CN1574221A - 液体供给装置及基板处理装置 - Google Patents
液体供给装置及基板处理装置 Download PDFInfo
- Publication number
- CN1574221A CN1574221A CNA2004100459470A CN200410045947A CN1574221A CN 1574221 A CN1574221 A CN 1574221A CN A2004100459470 A CNA2004100459470 A CN A2004100459470A CN 200410045947 A CN200410045947 A CN 200410045947A CN 1574221 A CN1574221 A CN 1574221A
- Authority
- CN
- China
- Prior art keywords
- aforementioned
- liquid
- fluid
- substrate
- supplying apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 141
- 239000007788 liquid Substances 0.000 title claims description 159
- 239000012530 fluid Substances 0.000 claims abstract description 108
- 230000007246 mechanism Effects 0.000 claims abstract description 16
- 239000000126 substance Substances 0.000 claims abstract description 8
- 238000005086 pumping Methods 0.000 claims description 43
- 235000014347 soups Nutrition 0.000 claims description 41
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 19
- 230000001681 protective effect Effects 0.000 claims description 11
- 238000004140 cleaning Methods 0.000 abstract description 100
- 238000000034 method Methods 0.000 abstract description 4
- 230000008569 process Effects 0.000 abstract description 2
- 238000005406 washing Methods 0.000 description 86
- 208000028659 discharge Diseases 0.000 description 44
- 238000003860 storage Methods 0.000 description 15
- 238000010586 diagram Methods 0.000 description 14
- 230000009471 action Effects 0.000 description 10
- 230000000694 effects Effects 0.000 description 6
- 239000002245 particle Substances 0.000 description 5
- 241000894006 Bacteria Species 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000012800 visualization Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 239000003223 protective agent Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
- B05C5/0237—Fluid actuated valves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Landscapes
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Materials For Photolithography (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
Description
Claims (9)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003159394 | 2003-06-04 | ||
JP2003159394A JP4298384B2 (ja) | 2003-06-04 | 2003-06-04 | 液供給装置および基板処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1574221A true CN1574221A (zh) | 2005-02-02 |
CN1322550C CN1322550C (zh) | 2007-06-20 |
Family
ID=34052463
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100459470A Expired - Lifetime CN1322550C (zh) | 2003-06-04 | 2004-05-25 | 液体供给装置及基板处理装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4298384B2 (zh) |
KR (1) | KR100596551B1 (zh) |
CN (1) | CN1322550C (zh) |
TW (1) | TWI244132B (zh) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1885164B (zh) * | 2005-06-24 | 2010-04-07 | 友达光电股份有限公司 | 光阻涂布方法及其光阻涂布设备 |
CN101221361B (zh) * | 2008-01-18 | 2010-06-09 | 友达光电股份有限公司 | 管路压力平衡系统 |
CN101489688B (zh) * | 2006-07-19 | 2011-09-07 | 3M创新有限公司 | 具有插件的模头以及用于模头的气体吹扫方法 |
CN101639633B (zh) * | 2008-07-29 | 2012-02-29 | 和舰科技(苏州)有限公司 | 一种显影液供给管路 |
CN101614960B (zh) * | 2008-06-27 | 2012-05-16 | 显示器生产服务株式会社 | 具备喷嘴唇口清洗装置的狭缝式涂敷装置 |
CN102463237A (zh) * | 2010-11-17 | 2012-05-23 | 三星移动显示器株式会社 | 基底清洁系统和方法 |
CN103645607A (zh) * | 2013-12-19 | 2014-03-19 | 合肥京东方光电科技有限公司 | 涂胶系统 |
CN103736606A (zh) * | 2013-12-23 | 2014-04-23 | 清华大学深圳研究生院 | 集成式出射流道结构工艺喷嘴 |
CN104898324A (zh) * | 2014-03-07 | 2015-09-09 | 芝浦机械电子株式会社 | 接液处理装置、接液处理方法、基板处理装置及基板处理方法 |
CN103456665B (zh) * | 2012-05-31 | 2017-07-18 | 细美事有限公司 | 一种基板处理装置及基板处理方法 |
TWI632634B (zh) * | 2014-12-16 | 2018-08-11 | 東京威力科創股份有限公司 | 基板液體處理裝置 |
CN109216229A (zh) * | 2017-06-30 | 2019-01-15 | 株式会社斯库林集团 | 基板处理装置及基板处理方法 |
CN110211897A (zh) * | 2018-02-28 | 2019-09-06 | 株式会社斯库林集团 | 基板处理装置、处理液排出方法、处理液交换方法及基板处理方法 |
CN110412837A (zh) * | 2018-04-28 | 2019-11-05 | 上海微电子装备(集团)股份有限公司 | 喷洒装置、显影系统和显影方法 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7767026B2 (en) | 2005-03-29 | 2010-08-03 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing apparatus and substrate processing method |
KR100721289B1 (ko) * | 2005-11-04 | 2007-05-25 | 세메스 주식회사 | 슬릿노즐의 보관 세정 장치 및 세정처리 방법 |
JP4703467B2 (ja) * | 2006-03-30 | 2011-06-15 | 株式会社日立ハイテクノロジーズ | 基板処理装置、基板処理方法、及び基板の製造方法 |
KR101374096B1 (ko) * | 2006-06-27 | 2014-03-13 | 엘지디스플레이 주식회사 | 스핀리스 코터 및 이를 이용한 코팅방법 |
JP5060835B2 (ja) * | 2006-07-26 | 2012-10-31 | 芝浦メカトロニクス株式会社 | 基板の処理装置 |
JP4835304B2 (ja) * | 2006-07-27 | 2011-12-14 | 凸版印刷株式会社 | 現像ノズル及び現像装置 |
KR100865721B1 (ko) | 2007-09-11 | 2008-10-29 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
JP5427387B2 (ja) * | 2008-10-03 | 2014-02-26 | 株式会社日立産機システム | インクジェット記録装置の経路洗浄方法。 |
JP6328538B2 (ja) * | 2014-11-11 | 2018-05-23 | 東京エレクトロン株式会社 | 基板液処理装置の洗浄方法、記憶媒体及び基板液処理装置 |
KR102037917B1 (ko) * | 2016-07-29 | 2019-10-30 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
JP7132054B2 (ja) * | 2018-09-21 | 2022-09-06 | 株式会社Screenホールディングス | 基板処理装置、及び基板処理方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2105278U (zh) * | 1991-11-04 | 1992-05-27 | 中国人民解放军第118医院 | 药液自动配制装置 |
CN1038625C (zh) * | 1993-01-20 | 1998-06-03 | 株式会社日立制作所 | 防止液体中杂质附着的溶液和使用它的腐蚀方法 |
JP3638803B2 (ja) * | 1998-11-10 | 2005-04-13 | 大日本スクリーン製造株式会社 | ノズル洗浄機能を備えた基板処理装置および該装置による基板処理方法 |
US7080651B2 (en) * | 2001-05-17 | 2006-07-25 | Dainippon Screen Mfg. Co., Ltd. | High pressure processing apparatus and method |
-
2003
- 2003-06-04 JP JP2003159394A patent/JP4298384B2/ja not_active Expired - Fee Related
-
2004
- 2004-05-11 TW TW093113224A patent/TWI244132B/zh not_active IP Right Cessation
- 2004-05-25 CN CNB2004100459470A patent/CN1322550C/zh not_active Expired - Lifetime
- 2004-06-02 KR KR1020040039924A patent/KR100596551B1/ko active IP Right Grant
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1885164B (zh) * | 2005-06-24 | 2010-04-07 | 友达光电股份有限公司 | 光阻涂布方法及其光阻涂布设备 |
CN101489688B (zh) * | 2006-07-19 | 2011-09-07 | 3M创新有限公司 | 具有插件的模头以及用于模头的气体吹扫方法 |
CN101221361B (zh) * | 2008-01-18 | 2010-06-09 | 友达光电股份有限公司 | 管路压力平衡系统 |
CN101614960B (zh) * | 2008-06-27 | 2012-05-16 | 显示器生产服务株式会社 | 具备喷嘴唇口清洗装置的狭缝式涂敷装置 |
CN101639633B (zh) * | 2008-07-29 | 2012-02-29 | 和舰科技(苏州)有限公司 | 一种显影液供给管路 |
CN102463237A (zh) * | 2010-11-17 | 2012-05-23 | 三星移动显示器株式会社 | 基底清洁系统和方法 |
US9199285B2 (en) | 2010-11-17 | 2015-12-01 | Samsung Display Co., Ltd. | System and method for cleaning substrate |
CN103456665B (zh) * | 2012-05-31 | 2017-07-18 | 细美事有限公司 | 一种基板处理装置及基板处理方法 |
CN103645607A (zh) * | 2013-12-19 | 2014-03-19 | 合肥京东方光电科技有限公司 | 涂胶系统 |
CN103645607B (zh) * | 2013-12-19 | 2016-09-07 | 合肥京东方光电科技有限公司 | 涂胶系统 |
CN103736606B (zh) * | 2013-12-23 | 2016-04-06 | 清华大学深圳研究生院 | 集成式出射流道结构工艺喷嘴 |
CN103736606A (zh) * | 2013-12-23 | 2014-04-23 | 清华大学深圳研究生院 | 集成式出射流道结构工艺喷嘴 |
CN104898324A (zh) * | 2014-03-07 | 2015-09-09 | 芝浦机械电子株式会社 | 接液处理装置、接液处理方法、基板处理装置及基板处理方法 |
CN104898324B (zh) * | 2014-03-07 | 2017-11-17 | 芝浦机械电子株式会社 | 接液处理装置、接液处理方法、基板处理装置及基板处理方法 |
TWI632634B (zh) * | 2014-12-16 | 2018-08-11 | 東京威力科創股份有限公司 | 基板液體處理裝置 |
CN109216229A (zh) * | 2017-06-30 | 2019-01-15 | 株式会社斯库林集团 | 基板处理装置及基板处理方法 |
CN109216229B (zh) * | 2017-06-30 | 2022-03-22 | 株式会社斯库林集团 | 基板处理装置及基板处理方法 |
CN110211897A (zh) * | 2018-02-28 | 2019-09-06 | 株式会社斯库林集团 | 基板处理装置、处理液排出方法、处理液交换方法及基板处理方法 |
CN110211897B (zh) * | 2018-02-28 | 2023-06-20 | 株式会社斯库林集团 | 基板处理装置及方法、处理液排出方法、处理液交换方法 |
CN110412837A (zh) * | 2018-04-28 | 2019-11-05 | 上海微电子装备(集团)股份有限公司 | 喷洒装置、显影系统和显影方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20040104914A (ko) | 2004-12-13 |
JP2004363292A (ja) | 2004-12-24 |
TW200428510A (en) | 2004-12-16 |
TWI244132B (en) | 2005-11-21 |
CN1322550C (zh) | 2007-06-20 |
JP4298384B2 (ja) | 2009-07-15 |
KR100596551B1 (ko) | 2006-07-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: SCREEN GROUP CO., LTD. Free format text: FORMER NAME: DAINIPPON SCREEN MFG. CO., LTD. Owner name: DAINIPPON SCREEN MFG. CO., LTD. Free format text: FORMER NAME: DAINIPPON MESH PLATE MFR. CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Kyoto Japan Patentee after: Skilling Group Address before: Kyoto Japan Patentee before: DAINIPPON SCREEN MFG Co.,Ltd. Address after: Kyoto Japan Patentee after: DAINIPPON SCREEN MFG Co.,Ltd. Address before: Kyoto Japan Patentee before: Dainippon Screen Mfg. Co.,Ltd. |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20070620 |