CN1681376A - 印刷电路板的制造方法以及制造装置 - Google Patents

印刷电路板的制造方法以及制造装置 Download PDF

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Publication number
CN1681376A
CN1681376A CNA2005100657777A CN200510065777A CN1681376A CN 1681376 A CN1681376 A CN 1681376A CN A2005100657777 A CNA2005100657777 A CN A2005100657777A CN 200510065777 A CN200510065777 A CN 200510065777A CN 1681376 A CN1681376 A CN 1681376A
Authority
CN
China
Prior art keywords
circuit board
spool
pcb
liquid
make
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2005100657777A
Other languages
English (en)
Chinese (zh)
Inventor
五味二夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of CN1681376A publication Critical patent/CN1681376A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
CNA2005100657777A 2001-12-28 2002-11-18 印刷电路板的制造方法以及制造装置 Pending CN1681376A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001400237 2001-12-28
JP2001400237A JP3738834B2 (ja) 2001-12-28 2001-12-28 配線基板の製造方法及び製造装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CNB02151335XA Division CN1231100C (zh) 2001-12-28 2002-11-18 柔性印刷电路板的输送方法以及输送装置

Publications (1)

Publication Number Publication Date
CN1681376A true CN1681376A (zh) 2005-10-12

Family

ID=19189588

Family Applications (2)

Application Number Title Priority Date Filing Date
CNB02151335XA Expired - Fee Related CN1231100C (zh) 2001-12-28 2002-11-18 柔性印刷电路板的输送方法以及输送装置
CNA2005100657777A Pending CN1681376A (zh) 2001-12-28 2002-11-18 印刷电路板的制造方法以及制造装置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CNB02151335XA Expired - Fee Related CN1231100C (zh) 2001-12-28 2002-11-18 柔性印刷电路板的输送方法以及输送装置

Country Status (4)

Country Link
JP (1) JP3738834B2 (ja)
KR (1) KR100567435B1 (ja)
CN (2) CN1231100C (ja)
TW (1) TW545094B (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3902169B2 (ja) 2003-09-08 2007-04-04 日東電工株式会社 配線回路基板の製造方法および製造装置
CN102790002B (zh) * 2012-07-27 2015-02-11 京东方科技集团股份有限公司 柔性基板处理装置
CN103884751A (zh) * 2014-04-18 2014-06-25 苏州怡拓生物传感技术有限公司 一种用于血液快速检测系列生物传感器连续化生产的方法
MY193815A (en) * 2016-01-12 2022-10-27 Jcu Corp Wet type processing apparatus for resin film
CN106542888A (zh) * 2016-10-20 2017-03-29 河南科技学院 一种促进植物生长的基质添加剂及其制备方法和应用
WO2023162367A1 (ja) * 2022-02-24 2023-08-31 住友電気工業株式会社 伝送基板の製造方法

Also Published As

Publication number Publication date
CN1429062A (zh) 2003-07-09
KR100567435B1 (ko) 2006-04-04
JP3738834B2 (ja) 2006-01-25
JP2003198097A (ja) 2003-07-11
CN1231100C (zh) 2005-12-07
TW545094B (en) 2003-08-01
KR20030057452A (ko) 2003-07-04

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Open date: 20051012