASJONUBLZVQX-UHFFFAOYSA-N 1,4-naphthoquinone Chemical compound C1=CC=C2C(=O)C=CC(=O)C2=C1 FRASJONUBLZVQX-UHFFFAOYSA-N 0.000 description 2
- ZDQNWDNMNKSMHI-UHFFFAOYSA-N 1-[2-(2-prop-2-enoyloxypropoxy)propoxy]propan-2-yl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COCC(C)OC(=O)C=C ZDQNWDNMNKSMHI-UHFFFAOYSA-N 0.000 description 2
- WVOVXOXRXQFTAS-UHFFFAOYSA-N 1-methyl-7-propan-2-ylphenanthrene-9,10-dione Chemical compound C1=CC=C2C3=CC=C(C(C)C)C=C3C(=O)C(=O)C2=C1C WVOVXOXRXQFTAS-UHFFFAOYSA-N 0.000 description 2
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- CYUZOYPRAQASLN-UHFFFAOYSA-N 3-prop-2-enoyloxypropanoic acid Chemical compound OC(=O)CCOC(=O)C=C CYUZOYPRAQASLN-UHFFFAOYSA-N 0.000 description 2
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- MJVAVZPDRWSRRC-UHFFFAOYSA-N Menadione Chemical compound C1=CC=C2C(=O)C(C)=CC(=O)C2=C1 MJVAVZPDRWSRRC-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000002318 adhesion promoter Substances 0.000 description 2
- 239000002671 adjuvant Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical class [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- JPZYWLWSLROXQG-UHFFFAOYSA-N ethyl 2-prop-2-enoylperoxycarbonylbenzoate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OOC(=O)C=C JPZYWLWSLROXQG-UHFFFAOYSA-N 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical group 0.000 description 2
- RBTKNAXYKSUFRK-UHFFFAOYSA-N heliogen blue Chemical compound [Cu].[N-]1C2=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=NC([N-]1)=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=N2 RBTKNAXYKSUFRK-UHFFFAOYSA-N 0.000 description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 description 2
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- 239000001023 inorganic pigment Substances 0.000 description 2
- 239000011133 lead Substances 0.000 description 2
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- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000013618 particulate matter Substances 0.000 description 2
- 235000021317 phosphate Nutrition 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
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- 239000004065 semiconductor Substances 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- JNELGWHKGNBSMD-UHFFFAOYSA-N xanthone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3OC2=C1 JNELGWHKGNBSMD-UHFFFAOYSA-N 0.000 description 2
- CKGKXGQVRVAKEA-UHFFFAOYSA-N (2-methylphenyl)-phenylmethanone Chemical compound CC1=CC=CC=C1C(=O)C1=CC=CC=C1 CKGKXGQVRVAKEA-UHFFFAOYSA-N 0.000 description 1
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
- XKSUVRWJZCEYQQ-UHFFFAOYSA-N 1,1-dimethoxyethylbenzene Chemical compound COC(C)(OC)C1=CC=CC=C1 XKSUVRWJZCEYQQ-UHFFFAOYSA-N 0.000 description 1
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- BOCJQSFSGAZAPQ-UHFFFAOYSA-N 1-chloroanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2Cl BOCJQSFSGAZAPQ-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- CERJZAHSUZVMCH-UHFFFAOYSA-N 2,2-dichloro-1-phenylethanone Chemical compound ClC(Cl)C(=O)C1=CC=CC=C1 CERJZAHSUZVMCH-UHFFFAOYSA-N 0.000 description 1
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- LSRPLKNLQGMCNR-UHFFFAOYSA-N 2-methyl-6-sulfohex-2-enoic acid Chemical compound OC(=O)C(C)=CCCCS(O)(=O)=O LSRPLKNLQGMCNR-UHFFFAOYSA-N 0.000 description 1
- HIWGDJVTAWTBNH-UHFFFAOYSA-N 2-methylidene-5-sulfopentanoic acid Chemical compound OC(=O)C(=C)CCCS(O)(=O)=O HIWGDJVTAWTBNH-UHFFFAOYSA-N 0.000 description 1
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- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
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- 150000008366 benzophenones Chemical class 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- ODWXUNBKCRECNW-UHFFFAOYSA-M bromocopper(1+) Chemical compound Br[Cu+] ODWXUNBKCRECNW-UHFFFAOYSA-M 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
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- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 1
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- 150000002009 diols Chemical class 0.000 description 1
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- DCYOBGZUOMKFPA-UHFFFAOYSA-N iron(2+);iron(3+);octadecacyanide Chemical compound [Fe+2].[Fe+2].[Fe+2].[Fe+3].[Fe+3].[Fe+3].[Fe+3].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-] DCYOBGZUOMKFPA-UHFFFAOYSA-N 0.000 description 1
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- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
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- MUTNCGKQJGXKEM-UHFFFAOYSA-N tamibarotene Chemical compound C=1C=C2C(C)(C)CCC(C)(C)C2=CC=1NC(=O)C1=CC=C(C(O)=O)C=C1 MUTNCGKQJGXKEM-UHFFFAOYSA-N 0.000 description 1
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- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/36—Inkjet printing inks based on non-aqueous solvents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Glass Compositions (AREA)
- Iron Core Of Rotating Electric Machines (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB0221892.3A GB0221892D0 (en) | 2002-09-20 | 2002-09-20 | Process |
| PCT/GB2003/003697 WO2004026977A1 (en) | 2002-09-20 | 2003-08-22 | Process and ink for making electronic devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005539391A true JP2005539391A (ja) | 2005-12-22 |
| JP2005539391A5 JP2005539391A5 (https=) | 2011-06-02 |
Family
ID=9944478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004537257A Withdrawn JP2005539391A (ja) | 2002-09-20 | 2003-08-22 | 電子装置を製造する方法及びインク |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US7427360B2 (https=) |
| EP (1) | EP1543083B1 (https=) |
| JP (1) | JP2005539391A (https=) |
| KR (1) | KR100966508B1 (https=) |
| CN (1) | CN1694934A (https=) |
| AT (1) | ATE335796T1 (https=) |
| AU (1) | AU2003260741A1 (https=) |
| DE (1) | DE60307485T2 (https=) |
| GB (1) | GB0221892D0 (https=) |
| TW (1) | TWI340754B (https=) |
| WO (1) | WO2004026977A1 (https=) |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01271469A (ja) * | 1988-04-22 | 1989-10-30 | Nippon Synthetic Chem Ind Co Ltd:The | 紫外線硬化型インキ |
| JPH0675374A (ja) * | 1992-07-02 | 1994-03-18 | Showa Denko Kk | 光硬化性材料及び硬化方法 |
| JPH06237063A (ja) * | 1993-02-12 | 1994-08-23 | Mitsubishi Rayon Co Ltd | プリント配線板の製造方法 |
| JPH0766530A (ja) * | 1993-08-26 | 1995-03-10 | Olympus Optical Co Ltd | パターン形成方法 |
| JPH07170053A (ja) * | 1993-12-14 | 1995-07-04 | Canon Inc | エッチングレジスト性組成物、これを用いたパターン形成方法及び配線基板の製造方法 |
| JPH11340129A (ja) * | 1998-05-28 | 1999-12-10 | Seiko Epson Corp | パターン製造方法およびパターン製造装置 |
| JP2001324803A (ja) * | 2000-05-15 | 2001-11-22 | Mitsubishi Chemicals Corp | 赤外光感受性エッチングまたは鍍金用レジスト |
| JP2002179967A (ja) * | 2000-12-18 | 2002-06-26 | Dainippon Ink & Chem Inc | 紫外線硬化型ジェットインク組成物及びその製造方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4270985A (en) * | 1978-07-21 | 1981-06-02 | Dynachem Corporation | Screen printing of photopolymerizable inks |
| US4416974A (en) * | 1979-12-05 | 1983-11-22 | Hercules Incorporated | Radiation curable ceramic pigment composition |
| JPH01278585A (ja) | 1988-04-30 | 1989-11-08 | Somar Corp | 紫外線硬化性レジストインキ |
| US5204383A (en) * | 1990-03-28 | 1993-04-20 | Kuraray Co., Ltd. | Dental adhesives |
| GB9123070D0 (en) | 1991-10-30 | 1991-12-18 | Domino Printing Sciences Plc | Ink |
| US5371148A (en) * | 1993-06-23 | 1994-12-06 | Union Carbide Chemicals & Plastics Technology Corporation | Reactive polymers having pendant flexible side chains prepared from ethylenically unsaturated carbodiimides |
| GB9725928D0 (en) | 1997-12-05 | 1998-02-04 | Xaar Plc | Radiation curable ink jet ink compositions |
| GB9725929D0 (en) | 1997-12-05 | 1998-02-04 | Xaar Plc | Radiation curable ink jet ink compositions |
| JP2001288387A (ja) * | 2000-04-05 | 2001-10-16 | Sony Chem Corp | 電離放射線硬化型インクジェット用インク及びその印画物 |
| AU2002230607B2 (en) * | 2000-11-09 | 2006-06-29 | 3M Innovative Properties Company | Weather resistant, ink jettable, radiation curable, fluid compositions particularly suitable for outdoor applications |
| GB2371551B (en) | 2001-01-29 | 2003-07-30 | Sericol Ltd | A printing ink |
-
2002
- 2002-09-20 GB GBGB0221892.3A patent/GB0221892D0/en not_active Ceased
-
2003
- 2003-08-22 KR KR1020057004711A patent/KR100966508B1/ko not_active Expired - Fee Related
- 2003-08-22 WO PCT/GB2003/003697 patent/WO2004026977A1/en not_active Ceased
- 2003-08-22 EP EP03797366A patent/EP1543083B1/en not_active Expired - Lifetime
- 2003-08-22 US US10/528,582 patent/US7427360B2/en not_active Expired - Fee Related
- 2003-08-22 AT AT03797366T patent/ATE335796T1/de not_active IP Right Cessation
- 2003-08-22 DE DE60307485T patent/DE60307485T2/de not_active Expired - Lifetime
- 2003-08-22 JP JP2004537257A patent/JP2005539391A/ja not_active Withdrawn
- 2003-08-22 AU AU2003260741A patent/AU2003260741A1/en not_active Abandoned
- 2003-08-22 CN CNA03825204XA patent/CN1694934A/zh active Pending
- 2003-09-10 TW TW092125054A patent/TWI340754B/zh not_active IP Right Cessation
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01271469A (ja) * | 1988-04-22 | 1989-10-30 | Nippon Synthetic Chem Ind Co Ltd:The | 紫外線硬化型インキ |
| JPH0675374A (ja) * | 1992-07-02 | 1994-03-18 | Showa Denko Kk | 光硬化性材料及び硬化方法 |
| JPH06237063A (ja) * | 1993-02-12 | 1994-08-23 | Mitsubishi Rayon Co Ltd | プリント配線板の製造方法 |
| JPH0766530A (ja) * | 1993-08-26 | 1995-03-10 | Olympus Optical Co Ltd | パターン形成方法 |
| JPH07170053A (ja) * | 1993-12-14 | 1995-07-04 | Canon Inc | エッチングレジスト性組成物、これを用いたパターン形成方法及び配線基板の製造方法 |
| JPH11340129A (ja) * | 1998-05-28 | 1999-12-10 | Seiko Epson Corp | パターン製造方法およびパターン製造装置 |
| JP2001324803A (ja) * | 2000-05-15 | 2001-11-22 | Mitsubishi Chemicals Corp | 赤外光感受性エッチングまたは鍍金用レジスト |
| JP2002179967A (ja) * | 2000-12-18 | 2002-06-26 | Dainippon Ink & Chem Inc | 紫外線硬化型ジェットインク組成物及びその製造方法 |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007177174A (ja) | 2005-12-28 | 2007-07-12 | Fujifilm Corp | インク組成物、インクジェット記録方法、平版印刷版の製造方法、及び平版印刷版 |
| JP2010053177A (ja) * | 2008-08-26 | 2010-03-11 | Nisshin Steel Co Ltd | エッチングレジスト用インクジェットインキ組成物 |
| JP2015527284A (ja) * | 2012-06-19 | 2015-09-17 | エージーシー グラス ユーロップ | 選択的にエッチングされたガラスシートの製造方法 |
| JP2019513666A (ja) * | 2016-02-29 | 2019-05-30 | アグフア−ゲヴエルト | エッチング処理されたガラス製品を製造する方法 |
| JP7025570B2 (ja) | 2018-03-02 | 2022-02-24 | アグフア－ゲヴエルト，ナームローゼ・フエンノートシヤツプ | プリント回路基板を製造するためのインキジェットインキ |
| JP2021515092A (ja) * | 2018-03-02 | 2021-06-17 | アグフア−ゲヴエルト，ナームローゼ・フエンノートシヤツプ | プリント回路基板を製造するためのインキジェットインキ |
| JP2021515093A (ja) * | 2018-03-02 | 2021-06-17 | アグフア−ゲヴエルト，ナームローゼ・フエンノートシヤツプ | プリント回路基板を製造するためのインキジェットインキ |
| JP7025571B2 (ja) | 2018-03-02 | 2022-02-24 | アグフア－ゲヴエルト，ナームローゼ・フエンノートシヤツプ | プリント回路基板を製造するためのインキジェットインキ |
| US11407913B2 (en) | 2018-03-02 | 2022-08-09 | Agfa-Gevaert Nv | Inkjet inks for manufacturing printed circuit boards |
| JP2021517186A (ja) * | 2018-03-27 | 2021-07-15 | サン・ケミカル・コーポレーション | 開裂型光開始剤を含むｕｖ硬化性組成物 |
| JP7330999B2 (ja) | 2018-03-27 | 2023-08-22 | サン・ケミカル・コーポレーション | 開裂型光開始剤を含むｕｖ硬化性組成物 |
| JP2022511422A (ja) * | 2018-11-20 | 2022-01-31 | アグフア－ゲヴエルト，ナームローゼ・フエンノートシヤツプ | プリント回路基板を製造するための放射線硬化性インクジェットインク |
| JP2022513646A (ja) * | 2018-11-26 | 2022-02-09 | アグフア－ゲヴエルト，ナームローゼ・フエンノートシヤツプ | プリント基板の製造のための放射線硬化性インキジェットインキ |
| WO2026014193A1 (ja) * | 2024-07-12 | 2026-01-15 | コニカミノルタ株式会社 | 活性エネルギー線硬化型インクジェットインク及びインクジェット記録方法 |
| WO2026014192A1 (ja) * | 2024-07-12 | 2026-01-15 | コニカミノルタ株式会社 | 活性エネルギー線硬化型インクジェットインク及びインクジェット記録方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE60307485T2 (de) | 2007-04-12 |
| EP1543083A1 (en) | 2005-06-22 |
| KR20050057463A (ko) | 2005-06-16 |
| AU2003260741A1 (en) | 2004-04-08 |
| TWI340754B (en) | 2011-04-21 |
| EP1543083B1 (en) | 2006-08-09 |
| DE60307485D1 (de) | 2006-09-21 |
| TW200422356A (en) | 2004-11-01 |
| WO2004026977A1 (en) | 2004-04-01 |
| US7427360B2 (en) | 2008-09-23 |
| CN1694934A (zh) | 2005-11-09 |
| KR100966508B1 (ko) | 2010-06-29 |
| GB0221892D0 (en) | 2002-10-30 |
| ATE335796T1 (de) | 2006-09-15 |
| US20060154033A1 (en) | 2006-07-13 |
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