CN1574133A - 芯片式固体电解质电容器及其制造方法 - Google Patents
芯片式固体电解质电容器及其制造方法 Download PDFInfo
- Publication number
- CN1574133A CN1574133A CNA2004100495180A CN200410049518A CN1574133A CN 1574133 A CN1574133 A CN 1574133A CN A2004100495180 A CNA2004100495180 A CN A2004100495180A CN 200410049518 A CN200410049518 A CN 200410049518A CN 1574133 A CN1574133 A CN 1574133A
- Authority
- CN
- China
- Prior art keywords
- capacitor element
- cathode
- chip type
- solid electrolyte
- positive wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 100
- 238000000034 method Methods 0.000 title claims description 10
- 239000007787 solid Substances 0.000 title abstract description 3
- 239000000853 adhesive Substances 0.000 claims abstract description 9
- 230000001070 adhesive effect Effects 0.000 claims abstract description 9
- 239000007784 solid electrolyte Substances 0.000 claims description 27
- 239000000203 mixture Substances 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000005245 sintering Methods 0.000 claims description 6
- 238000003475 lamination Methods 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 abstract description 2
- 239000007767 bonding agent Substances 0.000 abstract 1
- 239000004020 conductor Substances 0.000 abstract 1
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 6
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 6
- 239000011230 binding agent Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229910052715 tantalum Inorganic materials 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 239000002322 conducting polymer Substances 0.000 description 2
- 229920001940 conductive polymer Polymers 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- MIVBAHRSNUNMPP-UHFFFAOYSA-N manganese(2+);dinitrate Chemical compound [Mn+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O MIVBAHRSNUNMPP-UHFFFAOYSA-N 0.000 description 2
- 239000010955 niobium Substances 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 2
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 2
- 238000004382 potting Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910001936 tantalum oxide Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000011191 terminal modification Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/26—Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices with each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
Claims (7)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP170428/2003 | 2003-06-16 | ||
JP2003170428A JP2005005642A (ja) | 2003-06-16 | 2003-06-16 | チップ型固体電解コンデンサ及びその製造方法 |
JP170428/03 | 2003-06-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1574133A true CN1574133A (zh) | 2005-02-02 |
CN100444291C CN100444291C (zh) | 2008-12-17 |
Family
ID=33509123
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100495180A Expired - Lifetime CN100444291C (zh) | 2003-06-16 | 2004-06-16 | 芯片式固体电解质电容器及其制造方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US7138713B2 (zh) |
JP (1) | JP2005005642A (zh) |
KR (1) | KR100706454B1 (zh) |
CN (1) | CN100444291C (zh) |
TW (1) | TWI248099B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103875048A (zh) * | 2011-10-17 | 2014-06-18 | 埃文斯电容公司 | 烧结制品和制备烧结制品的方法 |
CN109791845A (zh) * | 2016-09-29 | 2019-05-21 | 松下知识产权经营株式会社 | 固体电解电容器 |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005191466A (ja) * | 2003-12-26 | 2005-07-14 | Tdk Corp | コンデンサ |
US7419084B2 (en) * | 2004-11-24 | 2008-09-02 | Xerox Corporation | Mounting method for surface-mount components on a printed circuit board |
ES2439548T3 (es) | 2004-12-23 | 2014-01-23 | Electronics And Telecommunications Research Institute | Aparato para transmitir y recibir datos para proporcionar una comunicación de datos de alta velocidad y método para ello |
CN101176172B (zh) * | 2005-05-13 | 2012-09-26 | 三洋电机株式会社 | 层叠型固体电解电容器及其制造方法 |
US7468882B2 (en) * | 2006-04-28 | 2008-12-23 | Avx Corporation | Solid electrolytic capacitor assembly |
KR100887453B1 (ko) * | 2007-02-21 | 2009-03-10 | 삼화콘덴서공업주식회사 | Smd형 세라믹 디스크 커패시터 |
KR100944749B1 (ko) * | 2007-11-30 | 2010-03-03 | 삼화콘덴서공업주식회사 | Smd형 세라믹 커패시터 및 그 제조방법 |
US8139344B2 (en) * | 2009-09-10 | 2012-03-20 | Avx Corporation | Electrolytic capacitor assembly and method with recessed leadframe channel |
US8125769B2 (en) | 2010-07-22 | 2012-02-28 | Avx Corporation | Solid electrolytic capacitor assembly with multiple cathode terminations |
CN102347137B (zh) * | 2010-07-29 | 2014-04-02 | 禾伸堂企业股份有限公司 | 电容器结构及其制造方法 |
US8259436B2 (en) | 2010-08-03 | 2012-09-04 | Avx Corporation | Mechanically robust solid electrolytic capacitor assembly |
US8514550B2 (en) * | 2011-03-11 | 2013-08-20 | Avx Corporation | Solid electrolytic capacitor containing a cathode termination with a slot for an adhesive |
KR101278507B1 (ko) | 2011-05-24 | 2013-07-02 | 주식회사 엘지화학 | 전극 구조체 강도를 개선한 이차 전지 |
US8837166B2 (en) | 2011-10-28 | 2014-09-16 | Hamilton Sundstrand Corporation | Vertically mounted capacitor assembly |
WO2014116843A1 (en) * | 2013-01-25 | 2014-07-31 | Kemet Electronics Corporation | Solid electrolytic capacitor and method of manufacture |
TWI616914B (zh) * | 2016-10-14 | 2018-03-01 | 鈺邦科技股份有限公司 | 堆疊型固態電解電容器封裝結構及其製作方法 |
CN107958786A (zh) * | 2016-10-14 | 2018-04-24 | 钰邦电子(无锡)有限公司 | 堆叠型固态电解电容器封装结构及其制作方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2973499B2 (ja) * | 1990-09-13 | 1999-11-08 | 松下電器産業株式会社 | チップ型固体電解コンデンサ |
JPH0757971A (ja) * | 1993-08-11 | 1995-03-03 | Mitsubishi Materials Corp | 複合セラミックコンデンサ |
EP0650193A3 (en) | 1993-10-25 | 1996-07-31 | Toshiba Kk | Semiconductor device and method for its production. |
JP3755336B2 (ja) * | 1998-08-26 | 2006-03-15 | 松下電器産業株式会社 | 固体電解コンデンサおよびその製造方法 |
JP2001006986A (ja) * | 1999-06-23 | 2001-01-12 | Nec Corp | チップ型固体電解コンデンサおよびその製造方法 |
JP2001126958A (ja) | 1999-10-29 | 2001-05-11 | Hitachi Aic Inc | チップ形固体電解コンデンサ |
JP3945958B2 (ja) | 2000-03-29 | 2007-07-18 | 三洋電機株式会社 | 固体電解コンデンサ及びその製造方法 |
US6501270B1 (en) | 2000-05-15 | 2002-12-31 | Siemens Vdo Automotive Corporation | Hall effect sensor assembly with cavities for integrated capacitors |
US6343044B1 (en) * | 2000-10-04 | 2002-01-29 | International Business Machines Corporation | Super low-power generator system for embedded applications |
JP2003017368A (ja) * | 2001-07-02 | 2003-01-17 | Matsushita Electric Ind Co Ltd | 固体電解コンデンサの製造方法 |
JP4472277B2 (ja) | 2003-04-10 | 2010-06-02 | Necトーキン株式会社 | チップ型固体電解コンデンサ |
-
2003
- 2003-06-16 JP JP2003170428A patent/JP2005005642A/ja active Pending
-
2004
- 2004-06-10 US US10/866,154 patent/US7138713B2/en active Active
- 2004-06-14 TW TW093117002A patent/TWI248099B/zh not_active IP Right Cessation
- 2004-06-15 KR KR1020040044098A patent/KR100706454B1/ko not_active IP Right Cessation
- 2004-06-16 CN CNB2004100495180A patent/CN100444291C/zh not_active Expired - Lifetime
-
2006
- 2006-09-19 US US11/523,417 patent/US7320924B2/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103875048A (zh) * | 2011-10-17 | 2014-06-18 | 埃文斯电容公司 | 烧结制品和制备烧结制品的方法 |
CN103875048B (zh) * | 2011-10-17 | 2016-10-26 | 埃文斯电容公司 | 烧结制品和制备烧结制品的方法 |
CN109791845A (zh) * | 2016-09-29 | 2019-05-21 | 松下知识产权经营株式会社 | 固体电解电容器 |
Also Published As
Publication number | Publication date |
---|---|
TWI248099B (en) | 2006-01-21 |
US7320924B2 (en) | 2008-01-22 |
KR100706454B1 (ko) | 2007-04-10 |
CN100444291C (zh) | 2008-12-17 |
US7138713B2 (en) | 2006-11-21 |
KR20040111065A (ko) | 2004-12-31 |
JP2005005642A (ja) | 2005-01-06 |
TW200503024A (en) | 2005-01-16 |
US20040251558A1 (en) | 2004-12-16 |
US20070020843A1 (en) | 2007-01-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: Miyagi Prefecture, Japan, Sendai Taibai District, county, mountain six, Ding mu, 7, No. 1 Patentee after: TOKIN Corp. Address before: Miyagi Prefecture, Japan, Sendai Taibai District, county, mountain six, Ding mu, 7, No. 1 Patentee before: NEC Tokin Corp. |
|
CP01 | Change in the name or title of a patent holder | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170914 Address after: Miyagi Prefecture, Japan, Sendai Taibai District, county, mountain six, Ding mu, 7, No. 1 Patentee after: NEC TOKIN Corp. Address before: Sendai City, Miyagi Prefecture, Japan Co-patentee before: NEC Tokin Toyama, Ltd. Patentee before: NEC Tokin Corp. |
|
TR01 | Transfer of patent right |