CN1652342A - 光学器件 - Google Patents
光学器件 Download PDFInfo
- Publication number
- CN1652342A CN1652342A CNA2004100857567A CN200410085756A CN1652342A CN 1652342 A CN1652342 A CN 1652342A CN A2004100857567 A CNA2004100857567 A CN A2004100857567A CN 200410085756 A CN200410085756 A CN 200410085756A CN 1652342 A CN1652342 A CN 1652342A
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- CN
- China
- Prior art keywords
- mentioned
- base station
- optics
- opening portion
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 48
- 229920005989 resin Polymers 0.000 claims abstract description 42
- 239000011347 resin Substances 0.000 claims abstract description 42
- 239000012790 adhesive layer Substances 0.000 claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 9
- 241001074085 Scophthalmus aquosus Species 0.000 claims description 3
- 241001232809 Chorista Species 0.000 claims 3
- 238000007789 sealing Methods 0.000 description 15
- 239000011521 glass Substances 0.000 description 7
- 238000009434 installation Methods 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 238000003384 imaging method Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Light Receiving Elements (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Diffracting Gratings Or Hologram Optical Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
- Optical Couplings Of Light Guides (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004-025063 | 2004-02-02 | ||
JP2004025063A JP2005217337A (ja) | 2004-02-02 | 2004-02-02 | 光学デバイス |
JP2004025063 | 2004-02-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1652342A true CN1652342A (zh) | 2005-08-10 |
CN100433344C CN100433344C (zh) | 2008-11-12 |
Family
ID=34650877
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100857567A Expired - Fee Related CN100433344C (zh) | 2004-02-02 | 2004-10-11 | 光学器件 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7242538B2 (zh) |
EP (1) | EP1560270A3 (zh) |
JP (1) | JP2005217337A (zh) |
KR (1) | KR20050078633A (zh) |
CN (1) | CN100433344C (zh) |
TW (1) | TWI236155B (zh) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4170968B2 (ja) * | 2004-02-02 | 2008-10-22 | 松下電器産業株式会社 | 光学デバイス |
JP4591297B2 (ja) * | 2005-09-28 | 2010-12-01 | 株式会社デンソー | 半導体装置の取付構造および半導体装置の取付方法 |
JP2008277593A (ja) * | 2007-05-01 | 2008-11-13 | Matsushita Electric Ind Co Ltd | 回路基板、それを用いた光学デバイス、カメラモジュール、およびその製造方法 |
KR100896645B1 (ko) * | 2007-10-29 | 2009-05-08 | 삼성전기주식회사 | 카메라 모듈 패키지 |
JP2009277950A (ja) * | 2008-05-16 | 2009-11-26 | Panasonic Corp | 光学半導体装置 |
JP5093121B2 (ja) * | 2009-01-06 | 2012-12-05 | 日立電線株式会社 | 光モジュール |
JP5348271B2 (ja) * | 2012-03-22 | 2013-11-20 | 日本精工株式会社 | 玉軸受 |
JP5389970B2 (ja) * | 2012-03-26 | 2014-01-15 | シャープ株式会社 | 撮像モジュール、および撮像モジュールの製造方法 |
JP2013229675A (ja) * | 2012-04-24 | 2013-11-07 | Sony Corp | 撮像ユニット及び撮像装置 |
US11942496B2 (en) | 2020-06-04 | 2024-03-26 | Stmicroelectronics Pte Ltd | Slanted glass edge for image sensor package |
KR20220051486A (ko) * | 2020-10-19 | 2022-04-26 | 삼성전자주식회사 | 투명 커버를 갖는 이미지 센서 패키지 및 이의 제조 방법 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE58909888C5 (de) * | 1989-05-31 | 2017-03-02 | Osram Gesellschaft mit beschränkter Haftung | Verfahren zum Herstellen eines oberflächenmontierbaren Opto-Bauelements und oberflächenmontierbares Opto-Bauelement |
EP0454174B1 (en) * | 1990-04-27 | 1997-03-05 | Omron Corporation | Light emitting semiconductor device with Fresnel lens |
DE19549818B4 (de) * | 1995-09-29 | 2010-03-18 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiter-Bauelement |
DE19755734A1 (de) * | 1997-12-15 | 1999-06-24 | Siemens Ag | Verfahren zur Herstellung eines oberflächenmontierbaren optoelektronischen Bauelementes |
JP4372241B2 (ja) | 1998-08-05 | 2009-11-25 | パナソニック株式会社 | 固体撮像装置の製造方法 |
TW454309B (en) | 2000-07-17 | 2001-09-11 | Orient Semiconductor Elect Ltd | Package structure of CCD image-capturing chip |
JP2002043553A (ja) * | 2000-07-26 | 2002-02-08 | Canon Inc | 固体撮像装置 |
DE10151113B4 (de) * | 2001-10-15 | 2004-03-25 | Infineon Technologies Ag | Opto-elektronisches Modul und Verfahren zu seiner Herstellung |
JP2003174574A (ja) * | 2001-12-05 | 2003-06-20 | Matsushita Electric Ind Co Ltd | 固体撮像装置およびその製造方法 |
KR100514917B1 (ko) * | 2002-05-07 | 2005-09-14 | 미쓰이 가가쿠 가부시키가이샤 | 고체 촬상소자 장착용 패키지 |
-
2004
- 2004-02-02 JP JP2004025063A patent/JP2005217337A/ja active Pending
- 2004-10-11 CN CNB2004100857567A patent/CN100433344C/zh not_active Expired - Fee Related
- 2004-10-13 US US10/962,594 patent/US7242538B2/en not_active Expired - Fee Related
- 2004-10-14 TW TW093131227A patent/TWI236155B/zh not_active IP Right Cessation
- 2004-10-14 KR KR1020040082116A patent/KR20050078633A/ko not_active Application Discontinuation
- 2004-10-18 EP EP04024782A patent/EP1560270A3/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
EP1560270A2 (en) | 2005-08-03 |
JP2005217337A (ja) | 2005-08-11 |
KR20050078633A (ko) | 2005-08-05 |
TW200527685A (en) | 2005-08-16 |
TWI236155B (en) | 2005-07-11 |
US7242538B2 (en) | 2007-07-10 |
EP1560270A3 (en) | 2006-07-19 |
CN100433344C (zh) | 2008-11-12 |
US20050168845A1 (en) | 2005-08-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: KELAIBO INNOVATION CO., LTD. Free format text: FORMER OWNER: MATSUSHITA ELECTRIC INDUSTRIAL CO, LTD. Effective date: 20141201 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20141201 Address after: American California Patentee after: Craib Innovations Ltd Address before: Osaka Japan Patentee before: Matsushita Electric Industrial Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081112 Termination date: 20161011 |