WO2000077731A1 - Dispositif et procede de fabrication de dispositifs comprenant au moins une puce montee sur un support - Google Patents

Dispositif et procede de fabrication de dispositifs comprenant au moins une puce montee sur un support Download PDF

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Publication number
WO2000077731A1
WO2000077731A1 PCT/FR2000/001494 FR0001494W WO0077731A1 WO 2000077731 A1 WO2000077731 A1 WO 2000077731A1 FR 0001494 W FR0001494 W FR 0001494W WO 0077731 A1 WO0077731 A1 WO 0077731A1
Authority
WO
WIPO (PCT)
Prior art keywords
chip
support
substrate
communication interface
connection element
Prior art date
Application number
PCT/FR2000/001494
Other languages
English (en)
French (fr)
Inventor
Bernard Calvas
Philippe Patrice
Jean-Christophe Fidalgo
Original Assignee
Gemplus
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus filed Critical Gemplus
Priority to EP00938861A priority Critical patent/EP1192593B1/fr
Priority to AU54105/00A priority patent/AU5410500A/en
Priority to DE60006532T priority patent/DE60006532T2/de
Priority to AT00938861T priority patent/ATE254316T1/de
Publication of WO2000077731A1 publication Critical patent/WO2000077731A1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
    • H—ELECTRICITY
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    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68359—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during manufacture of interconnect decals or build up layers
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    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68363—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05568—Disposition the whole external layer protruding from the surface
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L2224/0554—External layer
    • H01L2224/05573—Single external layer
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
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    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
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    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/81001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector involving a temporary auxiliary member not forming part of the bonding apparatus
    • H01L2224/81005—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector involving a temporary auxiliary member not forming part of the bonding apparatus being a temporary or sacrificial substrate
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    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/812—Applying energy for connecting
    • H01L2224/8122—Applying energy for connecting with energy being in the form of electromagnetic radiation
    • H01L2224/81224—Applying energy for connecting with energy being in the form of electromagnetic radiation using a laser
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    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Wire Bonding (AREA)
  • Credit Cards Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Die Bonding (AREA)
PCT/FR2000/001494 1999-06-15 2000-05-30 Dispositif et procede de fabrication de dispositifs comprenant au moins une puce montee sur un support WO2000077731A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP00938861A EP1192593B1 (fr) 1999-06-15 2000-05-30 Dispositif et procede de fabrication de dispositifs comprenant au moins une puce montee sur un support
AU54105/00A AU5410500A (en) 1999-06-15 2000-05-30 Device and method for making devices comprising at least a chip mounted on a support
DE60006532T DE60006532T2 (de) 1999-06-15 2000-05-30 Vorrichtung und herstellungsverfahren mit zumindest einem chip auf einem träger
AT00938861T ATE254316T1 (de) 1999-06-15 2000-05-30 Vorrichtung und herstellungsverfahren mit zumindest einem chip auf einem träger

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR99/07549 1999-06-15
FR9907549A FR2795199B1 (fr) 1999-06-15 1999-06-15 Dispositif et procede de fabrication de dispositifs comprenant au moins une puce montee sur un support

Publications (1)

Publication Number Publication Date
WO2000077731A1 true WO2000077731A1 (fr) 2000-12-21

Family

ID=9546801

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FR2000/001494 WO2000077731A1 (fr) 1999-06-15 2000-05-30 Dispositif et procede de fabrication de dispositifs comprenant au moins une puce montee sur un support

Country Status (7)

Country Link
EP (1) EP1192593B1 (zh)
CN (1) CN1149512C (zh)
AT (1) ATE254316T1 (zh)
AU (1) AU5410500A (zh)
DE (1) DE60006532T2 (zh)
FR (1) FR2795199B1 (zh)
WO (1) WO2000077731A1 (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10566319B2 (en) 2015-03-20 2020-02-18 Rohinni, LLC Apparatus for direct transfer of semiconductor device die
US11069551B2 (en) 2016-11-03 2021-07-20 Rohinni, LLC Method of dampening a force applied to an electrically-actuatable element
US11094571B2 (en) 2018-09-28 2021-08-17 Rohinni, LLC Apparatus to increase transferspeed of semiconductor devices with micro-adjustment
US11462433B2 (en) 2016-11-23 2022-10-04 Rohinni, LLC Direct transfer apparatus for a pattern array of semiconductor device die

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030224581A1 (en) * 2002-06-03 2003-12-04 Robert Bosch Gmbh Flip chip packaging process using laser-induced metal bonding technology, system utilizing the method, and device created by the method
DE102011009577A1 (de) * 2011-01-27 2012-08-02 Texas Instruments Deutschland Gmbh RFID-Transponder und Verfahren zum Verbinden eines Halbleiter-Dies mit einer Antenne
FR3061801A1 (fr) * 2017-01-12 2018-07-13 Commissariat Energie Atomique Procede de connexion electrique entre au moins deux elements

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998002921A1 (en) * 1996-07-11 1998-01-22 Kopin Corporation Transferred flexible integrated circuit
FR2752077A1 (fr) * 1996-08-02 1998-02-06 Solaic Sa Carte a circuit integre a connexion mixte et module a circuit integre correspondant
FR2756955A1 (fr) * 1996-12-11 1998-06-12 Schlumberger Ind Sa Procede de realisation d'un circuit electronique pour une carte a memoire sans contact

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998002921A1 (en) * 1996-07-11 1998-01-22 Kopin Corporation Transferred flexible integrated circuit
FR2752077A1 (fr) * 1996-08-02 1998-02-06 Solaic Sa Carte a circuit integre a connexion mixte et module a circuit integre correspondant
FR2756955A1 (fr) * 1996-12-11 1998-06-12 Schlumberger Ind Sa Procede de realisation d'un circuit electronique pour une carte a memoire sans contact

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10566319B2 (en) 2015-03-20 2020-02-18 Rohinni, LLC Apparatus for direct transfer of semiconductor device die
US10615153B2 (en) 2015-03-20 2020-04-07 Rohinni, LLC Apparatus for direct transfer of semiconductor device die
US10622337B2 (en) 2015-03-20 2020-04-14 Rohinni, LLC Method and apparatus for transfer of semiconductor devices
US10910354B2 (en) 2015-03-20 2021-02-02 Rohinni, LLC Apparatus for direct transfer of semiconductor device die
US11152339B2 (en) 2015-03-20 2021-10-19 Rohinni, LLC Method for improved transfer of semiconductor die
US11488940B2 (en) 2015-03-20 2022-11-01 Rohinni, Inc. Method for transfer of semiconductor devices onto glass substrates
US11515293B2 (en) 2015-03-20 2022-11-29 Rohinni, LLC Direct transfer of semiconductor devices from a substrate
US11562990B2 (en) 2015-03-20 2023-01-24 Rohinni, Inc. Systems for direct transfer of semiconductor device die
US11069551B2 (en) 2016-11-03 2021-07-20 Rohinni, LLC Method of dampening a force applied to an electrically-actuatable element
US11462433B2 (en) 2016-11-23 2022-10-04 Rohinni, LLC Direct transfer apparatus for a pattern array of semiconductor device die
US11094571B2 (en) 2018-09-28 2021-08-17 Rohinni, LLC Apparatus to increase transferspeed of semiconductor devices with micro-adjustment
US11728195B2 (en) 2018-09-28 2023-08-15 Rohinni, Inc. Apparatuses for executing a direct transfer of a semiconductor device die disposed on a first substrate to a second substrate

Also Published As

Publication number Publication date
EP1192593A1 (fr) 2002-04-03
CN1370306A (zh) 2002-09-18
DE60006532D1 (de) 2003-12-18
FR2795199A1 (fr) 2000-12-22
CN1149512C (zh) 2004-05-12
EP1192593B1 (fr) 2003-11-12
DE60006532T2 (de) 2004-09-30
AU5410500A (en) 2001-01-02
FR2795199B1 (fr) 2001-10-26
ATE254316T1 (de) 2003-11-15

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