CN1638114A - 改善热管理的功率转换器封装 - Google Patents

改善热管理的功率转换器封装 Download PDF

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CN1638114A
CN1638114A CNA031104827A CN03110482A CN1638114A CN 1638114 A CN1638114 A CN 1638114A CN A031104827 A CNA031104827 A CN A031104827A CN 03110482 A CN03110482 A CN 03110482A CN 1638114 A CN1638114 A CN 1638114A
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叶润清
章进法
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Delta Optoelectronics Inc
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Abstract

本发明是关于一种功率转换器的封装技术，其中所有零件均与一多层电路板电连接。一具有至少一功率消耗芯片的子封装，其具有裸露的面向上的顶部热块，由多条对称引脚与板电连接。一热扩散元件以导热绝缘器直接连接在子封装的裸露顶部热块上、平面磁零件与其他组件的顶表面。子封装消耗的热量由裸露的顶部热块转移至连接的热扩散元件，并进一步转移至环境。此总成的特性为一具有改进的电性能及改善热管理的紧密及价廉的功率转换器封装。

Description

改善热管理的功率转换器封装
(1)技术领域
本发明有关一种电气组件的封装及安装，特别是有关一种改善热管理、具有高电气互联密度及小型的功率转换器的封装及总成。
(2)背景技术
参考图1，图1显示根据习知技艺功率转换器中封装电气组件的结构示意图。如图1所示，功率消耗装置如9b，9d及磁元件9c是直接由一导体绝缘器8安装在一金属基板6上以达到较佳的热传导。功率组件由一引脚12与印刷电路板(PCB)5a形成电连接。磁元件9c电连接至印刷电路板5a。其他必要组件如9a，9e则安装在印刷电路板5a的一侧或二侧上。此安装可密封于一密封盒中(未示出)，其能达到好的热管理及机械支持。
图1中习知技艺所示的封装有一缺点，因为功率消耗装置9b，9d由一单横向引脚12与印刷电路板5a电连接，此制造方法复杂及不理想地增加成本。同时，其功率消耗元件及磁元件的引脚电连接会造成高电杂散损耗，其将导致更多的连接阻抗损失及不佳的转换器性能，特别是高电流转换器封装。此外，功率消耗装置9b，9d的体积较大，因此无可避免的造成较低的功率密度封装。
美国专利NO.5,973,929揭示另一习知技艺方法以封装电子组件于图2中的功率转换器中。在此封装中，自功率消耗元件22至外部建立一热连接，其中，一铜涂层的通孔42在印刷电路板28的制造程序中制备。功率消耗元件22的金属块43安装在铜涂层通孔42的顶部垫上，一金属基板32通过热传导绝缘器30及104连接在铜涂层通孔42的底部垫上。通过此铜涂层通孔42，热量可自功率消耗装置印刷电路板28转移至印刷电路板28的另一侧，进一步传导至金属基板32。磁元件26b亦连接至印刷电路板28上，并由一热传导软垫34连接至金属基板32上以加强热传导。
图2的封装的缺点为，因为功率消耗元件22是安装在铜涂层通路42顶侧上，而铜涂层通路的底侧由热连接30及104所占据，总成降低了平板28电互联密度。此外，自功率元件22的热量同时将由铜涂层通孔42传导至平板28，因而增加平板28的温度升高。
随功率转换器增加的功率密度及电流输出能力增加，更多功率消耗元件将安装于印刷电路板上满足高电流输出需求。此外，功率消耗元件的功率损失及其传导路径随输出电流的增加而大辐增加。由于电流密度及输出电流的增加，如何管理自功率装置的热量及如何缩短互联路径成为功率转换器封装的重要问题。
(3)发明内容
因此本发明的目的为提供一种封装技术以供功率转换器用，并以低成本达到改善的热管理及高互联密度及改进的电性能。
本发明提供一功率转换器的封装，一功率转换器的封装方法及用于本发明封装中的一子封装装置。此封装包括：(1)一多层电路板，其具有第一导电表面及与第一导电表面相对的第二导电表面；(2)一具有至少一热转移表面的热扩散元件；(3)一具有至少一功率消耗芯片的子封装，其配置在多层电路板的一导电表面与热扩散元件的热转移表面之间，其有一裸露的顶部热块与热扩散元件的热转移表面经一导热绝缘器连接，以提供热传导路径于其间，并具有多个对称引脚与多电路板的一导电表面接触以提供导电路径于其间，其中该多个对称引脚及热块配置在相反方向，以使导电路径与导热路径分开。
本发明的一实施例中，多个引脚亦可由焊球所取代以达到电连接的需求。
本发明中，子封装及磁元件封装及其他被动组件均安装在多层电路板上。
此封装的概念的独特特性为功率消耗半导体的封装，功率消耗芯片为事先组装在子封装中，因此，使封装有一高互联密度。子封装有一裸露的顶部热块及多个对称引脚(或焊球)，其中的多个对称引脚及热块配置成相反方向。在本发明的一实施例中，热块面向上，引线则面向下。当然，热块亦可面向下，而引线面向上。
本发明中，子封装配置在多层电路板的导电表面与热扩散元件的热转移表面之间。以此方式，多层电路板的第一导电表面可适于与子封装的引脚电连接，以提供其间的导电路径。热扩散元件的热转移表面适于与子封装的热块经热传导绝缘器的热连接，以提供热传导路径于其间。自磁元件的热量亦可由连接的热扩散元件转移至环境。因此，导电路径与导热路径分开，而获得改善的热管理及改进的电性能。
在本发明的一实施例中，子封装还包括控制芯片及被动芯片。为了增加的封装密度及改进的电性能，功率消耗芯片、控制芯片及被动芯片可共同组合为一子封装。特别是，仅有一芯片的子封装可简化为具有一裸露向上的热块的标准表面安装封装。
本发明的另一方面提供功率转换器封装的方法，包括：(1)提供一具有至少一导电表面的多层电路板；(2)提供一具有至少一热转移表面的热扩散元件；(3)将具有至少一功率消耗芯片的子封装配置在多层电路板的导电表面与热扩散元件的热转移表面之间，此一子封装具有裸露的顶部向上热块及多个向下的对称引脚，因此多层电路板的导电表面适于与子封装的引脚电连接，以提供一导电路径于其间；热扩散元件的热转移表面，适于与至少有一功率消耗芯片的子封装的热块经一导热绝缘器成热连接以提供导热路径于其间；导电路径与导热路径为分开。
本发明另一方面提供一子封装。为了满足各种应用，建议一衍生技术的子封装。在此技术中，有引脚的分立功率消耗元件有一裸露的底部热块，并与子封装的热块为电连接及热连接。控制元件及被动元件由子封装的热块底表面的导电轨迹与功率消耗元件为电连接。子封装由多个对称引脚或球与功率转换器的母板为电连接，及与子封装的热块为热连接。因此，子封装的导电路径与导热路径分开。
(4)附图说明
本发明可由以下的说明及附图而更清楚地予以理解，其中：
图1为习知技术的功率转换器的剖面侧视图，其中的功率消耗元件，其单横向引脚连接在金属基板；
图2为习知技术功率转换器的剖面侧视图，其中自功率消耗元件的热经由PCB的铜涂层通孔转移；
图3为本发明的功率转换器封装的剖面侧视图，其中具有功率消耗芯片的子封装是装在PCB的一侧；
图3(a)为图3中的具有功率消耗芯片的子封装的总成放大图；
图4为本发明功率转换器封装的剖面侧视图，其中具有至少一功率消耗芯片的子封装是装在PCB的二侧；
图5(a)为本发明的子封装的剖面侧视图，封装至少有一功率消耗芯片及一顶部热块及向下引脚；
图5(b)为本发明子封装的剖面侧视图，封装至少有一功率消耗芯片及顶部热块及向下的焊球；
图6(a)为本发明子封装的剖面侧视图，封装至少有一分立功率消耗封装，及一顶部热块及向下的引脚；
图6(b)为本发明子封装的剖面侧视图，封装至少有一分立的功率消耗封装，一顶部热块及向下的球。
(5)具体实施方式
虽然本发明可以有各种不同形式的实施例，为简化说明起见，于本发明中列举某些较佳实施例，详细描述及说明于下文中。然而本处所揭示的内容是例示本发明的原理，但本发明的申请专利范围非仅局限于下述特定实施例。
图3为本发明功率转换封装的较佳实施例的剖面侧视图。如图所示，功率转换器的所有电连接均经由装在多层印刷电路板402而实现以便有一高互联密度。一热扩散元件404经导热绝缘器406直接连接至子封装401的裸露顶部热块405及磁元件407。磁元件407可装在印刷电路板402的切孔或装在印刷电路板402的顶侧。控制装置408及被动部分409可装在印刷电路板402的一侧或二侧，热扩散元件404亦可连接在其上。可使用一个硬环氧树脂盖子410以便将组件与环境隔离。
从本发明可知，子封装401是配置在多层印刷电路板402与热扩散元件404之间。以此方式，多层印刷电路板402适于与子封装401的引脚403电连接以提供导电路径于其间。热扩散元件404适于与子封装401的热块405经导热绝缘器406成热连接，以提供导热路径于其间。
自子封装401的热量可经由子封装401的顶部热块405直接转移至连接的热扩散元件404并转移至外部。电连接仅发生在热封装401的引脚403与多层印刷电路板402之间。此封装的组装可实现导电路径与导热路径分开，及因此可改善热管理。
应用中，由子封装401所消耗的功率由于热扩散元件404的有限的表面而不易冷却，一额外吸热器411可连接至热扩散元件404以增加冷却面积，该额外吸热器411亦可经由导热绝缘器直接连接至子封装401的裸露顶部块405及磁元件407。子封装401由多个对称引脚如二个，四个或圆形分布的周边引脚403或焊球安装在印刷电路板402的一表面上，因此热扩散器404有一良好的支撑，及容易在安装期间提供子封装401的共面。在任何子封装401的二相反侧有同数目的引脚403。以圆形分布的引脚403为例，对子封装401的一轴而言，二侧上均有相同数目的引脚。
子封装401受到一低热机械应力，因为热块405以导绝缘器406与热扩散元件404连接的缘故。因此，本发明的总成不但有极佳的热性能及高互联密度，且有制造能力及低成本。
精于此技术人士当了解，子封装401的热块405可选自金属材料、陶瓷、金属基复合材料及绝缘材料基板及其组合，不论是传统的或稍后发展的。多个对称引线403可选自：两个、四个或圆形分布周边引脚。多层电路板402可选自：印刷线路板及陶瓷混合电路板。热扩散元件404可选自含金属、陶瓷及金属基复合材料的一组及其组合。
在另一实施例中，参考图4，具有至少一功率消耗芯片的子封装401，401a亦可装在印刷电路板402的二侧。热扩散元件404，404a可由导热绝缘器406自总成的二侧连接，因此，自装在印刷电路板402二侧的子封装401，401a可直接由裸露的顶部块405，405a转移至热扩散元件404及404a，再进一步转移至外部。磁元件407可自导热绝缘器406的二侧与热扩散元件404，404a连接。其他组件如控制元件408及低功率损失的被动元件409亦可自二侧与热扩散元件热连接。因此，总成可进一步改进功率转换器的热性能，及达到较高的功率密度及一低轮廓的功率转换器。本发明的封装方法亦可用以供垂直安装的转换器。
图5(a)显示本发明图3(a)中的子封装401的构造。为改进热特性，本发明备有一发展，即实施引脚的修正，使裸露的顶部块405向上，引线403向下。如图5(a)所示，功率消耗芯片416，416a及被动芯片417直接与热块405连接，其中该热块405可为一隔离的金属基板(IMS)或金属化陶瓷基板。可使用线接合或带自动接合(TAB)414供芯片内连接至导电轨迹418。可利用环氧树脂模制复合物415以密封此封装，及使块405的表面裸露。引脚403可制造成对称安排，如两个、四个或圆形分布周边引脚，其中实施的修正可提供向下引脚403供表面安装至印刷电路板，及提供向上热块405以供热连接。封装可由引脚403与印刷电路板电连接。经由此封装，热扩散元件可由导热绝缘器直接连接至裸露的顶部块405，以将功率消耗芯片416，416a热连接至外部。因此，自功率消耗芯片416，416a的热量可由顶部热块405转移至热扩散元件405，再进一步由热扩散元件405转移至外部，因此保持冷的印刷电路板。
参考图5(b)，图5(a)中的子封装401亦可制成图5(b)的形式。基于图5(a)的结构，引脚403由焊球403a所取代。焊球403a引脚有更小型化封装及更低的电杂散损耗，因此，电性能可进一步改进。为了增加封装密度及改进电性能，功率消耗芯片416，416a、控制装置芯片(未示出)及被动芯片417可组合为一子封装。此子封装可简化为一标准表面安装的封装有一面向上的裸露顶部块，而子封装仅容纳一个芯片416。
参考图6(a)，建议一图5(a)的衍生封装技术以满足其他应用。此技术中，分立的功率消耗元件501，501a有一裸露的底部热块502及电连接引脚503，并与子封装500a的热块504经底部热块502及引脚503连接，以提供电连接与热连接于分立的功率消耗元件501，501a与子封装500a的热块504之间。同时，子封装401的热块504可选自金属、陶瓷、金属基复合材料及绝缘金属基板及其组合。控制元件505及被动元件506亦与子封装500a的热块504连接。在分立功率消耗元件501，501a、控制元件505及被动元件506内的电内连接是由热块504的向下表面上的导电轨迹(未示出)实现。子封装500a由多个对称引脚507与功率转换器的母板电连接，及由热块504连接至外侧。因此，子封装500a的导电路径与导热路径分开。
如图6(b)所示，多个对称焊球507a可负责自封装500b与功率转换器母板间的电连接。
本发明已以较佳实施例予以说明如上，应了解的是本发明不受限于所述实施例，熟悉本技术的人员在本发明的精神与范围以内可作出种种的等效变化或等效替换，这些等效变化或替换均应包括在本申请的权利要求所限定的范围内。

Claims (14)

1.一种供功率转换器的封装，其特征在于，包含：
一种多层电路板具有第一导电表面及与该第一导电表面相对的第二导电表面；
一热扩散元件，具有至少一热转移表面；及
一子封装，具有至少一功率消耗芯片，其是配置在该多层电路板的一导电表面与该热扩散元件的该热转移表面之间，其有一裸露的顶部热块经由一导热绝缘器与该热扩散元件的该热转移表面接触，以提供导热路径于其间，及具有多个对称的引脚与该多层电路板的该导电表面的一连接，以提供导电路径于其间，其中该多个对称引脚及该热块是配置在相反方向，以使导电路径与该导热路径分开。
2.如权利要求1所述的封装，其特征在于，该热块是面向上，该引脚则面向下。
3.如权利要求1所述的封装，其特征在于，该热块是面向下，该引脚则面向上。
4.如权利要求1所述的封装，其特征在于，该子封装的该热块是选自金属、陶瓷、金属基复合材料及绝缘金属基板及其组合之一。
5.如权利要求1所述的封装，其特征在于，该多个对称引脚是两个、四个、或圆形分布的周边引脚。
6.如权利要求1所述的封装，其特征在于，该多层电路板是选自印制线路板及陶瓷拼合电路板之一。
7.如权利要求1所述的封装，其特征在于，该热扩散元件是选自金属、陶瓷及金属基复合材料及其组合之一。
8.如权利要求1所述的封装，其特征在于，该子封装是安装在该多层电路板的一表面上。
9.如权利要求1所述的封装，其特征在于，该子封装是安装在该多层电路板的二表面上。
10.一种封装一功率转换器的方法，其特征在于，包含：
提供一具有至少一导电表面的多层电路板；
提供一具有至少一热转移面的热扩散元件；及
配置一具有至少一功率消耗芯片的子封装于该多层电路板的该导电表面与该热扩散元件的该热转移表面之间，此子封装具有裸露的顶部热块及多个对称引脚，其中该多层电路板的该导电表面适于与该子封装的该引脚电连接，以提供导电路径于其间，该热扩散元件的该热转移表面适于与该子封装的该热块经一导热绝缘器热连接，以提供导热路径于其间，及该导电路径是与该导热路径为分开。
11.一种安排于供功率转换器封装中的子封装，其特征在于，包含：
至少一功率消耗芯片；
一基板与功率消耗芯片接触以自功率消耗芯片转移热量，以提供一导热路径；及
多个对称引脚电连接至该功率消耗芯片以提供一导电路径，其中该多个对称引线及该基板配置在相反方向，以使导电路径与导热路径分开。
12.如权利要求11所述的子封装，其特征在于，该基板是选自一陶瓷基板、一绝缘器金属基板、及金属块及其组合之一。
13.一种安排于供功率转换器封装中的子封装，其特征在于，包含：
至少一分立的功率消耗元件；
一基板与该分立的功率消耗元件接触以自该分立的功率消耗元件传输热量以提供一导热路径；及
多个对称引脚与该分立功率消耗元件连接以提供导电路径，其中该多个对称引线及该基板是配置在相反方向，以使导电路径与导热路径分开。
14.如权利要求13所述的子封装，其特征在于，该基板还包含控制元件及被动元件。
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