CN1507044A - 用于减少叠置通孔中热-机械应力的结构和方法 - Google Patents
用于减少叠置通孔中热-机械应力的结构和方法 Download PDFInfo
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- CN1507044A CN1507044A CNA2003101024255A CN200310102425A CN1507044A CN 1507044 A CN1507044 A CN 1507044A CN A2003101024255 A CNA2003101024255 A CN A2003101024255A CN 200310102425 A CN200310102425 A CN 200310102425A CN 1507044 A CN1507044 A CN 1507044A
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- 238000010276 construction Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
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- 229920001187 thermosetting polymer Polymers 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
- H01L21/76807—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics for dual damascene structures
- H01L21/76808—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics for dual damascene structures involving intermediate temporary filling with material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76829—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers
- H01L21/76831—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers in via holes or trenches, e.g. non-conductive sidewall liners
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5226—Via connections in a multilevel interconnection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/5329—Insulating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (15)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/319,032 US6831363B2 (en) | 2002-12-12 | 2002-12-12 | Structure and method for reducing thermo-mechanical stress in stacked vias |
US10/319,032 | 2002-12-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1507044A true CN1507044A (zh) | 2004-06-23 |
CN1297001C CN1297001C (zh) | 2007-01-24 |
Family
ID=32506541
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2003101024255A Expired - Lifetime CN1297001C (zh) | 2002-12-12 | 2003-10-20 | 用于减少叠置通孔中热-机械应力的结构和方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US6831363B2 (zh) |
JP (1) | JP3777182B2 (zh) |
CN (1) | CN1297001C (zh) |
TW (1) | TWI249235B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103377305A (zh) * | 2012-04-12 | 2013-10-30 | 台湾积体电路制造股份有限公司 | 迹线上凸块结构的迹线布局方法 |
CN104051322A (zh) * | 2013-03-11 | 2014-09-17 | 中芯国际集成电路制造(上海)有限公司 | 一种制作半导体器件的方法 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6939817B2 (en) * | 2003-05-08 | 2005-09-06 | Micron Technology, Inc. | Removal of carbon from an insulative layer using ozone |
US20060128163A1 (en) * | 2004-12-14 | 2006-06-15 | International Business Machines Corporation | Surface treatment of post-rie-damaged p-osg and other damaged materials |
US7402515B2 (en) * | 2005-06-28 | 2008-07-22 | Intel Corporation | Method of forming through-silicon vias with stress buffer collars and resulting devices |
US7312523B2 (en) * | 2005-07-28 | 2007-12-25 | International Business Machines Corporation | Enhanced via structure for organic module performance |
US7749896B2 (en) * | 2005-08-23 | 2010-07-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device and method for forming the same |
US20070246830A1 (en) * | 2006-04-21 | 2007-10-25 | Toshiba America Electronic Components, Inc. | Long-lifetime interconnect structure and method for making |
US8999764B2 (en) | 2007-08-10 | 2015-04-07 | International Business Machines Corporation | Ionizing radiation blocking in IC chip to reduce soft errors |
US7531373B2 (en) * | 2007-09-19 | 2009-05-12 | Micron Technology, Inc. | Methods of forming a conductive interconnect in a pixel of an imager and in other integrated circuitry |
TWI449152B (zh) * | 2011-12-21 | 2014-08-11 | Ind Tech Res Inst | 半導體元件堆疊結構 |
US9245824B2 (en) | 2013-04-18 | 2016-01-26 | Globalfoundries Inc. | Through-vias for wiring layers of semiconductor devices |
US11270955B2 (en) * | 2018-11-30 | 2022-03-08 | Texas Instruments Incorporated | Package substrate with CTE matching barrier ring around microvias |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3102409B2 (ja) * | 1998-04-30 | 2000-10-23 | 日本電気株式会社 | 配線の形成方法及びプラズマアッシング装置 |
US6294836B1 (en) * | 1998-12-22 | 2001-09-25 | Cvc Products Inc. | Semiconductor chip interconnect barrier material and fabrication method |
US6153512A (en) * | 1999-10-12 | 2000-11-28 | Taiwan Semiconductor Manufacturing Company | Process to improve adhesion of HSQ to underlying materials |
US6720502B1 (en) * | 2000-05-15 | 2004-04-13 | International Business Machine Corporation | Integrated circuit structure |
US6586334B2 (en) * | 2000-11-09 | 2003-07-01 | Texas Instruments Incorporated | Reducing copper line resistivity by smoothing trench and via sidewalls |
US6613664B2 (en) * | 2000-12-28 | 2003-09-02 | Infineon Technologies Ag | Barbed vias for electrical and mechanical connection between conductive layers in semiconductor devices |
US6429116B1 (en) * | 2001-02-07 | 2002-08-06 | Advanced Micro Devices, Inc. | Method of fabricating a slot dual damascene structure without middle stop layer |
US6599827B1 (en) * | 2001-05-02 | 2003-07-29 | Advanced Micro Devices, Inc. | Methods of forming capped copper interconnects with improved electromigration resistance |
US6620727B2 (en) * | 2001-08-23 | 2003-09-16 | Texas Instruments Incorporated | Aluminum hardmask for dielectric etch |
US6605549B2 (en) * | 2001-09-29 | 2003-08-12 | Intel Corporation | Method for improving nucleation and adhesion of CVD and ALD films deposited onto low-dielectric-constant dielectrics |
-
2002
- 2002-12-12 US US10/319,032 patent/US6831363B2/en not_active Expired - Lifetime
-
2003
- 2003-10-20 CN CNB2003101024255A patent/CN1297001C/zh not_active Expired - Lifetime
- 2003-11-28 TW TW092133502A patent/TWI249235B/zh not_active IP Right Cessation
- 2003-12-03 JP JP2003405153A patent/JP3777182B2/ja not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103377305A (zh) * | 2012-04-12 | 2013-10-30 | 台湾积体电路制造股份有限公司 | 迹线上凸块结构的迹线布局方法 |
CN104051322A (zh) * | 2013-03-11 | 2014-09-17 | 中芯国际集成电路制造(上海)有限公司 | 一种制作半导体器件的方法 |
CN104051322B (zh) * | 2013-03-11 | 2019-01-18 | 中芯国际集成电路制造(上海)有限公司 | 一种制作半导体器件的方法 |
Also Published As
Publication number | Publication date |
---|---|
CN1297001C (zh) | 2007-01-24 |
JP2004193605A (ja) | 2004-07-08 |
TW200509354A (en) | 2005-03-01 |
TWI249235B (en) | 2006-02-11 |
US20040113278A1 (en) | 2004-06-17 |
US6831363B2 (en) | 2004-12-14 |
JP3777182B2 (ja) | 2006-05-24 |
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TR01 | Transfer of patent right |
Effective date of registration: 20171207 Address after: Grand Cayman, Cayman Islands Patentee after: GLOBALFOUNDRIES INC. Address before: American New York Patentee before: Core USA second LLC Effective date of registration: 20171207 Address after: American New York Patentee after: Core USA second LLC Address before: American New York Patentee before: International Business Machines Corp. |
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Granted publication date: 20070124 |