CN1637034B - 聚氨酯-酰亚胺树脂、粘合剂组合物及电路连接用粘合剂组合物 - Google Patents

聚氨酯-酰亚胺树脂、粘合剂组合物及电路连接用粘合剂组合物 Download PDF

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Publication number
CN1637034B
CN1637034B CN2005100001931A CN200510000193A CN1637034B CN 1637034 B CN1637034 B CN 1637034B CN 2005100001931 A CN2005100001931 A CN 2005100001931A CN 200510000193 A CN200510000193 A CN 200510000193A CN 1637034 B CN1637034 B CN 1637034B
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CN
China
Prior art keywords
polyurethane
adhesive composition
imide resin
resin
bis
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN2005100001931A
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English (en)
Chinese (zh)
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CN1637034A (zh
Inventor
杉浦实
汤佐正己
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Resonac Corp
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Hitachi Chemical Co Ltd
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Publication of CN1637034A publication Critical patent/CN1637034A/zh
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Anticipated expiration legal-status Critical
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN2005100001931A 2004-01-08 2005-01-06 聚氨酯-酰亚胺树脂、粘合剂组合物及电路连接用粘合剂组合物 Expired - Fee Related CN1637034B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2004002922 2004-01-08
JP2004002922 2004-01-08
JP2004002923 2004-01-08
JP2004-002922 2004-01-08
JP2004002923 2004-01-08
JP2004-002923 2004-01-08

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN2009100016085A Division CN101445714B (zh) 2004-01-08 2005-01-06 聚氨酯-酰亚胺树脂、粘合剂组合物及电路连接用粘合剂组合物

Publications (2)

Publication Number Publication Date
CN1637034A CN1637034A (zh) 2005-07-13
CN1637034B true CN1637034B (zh) 2010-04-28

Family

ID=34889283

Family Applications (2)

Application Number Title Priority Date Filing Date
CN2005100001931A Expired - Fee Related CN1637034B (zh) 2004-01-08 2005-01-06 聚氨酯-酰亚胺树脂、粘合剂组合物及电路连接用粘合剂组合物
CN2009100016085A Expired - Fee Related CN101445714B (zh) 2004-01-08 2005-01-06 聚氨酯-酰亚胺树脂、粘合剂组合物及电路连接用粘合剂组合物

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN2009100016085A Expired - Fee Related CN101445714B (zh) 2004-01-08 2005-01-06 聚氨酯-酰亚胺树脂、粘合剂组合物及电路连接用粘合剂组合物

Country Status (3)

Country Link
KR (2) KR100792056B1 (enExample)
CN (2) CN1637034B (enExample)
TW (2) TW200526710A (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2008015759A1 (ja) * 2006-08-04 2009-12-17 日立化成工業株式会社 フィルム状接着剤、接着シート及びこれを使用した半導体装置
KR101063602B1 (ko) * 2006-08-22 2011-09-07 히다치 가세고교 가부시끼가이샤 회로 접속 재료, 회로 부재의 접속 구조 및 회로 부재의 접속 구조의 제조 방법
KR101181591B1 (ko) 2006-10-04 2012-09-10 히다치 가세고교 가부시끼가이샤 다이본딩용 수지 페이스트, 반도체장치의 제조방법 및 반도체장치
WO2008132960A1 (ja) * 2007-04-19 2008-11-06 Kaneka Corporation 新規なポリイミド前駆体組成物及びその利用
CN101121101B (zh) * 2007-07-06 2010-06-02 清华大学 聚氨酯酰亚胺渗透汽化芳烃/烷烃分离膜的制备方法
WO2011043342A1 (ja) * 2009-10-07 2011-04-14 日立化成工業株式会社 熱硬化性樹脂組成物、フレキシブル配線板の保護膜を形成する方法及びフレキシブル配線板
TWI510521B (zh) * 2013-01-21 2015-12-01 Daxin Materials Corp 聚亞醯胺結構以及聚亞醯胺樹脂組成物
CN104031241A (zh) * 2013-03-09 2014-09-10 东莞市长安东阳光铝业研发有限公司 一种有机硅改性聚氨酯-酰亚胺材料的制备方法及其应用
JP6069153B2 (ja) * 2013-09-27 2017-02-01 デクセリアルズ株式会社 アンダーフィル材、及びこれを用いた半導体装置の製造方法
JP6578100B2 (ja) * 2014-12-25 2019-09-18 日東シンコー株式会社 絶縁紙
CN105097068B (zh) * 2015-06-25 2017-03-08 英利能源（中国）有限公司 导电胶、太阳能电池串及其制备方法
KR102818841B1 (ko) * 2018-10-02 2025-06-10 나믹스 가부시끼가이샤 수지 조성물, 필름, 적층판 및 반도체 장치
CN110041212B (zh) * 2019-05-21 2020-10-02 吉林大学 一种含氟多胺单体及其制备方法、一种聚酰亚胺及其制备方法和一种聚酰亚胺膜
CN110373026B (zh) * 2019-09-02 2021-06-29 无锡创彩光学材料有限公司 聚酰亚胺树脂组合物及其制备方法和薄膜
KR102800340B1 (ko) * 2023-10-19 2025-04-23 김형승 내열성과 저온 접착성이 우수한 (메타)아크릴레이트 말단의 폴리우레탄이미드(아미드) 공중합체를 포함하는 회로접속용 접착수지

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4929358A (en) * 1989-08-09 1990-05-29 Exxon Research And Engineering Company Polyurethane-imide membranes and their use for the separation of aromatics from non-aromatics
US4962271A (en) * 1989-12-19 1990-10-09 Exxon Research And Engineering Company Selective separation of multi-ring aromatic hydrocarbons from distillates by perstraction
CN1050883A (zh) * 1989-10-10 1991-04-24 B·F·谷德里奇公司 辐射可固化的热塑性聚氨酯

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0523558A (ja) * 1989-12-19 1993-02-02 Exxon Res & Eng Co 支持薄層膜の製造
US5254659A (en) * 1990-03-27 1993-10-19 Hitachi, Ltd. Insulating coating composition, solderable insulated wires, production process of the insulated wires and flyback transformers using the insulated wires
KR970006896B1 (ko) * 1993-11-10 1997-04-30 생산기술연구원 내열성 폴리(우레탄-이미드)수지 및 그 제조방법
TW398165B (en) * 1997-03-03 2000-07-11 Hitachi Chemical Co Ltd Circuit boards using heat resistant resin for adhesive layers
GB9814835D0 (en) * 1998-07-08 1998-09-09 Europ Org For Nuclear Research A thermal management board
US6403753B1 (en) * 2000-01-18 2002-06-11 Sandia Corporation Method of making thermally removable polyurethanes
KR100545255B1 (ko) * 2003-04-29 2006-01-24 (주)애드뷰 전도성 고분자를 포함하는 액정 배향제 조성물, 이를이용한 액정 배향막, 그 제조방법 및 상기 액정 배향막을포함하는 액정 소자
JP2006241174A (ja) * 2005-02-07 2006-09-14 Hitachi Chem Co Ltd ダイボンディング用フィルム状接着剤及びこれを用いた接着シート、並びに半導体装置。

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4929358A (en) * 1989-08-09 1990-05-29 Exxon Research And Engineering Company Polyurethane-imide membranes and their use for the separation of aromatics from non-aromatics
CN1050883A (zh) * 1989-10-10 1991-04-24 B·F·谷德里奇公司 辐射可固化的热塑性聚氨酯
US4962271A (en) * 1989-12-19 1990-10-09 Exxon Research And Engineering Company Selective separation of multi-ring aromatic hydrocarbons from distillates by perstraction

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
刘瑾.不同软段结构聚氨酯－酰亚胺嵌段共聚物的合成及热性能研究.高分子学报 2.2002,(2),221-226. *
王东.侧链型二阶非线性光学聚(氨酯-酰亚胺)的极化和取向稳定性的研究.功能高分子学报14 1.2001,14(1),35-38. *
陈正国.聚氨酯酰亚胺的合成、性能及应用进展.胶体与聚合物17 4.1999,17(4),26-30. *
陈正国.聚氨酯酰亚胺的合成及性能研究.湖北大学学报(自然科学版)23 3.2001,23(3),实验部分. *

Also Published As

Publication number Publication date
KR20050073528A (ko) 2005-07-14
CN101445714B (zh) 2013-03-20
CN101445714A (zh) 2009-06-03
KR100792056B1 (ko) 2008-01-04
TW200848483A (en) 2008-12-16
KR100860892B1 (ko) 2008-09-29
CN1637034A (zh) 2005-07-13
KR20070077201A (ko) 2007-07-25
TWI314567B (enExample) 2009-09-11
TW200526710A (en) 2005-08-16

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Granted publication date: 20100428

Termination date: 20140106