CN1370306A - 用于制造包含至少一个装在底座上的芯片的器件的装置和方法 - Google Patents

用于制造包含至少一个装在底座上的芯片的器件的装置和方法 Download PDF

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CN1370306A
CN1370306A CN00811687A CN00811687A CN1370306A CN 1370306 A CN1370306 A CN 1370306A CN 00811687 A CN00811687 A CN 00811687A CN 00811687 A CN00811687 A CN 00811687A CN 1370306 A CN1370306 A CN 1370306A
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chip
base
communication interface
substrate
connection element
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CN1149512C (zh
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B·卡尔瓦斯
P·帕特里斯
J·C·菲达尔戈
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Jin Yatuo
Gemalto Oy
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Gemplus SA
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Abstract

本发明涉及一种器件的制造方法,此器件包含与至少一个微电路芯片(6)(例如芯片卡)相连的底座(2)。本发明的特征是,该芯片或每个芯片的制造包括以下各步骤:首先,给上述芯片提供一个组件,该组件包含一个通过与衬底(8)结合第一表面(6b)支持的薄芯片(6),且在相反的第二表面(6a)上有至少一个焊接垫(12);在底座的一个表面(2a)上形成一个通信接口(4),该组件包含至少一个与上述芯片相连的连接元件(4b);然后依次将包括芯片(6)和衬底(8)构成的组件放在通信接口上,使得有至少一个芯片焊接垫(12)靠接在通信接口的相应连接元件(4b;24a;24b)上;将每个焊接垫与和它相应的连接元件连在一起;并将衬底(8)从芯片的第一表面(6b)去掉。这种方法能很方便地利用SOI芯片工艺。

Description

用于制造包含至少一个装在底座上的 芯片的器件的装置和方法
本发明涉及一种包含一个安装在底座上的微电路的器件的制造方法，例如制造一个智能卡的方法。
在某些领域(包括智能卡领域)，需要实现将一个微电路或芯片安装在一个比较薄且挠性的底座上。在智能卡的情况下，一方面要求不因芯片的存在而使卡的厚度过大，以致超出国际标准规定的允许值(目前为50μm)，另一方面要求即使当卡受到比较大的弯曲和扭曲应力时，芯片的安装也要充分固定以实现长期使用。
通常为了避免厚度过大而将芯片置于一个为此目的而设在底座层内的空腔内。
图1是将芯片6装在底座2上以构成一块智能卡的一个众所周知实例的示意图。芯片6几乎全部容纳在空腔3内，使得它的厚度包含在底座2的厚度之内。在芯片6朝空腔3外面的表面边缘有一组连接垫5。这些垫5通过引线9与底座上的相应接点7相连。接点7可以设在空腔的底部，或如图中所示，在设于空腔附近一个下凹区域11的中间平台上。这些接点7又与接触面13电气相连，接触面与读卡器作欧姆连接。这些接触面13完全容纳在凹区11内，因而它们的厚度也包括在底座2的厚度之内。
为了保护这个整体，用防护材料15做成一个涂层，覆盖由腔体3，引线9及接触面13的内侧的一部分所占据的全部区域。
上述传统技术有几个缺点。首先，该操作包括将芯片6的连接垫5电连接至接点7需要采用很细而易损坏的引线9，这造成了一些脆弱点。另外，将这些引线9焊起来的操作需要用大量的工具和不少时间。
还有，空腔的形成需要机械加工，这不但费钱，而且使卡的强度减弱。
基于这些问题，本专利申请者提出了一种将至少一个有源电路(例如一个芯片)安装在一个底座上的方法，它不需要在底座上做出一个空腔，而同时又不会使厚度超出允许范围。
为此，本发明提出了一种将很薄的结合在衬底上的芯片连到底座上的方法。这类芯片具有特别的厚度，因而具有一定程度的机械挠度。芯片在制造阶段被结合在一个衬底上，衬底除了有其它一些用途外，还能加强芯片在各个制造阶段的刚性。目前市场上有用这种工艺制造的芯片，称为SOI(去绝缘体上的外延硅)，其总厚度(有效表面的衬底加上连接点的厚度)约为10微米。这方面我们参考了公开的专利文件WO-A-98/02921，此文件披露了制造这种芯片的工艺。
然而，在要把芯片连到底座上的情形下，SOI工艺就特别复杂。当前所用的这种工艺要通过将薄芯片从它的加强衬底上取出的步骤，以将它放置并连接在底座的连接点上。问题是一方面要从其衬底上将芯片取出，另一方面还要操作裸露的芯片，以便将它固定到最后的底座上。
为解决此问题，本发明提出了一种用于制造具有一个与至少与一块芯片形状的微电路相连的底座的器件的方法，其特征在于它包含用于芯片的以下各步骤：
-在开始为上述芯片提供一个组件，该组件包含一个很薄的芯片，此芯片由固定于衬底上的第一面支持，且在相反的第二面上有至少一个连接垫；
-在底座的一面上制成一个通信接口，它有至少一个单元与上述芯片相连接；
-将上述包含芯片和衬底的组件紧靠在通信接口上，使芯片上的每个垫处在通信接口的相应连接元件上；
-将每个垫与它相应的连接元件相连；
-从上述芯片的第一面将上述衬底取下。
因此，本发明可以在保持初始衬底的情况下操作由SOI工艺制成的芯片。当把芯片连到底座的连接元件时，此衬底很显然被保留。这样就把在安装过程中损坏芯片的风险降至最小。
当希望通过把薄的衬底与薄的底座相连而保持所允许的器件厚度的优势时，采用本发明的方法特别有效。因此，本发明的方法允许一个或几个薄的芯片组件直接装在底座表面上，从而得到有用的薄电路，而不需要在底座上开一个空腔。
在一种优选实施例中，可以把通信接口做在位于底座的所述面整个平面的一部分表面上，也就是说，通信接口是从底座表面突起的，因而不需要象图1所示的那样做出一个凹坑。
这样就可以制成的一个器件(如智能卡)，该器件中所有连接到底座的元件(通信接口和芯片)都在一个表面上。
这是因为本发明可以采用非常薄的芯片，从而可以使形成通信接口的金属化层具有可接受的足够厚度。对于智能卡的情形，此通信接口可包括一些接触面，使得卡与“接触”型的读卡器可以相连。为了构成一个“无触点”型卡，也可以把通信接口电连接到一个集成在卡上的天线上，这时它与芯片的信号交换或许还有电源供给是通过天线用无线电实现的。
最好将每个垫与和它对应的连接元件用激光束焊接连起来。
显然可根据本发明布置激光束，使得它穿过衬底和芯片的组件的衬底。换言之，芯片上的焊接垫(例如小凸起)是通过衬底受到照射的。在这方面应该注意，在SOI工艺中常用的衬底(一般都做在玻璃上)对于激光焊所用的波长通常而言是透明的。芯片本身在预计的厚度下也是透明的。
在本发明的一个优选实施方案中，激光束是通过多个光路传送的，每个指向芯片上的一个相应焊接垫。这样，在芯片上可以同时有几个焊点进行焊接，从而节省了加工时间。
最好每个光路通过一个光纤来产生。例如，可以把各个光路集成到一个装置内，由它将芯片定位和/或支撑在底座的通信接口的位置上。
根据一种实施方案，每个焊接垫是一种在激光束作用下会熔化的金属合金制成的，和/或将要与相应的垫连接的连接元件的一部分是由在激光束照射下熔化的材料制成的。
而且，根据所用的焊接垫和连接元件的材料，本发明也可以采用其它的方法将芯片与和它相应的连接元件连起来，例如：
-用热焊方法，或者
-用超声焊接。
当把芯片固定在它的底座时，在将衬底取走后还可以进行把一层防护层沉积在芯片上的步骤。
本发明还涉及一种带集成电路芯片的器件(如智能卡，标竿等)，该器件有一个带通信接口的底座，其中包含与芯片焊接垫相连的连接元件。此器件的特征是：芯片的正面对着底座，其垫直接与通信接口的连接元件相连；芯片置于底座表面之上，且连接元件及带焊接垫的芯片的厚度小于50微米。
本发明的其它一些优点和特征可以参考附图阅读几个优选实施例而更清楚地了解，这些例子仅仅是作为示例而不是局限于此，附图中：
图1在正面已经描述过，这个剖面图表示根据已有技术将芯片安装在底座中的空腔内的情形；
图2a是一个包含通信接口的智能卡底座的局部平面视图；
图2b是沿图2a中II-II’轴线的剖视图；
图3a是包含一个按照SOI“倒装芯片”工艺焊接到衬底上的芯片组件的剖视图；
图3b是一个基片在切开前的平面视图，此基片包含一组为图3a的组件；
图4是图3a的组件装在底座上的剖面图；
图5表示将图3a的组件焊接到底座上的工序；
图6表示按图5的一种变体方式将图3a的组件焊到底座上的工序；
图7是按照本发明的一种实施例中方法的最后一个器件的局部剖视图，此器件包含一个安装在底座上的芯片；
图8是一个带通信接口的底座的局部平面视图，此底座将用于制造无触点智能卡；
图9是沿图8的IIX-IIX’轴线的剖视图，表示按照SOI“倒装芯片”工艺，将一个带与衬底结合芯片的组件固定到底座上的工序。
图2a示出一个底座2，在本例中它由一块塑料卡制成，将按照已有的尺寸标准(如ISO 7810)制成一张智能卡。
为此目的，在用来容纳一个微电路(以后把它称为一个“芯片”)的底座区域上做有一组垫块，由它们形成或连着一个通信接口4。此通信接口4根据不同情况可用作：
-将芯片的输入和输出与外部(特别是读卡器)相连；和/或
-提供芯片和设在底座上的元件间所需的相互联结。这些元件可以是一个与底座2做成一体的天线，以形成一个所谓的“无触点卡”，或者是集成在卡内的其它电路元件(例如一个或更多的其它芯片)，或者是一个电源装置。
在所示的例子中，通信接口4一方面用互连垫块4a将外部设备以欧姆接触方式与芯片相连，另一方面通过印刷线4b将互连垫块与芯片相连，这在下面要讲到。
如图2b所示，通信接口4是形成于底座2的一个2a表面一部分表面上，而底座2是处在与2a其余部分同一个平面上。换句话说，包含通信接口4的那部分表面不象空腔或凹坑的情况那样陷在面2a的平面之下。因而通信接口4相对于底座2的表面2a形成一个多出的厚度。
通信接口4是依照下面的工艺形成的：将用来构成此通信接口的导电材料沉积一薄层e1(图2b)。例如，通信接口4的厚度e1约为5至15微米。
可以设计几种本身已知的方法来制作这个通信接口4。例如，可以用含银颗粒的导电液印刷具有垫块4a和印刷线4b构形的导电板来制造通信接口4。也可以用网板印刷，真空沉积等工艺通过金属化来制作通信接口4。所用的导电材料一般是以铜、镍或铝为主。这种材料可以加入用在所用工艺的粘接剂中。
芯片是用能获得很薄衬底的工艺制成的，因而能将芯片放置在通信接口4上。
在本实施方案例中，微电路是根据SOI工艺制造的，即在绝缘体上外延硅可以制成特别薄的芯片。这种工艺的特别之处可通过专利文件WO-A-98/02921等了解。
根据SOI工艺制成的一个包含芯片及其衬底的组件实例在图3a和3b中示出。
图3a是一个纵剖面图，图中画出一个安装在绝缘衬底8(在此情况下由玻璃制成)上的芯片6。芯片6被粘接垫10固定在玻璃衬底8上。因此，由芯片6和它的绝缘衬底8及粘接垫10构成一个组件，这个组件是从图3b切出一条而形成的。
在图3b中更清楚地示出一组在衬底8上的芯片6的平面图，粘接垫10仅在芯片的四角支持着芯片。除了玻璃衬底8的边缘外，每个粘接垫10为矩形，它的边相对于芯片6的边成45°，而且在衬底8上支持着4个单独芯片6的4个成组的角。因此，芯片6只在其角处被支持在玻璃衬底8上。
从芯片6与面向玻璃衬底8的6b面相对的6a面上，玻璃衬底8有一系列导电凸起12从此面6a稍微突出。这些导电凸起12在英语中常称为“小凸起”(“bumps”)，它们构成芯片6电路和外部的相互连接点。这些凸起通常呈尖拱形，因而能穿入熔融状态的材料中(例如在焊接时)。
在本例中，前面提过的通信接口4上将设置一个单一的芯片6。小凸起12的排列与导电印刷线4b或互连垫4a的一部分的排列相对应。
然后，将每个芯片6连同一部分玻璃衬底8和直接处在芯片下面的粘接垫10从芯片组中切出。这样就得到了一个切开的组件，它包含芯片6，在芯片四个角处的那部分粘接垫10，及尺寸基本上和芯片相同的一部分玻璃衬底8(图3a)。
如图4所示，这个组件位于设在底座2的通信接口4上，其中小凸起12与相应的印刷线4b对齐，以实现所需的相互连接。
需要指出，当芯片6放到它的限定底座(此底座在这里是构成智能卡主体的塑料座2)时，前面定义的面6a将不再面朝外，而是面对此底座2。换句话说，这个面在它刚制成时的形状和它的最后确定的位置之间转过了180°。这种将芯片6相对于它原来的衬底旋转的工艺在英语中称为“倒装芯片”。
一旦将芯片6放到正确位置，就把小凸起12分别与相应的连接点(此处为印刷线4b的一部分)固定下来。
在本发明的优选实施例中，这种固定是通过穿过芯片6原来的衬底8施加能量来实现的。此能量是由激光14提供的，激光发送一个对着衬底朝外一面8a的光束16。光束16一直穿过衬底8的厚度和芯片6在包含一个小凸起12的轴线上的厚度，以将热能传给小凸起。
由锡或铅等易熔金属合金制成的小凸起12吸收的热能使小凸起12开始熔化。
然后，当一个小凸起焊好后，激光14就移到下一个小凸起的位置，并在那儿进行焊接。
因此，每个小凸起是被激光束16焊到通信接口4的相应连接点4b上。
换一种方式，也可以在用来接纳相应的小凸起12的通信接口4的点4b上设置一些焊接垫块。然后用一种在激光束16通过相应的小凸起12所传导的热能下能熔化的材料来制造这些垫块，以将小凸起焊上。
在本例中，用来制造衬底8的玻璃，对于通常用于微点焊接的激光束波长而言是透明的。一种发射1.06微米波长的YAGNd型激光显然可以用来焊接。
可以把激光14安装在一个定位机械手18上，它能使激光束16与支持在底座2上的芯片6的每个小凸起12依次对准。
图6示出另一种焊接方式，根据它几个小凸起12的焊接是用一个激光器14通过一组光路20同时进行的，每个光路将一个激光束16传送至与一个小凸起12对齐的相应位置。光路20可以用光纤制成。这种情况下，有至少一个光纤是垂直地与玻璃衬底8的面8a(些面在组装位置是朝外的)相对放置的，且垂向与每个小凸起12对剂。如上所述，焊接是通过光纤20传递的能量来进行的。激光14的功率应与所用的光路数相适应。如果需要，可以采用几个不同的激光源供各光路之用。
可以把光纤的端部20a集成到用于定位和固定对着底坐2的芯片的装置上，光纤端部20a是按照将要焊到通信接口4上的小凸起12的形状来配置的。基于此目的可以采用一个框架来将几个芯片6组装并焊接到同一底座2或不同的底座上。
这种装置的特点是能同时把所有小凸起12焊起来。
焊接完成后，把玻璃衬底8与芯片6分开。这项工序也能通过剥离衬底8来实现，因为托起粘接垫8的力比将小凸起12焊到连接界面上的力要小得多。
此工序的结果是芯片6与底座2的表面实现了电和机械连接。为了保护芯片6，在它的外露表面6b上加了一层薄膜22，如图7所示。可以简单地喷一层能保护电路不受天气和机械应力侵害漆来形成此薄膜22，薄膜22应限制在不盖住相互连接热垫4a的范围内，以提供一个欧姆接触。但也可以设想将薄膜22盖住底座2上更大的一个部分，甚至整个表面，条件是把欧姆接触面4a掩盖起来或者将这些区域的薄膜材料除去。
第一个实施例是基于所谓的“接触式”智能卡，因为它是设计成通过欧姆接触面4a来与外部进行通信。
而本发明的方法也适用于制造所谓的“无接触式”卡。这些卡用途之一是遥控付费或存取控制系统等场合，它可以通过外部与卡的芯片(一个或数个)6之间的无线电链接实现通信联络。
图8示出这种卡的一个例子。卡上设有一根天线24，其两端24a和24b与触点(此处为小凸起的形式)相连，这些小凸12起做在芯片6上作为连接之用，如图9所示。
在本例中，与第一个实施例一样，由天线24的两端24a和24b与芯片6的面6a上的两个相应小凸起12形成两个连接点，芯片6是用SOI工艺制成的并朝向底座。
在此例中，用来完成焊接的激光束16是直接由安装在定位机械手18上的激光14产生，这与正面图5所示的一样。当然也可以用具有几个光路20的装置用同时进行焊接，如图6所示的那样。
从小凸12和与它们的接触点24a、24b相焊接开始，以后的各步骤和正面讲的一样，其中包括将玻璃衬底8取走，及保护层22的制备。
本发明的显著特色是，它制成的芯片组件可以安装在很薄的底座上，而不需要在底座上用来接纳芯片的地方制作一个空腔或其它的凹坑。
在上述基于智能卡的例子中，完全可以遵守工业标准ISO 7810关于卡的整个平面上最大附加厚度的规定(现在是50微米)。这是因为由组合(包括通信接口4，芯片6和保护薄膜22)表面安装而产生的总附加厚度可以细分如下：
-形成通信接口的金属化层厚度≤30μm；
-如专利文件WO-A-989/02921所述，由SOI工艺制成的芯片6的厚度＝10μm(有源电路5μm+小凸起12的5μm)；
-保护膜厚度＝5～15μm。
本发明可以有很多种变型。
因此应当注意，芯片6可以与同上述的底座2不同形式的底座相连。实际上，完全可以将芯片6连至一个单面印刷电路(例如以压延的方式)，或一个无电介质的栅网，或其它任何能与芯片6在机械方面和电方向集成一体的底座。
此外，本发明的范围远远超出智能卡的领域。它可以应用于所有有赖于安装在底座上的有源电路的领域，包括数据处理卡，平面屏显示器等。

Claims (15)

1.一种用于制造包含与至少一个芯片(6)形式的微电路相连的底座(2)的器件的方法，其特征在于，一个或数个芯片的制造包括以下步骤：
-首先为该芯片提供一个组件，该组件包含一个由固定在衬底(8)的第一面(6b)支持的薄芯片(6)，且在相反的第二面(6a)上有至少一个焊接垫(12)；
-在底座上的一面(2a)制成一个通信接口(4)，该通信接口有至少一个元件(4b)用来与该芯片相连；
-将包含芯片(6)和衬底(8)的组件设置在通信接口上，使得芯片上有至少一个的焊接垫(12)位于通信接口的一个相应连接元件(4b；2a，2b)上；
-将一个或几个垫和与之相应的连接元件相连；
-将所述衬底(8)从芯片的所述第一面(6b)上取走。
2.根据权利要求1所述方法，其特征在于，通信接口(4)是设置在底座(2)的整个平面的一部分表面上。
3.根据权利要求1或2所述方法，其特征在于，每个焊接垫(12)通过激光束(16)与相应的连接元件(4b；24a，24b)相焊接。
4.根据权利要求3所述的方法，其特征在于，激光束(16)穿过组件(6，8)的衬底(8)。
5.根据权利要求3或4所述方法，其特征在于，激光束(16)是由多个光路(20)传输的，每一路指向芯片(6)上的一个相应焊接垫(12)。
6.根据权利要求5所述的方法，其特征在于，每一光路是由至少一根光纤构成的。
7.根据权利要求5或6所述方法，其特征在于，各光路(20)与用来将组件(6，8)定位并支持在底座(2)上的装置做成一体。
8.根据权利要求3至7中任一条所述方法，其特征在于，每个焊接垫(12)用一种金属合金制成，这种合金在激光束(16)作用下可以熔化。
9.根据权利要求3至8中任一条所述的方法，其特征在于，将与相应焊接垫(12)相连的连接元件(4b；24a，24b)的每一部分是由在激光束(16)作用下能熔化的材料制成的。
10.根据权利要求1或2所述的方法，其特征在于，每个焊接垫(12)是通过加压的方法与和它相应的连接元件(4b；24a，24b)相连，压力施于组件(6，8)的衬底(8)上。
11.根据权利要求1或2所述的方法，其特征在于，每个焊接垫(12)通过热焊与和它相应的连接元件(4b；24a，24b)相连。
12.根据权利要求1或2所述的方法，其特征在于，每个焊接垫(12)通过超声焊与和它相应的连接元件(4b；24a，24b)相连。
13.根据权利要求1至12任一条所述的方法，其特征在于，它还包括一个步骤，其中在将衬底(8)除去后，在芯片(6)上沉积一个保护层(22)。
14.根据权利要求1至13中任一条所述的方法可用于智能卡，电子标牌等的制造中。
15.一种集成电路芯片器件如智能卡(6)、电子标牌等，具有一个带通信接口(4)的底座(2)，此界面包含与芯片焊接垫(12)相连的连接元件(4b；24a，24b)，这种器件的特征在于：
-芯片放被配置成其正面朝向底座，其焊接垫(12)直接与界面(4)的连接元件(4b)相连；
-芯片放在底座表面的上方；
-连接元件和带有垫的芯片的厚度小于50微米。
CNB008116873A 1999-06-15 2000-05-30 用于制造至少包含一个装在底座上的芯片的器件的装置和方法 Expired - Fee Related CN1149512C (zh)

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US11069551B2 (en) 2016-11-03 2021-07-20 Rohinni, LLC Method of dampening a force applied to an electrically-actuatable element
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CN110544666B (zh) * 2015-03-20 2022-01-14 罗茵尼公司 用于半导体装置转印的方法
US11488940B2 (en) 2015-03-20 2022-11-01 Rohinni, Inc. Method for transfer of semiconductor devices onto glass substrates
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US11462433B2 (en) 2016-11-23 2022-10-04 Rohinni, LLC Direct transfer apparatus for a pattern array of semiconductor device die
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US11728195B2 (en) 2018-09-28 2023-08-15 Rohinni, Inc. Apparatuses for executing a direct transfer of a semiconductor device die disposed on a first substrate to a second substrate

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DE60006532T2 (de) 2004-09-30
ATE254316T1 (de) 2003-11-15
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CN1149512C (zh) 2004-05-12
AU5410500A (en) 2001-01-02

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