CN1310474A - 可消除机械应力的大功率半导体组件 - Google Patents

可消除机械应力的大功率半导体组件 Download PDF

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CN1310474A
CN1310474A CN01104945A CN01104945A CN1310474A CN 1310474 A CN1310474 A CN 1310474A CN 01104945 A CN01104945 A CN 01104945A CN 01104945 A CN01104945 A CN 01104945A CN 1310474 A CN1310474 A CN 1310474A
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sleeve pipe
jockey
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substrate
conductive pin
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CN1263124C (zh
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M·罗登克特尔
T·斯托尔策
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Opec European Power Semiconductor Co ltd
Infineon Technologies AG
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Abstract

一种可消除机械应力的大功率半导体组件(1),包括一个基片(4)和管壳(6),具有一个与基片(4)连接的套管(2a,2b)和至少一个插入该套管(2a,2b)中的导电销(3),该导电销用来实现与一块印刷电路板(5)的电连接,而该印刷电路板则与管壳(6)连接。通过导电销(3)在套管(2a,2b)中的轴向自由度可避免在温度变化过程中由于不同的材料性能所引起的机械应力。

Description

可消除机械应力的大功率半导体组件
本发明涉及一种具有一个基片和一个管壳的大功率半导体组件，该组件可消除在温度变化过程中由于组件的各元件的不同材料性能所引起的机械应力。
近年来，大功率半导体在汽车电子、能源管理以及工业传动技术和自动化技术中的应用日益增加。这种大功率半导体一般组合成符合用户特殊要求的组件。
在这种大功率半导体组件中，单个电子元件通常焊接在一个陶瓷基片上。在有些情况中，该陶瓷基片则与一块底板(散热片)焊接。从而保证了电子元件在运行中的充分散热。图5例如表示一个带有集成门电路(IGBT)的双极性晶体管组件的侧视剖面图，摘自Auerbach、Schwarzbauer、Lammers、Lenninger、Sommer在1996年慕尼黑混合微电子学国际学会(ISHM)会议上发表的题为“铝粗线压焊连接的可靠性(Zuverlssigkeit von Al-Dickdraht-Bondverbindungen)”一文。从该图可以看出，一个这样的大功率半导体组件15具有若干焊接在一个陶瓷基片17上的硅芯片19。而陶瓷基片17则与一块基板18焊接。硅芯片19与铝线20相互电连接。此外，管脚16在管壳22的两侧引出并在以后安装时与印刷电路板(未示出)焊接。这个组件的全部元件都用硅胶24浇注进行电绝缘，其中大功率半导体组件15的管壳22用一个盖23封闭。
为了保证硅芯片19通过管脚16与印刷电路板的电连接，在这个组件15中设置了另外的铝压焊连接线21。其中这些压焊连接线的两端分别焊接在硅芯片19上和管脚16的阳台状段上。如图5所示，这些铝压焊连接线21具有弯弓形状。这种所谓的伸缩环或平衡段是必需的，用以避免在温度变化时由于组件各个元件的不同材料性能所引起的有害的机械应力影响。
为了保证这种大功率半导体组件的可靠压焊连接，在焊接过程中必需用昂贵的工件安装和固定装置来把连接头固定在它们的位置内。这样就导致了昂贵的制造过程和误差影响。此外，在用这种铝压焊连接线时，最大容许电流强度受到了压焊线长度和压焊线直径的限制。
所以为了用简单的方式就能消除热引起的机械应力，本发明旨在提出一种在基片上的大功率半导体的接线直接连接的大功率半导体组件及其制造方法。
这个目的是通过权利要求1的大功率半导体组件或通过权利要求23所述的大功率半导体组件的一种制造方法来实现的。
亦即本发明提出了一个具有一基片和一管壳的大功率半导体组件，其特征是，至少一个套管与该基片连接和至少一个导电销插入该套管中，该导电销用来实现与一块印刷电路板的电连接，而该印刷电路板则与管壳连接。为了更好的绝缘，该管壳最好用塑料制成。
在本发明的一个优选实施例中，该套管与该基片焊接。就这点而言，也可设想该套管与其他的电子元件一起在炉子运行过程中焊接在该基片上，从而可达到大功率半导体组件的高效率的制造。
根据本发明的另一个优选实施例，围绕布置在基片表面的一个腐蚀坑设置有浸润面，以备焊接。此外，该基片压有一种膏状焊料。在入炉或焊接前，把套筒放到该膏状焊料上。紧接着膏状焊料在炉子中熔化，于是在浸润面和套管之间引起的表面张力使套管与腐蚀坑定中心。所以套管可很简便地对准基片而达到很精确的位置误差，从而进一步简化了大功率半导体组件的制造。
根据本发明的又一个优选实施例，导电销引入与该基片连接的该套管中。这样就由该套管和该导电销形成了一个两部分式插头系统来代替在基片和印刷电路板之间的迄今为止所用的上述压焊连接线。通过套管的一种有利的造型可使导电销牢固夹紧在套管中。但在一定的外力作用下，该导电销仍可轴向移动。通过这种结构有利于导电销在其与该套管相对的一端与一块印刷电路板连接并将大功率半导体组件装在该印刷电路板上，从而又可直接减小由于温度变化所引起的不利的机械应力。这个实施例的另一个优点是，导电销的可焊性一直保持到安装在印刷电路板上为止，因为该导电销只是在入炉后才引入该套管中。
此外，由套管和导电销组成的两部分式插头系统来实现基片与印刷电路板的电连接的另一个优点是，与迄今为止的压焊连接比较，容许在基片和印刷电路板之间有更大的最大电流强度。因此迄今为止作为电流承受能力重要参数的导线直径和压焊导线长度对本发明的插头系统来说只起次要的作用。
根据本发明的另一个有利的实施例，套管和导电销都用镀锌的铜或铜合金制成，从而保证了它们的良好的可焊性。就此而论，一般都需要对套管和导电销进行适当的材料选择，以避免例如象在铁和铜之间产生的那种有害的接触腐蚀。
根据本发明的又一个有利的实施例，套管由一个底段和外套段组成，其中在最简单的情况中，该外套段例如基本上为一个圆筒形。在这种情况下，即使不保持圆筒直径的精确误差也保证了导电销的足够夹紧。为了便于该导电销插入套管，该导电销可在其端段作一斜面，该斜面作入插入斜面使用。亦即通过这个简单的实施例也可有利地保证上述的两部分式插头系统。
根据本发明的再一个有利的实施例，套管的外套段做成漏斗形，从而更便于导电销的插入。另一个解决办法是，在这个实施例中也可把导电销端部做成插入斜面。在漏斗形结构中，外套段具有若干臂，臂之间有缝隙，这样在焊接后基片进行清洗的过程中就可保证残余焊剂通过这些缝隙从套管内部流出并可彻底进行清除。
根据本发明的又一个有利的实施例，为了组件各元件的绝缘，在大功率半导体组件的管壳中浇注了硅胶。其中，上述缝隙保证了空气从套管区域内的硅胶中排出，从而保证了可靠的绝缘。
大功率半导体组件的其他的有利改进在权利要求2至22中进行了描述。
本发明的方法是这样实施的：至少一个套管放在一个涂敷在基片上的膏状焊料上；基片与套管一起加热，以使套管与基片焊接在一起；导电销插入该套管中并通过该导电销实现大功率半导体组件与印刷电路板的电连接。
本发明方法的其他有利改进在权利要求24至28中进行了描述。
下面结合附图来详细说明本发明，附图表示：
图1与一块印刷电路板连接的本发明大功率半导体组件的局部侧视图；
图2图1大功率半导体组件的一个与基片连接的套管和一根导电销的放大图；
图3图2所用套管的星形展开图；
图4A与基片连接的套管的另一个实施例；
图4B图4A套管的展开图
图5先有技术的大功率半导体组件。
图1表示具有一个基片4和一个管壳6的本发明大功率半导体组件1的局部图。从剖开的区域可以看出至少一个套管2a,2b与基片4连接。在这个实施例中，套管2a,2b最好与基片4焊接。此外，至少一个导电销3这样引入套管2a,2b中，即该导电销大致垂直于基片4的表面延伸。在这种情况下，没有引入套管2a,2b的导电销3的另一个自由端则用于基片4和印刷电路板5的电连接。
在图1所示的本发明实施例中，大功率半导体组件1通过管壳6的连接装置7安装在印刷电路板5上。在这里所示的实施例中，导电销3的自由端最好与印刷电路板5焊接。此外，为了保证大功率半导体组件1可靠安装在印刷电路板5上，管壳6具有连接装置7。在本发明的这个实施例中，连接装置7最好是塑料套钩，这种套钩可扣入印刷电路板5中。此外，管壳6具有一个管壳上侧6a，其上至少有一个孔8。在这个实施例中，管壳上侧6a最好与管壳6构成一体。另一个办法是，管壳上侧6a也可用一个与管壳6连接的单独的元件制成。
如图1所示，异电销3穿过管壳上侧6a的孔8延伸。这样，导电销3就可以管壳6引出。其次，由于导电销3穿过管壳上侧6a的孔8延伸，附加地保证了导电销3的导向。在这个实施例中，由于管壳上侧6a象管壳6那样最好同样用塑料制成，所以保证了上述组件的可靠绝缘。另外，基片4和管壳上侧6a之间的间隙用硅胶浇注，这样就进一步保证了可能多个的套管2a,2b的导电销3的相互的良好绝缘。在这个实施例中，硅胶14是通过在硅胶14和管壳上侧6a之间留的一个空腔注入管壳6的。
为了便于理解本发明，图2一起放大示出一个套管2a和导电销3的基片4的原理结构的侧视剖面。基片4由一层夹在两铜层4b之间的陶瓷层4a组成。从图中可清楚看出，面向套管2a的铜层4b具有一个腐蚀坑9b，该腐蚀坑被金属浸润的面(图中未示出)包围。套管2a的底段11具有一个中心孔9a与腐蚀坑9b相对应。
当基片4加热时，压在其上的膏状焊料10熔化，于是在基片4的浸润面和套管2的底段11的下侧之间作用的表面张力引起中心孔9a与铜层4b内设置的腐蚀坑9b自动对准中心。在图2中示出了中心孔9a与腐蚀坑9b的这种自动对准中心。此外，套管2a具有大致垂直于基片4的表面延伸的若干个单独的臂12。这个套管2a的这些臂12相对于底段11这样弯曲，使套管2a构成一个漏斗的形状。此外，这些臂12在套管2a,2b的中心轴线9c的方向内这样弯曲，使漏斗形的套管2a具有一个最小直径的区域13，其直径稍小于导电销3的直径。导电销3轴向引入套管2a中，其中导电销3面对套管2a的自由端经套管2a最小直径的区域13插入，但与底段11不接触。直径的上述差别使导电销3在套管2a的最小直径区域13达到夹紧。
图3表示图2套管2a的展开图。从图中可以看出，套管2a的外套段由星形布置的臂12组成，这些臂从包围中心孔9a的底段11的边缘径向向外延伸。例如可用一块钢板或带钢就可冲压成这样的展开图，而不用大的花费。从底段11的边缘径向向外延伸的星形臂12紧接着这样成形，使套管2a具有图2所示的漏斗形状。如这个星形展开图所示，漏斗形的套管2a在臂12之间有一些缝隙，这些缝隙保证了在焊接后紧接着进行的洗涤过程中残余焊剂的流出。此外，这些缝隙确保了在浇注硅胶14时，空气可从中排出，因此在浇注的硅胶14中不存在不希望有的空气夹杂。
图4表示一个改型的套管2b的实施例。这个套管2b的原理结构与套管2a的相当。所以凡是相同特征的部分都用相同的附图标记表示，这里不再赘述。从图4A所示的侧视剖面图可以看出，这个套管2b在直径最小的区域13具有一个楔形段13a，它以一定的锐角径向向里突出于套管2b的中心轴线9c。这样，与套管2a比较，导电销3就可达到更可靠的夹紧效果，而该导电销又不因此完全失掉轴向的自由度。
套管2b的外套段的展开图如图4B所示。从图可以看出，套管2b的外套段主要由四个十字形布置的臂12形成。套管2b可按相同的方式用一块钢板或带钢冲压，而且由于臂12的数目较少，总的来说简化了这个套管2b的制造过程。
本发明的方法是这样实施的：将至少一个套管2a、2b安装在涂敷于基片4上的膏状焊料10上。基片4与套管2a、2b一起例如在炉子运行过程中加热，使套管2a,2b与基片4焊接在一起。紧接着将一根导电销3引入相应的套管2a,2b中，于是通过该导电销3就建立了大功率半导体组件1与印刷电路板5的电连接。
本发明的方法是这样实施的：套管2a、2b的底段11的中心孔9a在焊接过程中与一个设置在基片4上的腐蚀坑9b对准中心。这个效应是由于在基片4和套管2a,2b的一起加热过程中在面向套管2a,2b的基片4的一侧设置的浸润面(未示出)与套管2a,2b的底段13的下侧之间形成的表面张力所致。根据本发明的方法，在套管2a,2b和导电销3之间浇注硅胶14，以使可能是多个的套管2a,2b以及数目与之对应的导电销3相互适当绝缘。通过套管2a,2b的臂12之间的上述缝隙可使空气在浇注硅胶14的过程中通过这些缝隙挤出并从硅胶14中排出。
本发明提供了一种结构简单、工序少而不用大花费就能制造的大功率半导体组件。其中导电销3在套管2a,2b中的轴向自由度保证了大功率半导体组件一般在运行中经受温度变化时不可能在该组件中产生有害的机械应力。

Claims (20)

1．大功率半导体组件的连接装置，具有：
-一个与大功率半导体组件(1)的一个基片(4)连接的套管(2a,2b)；
-一个在运行中引入该套管(2a,2b)中的导电销(3)，以便与一块印刷电路板(5)构成电连接；
其特征为：
-引入的导电销通过该套管(2a,2b)可达到夹紧；
-为此，该套管(2a,2b)具有一个最小直径的区域，其直径小于导电销(3)的直径。
2．按权利要求1的连接装置，其特征为，为了形成最小直径的区域(13)，套管(2a,2b)的外套段由一个星形的展开图或一个十字形的展开图形成，该展开图特别是具有这样弯曲的臂(12)，使套管(2a,2b)构成一个漏斗形状。
3．按权利要求2的连接装置，其特征为，在套管(2a,2b)的臂(12)之间形成一些缝隙。
4．按前述权利要求任一项的连接装置，其特征为，最小直径的区域(13)具有楔形段(13a)，这些楔形段特别是径向向里以一定的锐角突出于套管(2b)的中心轴线(9c)。
5．按前述权利要求任一项的连接装置，其特征为，套筒(2a,2b)与基片(4)焊接。
6．按前述权利要求任一项的连接装置，其特征为，导电销(3)在力作用下可在套管(2a,2b)中轴向移动。
7．按前述权利要求2-6中任一项的连接装置，其特征为，该外套段基本上为圆筒形。
8．按前述权利要求任一项的连接装置，其特征为，套管(2a,2b)的底段(11)具有一个中心孔(9a)。
9．按前述权利要求任一项的连接装置，其特征为，基片(4)具有金属浸润的面。
10．按前述权利要求任一项的连接装置，其特征为，基片(4)具有一个腐蚀坑(9b)。
11．按权利要求10的连接装置，其特征为，金属浸润面包围该腐蚀坑(9b)。
12．按前述权利要求任一项的连接装置，其特征为，基片(4)上压有一种膏状焊料(10)。
13．按权利要求8至12任一项的连接装置，其特征为，套管(2a,2b)这样安装在基片(4)的浸润面上，使套管(2a,2b)的中心孔(8)与腐蚀坑(9b)对准中心。
14．按前述权利要求任一项的连接装置，其特征为，套管(2a,2b)和导电销(3)用镀锌的铜或铜合金制成。
15．按前述权利要求任一项的连接装置，其特征为，基片(4)用陶瓷(4a)制成。
16．按前述权利要求任一项的连接装置，其特征为，为了确保绝缘，在管壳(6)中在套管(2a,2b)和导电销(3)之间浇注硅胶(14)。
17．按前述权利要求任一项的连接装置，其特征为，管壳(6)具有一个设置了至少一个孔(8)的管壳上侧(6a)，导电销(3)可通过该孔延伸。
18．按前述权利要求任一项的连接装置，其特征为，管壳(6)具有一个安装在印刷电路板(5)上的装置(7)，大功率半导体组件(1)通过该装置与印刷电路板(5)连接。
19．按权利要求18的大功率半导体组件(1)，其特征为，该装置(7)由一个扣锁钩构成。
20．按前述权利要求任一项的连接装置，其特征为，管壳(6)用塑料制成。
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